Blister Package
A blister package is provided for retaining individual product units. The blister package is formed by a receptacle substrate and an outer laminate. The receptacle substrate includes a sealing flange and one or more receptacle hollows for retaining product therein. The outer laminate includes a first layer covering a sealing layer, with the sealing layer bonded to the receptacle flange and covering the product within the hollows. A repeating score line pattern is formed in the outer laminate for promoting a tear in the laminate upon forcing the product from the receptacle hollow against the outer laminate. The score pattern extends substantially across the area of the outer laminate covering the receptacle hollow and includes a plurality of spaced score lines formed in a crosswise relationship.
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The present application is a continuation of copending Ser. No. 12/011,116, filed Jan. 24, 2008, which is presently allowed.
FIELD OF THE INVENTIONThe present invention relates to packaging and in particular blister packaging of the type used to retain product in a repeating pattern of receptacle hollows.
BACKGROUND OF THE INVENTIONBlister packages are commonly used to package ingestible products, such as candy, gum, powders, medicine tablets and the like. This type packaging is convenient for separately securing individual product portions or doses. Each individual product portion or dose may be dispensed from the package while leaving additional portions still packaged. Such blister packages may also be used for non-consumable products, such as toys, hardware, etc.
U.S. Pat. No. 5,150,793 to Tannenbaum shows a blister package having a blister sheet surrounded by a reinforcing housing made of paper. The receptacles of the blister sheet are covered by a sealing layer, which is in part formed by metallic foil. A plurality of openings is provided in registry with the blister receptacles when the package is surrounded by the paper housing. The openings align with the dimension of the blister receptacle to define an area created for forcing the item through the sealing layer.
US 2005/0284789 to Carespodi shows a push through blister package having a backing laminate with a metallic or foil layer therein. The laminate may include polymer blends as well as adhesive layers, which are affixed to the foil layer. The sealing layer is laser scored to assist in the push through dispensing of an item from the blister receptacle.
Japanese patent publications JP 05161692 and JP 07149367 appear to describe blister packages with laser slits on the sealing layer, which is made from a plastic film. The blister packages include a covering film having multiple slits formed therein, centrally positioned over a receptacle hollow.
U.S. Pat. No. 5,529,188 to Coggswell shows a blister package having a sealing layer including a plurality of crossed perforations and a plurality of perforations in a U-shaped pattern, each aligned with the receptacle.
U.S. Pat. No. 5,360,116 to Schmiletvky shows a blister package with a covering layer having a perforation pattern that surrounds the periphery of the receptacle hollow to provide a means for peeling of the covering layer away from the receptacle.
SUMMARY OF THE INVENTIONThe present invention relates to a blister package for retaining individual products, such as pills, pellets, powders or the like. The blister package is formed by a receptacle substrate and an outer laminate. The receptacle substrate includes a planer sealing flange and one or more receptacle hollows formed therein for retaining product. The outer laminate is bonded to the receptacle flange and covers the product within the hollows. A repeating score line pattern is formed in the outer laminate for propagation of a tear in the laminate upon forcing a product from the receptacle hollow against the outer laminate. The score line pattern extends substantially across the area of the outer laminate covering the receptacle hollows.
In one aspect of the invention, a plurality of spaced lines that form the repeating score line pattern are formed in a crosswise relationship with respect to one another. The score lines may be straight, include curves or include various combinations thereof. Further, the score lines may vary in length throughout the pattern. The score line pattern preferably extends across the entire area of the outer laminate. Further, the outer laminate may be made from a number of layers, including a top or first layer and a sealing layer. Also, the outer laminate is preferably formed from polymer materials, such as a top layer of an oriented polyethylene film and a sealing layer compatible with the flange of the blister receptacle and the top layer.
In a further aspect of the invention the score pattern may take a number of forms. For example, the plurality of spaced score lines may be formed in an overlapping relationship, with the ends of the lines positioned in a transverse or crosswise relationship with the body portion of an adjacent line.
In a further aspect of the invention, the repeating score pattern may be defined by a plurality of rows of longitudinal score lines, the score lines in at least one of the rows being oriented in alternating crosswise angle with respect to the direction of the row. The crosswise angle of the score lines of adjacent rows may also alternate from one row to the next. Further, the ends of the score lines may be directed substantially at the body of the adjacent lines. Alternatively, or in addition thereto, the ends of the score lines in the repeating pattern may be directed substantially towards the space between adjacent score lines.
For the purpose of illustrating the invention, there is shown in the drawings a number of forms which are presently preferred; it being understood, however, that the invention is not limited to the precise arrangements and instrumentalities shown.
Referring now to the drawings, where like numerals identify like elements, there is shown in
An outer laminate 20 is provided adjacent the sealing flange 14 of the substrate 12. As illustrated, the outer laminate 20 includes a first or top layer 22 and a sealing layer 24 positioned between the top layer 22 and the sealing flange 14. A pattern 26 of multiple score lines 28 is provided in the top layer 22. As illustrated in
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The sealing layer 24, in addition to adding to the overall strength of the outer laminate 20, serves as a bonding agent for the top layer 22 to the sealing flange 14 of the receptacle substrate 12. Selection of the material for the sealing layer 24 will depend on strength requirements as well as the need to bond the receptacle substrate material to the top layer 22. Preferably, the outer laminate 20 is heat sealed to the sealing flange 14 of the receptacle substrate 12 with the sealing layer being compatible with both materials. Various forms of adhesive or mechanical means may alternatively be utilized to adhere the various layers within the structure.
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The score line patterns as contemplated by the present invention may be incorporated into the outer laminate by any number of known methods, including laser absorption, die cutting, heat scoring or the like. Preferably, a rotary die cutting process is utilized, so as to mechanically control the depth of cut into the outer layer. Depth of cut is one option in controlling the effectiveness of the score pattern, while at the same time maintaining the package integrity under normal handling conditions. As illustrated in
In the drawings and specification, there has been set forth a number of embodiments of the invention and, although specific terms are employed, these terms are used in a generic and descriptive sense only and not for purposes of limitation. The scope of the invention is set forth in the following claims.
Claims
1. A blister package for retaining individual products, the package comprising:
- a receptacle substrate, the receptacle substrate having a planer sealing flange and at least one retaining receptacle hollow formed to retain product therein, and
- an outer laminate comprising a first layer having a score pattern thereon for promoting propagation of a tear in the outer laminate upon forcing the product from the receptacle hollow against the outer laminate, and a sealing layer positioned between the first layer and the receptacle substrate, the sealing layer bonded on one side to the receptacle substrate flange and covering the receptacle hollow, and the sealing layer bonded to the first layer on the opposite side of the sealing layer from the flange substrate and receptacle hollow,
- wherein the score pattern extends across the portion of the outer laminate covering the receptacle hollow of the receptacle substrate, the score pattern having two repeating line patterns positioned in a crosswise direction to one another, and
- wherein at least one of the line patterns is defined by a plurality of rows of curved score lines.
2. A blister package as in claim 1 wherein the curved score lines include a pattern of pair-sets of curved lines.
3. A blister package as in claim 2 wherein the pair-sets of curved score lines comprise opposing curves.
4. A blister package as in claim 1 wherein both repeating line patterns are defined by rows of curved score lines.
5. A blister package as in claim 1 wherein the curved score lines are “S” shaped.
6. A blister package as in claim 5 wherein both repeating line patterns are defined by rows of curved “S” shaped score lines.
7. A blister package as in claim 6 wherein the ends of the curved score lines are positioned adjacent and in an overlapping relationship with one another.
8. A blister package as in claim 1 wherein the two line patterns form a series of aligned rows.
9. A blister package as in claim 8 wherein the score lines within each of the aligned rows are oriented in alternating crosswise angle with respect to the direction of the score lines in each of the adjacent rows.
10. A blister package as in claim 1 wherein the score pattern is formed only in the first layer of the outer laminate.
11. A blister package as in claim 1 wherein the outer laminate is formed from polymer materials.
12. A blister package as in claim 1 wherein the sealing layer is heat sealed to the sealing flange of the receptacle substrate.
13. A blister package for retaining product therein, the package comprising:
- a receptacle substrate, the receptacle substrate having a sealing flange and at least one retaining receptacle hollow formed therein, the hollow formed for retaining one or more products therein,
- an outer layer, the outer layer formed from polymer film and bonded to the sealing flange and covering the receptacle hollow, and
- a score line pattern composed of a plurality of score lines, the score line pattern formed in the outer layer and extending across the area of the outer layer covering the receptacle hollow, the score lines within the score pattern extending into the outer layer at a defined depth, and
- the score line pattern defined by a first plurality of spaced score lines, wherein the first plurality of score lines are curved, and a second plurality of score lines, wherein the second plurality of score lines are positioned crosswise with respect to the direction of orientation of first plurality of score lines.
14. A blister package as in claim 13 wherein the depth of the score lines is less than the thickness of the outer layer.
15. A blister package as in claim 13 wherein the score lines within the second plurality of lines are curved.
16. A blister package as in claim 14 wherein the first and second plurality of curved score lines have an overlapping relationship, with an end of each line within the first plurality of score lines positioned transverse to a body portion of an adjacent line within the second plurality of score lines.
17. A blister package as in claim 13 wherein the material layers of the outer layer comprises a first layer having the score line pattern therein and a second layer for forming a seal between first layer and the sealing flange of the receptacle substrate.
18. A blister package as in claim 17 wherein the second layer is heat sealed to the flange of the receptacle substrate.
19. A blister package for retaining product therein, the package comprising:
- a receptacle substrate, the receptacle substrate having a planer sealing flange and at least one retaining receptacle hollow formed to retain product, and
- a top layer covering the receptacle hollow in the receptacle substrate, at least a portion of the top layer overlapping with and sealed to the planer sealing flange, and
- a repeating pattern of spaced score lines formed in the top layer for promoting upon application of a force thereto the propagation of a tear in the top layer, the score pattern extending across the portion of the top layer covering the at least one retaining receptacle hollow,
- the repeating score pattern defined by a plurality of rows of aligned curved score lines, the score lines within each of the plurality of rows positioned at transverse angle with respect one or more further rows of score lines.
20. A blister package as in claim 19 wherein the top layer further comprising a sealing layer, the sealing layer being heat sealed to the sealing flange of the receptacle substrate.
Type: Application
Filed: Nov 22, 2011
Publication Date: Mar 15, 2012
Applicant: Sonoco Development, Inc. (Hartsville, SC)
Inventors: Donald McArthur (Oswego, NY), Benjamin Davis (Columbia, SC)
Application Number: 13/301,887
International Classification: B65D 75/36 (20060101); B65D 83/04 (20060101);