Structure of heat sink
An improved structure of a heat sink is disclosed. The heat sink is composed of a ring body, fins and a bottom plate. The fins are radially arranged on the ring body. The bottom plate is fixed in the ring body for being placed a heat source. The heat sink can effectively dissipate the heat from the heat source.
1. Technical Field
The invention generally relates heat sinks, more particularly to annular heat sinks.
2. Related Arts
Technology of heat dissipation plays an important role in the field of electronic apparatuses. With continuous development of consumer electronic apparatuses, the requirement and challenge of heat dissipation also increase. For example, tungsten lamps and halogen lamps have been replaced by light emitting diodes (LEDs). The main features of the LEDs are less power consumption, long service time, compact size and light weight. The LEDs also can emit various light so they can be extensively applied in many fields for indication and illumination. Although the LEDs generate less heat than conventional lighting devices, the problem of heat dissipation accompanied with high power LEDs still should be dealt with carefully.
Taiwan Patent Application Publication No. 200716911 discloses a heat dissipating device for LED lamp. '911 connects a high power LED lamp to a heat spreader via a heat pipe so that the heat from the LED lamp can be conducted to the heat spreader. However, '911's structure is considerably complicated and bulky.
Taiwan Utility Model Patent No. M317539 discloses an LED lamp. '539 employs a heat conducting post and a plurality of fins annularly connected thereto to constitute a heat dissipating module. The fins are radially disposed on the heat conducting post and form a recess at a top end of the heat conducting post for accommodating an LED.
In '539, however, the fins and heat conducting post can not be tightly connected so that the heat from the LED can not be effectively conducted to the fins through the heat conducting post. Thus, the heat dissipating efficiency of '539 is not good enough, and the LED tends to be damaged because of overheating. Furthermore, '539 has too many components and lacks secure positioning and connecting arrangement. Therefore, '539 is hard to be assembled and is uneconomical for manufacture.
SUMMARY OF THE INVENTIONA primary object of the invention is to provide an improved heat sink having a ring body and a seat plate, which can be securely and tightly connected to each other.
Another object of the invention is to simplify a structure of heat sink and to shorten production time in manufacturing process.
Another object of the invention is to enhance heat dissipation performance.
To accomplish the objects abovementioned, the heat sink is composed of a ring body, fins and a bottom plate. The fins are radially arranged on the ring body. The bottom plate is fixed in the ring body for being placed a heat source.
Referring to
In the shown embodiment, ring body 10 and fins 30 are fixedly connected by an extrusion process. Referring to
Referring to
On the other side, ring body 10, bottom plate 20 and fins can be made of different materials such as iron, copper, aluminum or alloy of previous metals to satisfy requirement of various circumstances as shown in
The junction between bottom plate 20 and ring body 10 can be noncomplete to retain air gaps. As shown in
On the other side, ring body 100 can be rectangular as shown in
Referring to
Referring to
Ring body 10a is not limited to a hollow cylinder, it also can be configured into a shape shown in
Furthermore, as shown in
Claims
1. A heat sink comprising:
- a ring body;
- a plurality of fins radially disposed on an outer surface of the ring body; and
- a bottom plate fixed in the ring body for being placed a heat source.
2. The heat sink of claim 1, wherein the ring body is provided with a plurality of thin grooves and taper slot, both of which are alternatively arranged.
3. The heat sink of claim 2, wherein the thin grooves separately grip the fins by using a punch to extrude the taper slot.
4. The heat sink of claim 1, wherein the ring body is one of circle, semicircle, oval, rectangle or cone.
5. The heat sink of claim 1, wherein the ring body is of an irregular shape.
6. The heat sink of claim 1, wherein a diameter of the bottom plate is equal to or slightly smaller than an inner diameter of the ring body.
7. The heat sink of claim 6, wherein the bottom plate is connected to the ring body by soldering, welding or infusing thermal grease.
8. The heat sink of claim 6, wherein the bottom plate is connected to the ring body by pressing the bottom plate to deform.
9. The heat sink of claim 1, wherein a diameter of the bottom plate is slightly larger than an inner diameter of the ring body.
10. The heat sink of claim 9, wherein the bottom plate is connected to the ring body by using a molding machine to press the bottom plate.
11. The heat sink of claim 1, wherein the bottom plate is made of copper, aluminum or iron.
12. The heat sink of claim 1, wherein the bottom plate is composed of two elements with different materials.
13. The heat sink of claim 1, wherein the ring body and bottom plate are made of different materials.
14. The heat sink of claim 1, wherein a junction between the bottom plate and the ring body is provided with at least one gap for air flow.
15. The heat sink of claim 1, wherein the bottom plate is a heat spreader having a working fluid.
16. The heat sink of claim 1, wherein both the ring body and the fins are integratedly formed into a single module.
Type: Application
Filed: Mar 9, 2009
Publication Date: Apr 8, 2010
Inventor: Shyh-Ming Chen (Taipei County)
Application Number: 12/400,011
International Classification: F28F 7/00 (20060101);