HEAT DISSIPATING APPARATUS AND METHOD FOR MANUFACTURING SAME
An exemplary heat dissipation apparatus includes a stack of fins, a heat pipe extending through the fins, and a resilient plate fixed between the fins and the heat pipe. The fins are spaced from each other. Each of the fins defines a through hole therein for extending of the heat pipe therethrough. The heat pipe is mounted in the through hole. The resilient plate is fixed in the through hole and located between an edge of the through hole of the fin and the heat pipe, pushing the heat pipe into abutting engagement against the fin.
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1. Technical Field
The present disclosure generally relates to heat dissipation in electronics, and particularly to a heat dissipation apparatus for electronic components and a method for manufacturing the heat dissipation apparatus.
2. Description of Related Art
With developments in electronics technology, increased performance of electronic components such as CPUs (central processing units) has been achieved. However, such electronic components generate increased levels of heat, which must be dissipated promptly. Conventionally, a heat dissipation apparatus which includes a fin assembly and a heat pipe extending through the fin assembly is used to remove the heat generated by the electronic component.
The fin assembly includes a plurality of fins evenly spaced from each other. Each of the fins defines a through hole therein, for extending of the heat pipe therethrough. The heat pipe includes an evaporation section and a condensing section at two opposite ends thereof. The evaporation section is thermally attached to the electronic component to absorb heat therefrom. The condensing section is received in the through holes of the fins, to transfer the heat from the evaporation section to the fin assembly. In order to ensure a high heat conductive efficiency between the condensing section of the heat pipe and the fins, typically, the condensing section of the heat pipe is soldered in the through holes of the fins.
During the soldering process, the heat pipe is inserted in the through holes of the fins and coated with a proper amount of solder. Then the fin assembly together with the heat pipe is put in a soldering stove. In the soldering stove, the solder melts down to fill in a gap between the heat pipe and an edge of the through hole of each fin. When the solder cools down, the heat pipe is intimately soldered in the through hole of the fin. However, the solder is typically composed of a lot of heavy metals, such as lead, tin or others, which if mishandled can cause permanent damage to humans or the environment.
Therefore, what is needed is a heat dissipation apparatus and a method for manufacturing the heat dissipation apparatus which can overcome the described limitations.
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Each fin 11 further defines two rectangular recesses 113 therein, adjacent the through holes 112, respectively. Each recess 113 communicates with the corresponding through hole 112. A collar 114 protrudes perpendicularly from the fin 11 at each of the through holes 112. The collar 114 is C-shaped, and surrounds a majority of the corresponding through hole 112. A gap 1141 is defined in the collar 114, corresponding to the recess 113 adjacent to the through hole 112. That is, the gap 1141 is located between the two ends of the C-shape of the collar 114. The gap 1141 is aligned and communicates with the recess 113. Perpendicular projections of the two ends of the collar 114 at two opposite sides of the gap 1141 relative to the fin 11 project into the corresponding recess 113 (see
Each of the heat pipes 20 includes an evaporation section 21 and a condensing section 22 at two opposite ends thereof. The evaporation section 21 is adapted to be thermally attached to an electronic component (not shown) to absorb heat therefrom. The condensing section 22 is mounted in the through hole 112 and the corresponding collar 114 of each fin 11 through interference fit (see below). The condensing section 22 has a generally D-shaped cross section, and includes a plane surface 221 and a curved surface 222 adjoining each other. The plane surface 221 of the condensing section 22 is oriented towards the recess 113 and the gap 1141 of the collar 114 of each fin 11. The curved surface 222 of the condensing section 22 is oriented towards a majority of a periphery of the through hole 112 other than at the recess 113, and abuts against an inner wall of the collar 114.
Each resilient plate 30 is strip-shaped, and extends through the corresponding through hole 112 of each fin 11. The resilient plate 30 has a generally saddle-shaped cross section (see
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In the heat dissipation apparatus 100, the condensing section 22 of each heat pipe 20 is punched to deform and thus be fittingly mounted in the collar 114 of each fin 11 through an interference fit instead of through, e.g., soldering. This avoids the use of solder comprised of heavy metals. In addition, each resilient plate 30 of the heat dissipation apparatus 100 is resiliently fixed between each fin 11 and the condensing section 22 of the corresponding heat pipe 20, to push the condensing section 22 to abut against the inner wall of the collar 114 and further ensure an intimate contact between the heat pipe 20 and the fin assembly 10. Furthermore, unlike with conventional heat dissipation apparatuses, soldering stoves are not needed during manufacturing of the heat dissipation apparatus 100. This not only simplifies the manufacturing process of the heat dissipation apparatus 100, but also can reduce a manufacturing cost of the heat dissipation apparatus 100.
Referring to
During a punching process for manufacturing the heat dissipation apparatus 110a, the resilient plate 30 deforms resiliently when the abutting flanges 32 thereof respectively run into the two protruding tongues 1131, until the resilient plate 30 enters the through hole 112 of the fin 11. After passing through the gap 1141a, the resilient plate 30 rebounds to its original state. The abutting portion 31 of the resilient plate 30 abuts against the plane surface 221 of the condensing surface 22, and the two abutting flanges 32 respectively abut against the two protruding tongues 1131.
It is to be understood, however, that even though numerous characteristics and advantages of the exemplary embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and that changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims
1. A heat dissipation apparatus comprising:
- a plurality of fins stacked together and spaced from each other, each of the fins defining a through hole therein;
- a heat pipe mounted in the through holes of the fins; and
- a resilient plate fixed in the through hole of each fin and located between an edge of the through hole of the fin and the heat pipe, the resilient plate pushing the heat pipe into abutting engagement against the fin.
2. The heat dissipation apparatus of claim 1, wherein the resilient plate is strip-shaped, two opposite lateral edges of the resilient plate abut against each of the fins, and a middle of the resilient plate between the two lateral edges abuts against the heat pipe.
3. The heat dissipation apparatus of claim 2, wherein a collar protrudes from the edge of the through hole of each of the fins, and the heat pipe is interferingly mounted in the collars of the fins with the two opposite lateral edges of the resilient plate abutting against inner walls of the collars.
4. The heat dissipation apparatus of claim 3, wherein each fin further defines a recess therein adjacent to the through hole, the recess communicates with the through hole, the collar is C-shaped such that a gap is defined in the collar, the gap communicates with the recess, and perpendicular projections of two ends of the collar at two opposite sides of the gap relative to the fin project into the recess.
5. The heat dissipation apparatus of claim 2, wherein each of the fins further defines a recess therein adjacent to the through hole, the recess communicates with the through hole, two protruding tongues of the fin bound two opposite sides of the recess, the two protruding tongues face each other, and the two opposite lateral edges of the resilient plate respectively abut against the two protruding tongues.
6. The heat dissipation apparatus of claim 5, wherein a collar protrudes from the edge of the through hole of each fin, the collar is C-shaped such that a gap is defined in the collar, the gap communicates with the recess, the heat pipe is interferingly mounted in collar, and perpendicular projections of two ends of the collar at two opposite sides of the gap relative to the fin are located farther away from the recess than the two protruding tongues.
7. The heat dissipation apparatus of claim 2, wherein the resilient plate comprises an abutting portion at the middle thereof and two abutting flanges at two opposite lateral sides of the abutting portion, the abutting portion abuts against the heat pipe, and the abutting flanges abut against each of the fins.
8. The heat dissipation apparatus of claim 1, wherein the heat pipe comprises a plane surface and a curved surface adjacent to the plane surface, the curved surface abuts against each fin, and the resilient plate abuts against the plane surface.
9. A method for manufacturing a heat dissipation apparatus, comprising:
- providing a plurality of fins each of which defines a through hole and a recess therein, the recess being adjacent to and communicating with the through hole, the fins spaced from each other;
- providing a heat pipe and inserting the heat pipe in the through holes of the fins;
- providing a resilient plate and inserting the resilient plate in the recesses of the fins;
- providing a punching tool, and driving the punching tool to punch the resilient plate to cause the resilient plate to enter the through holes and press the heat pipe to abut against the fins, the heat pipe thereby deforming and becoming interferingly fixed in the through holes, with the resilient plate fixed in the through holes and located between edges of the through holes of the fins and the heat pipe.
10. The method of claim 9, wherein the resilient plate is strip-shaped, two opposite lateral edges of the resilient plate abut against the fin, and a middle of the resilient plate between the two opposite lateral edges abuts against the heat pipe.
11. The method of claim 10, wherein a collar protrudes from the edge of the through hole of each of the fins, the collar is C-shaped such that a gap is defined in the collar, the gap communicates with the recess, perpendicular projections of two ends of the collar at two opposite sides of the gap relative to the fin project in the recess, when the heat pipe is pressed to deform, the heat pipe is interferingly fixed in collar, and the two opposite lateral edges of the resilient plate abutting against inner walls of the collars.
12. The method of claim 10, two protruding tongues of the fin bound two opposite sides of the recess, the two protruding tongues face each other, and when the heat pipe is pressed to deform, and the two opposite lateral edges of the resilient plate respectively abut against the two protruding tongues.
13. The method of claim 12, wherein a collar protrudes from the edge of the through hole of each fin, the collar surrounds a majority the through hole, the collar is C-shaped such that a gap is defined in the collar, the gap communicates with the recess, perpendicular projections of two ends of the collar at two opposite sides of the gap relative to the fin are located farther away from the recess than the two protruding tongues, and when the punching process is over, the heat pipe is mounted in collar through interference fit.
14. The method of claim 10, wherein the resilient plate comprises an abutting portion at the middle thereof and two abutting flanges formed at two longitudinal lateral sides of the abutting portion, the abutting portion abuts against the heat pipe, and the abutting flanges abut against each of the fins.
15. The method of claim 9, when the heat pipe is pressed to deform, a plane surface and a curved surface are formed on the heat pipe, the plane surface and the curved surface adjoins each other, the curved surface abuts against the fin, and the resilient plate abuts against the plane surface of the heat pipe.
16. A heat dissipation apparatus comprising:
- a plurality of parallel fins stacked together and spaced from each other, each of the fins defining a through hole therein;
- a heat pipe mounted in the through holes of the fins; and
- a resilient plate fixed in the through hole of each fin and located between an edge of the through hole of the fin and the heat pipe, the resilient plate elastically urging the heat pipe and a portion of the fin at the through hole such that the heat pipe abuts against another portion of the fin at the through hole and is in intimate thermal contact with the other portion of the fin.
17. The heat dissipation apparatus of claim 16, wherein the resilient plate is strip-shaped and has a saddle-shaped cross section, the resilient plate comprises an abutting portion at a middle thereof and two abutting flanges formed at two longitudinal lateral sides of the abutting portion, the abutting portion abuts against the heat pipe, and the abutting flange abuts against each of the fins.
18. The heat dissipation apparatus of claim 17, wherein a collar protrudes from each of the fins from the edge the through hole of the fin, the heat pipe is interferingly mounted in the collars of the fins, and the two abutting flanges of the resilient plate abut against an inner wall of the collar.
19. The heat dissipation apparatus of claim 18, wherein each fin further defines a recess therein adjacent to the through hole, the recess communicates with the through hole, the collar is C-shaped such that a gap is defined in the collar, the gap communicates with the recess, and perpendicular projections of two ends of the collar at two opposite sides of the gap relative to the fin project into the recess.
20. The heat dissipation apparatus of claim 17, wherein the fin further defines a recess therein adjacent to the through hole, the recess communicate with the through hole, two protruding tongues of the fin bound two opposite sides of the recess, the two protruding tongues face each other, and the two abutting flanges of the resilient plate respectively abut against the two protruding tongues.
Type: Application
Filed: Apr 28, 2011
Publication Date: Jul 26, 2012
Applicants: FOXCONN TECHNOLOGY CO., LTD. (Tu-Cheng), FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. (Shenzhen City)
Inventors: JING ZHANG (Shenzhen City), JIAN LIU (Shenzhen City), XING-HUA HE (Shenzhen City)
Application Number: 13/097,014
International Classification: F28D 15/04 (20060101);