WAFER SIDE EDGE CLEANING APPARATUS
A wafer side edge cleaning apparatus includes: a cleaning device including a fixing element and a wafer brush disposed beneath the fixing element. The wafer brush is in the shape of a frustum. The frustum has a tapered surface contacting with a side edge of a wafer. The top surface of the frustum is larger than the bottom surface of the frustum. When cleaning the side edge of the wafer, the wafer and the wafer brush are rotated in different directions and a cleaning solution flows out from the fixing element rinses and washes the side edge brush.
1. Field of the Invention
The present invention relates to a wafer cleaning apparatus, and more particularly, to an apparatus for cleaning the side edge of a wafer.
2. Description of the Prior Art
Semiconductor chip fabrication is a complicated process that involves many manufacturing steps. These steps may include layering, patterning, etching, doping, chemical mechanical polishing (CMP), etc. It is well known that, during the various steps in these operations, the surfaces, or side edges of the semiconductor wafers will become contaminated with residues. In particular, the side edge of the wafer may suffer from peelings.
The removal of these contaminants and peelings is a priority to semiconductor chip fabricators because contaminants and peelings will pollute the chamber and influence the quality of the integrated circuit on the wafer.
Conventionally, one system used to remove wafer contaminants on the surface is a wafer cleaning device. In the wafer cleaning device, a semiconductor wafer is held to a stage. The stage has a vacuum suction member to suck the back side of the wafer, so the wafer can be disposed on the stage stably. Then, the wafer is rotated and the surface of the wafer is scrubbed by a brush.
Although a conventional wafer cleaning device can effectively clean the front side of the wafer, such systems fail to provide a cleaning method at the side edge/bevel area to remove contamination and peelings.
SUMMARY OF THE INVENTIONIt is therefore one objective of the present invention to provide an apparatus that cleans the side edge of wafers, including the bevel area (when present).
According to a preferred embodiment of the present invention, a wafer side edge cleaning apparatus includes: a wafer stage for holding and rotating a wafer, wherein the wafer has a side edge, and a cleaning element includes: a fixing element, and a wafer brush fixed onto the fixing element, the wafer brush having a tapered surface contacting the side edge of the wafer. The tapered surface defines a bottom surface and a top surface of the wafer brush; the bottom surface is away from the fixing element, the top surface contacts the fixing element, and the bottom surface is smaller than the top surface. A cleaning solution rinses the wafer brush when the side edge of the wafer is subject to cleaning by the wafer brush.
According to a preferred embodiment of the present invention, the tapered surface and the top surface define an included angle which is between 45 and 80 degrees.
According to another preferred embodiment of the present invention, the wafer side edge cleaning apparatus further includes a bolt disposed under the fixing element and penetrating the wafer brush, and a nut disposed under the wafer brush and screwed on the bolt to fix the wafer brush on the fixing element.
According to another preferred embodiment of the present invention, the side edge of the wafer comprises a bevel.
From one aspect, the features of the present invention are that the side edge of the wafer is cleaned by the tapered surface of the wafer brush. Because the tapered surface contacts the side edge of the wafer, the containments or peelings on the side edge can be adsorbed on the wafer brush so these containments or peelings can be removed.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
When the side edge 16 is subject to cleaning, the wafer 14 is rotated to a first direction: for example, the wafer 14 is rotated clockwise. At this point, a controlling arm 18 moves a cleaning element 20 downward, and a wafer brush 22 of the cleaning element 20 is therefore disposed at a side of the side edge 16 in a horizontal direction. Then, the controlling arm 18 moves the cleaning device 20 toward the side edge 16 of the wafer in a horizontal direction, and a tapered surface 24 of the wafer brush 22 contacts the side edge 16 of the wafer 14. At this point, the wafer brush 22 has a lateral force F2 and a downward force F3 with respect to the wafer 14. According to a preferred embodiment of the present invention, the suction force F1 should be greater than the downward force F3 provided by the wafer brush 22, otherwise one point on the rim of the wafer 14 will be raised upwards, making the wafer 14 act like a seesaw. The lateral force F2 should be equal to a coefficient of friction μ multiplied by the suction force F1; that is, F2=F1×μ. The coefficient of friction μ represents the coefficient of friction of the wafer 14 on the stage 12. In this way, the wafer 14 can be fixed on the stage 12 stably without moving in a lateral direction. Moreover, during the process of the side edge 16 of the wafer being cleaned, the wafer brush 22 is rotated to a second direction: for example, the wafer brush 22 can be rotated counterclockwise.
As shown in
It should be noted that the wafer brush 22 is preferably in the shape of a frustum. The wafer brush has a tapered surface 24, and the tapered surface 24 defines a bottom surface 34 and a top surface 36 of the wafer brush 22. The bottom surface 34 is away from the fixing element 26, and the top surface 36 contacts the fixing element 26. Moreover, the bottom surface 34 is smaller than the top surface 36. Referring to
As illustrated in
Please refer to
The difference between the cleaning element in
The fixing element of the present invention has openings so that the cleaning solution can flow out from the openings to rinse the wafer brush, and the tapered surface of the wafer brush contacting the side edge of the wafer can adsorb containments or peelings on the side edge. Furthermore, the cleaning solution can wash down the containments or peelings adsorbed on the wafer brush.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention.
Claims
1. A wafer side edge cleaning apparatus comprising:
- a wafer stage for holding and rotating a wafer, wherein the wafer has a side edge; and
- a cleaning element comprising: a fixing element; and a wafer brush fixed onto the fixing element, wherein the wafer brush has a tapered surface contacting the side edge of the wafer, the tapered surface defines a bottom surface and a top surface of the wafer brush, the bottom surface is away from the fixing element, the top surface contacts the fixing element, and the bottom surface is smaller than the top surface, and wherein a cleaning solution rinses the wafer brush when the side edge of the wafer is subject to cleaning by the wafer brush.
2. The wafer side edge cleaning apparatus of claim 1, wherein the tapered surface and the top surface define an included angle between 30 and 90 degrees.
3. The wafer side edge cleaning apparatus of claim 2, wherein the included angle is between 45 and 80 degrees.
4. The wafer side edge cleaning apparatus of claim 1, wherein the fixing element comprises at least one opening and the cleaning solution flows out from the opening.
5. The wafer side edge cleaning apparatus of claim 1, wherein the cleaning solution comprises de-ionized water.
6. The wafer side edge cleaning apparatus of claim 5, wherein the cleaning solution comprises conductive ions.
7. The wafer side edge cleaning apparatus of claim 1, wherein the wafer brush comprises resin.
8. The wafer side edge cleaning apparatus of claim 7, wherein the wafer brush comprises poly vinyl alcohol (PVA).
9. The wafer side edge cleaning apparatus of claim 1, wherein when the side edge of the wafer is subject to cleaning, the wafer is rotated to a first direction, and the wafer brush is rotated to a second direction so that contaminants on the side edge can be adsorbed on the wafer brush.
10. The wafer side edge cleaning apparatus of claim 1, further comprising a bolt disposed under the fixing element and penetrating the wafer brush, and a nut disposed under the wafer brush and screwed on the bolt to fix the wafer brush on the fixing element.
11. The wafer side edge cleaning apparatus of claim 1, wherein the side edge of the wafer comprises a bevel.
Type: Application
Filed: Jun 2, 2010
Publication Date: Dec 8, 2011
Inventors: JINGDONG JIA (Singapore), CHEE MONG LOO (Singapore), MINGKUI Zhang (Singapore), Yao-Hung Liu (Tainan County)
Application Number: 12/791,889