Photodetector

Abstract

The present invention aims at providing a photodetector which can detect the incident light intensity with a high speed while having a wide dynamic range for incident light intensity detection. Each photodiode PDm,n generates electric charges Q by an amount corresponding to the intensity of light incident thereon. An electric charge amount level determining circuit 10m,n is provided so as to correspond to the photodiode PDm,n, determines the level of the amount of electric charges Q generated by the photodiode PDm,n, and outputs a level signal Level indicative of the result of level determination. The capacitance value of the integral capacitance part 21 in the integrating circuit 20m is set by the respective level signals Level sequentially fed from N electric charge amount level determining circuits 10m,1 to 10m,N. The integrating circuit 20m accumulates the electric charges Q fed to the input terminal sequentially from the N electric charge amount level determining circuits 10m,1 to 10m,N into the integral capacitance part 21, and outputs a voltage V20 corresponding to the amount of thus accumulated electric charges Q from the output terminal.

Description

TECHNICAL FIELD

The present invention relates to a photodetector including a plurality of photodiodes arranged.

BACKGROUND ART

A photodetector is an apparatus comprising a plurality of photodiodes arranged one-dimensionally or two-dimensionally, and an integrating circuit including an amplifier and an integral capacitance part, and may further comprise signal processing circuits subsequent thereto. In this photodetector, each photodiode outputs electric charges by an amount corresponding to the intensity of light incident thereon, these electric charges are accumulated in the integral capacitance part, and the integrating circuit outputs a voltage corresponding to the amount of thus accumulated electric charges. According to the voltage outputted from the integrating circuit in response to the amount of respective electric charges generated by a plurality of photodiodes, the light incident on the photosensitive surface on which the plurality of photodiodes are arranged is detected. There is a case where the photodetector further comprises an A/D converter which converts voltages (analog values) outputted from the integrating circuit, into digital values. In this case, the incident light intensity is obtained as a digital value, which can further be processed by a computer or the like.

Such a photodetector can be manufactured by the CMOS technology, and can enlarge its dynamic range for detecting the incident light intensity by changing the capacitance value of the integral capacitance part included in the integrating circuit. A photodetector described in S. L. Garverick, et al., “A 32-Channel Charge Readout IC for Programmable, Nonlinear Quantization of Multichannel Detector Data”, IEEE Journal of Solid-State Circuits, Vol. 30, No. 5, pp. 533-541 (1995), for example, includes an integrating circuit in which an integral capacitance part having a variable capacitance value is arranged between input and output terminals of an amplifier, so that electric charges outputted from photodiodes are accumulated in the integral capacitance part, and a voltage corresponding to the amount of thus accumulated electric charges is outputted. The photodetector described in the document mentioned above enlarges the dynamic range for incident light intensity detection by appropriately setting the capacitance value of the integral capacitance part under external control.

Namely, when the capacitance value of the integral capacitance part is made smaller, the detection sensitivity becomes higher even if the incident light intensity is low. When the capacitance value of the integral capacitance part is made greater, on the other hand, output signals are kept from being saturated even if the incident light intensity is high. Using this photodetector makes it possible to capture an object while keeping output signals from being saturated even when the object is very bright as in the daytime in the middle of summer, for example. Also, the object can be captured with a favorable sensitivity even when the object is very dark as in the nighttime, for example.

When the brightness greatly varies depending on the position on the object in the photodetector described in the above-mentioned document, however, output signals in a brighter part of the object may be saturated if darker parts of the object are to be captured with a favorable sensitivity. When captured so as to keep brighter parts of the object from being saturated, on the other hand, the imaging sensitivity may become worse in darker parts of the object. Thus, though enlarging the dynamic range for incident light detection by appropriately setting the capacitance value of the integral capacitance part for each capture, the above-mentioned photodetector does not enlarge the dynamic range for incident light detection part per pixel in one picture.

An invention aimed at solving such a problem is disclosed in International Publication No. 02/12845 pamphlet. The photodetector disclosed in this International Publication pamphlet comprises an integrating circuit including an integral capacitance part having a variable capacitance value, and an electric charge amount level determining circuit for determining the level of the amount of respective electric charges generated in photodiodes. One of a plurality of photodiodes is chosen, the level of the amount of electric charges generated in thus chosen photodiode is determined by the electric charge amount level determining circuit, the capacitance value of the integral capacitance part is set according to thus determined electric charge amount level, and then an operation of accumulating the electric charges generated in the chosen photodiode is started in the integrating circuit. Such a configuration allows the photodetector to enlarge the dynamic range for incident light intensity detection for each photodiode (i.e., per pixel in one picture).

DISCLOSURE OF THE INVENTION

However, the photodetector disclosed in the above-mentioned International Publication pamphlet requires a number of steps after choosing one of a plurality of photodiodes until the electric charge accumulating operation in the integrating circuit started as mentioned above. Therefore, this photodetector may be problematic in that a high-speed photodetecting operation is difficult.

In order to overcome the problem mentioned above, it is an object of the present invention to provide a photodetector which can detect the incident light intensity with a high speed while having a wide dynamic range for incident light intensity detection.

The photodetector in accordance with the present invention comprises (1) N photodiodes (N being an integer of 2 or greater) each generating an electric charge by an amount corresponding to an intensity of light incident thereon; (2) N electric charge amount level determining circuits, respectively arranged so as to correspond to the N photodiodes, for determining respective levels of amounts of electric charges generated in the photodiodes and outputting respective level signals indicative of results of level determinations; (3) an integrating circuit including an integral capacitance part having a variable capacitance value, which is set according to the level signal, accumulating an electric charge fed from the input terminal into the integral capacitance part, and outputting a voltage corresponding to an amount of the accumulated electric charge, from the output terminal; (4) first switches respectively provided so as to correspond to the N photodiodes, and arranged between the respective photodiodes and the input terminal of the integrating circuit; and (5) second switches respectively provided so as to correspond to the N electric charge amount level determining circuits, and arranged between the respective electric charge amount level determining circuits and the integral capacitance part.

In the photodetector in accordance with the present invention, electric charges are generated by an amount corresponding to the intensity of light incident on a photodiode, and the level of electric charges is determined by an electric charge amount level determining circuit. According to thus determined electric charge amount level, the capacitance value of the integral capacitance part in the integrating circuit is set. Thereafter, in the integrating circuit, the electric charges generated in the photodetector are accumulated in the integral capacitance part, and a voltage signal having a value corresponding to thus accumulated amount of electric charges is outputted. When the incident light intensity is high, the capacitance value of the variable capacitance part in the integrating circuit is set to a relatively large value, whereby even the high incident light intensity can be detected without saturation. When the incident light intensity is low, on the other hand, the capacitance value of the variable capacitance part in the integrating circuit is set to a relatively small value, whereby even the low incident light intensity can be detected with a favorable sensitivity. Since the electric charge amount level determining circuits are provided in a one-to-one relationship with respect to the photodiodes in this photodetector, the capacitance value of the integral capacitance part in the integrating circuit can be set rapidly, whereby the incident light intensity can be detected with a high speed.

Preferably, the photodetector in accordance with the present invention further comprises an A/D converter circuit for inputting the voltage outputted from the output terminal of the integrating circuit, A/D-converting the voltage into a digital value corresponding to the voltage, and outputting the digital value. In this case, the voltage outputted from the integrating circuit is fed into the A/D converter circuit, so as to be converted into the digital value, which is then outputted from the A/D converter circuit.

Preferably, the photodetector in accordance with the present invention further comprises a shift circuit for inputting the digital value outputted from the A/D converter circuit, shifting bits of the digital value according to the level signal, and outputting the bit-shifted digital value. In this case, the digital value outputted from the A/D converter circuit is outputted by the shift circuit after the bits of the digital value are shifted by the shift circuit according to the electric charge amount level determined by the electric charge amount level determining circuit.

Preferably, in the photodetector in accordance with the present invention, the integral capacitance part is settable to a first or second capacitance value, the first capacitance value is 2^p times as large as the second capacitance value (p being an integer of 1 or greater), the A/D converter circuit outputs a digital value with a bit number of p or greater, and the shift circuit shifts the digital value by p bits according to the level signal. In this case, the digital value outputted from the A/D converter circuit is shifted by p bits when necessary, whereby the resulting digital value attains an excellent linearity with respect to the incident light intensity.

Preferably, the photodetector in accordance with the present invention further comprises a control circuit for controlling opening and closing of each of the first and second switches, wherein, for each of the N photodiodes, the control circuit closes the second switch and, after the capacitance value of the integral capacitance part is set according to the level signal outputted from the electric charge amount level determining circuit corresponding to the photodiode, closes the first switch corresponding to the photodiode. In this case, the capacitance value of the integral capacitance part in the integrating circuit is set rapidly, and the incident light intensity is detected with a high speed.

Preferably, the photodetector in accordance with the present invention comprises M sets (M being an integer of 2 or greater) each composed of the N photodiodes, the N electric charge amount level determining circuits, and the integrating circuit. Since M×N photodiodes are arranged, the number of pixels can further be increased in this case.

Preferably, the photodetector in accordance with the present invention comprises (1) the N photodiodes arranged on a first substrate; and (2) the N electric charge amount level determining circuits, integrating circuit, first switches, and second switches arranged on a second substrate; (3) wherein the first and second substrates are connected to each other with a bump, the photodiodes and the first switches corresponding thereto are electrically connected to each other, and the photodetectors and the electric charge amount level determining circuits corresponding thereto are electrically connected to each other. In this case, the first and second substrates can be manufactured by their respective optimal manufacturing processes, which is favorable in terms of improving the integration density.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an overall diagram of a photodetector 1 in accordance with an embodiment.

FIG. 2 is a partial diagram of the photodetector 1 in accordance with the embodiment.

FIG. 3 is a circuit diagram of an electric charge amount level determining circuit 10_m,n and an integrating circuit 20_m which are included in the photodetector 1 in accordance with the embodiment.

FIG. 4 is a timing chart for explaining operations of the photodetector 1 in accordance with the embodiment.

FIG. 5 is a perspective view showing the relationship of arrangement of a first substrate 100 and a second substrate 200 in the photodetector 1 in accordance with the embodiment.

FIG. 6 is a view showing an example of cross sections of the first substrate 100 and second substrate 200 in the photodetector 1 in accordance with the embodiment.

FIG. 7 is a view showing another example of cross sections of the first substrate 100 and second substrate 200 in the photodetector 1 in accordance with the embodiment.

BEST MODES FOR CARRYING OUT THE INVENTION

In the following, embodiments of the present invention will be explained in detail with reference to the accompanying drawings. In the explanation of the drawings, constituents identical to each other will be referred to with numerals identical to each other without repeating their overlapping descriptions.

FIG. 1 is an overall diagram of a photodetector 1 in accordance with an embodiment. FIG. 2 is a partial diagram of the photodetector 1 in accordance with this embodiment. FIG. 2 shows details of blocks X₁ to X_M within the area Y indicated by dotted lines in FIG. 1. The photodetector 1 shown in these drawings comprises M units U₁ to U_M, an A/D converter 30, a shift circuit 40, and a control circuit 50. Each unit U_m has the same configuration comprising N photodiodes PD_m,1 to PD_m,N, N electric charge amount level determining circuits 10_m,1 to 10_m,N, N first switches SW1_m,1 to SW1_m,N, N second switches SW2_m,1 to SW2_m,N, an integrating circuit 20_m, a switch SW3_m, and a switch SW4_m. Here, M is an integer of 1 or greater, N is an integer of 2 or greater, m is an integer of at least 1 but not greater than M, and n in the following is an integer of at least 1 but not greater than N.

Each photodiode PD_m,n generates electric charges Q by an amount corresponding to the intensity of light incident thereon. Switch SW1_m,n is arranged between its corresponding photodiode PD_m,n and the input terminal of the integrating circuit 20_m, and can electrically be opened and closed.

Each electric charge amount level determining circuit 10_m,n is provided for its corresponding photodiode PD_m,n, determines the level of the amount of electric charges Q generated in the photodiode PD_m,n, and outputs a level signal Level indicative of the result of level determination. Switch SW2_m,n is arranged between its corresponding electric charge amount level determining circuit 10_m,n and the integrating circuit 20_m, and can electrically be opened and closed. The level signal Level is a digital signal of 1 bit or a plurality of bits, whereas the switch SW2_m,n includes switches by the number corresponding to that of the bits.

The integrating circuit 20_m includes an integral capacitance part having a variable capacitance value, whose input terminal is connected to the photodiodes PD_m,n by way of their corresponding switches SW1_m,n. As the switches SW1_m,1 to SW1_m,N are sequentially opened and closed, the respective electric charges Q are sequentially outputted from the N photodiodes PD_m,1 to PD_m,N, so as to be fed into the input terminal and accumulated into the integral capacitance part, whereby a voltage V₂₀ corresponding to the amount of thus accumulated electric charges Q is outputted from an output terminal. On the other hand, the integral capacitance part is connected to the electric charge amount level determining circuits 10_m,n by way of their corresponding switches SW2_m,n. As the switches SW2_m,1 SW2_m,N are sequentially opened and closed, the level signals Level are sequentially inputted from the N electric charge amount level determining circuits 10_m,n. According to thus inputted level signals Level, the capacitance value is set.

The A/D converter circuit 30 receives inputs of the voltages V₂₀ sequentially outputted from the output terminals of the integrating circuits 20_m by way of the switches SW3_m, A/D-converts the voltage V₂₀ into digital values, and outputs the digital values corresponding to the voltages V₂₀. The shift circuit 40 receives inputs of the digital values outputted from the A/D converter circuit 30, sequentially receives inputs of the respective level signals Level outputted from the electric charge amount level determining circuits 10_m,1 to 10_m,N by way of the switches SW2_m,n and switches SW4_m, shifts the bits of the digital values according to the level signals Level, and outputs thus bit-shifted digital values.

The control circuit 50 regulates operations of the photodetector 1 as a whole. In particular, the control circuit 50 regulates the opening and closing of each of the switches SW1_m,n and SW2_m,n. Specifically, for each photodiode PD_m,n, the control circuit 50 closes the corresponding switch SW2_m,n and, after the capacitance value of the integral capacitance part in the integrating circuit 20_m is set according to the level signal Level outputted from the corresponding electric charge amount level determining circuit 10_m,n, closes the corresponding switch SW1_m,n, thereby starting an integrating operation in the integrating circuit 20_m. The control circuit 50 also regulates timings of respective operations of the integrating circuits 20_m, switches SW3_m, switches SW4_m, A/D converter circuit 30, and shift circuit 40. These operation timings will later be explained in detail. FIG. 1 omits control signals sent from the control circuit 50 to the other constituent circuits.

FIG. 3 is a circuit diagram of the electric charge amount level determining circuit 10_m,n and integrating circuit 20_m included in the photodetector 1 in accordance with this embodiment. This diagram shows only the part corresponding to the n-th photodiode PD_m,n within the m-th unit U_m.

The electric charge amount level determining circuit 10_m,n includes three comparators 11 to 13 and a controller 14. The non-inverting input terminal of each of the comparators 11 to 13 is connected to the junction between the cathode terminal of the photodiode PD_m,n and the switch SW1_m,n. Reference voltages V_ref1, V_ref2, and V_ref3 are fed to the inverting input terminals of the comparators 11, 12, and 13, respectively. Each of the comparators 11 to 13 compares the respective voltages fed to its inverting and non-inverting input terminals in terms of magnitude, and outputs a signal indicative of the result of comparison to the controller 14. The controller 14 inputs the respective signals outputted from the comparators 11 to 13, and outputs a 3-bit level signal Level for setting the capacitance value of the integral capacitance part in the integrating circuit 20_m.

Here, the reference voltages V_ref1 to V_ref3 satisfy the following relational expressions:

V_ref1=V_sat/2  (1a)

V_ref2=V_sat/4  (1b)

V_ref3=V_sat/8  (1c)

Here, V_sat is a constant value. Therefore, the three comparators 11 to 13 can determine within which of the following ranges:

V_PD<V_sat/8  (2a)

V_sat/8≦V_PD<V_sat/4  (2b)

V_sat/4≦V_PD<V_sat/2  (2c)

V_sat/2≦V_PD  (2d)

the potential V_PD of the cathode terminal of the photodiode PD_m,n falls. The level signal Level outputted from the controller 14 indicates within which ranges of the above-mentioned expressions (2a) to (2d) the potential V_PD falls.

The integrating circuit 20_m includes an amplifier A, capacitance elements C₀ to C₃, and switches SW₀ to SW₃. The input terminal of the amplifier A is connected to the cathode terminal of the photodiode PD_m,n by way of the switch SW1_m,n. The output terminal of the amplifier A is connected to the A/D converter circuit 30 by way of the switch SW3_m. The switch SW₁ and capacitance element C₁ connected in series, the switch SW₂ and capacitance element C₂ connected in series, the switch SW₃ and capacitance element C₃ connected in series, the capacitance element C₀, and the switch SW₀ are connected in parallel between the input and output terminals of the amplifier A.

The capacitance elements C₀ to C₃ and switches SW₁ to SW₃ constitute an integral capacitance part 21 having a variable capacitance value. Namely, the switches SW₁ to SW₃ open and close depending on the level signal Level inputted from the controller 14 of the electric charge amount level determining circuit 10_m,n by way of the switch SW2_m,n, whereby the capacitance value of the integral capacitance part 21 is determined according to their states of opening/closing. Here, the respective capacitance values of the capacitance elements C₀ to C₃ satisfy the relational expressions of:

C₀=C  (3a)

C₁=C  (3b)

C₂=2C  (3c)

C₃=4C  (3d)

Here, C is a constant value.

The capacitance value of the integral capacitance part 21 is set when the respective opening/closing states of the switches SW₁ to SW₃ are set in response to the level signal Level, i.e., according to the potential V_PD of the cathode terminal of the photodiode PD_m,n determined by the three comparators 11 to 13, as follows. Namely, when it is determined that the potential V_PD falls within the range of the above-mentioned expression (2a), all the switches SW₁ to SW₃ are opened, whereby the capacitance value of the integral capacitance part 21 is set to C (=C₀). When it is determined that the potential V_PD falls within the range of the above-mentioned expression (2b), only the switch SW₁ is closed, whereby the capacitance value of the integral capacitance part 21 is set to 2C (=C₀+C₁). When it is determined that the potential V_PD falls within the range of the above-mentioned expression (2c), the switches SW₁ and SW₂ are closed, whereby the capacitance value of the integral capacitance part 21 is set to 4C (=C₀+C₁+C₂). When it is determined that the potential V_PD falls within the range of the above-mentioned expression (2d), all the switches SW₁ to SW₃ are closed, whereby the capacitance value of the integral capacitance part 21 is set to 8C (=C₀+C₁+C₂+C₃). In any of these cases, the voltage V₂₀ outputted from the output terminal of the integrating circuit 20_m falls within the range of:

V_sat/2≦V₂₀<V_sat  (4)

The A/D converter circuit 30 receives inputs of the voltages V₂₀ sequentially arriving from the respective output terminals 20_m of the units U_m by way of the switches SW3_m, A/D-converts the voltages V₂₀, and outputs digital values corresponding to the voltages V₂₀. Here, the voltages V₂₀ fed into the A/D converter circuit 30 always fall within the above-mentioned expression (4), whereby the A/D converter circuit 30 can effectively utilize all the bits of its outputting digital values when A/D-converting the voltages V₂₀.

The shift circuit 40 receives inputs of the digital values outputted from the A/D converter circuit 30, sequentially receives inputs of the respective level signals Level outputted from the electric charge amount level determining circuits 10_m,1 to 10_m,N, shifts the bits of digital values according to the level signals Level, and outputs the bit-shifted digital values. Namely, when a digital value outputted from the A/D converter circuit 30 is a digital value (D_K−1, D_K−2, . . . , D₁, D₀) having K bits (where K is an integer of 2 or greater), the shift circuit 40 outputs a digital value having (K+3) bits. When the level signal Level indicates that the potential V_PD falls within the range of the above-mentioned expression (2a), the shift circuit 40 outputs the digital value (0, 0, 0, D_K−1, D_K−2, . . . , D₁, D₀) having (K+3) bits without shifting the bits of the inputted digital value. When the level signal Level indicates that the potential V_PD falls within the range of the above-mentioned expression (2b), the shift circuit 40 shifts the inputted digital value by 1 bit to the higher order, and outputs thus obtained digital value (0, 0, D_K−1, D_K−2, . . . , D₁, D₀, 0) having (K+3) bits. When the level signal Level indicates that the potential V_PD falls within the range of the above-mentioned expression (2c), the shift circuit 40 shifts the inputted digital value by 2 bits to the higher order, and outputs thus obtained digital value (0, D_K−1, D_K−2, . . . , D₁, D₀, 0, 0) having (K+3) bits. When the level signal Level indicates that the potential V_PD falls within the range of the above-mentioned expression (2d), the shift circuit 40 shifts the inputted digital value by 3 bits to the higher order, and outputs thus obtained digital value (D_K−1, D_K−2, . . . , D₁, D₀, 0, 0, 0) having (K+3) bits.

Operation timings of the photodetector 1 in accordance with this embodiment will now be explained. FIG. 4 is a timing chart for explaining operations of the photodetector 1 in accordance with this embodiment. This chart shows, successively from the upper side, respective opening/closing timings of the switches SW2_m,n−1 and SW1_m,n−1 corresponding to the photodiode PD_m,n−1, respective opening/closing timings of the switches SW2_m,n and SW1_m,n corresponding to the photodiode PD_m,n arranged adjacent to the PD_m,n−1 in each unit U_m, respective opening/closing timings of the switches SW2_m,n+1 and SW1_m,n+1 corresponding to the photodiode PD_m,n+1 arranged adjacent to the PD_m,n in each unit U_m, the output voltage V₂₀ from the integrating circuit 20_m, and output digital values from the A/D converter circuit 30.

From time t_n−1,2 to time t_n,1, only the (n−1)-th switch SW2_m,n−1 in the N switches SW2_m,1 to SW2_m,N is closed in each unit U_m, whereby the level signal Level outputted from the controller 14 of the (n−1)-th electric charge amount level determining circuit 10_m,n−1 is fed into the integrating circuit 20_m, so that the capacitance value of the integral capacitance part 21 in the integrating circuit 20_m is set according to this level signal. The level signal at this time indicates the level of the potential V_PD of the cathode terminal of the photodiode PD_m,n determined by the three comparators 11 to 13 of the electric charge amount level determining circuit 10_m,n−1 and held by the controller 14 at the time t_n−1,2. The switch SW₀ of the integrating circuit 20_m is closed at the time t_n−1,2, so that the voltage V₂₀ outputted from the integrating circuit 20_m is initialized.

During the period from time t_n,1 to time t_n,2, only the n-th switch SW1_m,n in the N switches SW1_m,1 to SW1_m,N is closed in each unit U_m, while the switch SW₀ of the integrating circuit 20_m is open, whereby an integrating operation of the integrating circuit 20_m is carried out. The voltage V₂₀ outputted from the integrating circuit 20_m at this time corresponds to the amount of electric charge accumulated into the integral capacitance part 21 after being outputted from the n-th switch SW1_m,n in the N switches SW1_m,1 to SW1_m,N and the capacitance value of the integral capacitance part 21.

During the period from time t_n,1 to time t_n,2, the M switches SW3_m are closed sequentially, and the M switches SW4_m are closed sequentially. The voltages V₂₀ sequentially outputted from the M units U₁ to U_M are converted into digital values by the A/D converter circuit 30, whereas these digital values are outputted from the shift circuit 40 after being bit-shifted thereby according to the level signals Level sequentially outputted from the M units U₁ to U_M. The digital values sequentially outputted from the shift circuit 40 at this time correspond to respective intensities of light incident on the n-th photodiodes PD_m,n included in the M units U₁ to U_M.

At the time t_n,2, the n-th switches SW1_m,n and SW2_m,n are opened in each unit U_m, whereas the switch SW₀ in the integrating circuit 20_m is closed, whereby a series of operations concerning the n-th photodiode PD_m,n end. During the period from time t_n,2 to time t_n+1,2, a series of operations concerning the (n+1)-th photodiode PD_m,n+1 are similarly carried out in each unit U_m. The same holds in subsequent periods.

Since an electric charge amount level determining circuit 10_m,n is provided for each photodiode PD_m,n in the photodetector 1 in accordance with this embodiment as in the foregoing, an appropriate capacitance value corresponding to the amount of electric charges outputted from the photodiode PD_m,n is set in the integral capacitance part 21 in the integrating circuit 20_m, whereby the dynamic range for incident light intensity detection for each photodiode (i.e., per pixel in one picture) can be enlarged. Also, since electric charge amount level determining circuit 10_m,n is provided in a one-to-one relationship with each photodiode PD_m,n, the capacitance value of the integral capacitance part 21 in the integrating circuit 20_m is set rapidly, whereby the incident light intensity can be detected with a high speed. Since each electric charge amount level determining circuit 10_m,n does not require high-speed processing at the time of determining the electric charge amount level, the power consumption can be saved.

A mode of mounting the photodetector 1 in accordance with this embodiment will now be explained with reference to FIGS. 5 to 7. FIG. 5 is a perspective view showing the relationship of arrangement of a first substrate 100 and a second substrate 200 in the photodetector 1 in accordance with this embodiment. As shown in this drawing, the photodetector 1 is split onto two substrates, i.e., the first substrate 100 and the second substrate 200. On the first substrate 100, M×N photodiodes PD_1,1 to PD_M,N are arranged in a matrix of M rows by N columns. On the second substrate 200, M×N electric charge amount level determining circuits 10_1,1 to 10_M,N, M×N switches SW1_1,1 to SW1_M,N, M×N switches SW2_1,1 to SW2_M,N, integrating circuits 20₁ to 20_M, M switches SW3₁ to SW2_M, M switches SW4₁ to SW4_M, an A/D converter circuit 30, a shift circuit 40, and a control circuit 50 are arranged. As shown in this drawing, the substrates are mounted while being laminated such that they are overlaid on each other in the light incidence direction. The respective cathode electrodes of the photodiodes PD_m,n on the first substrate 100 are electrically connected to their corresponding switches SW1_m,n and electric charge amount level determining circuits 10_m,n on the second substrate 200 by way of bumps.

FIG. 6 is a view showing an example of cross sections of the first substrate 100 and second substrate 200 in the photodetector 1 in accordance with this embodiment. Since a basic pattern is repeated in the lateral direction in this drawing, only one basic pattern will be explained in the following.

Formed on a first surface (the upper face in the drawing) of an n-type semiconductor substrate in the first substrate 100 are a p⁺ region 111 constructing a photodiode PD by forming a pn junction with the n-type substrate, and an n⁺ region 112 as an isolation region. Formed on a second surface (the lower face in the drawing) of the n-type semiconductor substrate in the first substrate 100 are an n⁺-type impurity layer 121 forming an ohmic connection with a bonding pad 124, an insulating protective layer 122 for protecting the surface, and the bonding pad 124 penetrating through the protective layer 122 so as to be electrically connected to the n⁺-type impurity layer 121. A through hole is formed so as to penetrate through the first substrate 100 between the first and second surfaces, whereas a through electrode 131 is arranged within the through hole by way of an insulator layer formed on the inner wall. A metal lead 113 for electrically connecting the p⁺ region 111 to the through electrode 131 is formed on an insulating film 114 on the first surface side of the first substrate 100, whereas a bonding pad 123 electrically connected to the through electrode 131 is formed on the second surface side.

Formed on a first surface (the upper face in the drawing) of a semiconductor substrate in the second substrate 200 are a bonding pad 223 electrically connected to a first terminal of a switch SW1, and a bonding pad 224 electrically connected to a ground potential. The bonding pad 123 of the first substrate 100 and the bonding pad 223 of the second substrate 200 are connected to each other with a bump 423, whereas the bonding pad 124 of the first substrate 100 and the bonding pad 224 of the second substrate 200 are connected to each other with a bump 424. The gap between the first substrate 100 and second substrate 200 is filled with a resin.

A scintillator 510 and a shield plate 520 are arranged on the first surface side of the first substrate 100. The scintillator 510 is arranged above the p⁺ region 111 of the first substrate 100, and generates scintillation light when energy lines such as X-rays are incident thereon. The shield plate 520, which is arranged above the n⁺ region 112 of the first substrate 100, inhibits energy lines such as X-rays from penetrating therethrough and secures the scintillator 510.

When energy lines such as X-rays are incident on the scintillator 510 in the configuration shown in FIG. 6, the scintillator 510 generates scintillation light. When the scintillation light is incident on the p⁺ region 111 of the first substrate 100, electric charges are generated in its pn junction. These electric charges pass the metal lead 113, the through electrode 131, the bonding pad 123, the bump 423, and the bonding pad 223 of the second substrate 200, so as to be fed to the input terminal of the integrating circuit 20 by way of the switch SW1 formed on the second substrate 200.

FIG. 7 is a view showing another example of cross sections of the first substrate 100 and second substrate 200 in the photodetector 1 in accordance with this embodiment. Since a basic pattern is also repeated in the lateral direction in this drawing, only one basic pattern will be explained in the following.

Formed on a first surface (the upper face in the drawing) of an n-type semiconductor substrate in the first substrate 100 are an n⁺-type accumulation layer 151 for preventing electric charges from recombining, and an insulating protective layer 152 for protecting the surface. Formed on a second surface (the lower face in the drawing) of the n-type semiconductor substrate in the first substrate 100 are a p⁺ region 161 forming a pn junction with the n-type substrate so as to construct a photodiode PD, and an n⁺ region 162 as an isolation region, whereas a protective layer 163 is formed on them. Also formed on the second surface of the first substrate 100 are a bonding pad 164 electrically connected to the p⁺ region 161, and a bonding pad 165 electrically connected to the n⁺ region 162.

Formed on a first surface (the upper face in the drawing) of a semiconductor in the second substrate 200 are bonding pads 264 electrically connected to a first terminal of the switch SW1, and a bonding pad 265 electrically connected to a ground potential. The bonding pad 164 of the first substrate 100 and the bonding pad 264 of the second substrate 200 are connected to each other with a bump 464. The bonding pad 165 of the first substrate 100 and the bonding pad 265 of the second substrate 200 are connected to each other with a bump 465. The gap between the first substrate 100 and second substrate 200 is filled with a resin.

A scintillator 510 and a shield plate 520 are arranged on the first surface side of the first substrate 100. The scintillator 510 is arranged above the p⁺ region 161 of the first substrate 100, and generates scintillation light when energy lines such as X-rays are incident thereon. The shield plate 520, which is arranged above the n⁺ region 162 of the first substrate 100, inhibits energy lines such as X-rays from penetrating therethrough and secures the scintillator 510. The first substrate 100 is etched on the first surface side in the part formed with the p⁺ region 161, so as to be thinned.

When energy lines such as X-rays are incident on the scintillator 510 in the configuration shown in FIG. 7, the scintillator 510 generates scintillation light. When the scintillation light is incident on the p⁺ region 161 through the first substrate 100, electric charges are generated in the pn junction. These electric charges pass the bonding pad 164, the bump 464, and the bonding pad 264 of the second substrate 200, and are fed to the input terminal of the integrating circuit 20 by way of the switch SW1 formed on the second substrate 200.

The photodetector 1 in accordance with this embodiment constructed as in the foregoing can exhibit the following effects. Namely, the electric charge migration path from each photodiode PD_m,n to the input terminal of the integrating circuit 20_m becomes shorter, so that the parasitic capacitance in the wiring on the path becomes smaller, which reduces the noise included in the voltage outputted from the integrating circuit 20_m, thereby making it possible to detect light accurately. Since circuits for signal processing such as the integrating circuit 20_m are not provided on the first substrate 100, an increase in the number of pixels or a higher density can be achieved. Also, the second substrate 200 can be made smaller than the first substrate 100, so that, when arranging a plurality of photodetectors 1, the first substrates 100 each provided with a photodiode can be arranged very close to each other or in contact with each other. It is also favorable in that respective optimal processes can be employed for the first substrate 100 formed with a photodiode array and the second substrate 200 formed with a signal processing circuit such as the integrating circuit 20_m.

Without being restricted to the above-mentioned embodiment, the present invention can be modified in various manners. For example, the cross-sectional structures of the first substrate 100 and second substrate 200 are not restricted to those shown in FIGS. 6 and 7. Other circuits may also be provided on the second substrate 200. The number of thresholds for determining the electric charge amount level in the electric charge amount level determining circuit 10_m,n is arbitrary. Depending on this number, the number of cases of capacitance values attainable by the integral capacitance part of the integrating circuit 20_m is determined.

INDUSTRIAL APPLICABILITY

In the photodetector in accordance with the present invention, as explained in detail in the foregoing, electric charges are generated by an amount corresponding to the intensity of light incident on photodiodes, and the level of electric charges is determined by the electric charge amount level determining circuit. According to thus determined electric charge amount, the capacitance value of the integral capacitance part in the integrating circuit is set. Thereafter, in the integrating circuit, the electric charges generated by the photodiodes are accumulated in the integral capacitance part, and a voltage signal having a value corresponding to the amount of accumulated electric charges is outputted. When the incident light intensity is high, the capacitance value of the variable capacitance part in the integrating circuit is set to a relatively large value, whereby even the high incident light intensity can be detected without saturation. When the incident light intensity is low, on the other hand, the capacitance value of the variable capacitance part in the integrating circuit is set to a relatively small value, whereby even the low incident light intensity can be detected with a favorable sensitivity. Since the electric charge amount level determining circuits are provided in a one-to-one relationship with respect to the photodiodes in this photodetector, the capacitance value of the integral capacitance part in the integrating circuit can be set rapidly, whereby the incident light intensity can be detected with a high speed.

Claims

1-7. (canceled)

8: An imaging system comprising:

a first integrated circuit including a photodiode array comprising a plurality of integrating photodiode elements formed in an array of elements in a first and a second direction, the integrated circuit providing a plurality of output signals corresponding to an output of each photodiode; and

a second integrated circuit for receiving as inputs the plurality of output signals from the first integrated circuit and including a plurality of multiplexers corresponding to the number of elements in the first direction in the array, the output signals from a respective set of elements in a first direction forming inputs to a respective multiplexer, each multiplexer for selectively connecting one of the output signals to a multiplexer output, wherein each multiplexer is selectively switched between the plurality of output signals.

9: The imaging system of claim 8,

wherein the array of elements in the first and second direction is an array of rows and columns;

the plurality of multiplexers correspond to the number of columns in the array; and

the output signals from a respective column form the inputs to the respective multiplexer.

10: The imaging system of claim 9, wherein each multiplexer is selectively switched between the plurality of output signals by a plurality of control lines, the number of control lines corresponding to the number of rows in the array.

11: A photo detector module including:

a first integrated circuit including an array of photodiodes, an output of each photodiode forming an output signal of the first integrated circuit; and

a second integrated circuit for receiving as inputs the output signals of the first integrated circuit, and for selectively connecting the output signals to at least one array output signal.

12: The detector according to claim 11 wherein the array of photodiodes are integrating photodiodes.

13: The detector according to claim 11 further including a capacitor connected in parallel across each photodiode.

14: The detector of claim 11, wherein the number of array output signal lines is less than the number of array output signals.

15: The detector of claim 14, wherein a plurality of the output signals are grouped, such output signals being for selectively connecting to one array output signal.

16: The detector of claim 15, wherein there is provided a plurality of grouped output signals, each for selectively connecting to a respective array output signal.

17: The detector of claim 11, wherein the second integrated circuit includes a multiplexing means, the multiplexing means including a multiplexer associated with each column of the photodiode array, wherein the output signals of each column are provided as inputs to the respective multiplexer, for multiplexing onto a single array output signal.

18: The detector of claim 11, wherein the array comprises a plurality of rows, the multiplexing means adapted to receive a plurality of control signals corresponding to the number of rows and for selecting an output signal from each column for connection to the array output signal.

19: The detector of claim 17, wherein each multiplexer comprises a plurality of switches.

20: A detector according to claim 19 wherein the switches comprise transistors.

21: The detector of claim 11, wherein the at least one array output signal forms at least one output of the second integrated circuit.

22: The detector of claim 11 wherein the at least one array output signal forms at least one input to processing circuitry on the second integrated circuit.