ORGANIC PACKAGING CARRIER
An organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a meterial of the sealing metal layer includes AgSn and is lead-free.
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This application is a continuation-in-part of and claims the priority benefit of U.S. patent application No. 13/111,960, filed on May 20, 2011, now pending, which is a divisional of U.S. application Ser. No. 12/850,643, filed on Aug. 5, 2010, now patent No. 7,973,454, which claims the priority benefit of Taiwan application serial no. 99118186, filed on Jun. 4, 2010. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
TECHNICAL FIELDThe technical field relates to an organic packaging carrier.
BACKGROUNDIn recent sensor packaging technology, the correlation between vibration damping of sensors and vibration frequency as well as a sensing signal-to-noise ratio is taken into account, so the sensors need to be driven under a high negative pressure environment. Therefore, power consumption caused by collision of gas molecules can be reduced, and then the quality factor of the motion sensors can be improved and the sensing signal-to-noise ratio can be increased. As such, a sensor device package should provide the sensor device a stable, high negative pressure environment. That is, gas leakage must be prevented, and the pressure environment in a sensing space in the sensor device package cannot be changed as time goes on. Accordingly, the design need of such a sensor device (e.g. a vibrator, a radio frequency switch, a gyroscope, and so on) must comply with a hermetic sealing requirement.
Low temperature co-fired ceramic (LTCC) carriers made of dense materials can well block gas and thus have been extensively applied to conventional sensor device packages satisfying the hermetic sealing requirement.
However, when the LTCC carrier is applied, each sensor device package needs to be formed individually.
SUMMARYOne of exemplary embodiments comprises an organic packaging carrier. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a meterial of the sealing metal layer includes AgSn and is lead-free.
Several exemplary embodiments accompanied with figures are described in detail to further describe the disclosure.
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.
In
The organic packaging carrier 100 includes an organic substrate 108, a conductive circuit layer 110, and an inorganic hermetic insulation film 112. The organic substrate 108 has a first surface 108a and a second surface 108b. The conductive circuit layer 110 is located on the first surface 108a and exposes a portion of the first surface 108a. Besides, the conductive circuit layer 110 includes at least a conductive layer 114 and a sealing ring 116. The conductive layer 114 and the sealing ring 116 are basically in the same material layer, while the locations and the functions of the conductive layer 114 and the sealing ring 116 on the organic substrate 108 are different. The sensor device 104, for example, is a vibrator device, a sensing chip, and so on. The inorganic hermetic insulation film 112 at least covers the exposed first surface 108a to achieve an effect of completely hermetically sealing the organic packaging carrier 100.
In the disclosure, the so-called “inorganic hermetic insulation film” is made of a dense material capable of reducing the transmission rate of gas molecules, applying electrical insulation, and blocking moisture. For instance, the material of the inorganic hermetic insulation film 112 can be inorganic glass, ceramics, aluminum nitride, silicon oxide, aluminum oxide, and so forth. In addition, the inorganic hermetic insulation film 112 can be further extended and cover a portion of the conductive circuit layer 110, so as to ensure accomplishment of the hermetic sealing effect.
With reference to
In the exemplary embodiment, the organic substrate 108 is, for example, a printed circuit board (PCB) reinforced by fiber or a flexible substrate, e.g. a polyimide (PI) substrate. It is optional to form circuits such as back wires 122 and conductive through holes 124 penetrating through the organic substrate 108 on the second surface 108b of the organic substrate 108. Nevertheless, the organic packaging carrier 100 is not limited to the PCB. As long as the inorganic hermetic insulation film 112 is formed to cover the first surface 108a of the organic substrate 108 exposed by the conductive circuit layer 110, the hermetically sealing effect can be accomplished. Given the surface of the organic substrate 108 is covered by a composite layer including an organic polymer material and an inorganic material, moisture may escape from a junction between the organic polymer material and the inorganic material to the hermetic space 118, and thereby the hermetic sealing effect cannot be achieved.
It should be noted that the same reference numerals in
With reference to
With reference to
The organic packaging carrier described in the previous exemplary embodiments not only can serve as the packaging carrier of the sensor device but also can be applied to other packages in compliance with the hermetic sealing requirement.
The afore-mentioned drawings are cross-sectional views, and the disclosure is further provided in detail with reference to
In
In
The detailed structure of the organic packaging carrier is elaborated with reference to the aforesaid process, while the aforesaid process poses no limitation to the fabrication process described in this disclosure.
In addition, given the conductive cap described in the first or the third exemplary embodiment is a metal cap, a plurality of square caps 702 can be formed by exemplarily performing a pressing process on an entire metal piece 700, as shown in
In
In the exemplary embodiment, the organic substrate 802 is, for example, a printed circuit board (PCB) reinforced by fiber or a flexible substrate, e.g. a polyimide (PI) substrate. It is optional to form circuits such as back wires 812 on the second surface 802b and conductive through holes 814 penetrating through the organic substrate 802.
In the organic packaging carrier 900 as shown in
In the exemplary embodiment, a metal reinforcement layer 904 may be located on a surface of the inorganic hermetic insulation film 902, so as to improve toughness of the inorganic hermetic insulation film 902. The metal reinforcement layer 904 itself is also conducive to accomplishment of the hermetic sealing effect. The metal reinforcement layer 904 does not come into contact with and is electrically insulated from the conductive circuit layer 804. A material of the metal reinforcement layer 904 may be the same as that of the conductive circuit layer 804, and alternatively, the material of the metal reinforcement layer 904 may be different from that of the conductive circuit layer 804.
In additions, a metal adhesive layer 906 may be formed between the inorganic hermetic insulation film 902 and the metal reinforcement layer 904 to enhance adhesion therebetween. The metal adhesive layer 906, the inorganic hermetic insulation film 902, and the metal reinforcement layer 904 can all block moisture. The organic packaging carrier 900 not only can serve as the packaging carrier of the sensor device but also can be applied to other packages in compliance with the hermetic sealing requirement.
In light of the foregoing, the sealing metal layer is made of AgSn, and thus it can reduce the manufacture cost. Furthermore, since the organic substrate itself is not equipped with the gas-blocking function, the surface of the organic substrate exposed by the metal layer is covered by the hermetic insulation film, and therefore gas can be prevented from entering into the surface of the entire carrier. In addition, the metal reinforcement layer capable of improving toughness can also cover the hermetic insulation film. After the organic packaging carrier that can block entry of gas is formed, the sensor device package complying with the hermetic sealing requirement can be further formed.
Although the disclosure has been described with reference to the above exemplary embodiments, it will be apparent to one of the ordinary skill in the art that modifications to the described exemplary embodiments may be made without departing from the spirit of the disclosure. Accordingly, the scope of the disclosure will be defined by the attached claims not by the above detailed descriptions.
Claims
1. An organic packaging carrier, comprising:
- an organic substrate having a first surface;
- a conductive circuit layer, located on the first surface and comprising at least a conductive layer and a sealing ring, wherein the sealing ring is a closed ring; and
- a sealing metal layer, located on the sealing ring, wherein a meterial of the sealing metal layer includes AgSn and is lead-free.
2. The organic packaging carrier as claimed in claim 1, wherein the conductive layer and the sealing ring are in the same material layer.
3. The organic packaging carrier as claimed in claim 1, wherein the organic substrate comprises a polyimide substrate or a printed circuit board reinforced by fiber.
4. The organic packaging carrier as claimed in claim 1, wherein a portion of the first surface is exposed by the conductive circuit layer.
5. The organic packaging carrier as claimed in claim 4, further comprising an inorganic hermetic insulation film, at least covering the exposed first surface to achieve an effect of hermetically sealing the organic packaging carrier.
6. The organic packaging carrier as claimed in claim 5, wherein the inorganic hermetic insulation film is extended and covers a portion of the conductive circuit layer.
7. The organic packaging carrier as claimed in claim 5, wherein a material of the inorganic hermetic insulation film comprises inorganic glass, ceramics, aluminum nitride, silicon oxide, or aluminum oxide.
8. The organic packaging carrier as claimed in claim 5, further comprising a metal reinforcement layer located on a surface of the inorganic hermetic insulation film to improve toughness of the inorganic hermetic insulation film and to block moisture.
9. The organic packaging carrier as claimed in claim 8, wherein a material of the metal reinforcement layer is the same as the meterial of the sealing metal layer.
10. The organic packaging carrier as claimed in claim 8, wherein a material of the metal reinforcement layer is different from the material of the sealing metal layer.
11. The organic packaging carrier as claimed in claim 8, further comprising a metal adhesive layer located between the inorganic hermetic insulation film and the metal reinforcement layer.
Type: Application
Filed: Jun 7, 2012
Publication Date: Sep 27, 2012
Patent Grant number: 9343651
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu)
Inventors: Lung-Tai Chen (Kaohsiung City), Tzong-Che Ho (Hsinchu City), Li-Chi Pan (Hsinchu County), Yu-Wen Fan (Hsinchu City)
Application Number: 13/490,480
International Classification: H01L 23/12 (20060101);