Abstract: A thermal module structure includes an aluminum base having a heat pipe receiving groove formed on one side thereof; a heat dissipation unit including a plurality of radiation fin assemblies or heat sinks and being provided with a first heat pipe receiving section; a plurality of heat pipes made of a copper material and respectively having a heat absorption section and a horizontally extended condensation section; and a copper embedding layer provided on surfaces of the heat pipe receiving groove and the first heat pipe receiving section. The aluminum base and the heat dissipation unit are horizontally parallelly arranged. The heat absorption sections are fitted in the heat pipe receiving groove, and the condensation sections are extended through the first heat pipe receiving section. With the copper embedding layer, the aluminum base and the heat dissipation unit can be directly welded to the heat pipes.

Abstract: A vapor chamber and a mobile terminal are provided. The vapor chamber comprises a first cover plate, a second cover plate, a housing including the first cover plate and the second cover plate, wherein the first cover plate and the second cover plate are connected to form a sealed cavity, a cooling medium, a capillary structure disposed in the sealed cavity, and a supporting structure extending from an inner surface of the housing to an internal space of the housing. A material of the first cover plate and the second cover plate is a high-strength composite material, wherein the high-strength composite material comprises a first material layer and a second material layer. The vapor chamber has light weight, small thickness and structural strength.

Abstract: An electronic cigarette atomizer, comprising an electronic cigarette liquid storage chamber for storing electronic cigarette liquid, and an atomization assembly for absorbing and atomizing the electronic cigarette liquid. The atomization assembly comprises a porous body and a heating element. The porous body comprises an electronic cigarette liquid absorption surface in contact with the electronic cigarette liquid and an atomization surface. The heating element is provided on the atomization surface. The electronic cigarette liquid absorption surface is provided with a plurality of blind holes and/or grooves extending along the electronic cigarette liquid absorption surface towards the atomization surface. In the atomization assembly, electronic cigarette liquid atomization is performed on the porous body formed with the blind holes and/or grooves.

Abstract: A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

Abstract: The present invention relates to a cooling plate for thermal management of a system such as an electronic. A unitary, single-material cooling plate can be formed from three stacked flat aluminum sheets, including a top sheet, a bottom sheet, and a middle sheet. An open channel is formed in the middle sheet by laser cutting, and enclosed by the top and bottom sheets. The top and bottom sheets are secured to the middle sheet through continuous laser welds applied around the circumference of the open channel and laser welding applied around the outer perimeter of the cooling plate. Flow modifiers or sensor assemblies may be encapsulated within the middle sheet open channel. The open channel may, in some embodiments, constitute a single open coolant chamber, with islands of material positioned therein and welded to the top and bottom sheets. Methods for manufacture of such cooling plates are also disclosed.

Abstract: A heat transfer device includes three plates sandwiched together to form a vapor chamber or similar device. The three plates may be sealingly joined at a closed periphery to define a closed volume that contains a working fluid. One or more of the three plates may include structure to support capillary or other working fluid flow in the closed volume, e.g., a center plate may include openings and/or other structure to permit working fluid flow through and/or along the plate. An outer one of the plates may include an opening through which working fluid may be introduced into the closed volume. After filling with working fluid, the plates may be sealingly joined at one or more joints that extend chordwise across the closed periphery, e.g., so a portion of the plate that defines the opening can be removed from the device.

Abstract: A heatsink system includes a heatsink plate having a first set of slots defined in a first face thereof and a second set of slots defined in a second face thereof opposite the first face. The first and second sets of slots are configured to house phase change material (PCM) therein.

Abstract: The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm3 and a median particle diameter (D50) of 30 ?m or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 ?m. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.

Abstract: An AESA (Active Electronically Scanned Array), including: a PCB (Printed Circuit Board) substrate having an obverse surface; TRMs (Transmit/Receive Modules) disposed on the obverse surface; thermal pedestals wherein each thermal pedestal includes a wall, having a wall height, including wall surfaces and one of the wall surfaces being a contact surface; and a TIM (Thermal Interface Material), having a TIM height, disposed between a respective contact surface of the thermal pedestals and the obverse surface. The thermal pedestals are discrete with respect to one another, the contact surfaces of the thermal pedestals are interspersed about the TRMs, the thermal pedestals do not contact the TRMs, the TIM is electrically and thermally conductive, and the wall height plus the TIM height is sufficient to suppress resonances of the TRMs below a frequency greater than the Tx and Rx frequency bands of the TRMs.

Abstract: A cooling device for use in alternating magnetic fields include an evaporator part defining a first volume for evaporating a cooling medium contained therein, the evaporator part being made of an electrically and magnetically non-conductive material, and a condenser part defining a second volume for condensing the cooling medium contained therein, the condenser part being in fluid connection with the first volume.

Abstract: Disclosed herein is a blank for a heat-transfer device that includes a vapor chamber enclosed by a body of the heat-transfer device, and a charging tube connected to the vapor chamber, wherein a part of the charging tube protruding from the body has at least one unsealed sealing zone with an oblong flow area, where a width of the charging tube exceeds a height of the charging tube.

Abstract: Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.

Abstract: This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.

Abstract: A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.

Abstract: A vapor chamber includes a main body. The main body includes a base plate and a top plate. The base plate includes a plate body, a peripheral frame and a plurality of supporting pillars. The plate body has a surface. The peripheral frame is disposed on the surface of the plate body. The surface and the peripheral frame together define a first space. The first space is configured to accommodate a working fluid. The supporting pillars are located in the first space and are distributed on the surface of the plate body. The supporting pillars, the plate body and the peripheral frame are of an integrally-formed structure. The top plate abuts against the peripheral frame and the supporting pillars to seal up the first space.

Abstract: A combination structure of a vapor chamber and a heat pipe includes a half-shell seat element, a half-shell cover element, a wick structure, and a working fluid. The half-shell seat element includes a vapor chamber half-shell seat and multiple heat pipe half-shell seats. Each heat pipe half-shell seat is extended from the vapor chamber half-shell seat. The vapor chamber half-shell seat includes a vapor chamber cavity. Each heat pipe half-shell seat includes a heat pipe cavity. Each heat pipe cavity communicates with the vapor chamber cavity. The half-shell cover element is sealedly connected with the half-shell seat element. The wick structure is continuously laid on the vapor chamber half-shell seat and each heat pipe half-shell seat, and is formed in the vapor chamber cavity and each heat pipe cavity. The working fluid is disposed in the vapor chamber cavity.

Abstract: A heat pipe with micro tubes includes of a solid heat conductor provided therein with two or more parallel micro tubes. The micro tubes are filled with a working medium which exchanges heat through phase change. Two ends of the heat conductor are sealed and at least one of the ends is provided with a sealing strip of gradually shrinking shape that is formed from cold welding.

Abstract: A heat-dissipating device includes a casing and a heat dissipating fin set. The casing has a first hole structure. The heat dissipating fin set includes a protruding fin, a sheltering component and a bridging component. A hollow chamber of the protruding fin has a first opening and a second opening adjacent to each other. The first opening is connected to an inner space of the casing. The sheltering component is disposed on the protruding fin to shelter the second opening. The bridging component is connected to the protruding fin and fixed onto the first hole structure.

Abstract: A concentrate adaptor for a vaporizer device includes a reservoir and a base. The reservoir holds a concentrate. The reservoir is positioned within a vessel of the vaporizer device and is heated by a heating element of the vaporizer device to transfer heat to the concentrate, thereby generating an aerosol for inhalation by a user. The reservoir includes a sidewall surrounding an interior volume of the reservoir. The reservoir also includes a capillary structure positioned along the sidewall configured to direct the concentrate to the sidewall to be heated by the heating element.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.

Abstract: A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

Abstract: A wick assembly for use with a heat pipe is disclosed. The wick assembly includes an end plug including a wick receiving area, a wick, and a crimp. A portion of the wick is positioned about the wick receiving area. The crimp is positioned about the portion of the wick and the wick receiving area. The end plug, the portion of the wick, and the crimp are diffusion bonded.

Abstract: Printed circuit board (PCB) substrates include at least one pre-preg layer interposed between one or more electrically conductive layers, power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration, and a flat heat pipe positioned between the power device stacks within the at least one pre-preg layer, one surface of the flat heat pipe directly bonded to a first one of the power device stacks and an opposite surface of the flat heat pipe thermally coupled to a second one of the power device stacks.

Abstract: A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.

Abstract: A dual heat transfer structure, comprising: at least a heat pipe and at least a vapor chamber; the heat pipe having a first end, an extension portion, and a second end, the first and second ends disposed at the two ends of the extension portion; the vapor chamber being concavely bent with its two ends being joined together and selectively compasses, encircles, encloses, or surrounds one of the first and second ends and extension portion. The dual heat transfer structure of the present invention is a complex structure that can both transfer heat with a large area and to the distal end of the structure.

Abstract: The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing, and is in contact with the microchannel. An area of the wick is larger than an area of a region corresponding to the microchannel in a plan view of the vapor chamber.

Abstract: A heat dissipation device is provided and includes a vapor chamber unit, a heat pipe set provided on an outer surface of the vapor chamber unit, a first fin set provided on the outer surface of the vapor chamber unit and sleeving the heat pipe set, and a second fin set stacked on the first fin set and sleeving the heat pipe set, where the fin arrangement direction of the first fin set is different from the fin arrangement direction of the second fin set.

Abstract: A method of passive cooling for a high concentrating photovoltaic, the high concentrating photovoltaic, includes a photovoltaic receiver, a parabolic dish reflector and a plurality of thermally conductive heat pipes having a direct thermal contact between the receiver and the reflector to transfer excessive heat. The method includes receiving sunlight by the parabolic dish reflector, reflecting the sunlight towards the photovoltaic receiver that converts the sunlight into electricity and heat, transferring the heat through the thermally conductive heat pipes and absorbing the heat by the reflector serving a dual purpose as a heat sink. A reduction in weight and cost is accomplished by incorporating the flat heat pipes.

Abstract: A method of passive cooling for a high concentrating photovoltaic, the high concentrating photovoltaic, includes a photovoltaic receiver, a parabolic dish reflector and a plurality of thermally conductive heat pipes having a direct thermal contact between the receiver and the reflector to transfer excessive heat. The method includes receiving sunlight by the parabolic dish reflector, reflecting the sunlight towards the photovoltaic receiver that converts the sunlight into electricity and heat, transferring the heat through the thermally conductive heat pipes and absorbing the heat by the reflector serving a dual purpose as a heat sink. A reduction in weight and cost is accomplished by incorporating the flat heat pipes.

Abstract: A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.

Abstract: A method for manufacturing a roll-bond heat exchanger has steps of: (1) A preparing step: preparing an in-process roll-bond plate that has a main plate with a bulged structure, and a degassing portion with a tube; (2) A degassing step: removing air from the bulged structure through the tube; (3) A filling step: filling refrigerant into the bulged structure; (4) A pressing step: pressing the bulged structure flat to form a pressed portion; (5) A cutting step: cutting the degassing portion to form a cut portion on the main plate; and (6) A sealing step: welding the cut portion. The main plate and the degassing portion are integrally formed as a single part and the degassing portion is able to be directly connected with the vacuum filling machine. Accordingly, processing steps and manpower for manufacturing the roll-bond heat exchanger are reduced.

Abstract: A convection/radiation air conditioning terminal and an air conditioning system are provided. The convection/radiation air conditioning terminal includes a heat pipe. One end of the heat pipe is connected to a first heat exchange pipeline, and the other end of the heat pipe is connected to a second heat exchange pipeline. The heat pipe includes multiple first microchannels which are arranged and independent of each other, and multiple second microchannels which are arranged and independent of each other, where the first microchannels and the second microchannels are arranged and independent of each other. The first microchannels are each internally provided with a first heat exchange working medium, and the second microchannels are each internally provided with a second heat exchange working medium.

Abstract: A method for sealing a high-temperature heat pipe includes: (1) necking and reducing two ends of the heat pipe separately, so as to obtain a necked end and a reduced end; (2) sealing the necked end by laser welding or electron beam welding; (3) placing the heat pipe in an inert gas glove box, and pouring a working medium without impurities into the heat pipe; (4) heating the heat pipe, connecting the reduced end to a vacuum pump, pumping gas inside the heat pipe by the vacuum pump to vacuumize the heat pipe, such that pressure in an inner cavity of the heat pipe reaches a target pressure, and flattening the reduced end; and (5) sealing an opening of the flattened reduced end by electron beam welding or laser welding, so as to obtain the high-temperature heat pipe.

Abstract: A multi-thermal characteristic heat sink fin, comprising a first heat spreading plate, a second heat spreading plate, and a primary heat spreading plate is provided. A plurality of multi-thermal characteristic heat sink fins is assembled together to form a heat sink, further having at least a heat pipe assembled therethrough, and a base plate, assembled to the at least a heat pipe and in contact with a heat source. The primary heat spreading plate is sandwiched and enclosed within the first and second heat spreading plates, hindering debris, contaminants, and moisture from entering the surface interfaces therebetween. The material of the heat pipes and primary heat spreading plate is different from that of the first and second heat spreading plates. No heat treatment process of two or more different materials is required for assembly of the multi-thermal characteristic heat sink fin and at least a heat pipe assembled thereto.

Abstract: A heat transfer tube is made of aluminum and includes a streak-shaped Zn diffusion layer (6, 106) which is spirally formed on a circular outer peripheral surface in a length direction. According to this heat transfer tube, even in a case where rainwater or dew concentration water is intensively accumulated in a portion of the outer peripheral surface in a circumferential direction, it is possible to obtain a sufficient corrosion resistance.

Abstract: A heat dissipation structure mounted in an electronic device includes a base body defining a seal chamber, a heat transfer medium in the seal chamber, and a connecting element. The seal chamber includes interconnected evaporation and condensation portions. The connecting element is coupled to the evaporation portion and a camera module of the electronic device. Heat generated by the camera module is transferred to the evaporation portion via the connecting element, the heat transfer medium turns to gas, and the gas flows into the condensation portion and condenses, dissipating the heat to the outside of the electronic device. The disclosure further provides an electronic device using the heat dissipation structure.

Abstract: A vapor chamber includes a housing including first and second sheets that face each other and that include respective outer edge portions joined to each other, supports that support the first and second sheets from inside and that are disposed therebetween, and a hydraulic fluid enclosed in the housing. The first and second sheets do not include an angled portion having an angle of about 90° or less between a joint and a support nearest to the joint. The expression 0.02?b/a?0.3 is satisfied, where a is a distance from an outer edge of the outermost support to an inner edge of the joint between the first and second sheets, and b is a distance between the first and second sheets at the outer edge of the outermost support.

Abstract: A heat pipe includes an intermediate metal layer interposed between outermost metal layers, an inlet passage defined by opposing wall portions of the intermediate metal layer and the outermost metal layers, and a porous body provided at one or both of the wall portions. The porous body includes a first bottomed hole that caves in from one surface of the intermediate metal layer, a second bottomed hole that caves in from the other surface of the intermediate metal layer, and a pore formed by the first bottomed hole that partially communicates with the second bottomed hole. The outermost metal layers, the intermediate metal layer, the inlet passage, and the porous body form an inlet for filling a working fluid into the heat pipe.

Abstract: An apparatus for cooling an electronic device is disclosed. In an aspect, the apparatus includes a vapor chamber coupled to a heat generating component of the electronic device. In an aspect, the vapor chamber is coupled to an inner surface of an outer cover of the electronic device and conforms to a shape of the inner surface of the outer cover. In another aspect, the vapor chamber forms the outer cover of the electronic device. The vapor chamber comprises a sealed container, a wick structure disposed on an inner surface of the sealed container, and a fluid contained in the sealed container, wherein as heat is applied to an evaporator side of the sealed container coupled to the heat generating component, the fluid vaporizes over a condenser side of the sealed container opposite the evaporator side and returns to the evaporator side via the wick structure.

Abstract: A method of assembling a thermosiphon system includes placing a base of an evaporator and a tube of a condensate line in a brazing fixture such that the base covers an aperture in a bottom of the tube with a bottom surface of the base abutting a precision machined surface of the brazing fixture, and simultaneously brazing the base and the tube while held by the brazing fixture to form a unitary body in a single brazing process, the unitary body including the evaporator and the condensate line.

Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.

Abstract: A heat pipe structure and a manufacturing method of the heat pipe structure. The heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered.

Abstract: The present application relates to a method of manufacturing a heat sink from a plurality of extruded lamellas, each lamella including a base portion having a top surface, a bottom surface, and two side surfaces, each lamella further including a fin portion extending from the top surface of the base portion, wherein the base portion is wider than the fin portion. The method includes aligning the base portions of the plurality of lamellas with the fin portion of each lamella extending in the same direction and the side surfaces of adjacent base portions facing each other; pressing the base portions of adjacent lamellas into contact with each other by applying a force to the side surface of at least one of the base portions; and welding the bottom surfaces of adjacent base portions together. A heat sink and a lamella for use in manufacturing a heat sink are also disclosed.

Abstract: The method of manufacturing heat pipe is disclosed to insert a center bar into a metal tube such that the center bar contacts a clearance area of the inner sidewall of the metal tube. Then, the method is to fill the interval between the center bar and the metal tube with powder for sintering. At last, the method is to perform a sintering, extract the center bar, inject working fluid, and close the metal tube. A heat pipe is therefore formed. Because of no sintered powder on the clearance area, the heat pipe can be bent at the clearance area without damaging the capillary structure formed by the sintered powder. The flow path of the working fluid is not interrupted or influenced, so the heat transfer efficiency can be maintained, which overcomes the decrement of the heat transfer efficiency of a bent heat pipe in the prior art.

Abstract: A method for generating a microchannel heat pipe on a substrate surface includes co-extruding a primary material and a secondary material such that the primary material forms side walls that are spaced apart by the secondary material to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body structure having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.

Abstract: A manufacturing method of thin heat pipe includes steps of: providing a hollow tubular body and a mesh capillary structure; placing the mesh capillary structure into the tubular body; providing a tool and placing the tool into the mesh capillary structure; sintering the tubular body to make the mesh capillary structure sintered on an inner wall face of the tubular body and then taking out the tool; vacuuming the tubular body and filling a working fluid into the tubular body; sealing the tubular body; and pressing and flattening the tubular body into a flat form by means of mechanical processing. According to the manufacturing method of thin heat pipe, the mesh capillary structure can fully tightly attach to the inner wall face of the tubular body to keep the completeness of the tubular body and the completeness of the vapor-liquid circulation passageways in the heat pipe.

Abstract: A plate-type heat pipe sealing structure and a manufacturing method thereof are disclosed. The plate-type heat pipe includes a main body and a tube body. A notch is formed at one of two ends of the main body or one of four corners of the main body as a sealed section thereof. The tube body is disposed in the notch and connected with the main body. The main body of the plate-type heat pipe is cut by means of a mechanical processing method such as punching to form the notch. The notch of the main body is sealed by means of high frequency wave or copper welding. The tube body is positioned within the notch without protruding from the main body of the plate-type heat pipe. Accordingly, when assembled with a heat sink unit, the sealed section of the plate-type heat pipe will not interfere with the heat sink unit.

Abstract: A structural panel for a satellite comprising an elongate pipe mounted thereto. The heat pipe is bonded to the panel intermediate its remote ends with a thermally conductive adhesive. The adhesive is omitted proximate at least one distal end of the heat pipe. The at least one distal end of the heat pipe without adhesive is mechanically secured to the panel by at least one bolt received in a cooperating threaded receiving element. A method of manufacturing such a panel is also provided.

Abstract: A slim-type heat pipe includes a tube, being hollow and flat; and a wick structure, longitudinally disposed in the tube, having an attachment side attached on a local portion of an inner side of the tube and a formation side opposite to the attachment side, and a vapor passage formed between the formation side and the inner side of the tube. The wick structure is provided with grooves radially around the inner side of the tube. The attachment side is attached on the grooves. Depth of the groove is less than 30% of thickness of a wall of the tube.