SERIALLY-CONNECTED HEAT-DISSIPATING FIN ASSEMBLY

Abstract

A serially-connected heat-dissipating fin assembly includes a plurality of heat-dissipating fins and a thermal-conducting element. Each of the heat-dissipating fins is provided with a hollow connecting portion for allowing the thermal-conducting element to be disposed through. The inner edge of the connecting portion of the respective heat-dissipating fins is provided with a protruding wall. The protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions. The surface of the thermal-conducting element is brought into frictional contact with the abutting portions to thereby tightly fit into the connecting portions of the respective heat-dissipating fins. With the interference fit between the respective abutting portions and the surface of the thermal-conducting element, it is unnecessary to use solders.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat-dissipating member, in particular to a serially-connected heat-dissipating fin assembly.

2. Description of Prior Art

In order to facilitate the heat exchange performed by a thermal-conducting element (such as a heat pipe or a vapor chamber), heat-dissipating fins are usually mounted on the condensing end of the thermal-conducting element. Conventionally, the heat-dissipating fins are directly combined with the heat pipe or the vapor chamber by soldering. Alternatively, the heat pipe or vapor chamber is disposed through the heat-dissipating fins to serially connecting the heat-dissipating fins together. However, the conventional solution for serially connecting the heat-dissipating fins to the heat pipe or the vapor chamber involves the steps of providing through-holes on the respective heat-dissipating fins with their diameter corresponding to the outer diameter of the heat pipe or the external profile of the vapor chamber and serially connecting the heat-dissipating fins to the heat pipe or the vapor chamber by tight interference fit. However, a great friction force is generated between the heat-dissipating fins and the heat pipe or vapor chamber, so that it is not easy to assemble the heat-dissipating fins with the heat pipe or vapor chamber together. Thus, in practice, a common way is to form the through-holes with a larger diameter for admitting the heat pipe or the vapor chamber to be disposed through easily, and then to fill solders in the gaps between the heat-dissipating fins and the heat pipe or the vapor chamber.

Although the filling of solders in the gaps between the heat-dissipating fins and the heat pipe or the vapor chamber can increase the stability of connection therebetween, using more solders inevitably raises the manufacturing cost and affects the external appearance of the connecting portions between the heat-dissipating fins and the heat pipe or the vapor chamber. As a result, some solders are wasted, and it takes more time to assemble these elements together.

In view of the above, the present Inventor proposes a reasonable and novel structure based on his research and expert knowledge.

SUMMARY OF THE INVENTION

The present invention is to provide a serially-connected heat-dissipating fins assembly, in which a plurality of abutting portions is provided for generating an interference fit, so that the heat-dissipating fins can be assembled with a thermal-conducting element, such as a heat pipe or a vapor chamber, without using solders, thereby reducing material cost and manufacturing cost.

The present invention provides a serially-connected heat-dissipating fin assembly including a plurality of heat-dissipating fins and a thermal-conducting element. Each of the heat-dissipating fins is provided with a hollow connecting portion for allowing the thermal-conducting element to be disposed through. The inner edge of the connecting portion of the respective heat-dissipating fins is provided with a protruding wall. The protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions. The surface of the thermal-conducting element is brought into frictional contact with the abutting portions to thereby tightly fit into the connecting portions of the respective heat-dissipating fins.

BRIEF DESCRIPTION OF DRAWING

FIG. 1 is an exploded perspective view according to a first embodiment of the present invention;

FIG. 2 is an assembled perspective view according to the first embodiment of the present invention;

FIG. 3 is an assembled cross-sectional view according to the first embodiment of the present invention;

FIG. 4 is an exploded perspective view according to a second embodiment of the present invention;

FIG. 5 is an assembled cross-sectional view according to the second embodiment of the present invention;

FIG. 6 is an exploded perspective view according to a third embodiment of the present invention; and

FIG. 7 is an assembled cross-sectional view according to the third embodiment of the present invention;

DETAILED DESCRIPTION OF THE INVENTION

The characteristics and technical contents of the present invention will be further understood with reference to the following detailed description and the accompanying drawings. It is noteworthy to point out that the drawings is provided for the illustration purpose only, but not intended for limiting the scope of the present invention.

FIG. 1 is an exploded perspective view according to the first embodiment of the present invention, and FIG. 2 is an assembled perspective view according to the first embodiment of the present invention. The present invention provides a serially-connected heat-dissipating fin assembly, which includes a plurality of heat-dissipating fins 1 and a thermal-conducting element 2 disposed through the heat-dissipating fins 1.

The external profile of the respective heat-dissipating fins 1 can be varied according to practical demands. Each of the heat-dissipating fins 1 is provided with a hollow connecting portion 10 for allowing the thermal-conducting element 2 to be disposed through. The connecting portion 10 further extends to one side of the heat-dissipating fin 1 to form an opening 100 as shown in FIG. 3. Via this opening 100, the thermal-conducting element 2 can be disposed in the connecting portions 10 of the respective heat-dissipating fins 1. Further, the outer edge (e.g. upper edge or lower edge) of the respective heat-dissipating fins 1 may be bent to form a fold 13.

The thermal-conducting element 2 may be a heat pipe or a vapor chamber for serially connecting the heat-dissipating fins 1 to form a stacked structure. The thermal-conducting element 2 is disposed through the connecting portions 10 of the respective heat-dissipating fins 1. Alternatively, the thermal-conducting element 2 is transversely disposed into the connecting portions 10 of the respective heat-dissipating fins 1 via the opening 100. In this way, the respective heat-dissipating fins 2 can be serially connected to the thermal-conducting element 2 to form one body.

The primary technical characteristic of the present invention lies in that the inner edge of the connecting portion 10 of each heat-dissipating fin 1 is formed with a continuous protruding wall 11, and the protruding wall 11 is provided with a plurality of abutting portions 12 slightly protruding toward the connecting portions 10. Each of the abutting portions 12 only protrudes from the surface of the protruding wall 11 by 3 to 5 μm. In the first embodiment of the present invention, each of the abutting portions 12 is a boss. By this structure, when the thermal-conducting element 2 is disposed through the connecting portions 10 of the respective heat-dissipating fins 1 or disposed into the connecting portions 10 via the opening 100, the surface of the thermal-conducting element 2 is brought into frictional contact with the abutting portions 12 to thereby tightly fit into the connecting portions 10 of the respective heat-dissipating fins 1. In this way, it is unnecessary to use solders to assemble the thermal-conducting element 2 with the heat-dissipating fins 1, which accelerates the assembly and reduces the material cost and manufacturing cost.

FIG. 4 is an exploded perspective view according to the second embodiment of the present invention, and FIG. 5 is an assembled cross-sectional view according to the second embodiment of the present invention. Each of the abutting portions 12 is formed with a notch 120 on the protruding wall 11. Each of the heat-dissipating fins 1 is provided with interference flanges 121 slightly protruding toward the connecting portion 10 corresponding to the notches 120 respectively. By this structure, when the thermal-conducting element 2 is disposed through the connecting portions 10 of the heat-dissipating fins 1 or disposed into the connecting portions 10 via the opening 100, the surface of the thermal-conducting element 2 can be still brought into frictional contact with the interference flanges 121 of the abutting portions 12 to thereby tightly fit into the connecting portions 10 of the heat-dissipating fins 1 respectively.

FIG. 6 is an exploded perspective view according to the third embodiment of the present invention, and FIG. 7 is an assembled cross-sectional view according to the third embodiment of the present invention. The protruding wall 11 is formed into a U shape. Both sides of the U-shaped structure are formed into a stepped portion gradually widening from the opening 100 toward the interior of the connecting portion 10. By this arrangement, the heat-dissipating fins 1 generate a clamping force to the thermal-conducting element 2, thereby preventing the thermal-conducting element 2 from falling off.

With the above constitution, the serially-connected heat-dissipating fin assembly of the present invention can be obtained.

Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims

1. A serially-connected heat-dissipating fin assembly, including:

a plurality of heat-dissipating fins each provided with a hollow connecting portion; and

a thermal-conducting element disposed through the connecting portions of the heat-dissipating fins;

wherein an inner edge of the connecting portion of each heat-dissipating fin is provided with a protruding wall, the protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions, the surface of the thermal-conducting element is brought into friction contact with the abutting portions to thereby tightly fit into the connecting portions of the heat-dissipating fins.

2. The serially-connected heat-dissipating fin assembly according to claim 1, wherein an outer edge of each heat-dissipating fin is bent to form a fold.

3. The serially-connected heat-dissipating fin assembly according to claim 1, wherein the connecting portion is formed with an opening.

4. The serially-connected heat-dissipating fin assembly according to claim 1, wherein the connecting portion further extends to one side of the heat-dissipating fin to form an opening.

5. The serially-connected heat-dissipating fin assembly according to claim 4, wherein the protruding wall is formed into a U shape, both sides of the U-shaped protruding wall are formed into a stepped portion gradually widening from the opening toward the interior of the connecting portion.

6. The serially-connected heat-dissipating fin assembly according to claim 1, wherein each of the abutting portions protrudes from the surface of the protruding wall by 3 to 5 μm.

7. The serially-connected heat-dissipating fin assembly according to claim 1, wherein each of the abutting portions is formed into a boss.

8. The serially-connected heat-dissipating fin assembly according to claim 1, wherein each of the abutting portions is formed with a notch on the protruding wall, the heat-dissipating fins are respectively provided with interference flanges slightly protruding toward the connecting portions corresponding to the notches.

9. The serially-connected heat-dissipating fin assembly according to claim 1, wherein the thermal-conducting element is a heat pipe.

10. The serially-connected heat-dissipating fin assembly according to claim 1, wherein the thermal-conducting element is a vapor chamber.