COVERED PLATE-TYPE HEAT PIPE
A compact plate-type heat pipe having a large strength includes a plate-type heat pipe having a vaporized end and a condensed end and a metallic plate-like sleeve. The plate-like sleeve is covered outside the plate-type heat pipe tightly with the vaporized end of the plate-type heat pipe being exposed to the outside. The surface of the vaporized end of the plate-type heat pipe is adhered to the surface of a heat-generating electronic element, so that the heat generated by the heat-generating electronic element can be dissipated quickly.
1. Field of the Invention
The present invention relates to a heat pipe, and in particular to a compact plate-type heat pipe.
2. Description of Prior Art
Since the plate-type heat pipe has many advantageous features, such as a large capacity and a high rate of heat conductivity, light in weight, simple in structure and multiple functions, it can be used to transfer a large amount of heat without consuming any electricity. Therefore, the plate-type heat pipe is widely used in the heat conduction of electronic elements. Via the plate-type heat pipe, the heat generated by electronic elements can be dissipated quickly, thereby solving the heat accumulation of electronic elements at present stage.
The working principle of the plate-type heat pipe is described as follows. Via an internal vacuum environment, after being heated, the working fluid filled in the heat pipe generates a phase change thereby to transfer heat. Then, after being cooled, the working fluid returns to liquid state so that it can flow back for circulation. With the surface of an end of the plate-type heat pipe in which the working fluid is vaporized (referred as “vaporized end” hereinafter) abutting against the surface of the electronic heat-generating surface, a portion of the heat generated by the electronic element is absorbed by the surface of the vaporized end of the plate-type heat pipe, thereby achieving the heat-dissipating effect.
Since the electronic devices are made to be more and more compact, the plate-type heat pipe for dissipating the heat generated by the electronic elements also have to be made compact in volume and light in weight due to the increasingly limited volume of the electronic device. However, when the plate-type heat pipe intends to be made further compact, the plate body of the plate-type heat pipe will be bent and broken more easily especially during the transportation and package. Therefore, it is an important issue for the Inventor to provide a plate-type heat pipe that still has a large strength even though it is compact in volume and light in weight.
SUMMARY OF THE INVENTIONThe present invention is to provide a covered plate-type heat pipe, in which a plate-type sleeve is covered outside the plate-type heat pipe with a vaporized end of the plate-type heat pipe being exposed to the outside, thereby generating a compact plate-type heat pipe having a large strength.
The present invention is to provide a compact plate-type heat pipe having a large strength, which includes a plate-type heat pipe having a vaporized end and a condensed end and a metallic plate-type sleeve. The plate-type sleeve is tightly covered on the plate-type heat pipe with the vaporized end of the plate-type heat pipe being exposed to the outside, thereby providing a covered plate-type heat pipe that is compact in volume and light in weight with a large heat-dissipating area. In use, the surface of the vaporized end of the plate-type heat pipe is adhered to the surface of a heat-generating electronic element, so that the heat generated by the electronic element can be dissipated quickly via the plate-type heat pipe.
The detailed description and technical contents of the present invention will be explained with reference to the accompanying drawings. However, the drawings are illustrative only, but not used to limit the present invention.
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The plate-like sleeve 30 is a lightweight metallic casing made by one of Al, Al—Mg alloy and Ti. An opening 301 is provided on the plate-like sleeve 30 with a width approximately identical to that of the plate-type heat pipe 20, so that the plate-like sleeve 30 can be tightly covered outside the plate-type heat pipe 20. In the present embodiment, the plate-like sleeve 30 is covered outside the condensed end 22 of the plate-type heat pipe 20, so that the vaporized end 21 of the plate-type heat pipe 20 can be exposed to the outside. The plate-type sleeve 30 can contain therein a heat-conducting medium, such as heat-conducting paste, for accelerating the heat conduction. After the plate-like sleeve 30 is covered outside the plate-type heat pipe 20, the heat-conducting medium 31 is distributed uniformly between the plate-type heat pipe 20 and the plate-like sleeve 30. Via the heat-conducting medium 31, the heat can be conducted to the plate-like sleeve 30 more quickly.
Since the plate-like heat pipe 20 of the covered plate-type heat pipe 10 of the present invention is compact, its strength is insufficient. In order to increase the strength of the plate-type heat pipe 20, a lightweight metallic plate-like sleeve 30 is covered outside the plate-type heat pipe 20. The plate-like sleeve 30 does not fully cover the vaporized end 21 of the plate-type heat pipe 20, so that the vaporized end 21 of the plate-type heat pipe 20 can be adhered to the surface of a heat-generating element. With the metallic plate-like sleeve 30 being covered outside the plate-type heat pipe 20, the strength and the heat-dissipating area of the compact plate-type heat pipe 20 can be increased. Therefore, the present invention provides a covered plate-type heat pipe 10 that is compact in volume and light in weight with a large heat-dissipating area.
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Therefore, according to the present invention, a lightweight metallic plate-like sleeve is covered outside a compact plate-type heat pipe, thereby increasing the strength and the heat-dissipating area of the plate-type heat pipe. Thus, the present invention can provide a covered plate-type heat pipe that is compact in volume and light in weight with a large heat-dissipating area.
Although the present invention has been described with reference to the foregoing preferred embodiment, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
Claims
1. A covered plate-type heat pipe, comprising:
- a plate-type heat pipe having a vaporized end and a condensed end; and
- a plate-like sleeve covering the plate-type heat pipe tightly with the vaporized end of the plate-type heat pipe being exposed to the outside.
2. The covered plate-type heat pipe according to claim 1, wherein the plate-type heat pipe is provided therein with a wick structure and a working fluid.
3. The covered plate-type heat pipe according to claim 1, wherein the plate-like sleeve is made by one of Al, Al—Mg alloy and Ti.
4. The covered plate-type heat pipe according to claim 1, wherein the plate-like sleeve has therein a heat-conducting medium that is distributed between the plate-type heat pipe and the plate-like sleeve uniformly.
5. A process for manufacturing a covered plate-type heat pipe, comprising the steps of:
- providing a plate-type heat pipe having a vaporized end and a condensed end;
- refrigerating the plate-type heat pipe to reduce a volume thereof;
- providing a plate-like sleeve;
- heating the plate-like sleeve to expand a volume thereof; and
- covering the refrigerated plate-type heat pipe by the heated plate-like sleeve with the vaporized end of the plate-type heat pipe being exposed to the outside;
- whereby after returning to room temperature, the plate-like sleeve contracts to cover outside the plate-type heat pipe tightly.
6. The process according to claim 5, wherein the plate-type heat pipe is provided therein with a wick structure and a working fluid to form a vacuum chamber.
7. The process according to claim 5, wherein the plate-like sleeve further comprises a heat-conducting medium, after the plate-like sleeve is covered outside the plate-type heat pipe, the heat-conducting medium is distributed uniformly between the plate-type heat pipe and the plate-like sleeve.
Type: Application
Filed: Jul 14, 2008
Publication Date: Jan 14, 2010
Inventors: George Anthony Meyer, IV (San Jose, CA), Chien-Hung Sun (Zhongli City), Yung-Tai Lu (Zhongli City)
Application Number: 12/172,361
International Classification: F28D 15/00 (20060101);