MAGNETIC DEVICE AND MAGNETRON SPUTTERING DEVICE USING THE SAME
A magnetron sputtering device includes a base arranged adjacent to a sputtering target, and a plurality of movable magnet assemblies. Each movable magnet assembly includes a support fixed to the base, and a plurality of magnets that are connected to each other, arranged on the support and comprising opposing poles facing the base. Each movable magnet assembly also includes a driving device to drive the plurality of magnets to slide with respect to the support.
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1. Technical Field
The present disclosure relates to magnetron sputtering devices and, more particularly, to a magnetron sputtering device having slidable magnet assemblies.
2. Description of Related Art
Magnetron sputtering is a known method to deposit a film on a workpiece. Generally, if, during sputtering, magnets generating a magnetic field are stationary, then continuous sputtering consumes a disproportionate amount of the sputtering target at that location quickly and generates hot spots at the locations of sputtering, which lowers the utilization rate of the sputtering target. Therefore, what is needed is a magnetron sputtering device to overcome the aforementioned problem.
The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the magnetron sputtering device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Embodiments of the present disclosure will now be described in detail below, with reference to the accompanying drawings.
Referring to
The magnetic device 100 includes a base 110 and a plurality of movable magnet assemblies 101 on the base 110. The base 110 may be arranged on the backside of a circular sputtering target 300 (
Referring to
The holder 133 includes a top wall 1331 defining a recessed portion 1333 for receiving the magnet 132. The magnet 132 can be fixed to the holder 133 by any suitable known connection technique, such as gluing. The holder 133 also includes two sidewalls 1334 and 1335 at two sides of the top wall 1331. The frame 140 includes a main bar 141 and a plurality of connecting bars 142 formed on the same side of the main bar 141. The connecting bars 142 are substantially parallel to each other. Each holder 133 is fixed between two adjacent connecting bars 142.
Referring to
In the embodiment, the driving device 150 can be a linear motor including a driveshaft 152 that can extend and retract in a direction substantially parallel to the base 110. One end of the driveshaft 152 is attached to a connecting bar 142 of the frame 140. The frame 140 can thus be driven to slide with respect to the base 110. The magnets 132 can then slide relative to the base 110 and provide movable magnetic fields above the sputtering target 300, allowing uniform utilization of the sputtering target 300. Film with uniform film thickness can thus be deposited on the workpiece (not shown).
Referring to
While various embodiments have been described and illustrated, the disclosure is not to be constructed as being limited thereto. Various modifications can be made to the embodiments by those skilled in the art without departing from the true spirit and scope of the disclosure as defined by the appended claims.
Claims
1. A magnetron sputtering device comprising:
- a base arranged adjacent to a sputtering target; and
- a plurality of movable magnet assemblies each comprising: a support mounted to the base; a plurality of magnets arranged on the support and having alternating opposing poles facing the base; and a driving device to drive the plurality of magnets to slide with respect to the support.
2. The magnetron sputtering device according to claim 1, wherein the plurality of magnets in each of the plurality of movable magnet assemblies are arranged in a line.
3. The magnetron sputtering device according to claim 1, wherein the plurality of movable magnet assemblies are evenly spaced from each other.
4. The magnetron sputtering device according to claim 1, wherein each of the plurality of movable magnet assemblies further comprises a frame to hold the plurality of magnets.
5. The magnetron sputtering device according to claim 4, wherein each of the plurality of movable magnet assemblies further comprises a plurality of holders that are fixed to the frame and configured for holding the plurality of magnets.
6. The magnetron sputtering device according to claim 5, wherein each of the plurality of holders comprises two rotatable wheels, and the support defines two parallel grooves to receive and guide the two rotatable wheels.
7. The magnetron sputtering device according to claim 1, wherein the driving device comprises a linear motor to drive the plurality of magnets to slide.
8. The magnetron sputtering device according to claim 1, wherein the driving device comprises a first linear motor having a first driveshaft and a second linear motor having a second driveshaft, the plurality of magnets is connected to the second driveshaft, the first driveshaft is configured for driving the second linear motor to slide on the base in a first direction, and the second driveshaft is configured for driving the plurality of magnets to move with respect to the base in a second direction.
9. The magnetron sputtering device according to claim 6, wherein each holder comprises two spaced sidewalls each defining an axle hole, the two rotatable wheels are connected together by a shaft, and two ends of the shaft are rotatably connected in the axle holes of the sidewalls, respectively.
10. A magnetic device for use in a magnetron sputtering device, comprising:
- a base arranged adjacent to a sputtering target; and
- a plurality of movable magnet assemblies each comprising: a support fixed to the base; a plurality of magnets arranged on the support and having alternating opposing poles facing the base; and a driving device to drive the plurality of magnets to slide with respect to the support.
11. The magnetic device according to claim 10, wherein the plurality of magnets in each of the plurality of movable magnet assemblies are arranged in a line.
12. The magnetic device according to claim 10, wherein the plurality of movable magnet assemblies are evenly spaced from each other.
13. The magnetic device according to claim 10, wherein each of the plurality of movable magnet assemblies also comprises a frame to hold the plurality of magnets.
14. The magnetic device according to claim 13, wherein each of the plurality of movable magnet assemblies also comprises a plurality of holders that are fixed to the frame and configured for holding the plurality of magnets.
15. The magnetic device according to claim 14, wherein each of the plurality of holders comprises two rotatable wheels, and the support defines two parallel grooves to receive and guide the two rotatable wheels.
16. The magnetic device according to claim 11, wherein the plurality of movable magnet assemblies are evenly spaced from each other.
17. The magnetron sputtering device according to claim 2, wherein the plurality of movable magnet assemblies are evenly spaced from each other
Type: Application
Filed: Jun 8, 2010
Publication Date: Feb 3, 2011
Patent Grant number: 8382967
Applicant: HON HAI PRECISION INDUSTRY CO., LTD. (Tu-Cheng)
Inventor: SHAO-KAI PEI (Tu-Cheng)
Application Number: 12/796,620
International Classification: C23C 14/35 (20060101);