APPARATUS FOR REDUCING ETCHING MARKS ON SOLAR CELL SURFACE
An apparatus for reducing etching marks on a solar cell surface includes an etching bath, an etchant-feeding pipe configured in the etching bath, and a bubble guiding device that covers the etchant-feeding pipe. The bubble guiding device guides bubbles discharged from the etchant-feeding pipe to move toward at least one end of the etchant-feeding pipe for reducing etching marks on the solar cell surface.
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This application claims the priority benefit of Taiwan application serial no. 100112653, filed on Apr. 12, 2011. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
BACKGROUND OF THE INVENTION1. Field of the Invention
The invention relates to an apparatus for etching a solar cell. More particularly, the invention relates to an apparatus for reducing etching marks on a solar cell surface.
2. Description of Related Art
Solar cell is a clean energy source which can generate electricity directly from sunlight due to photoelectric effects. Currently, in various kinds of solar cell, the silicon solar cell has been developed and most extensively applied.
During the isolation process, an etching apparatus that can cyclically provide etchant is often applied. Given that bubbles pile up in an etchant-feeding pipe to a certain quantity during the etching process, the accumulative bubbles are likely to become large bubbles that may be unexpectedly discharged. Thereby, etching marks are indirectly generated on the silicon substrate 100, as indicated in
As shown in the top view of
In the invention, an apparatus for reducing etching marks on a solar cell surface is provided. By applying the apparatus, the etching marks caused by air bubbles are not formed on the solar cell surface.
In an embodiment of the invention, an apparatus for reducing etching marks on a solar cell surface is provided. The apparatus includes an etching bath, an etchant-feeding pipe configured in the etching bath, and a bubble guiding device covering the etchant-feeding pipe for guiding bubbles discharged from the etchant-feeding pipe to move toward at least one end of the etchant-feeding pipe.
According to an embodiment of the invention, the bubble guiding device includes a filter.
According to an embodiment of the invention, the bubble guiding device further includes a fixing member that is configured in the middle of the etchant-feeding pipe for fixing the filter.
According to an embodiment of the invention, the bubble guiding device further includes at least one supporting member that is configured at the end of the etchant-feeding pipe for supporting the filter.
According to an embodiment of the invention, a plurality of etchant outlets are configured between the ends of the etchant-feeding pipe.
According to an embodiment of the invention, the apparatus further includes an etchant-feeding bath that is connected to the etchant-feeding pipe, so as to continuously provide the etching bath with an etchant.
According to an embodiment of the invention, the apparatus further includes a motor for pumping the etchant from the etchant-feeding bath and moving the drawn etchant into the etching bath.
According to an embodiment of the invention, the apparatus further includes an etchant recycling pipe that is connected between the etching bath and the etchant-feeding bath, so as to cyclically provide the etchant.
According to an embodiment of the invention, the apparatus further includes a silicon substrate moving device that is configured above the etchant-feeding pipe in the etching bath.
According to an embodiment of the invention, the silicon substrate moving device includes a plurality of rollers for continuously moving a silicon substrate.
Based on the above, in the apparatus described in the embodiments of the invention, the bubble guiding device guides the bubbles discharged from the etchant-feeding pipe to move toward the ends of the etchant-feeding pipe, and thereby the etching marks caused by the bubbles are less likely to be formed on the solar cell surface.
Other features and advantages of the invention will be further understood from the further technological features disclosed by the embodiments of the invention wherein there are shown and described embodiments of this invention, simply by way of illustration of modes best suited to carry out the invention.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
A description accompanied with the drawings is provided below to sufficiently explain embodiments of the invention. However, it is noted that the invention can still be implemented in many other different forms and should not be construed as limited to the embodiments described hereinafter. As a matter of fact, the embodiments are provided to render the disclosure of the invention more explicit and complete, so as to fully convey the scope of the invention to people having ordinary skill in the pertinent art. In the drawings, for the purpose of clarity, the dimensions and the relative dimensions of each component and each region may not be illustrated in accurate proportion.
With reference to
As indicated in
The effects of the invention are elaborated below. Specifically, an etching process is continuously performed on a silicon substrate by the apparatus depicted in
With reference to
In view of the above, the etching apparatus applied in the etching process of the solar cell is improved in the invention. Thereby, the etching marks caused by the bubbles are far less likely to be formed on the solar cell surface. Further, by applying the etching apparatus described in the embodiments of the invention, it is no longer necessary to shut off the machine in order to discharge the bubbles.
Although the invention has been described with reference to the above embodiments, it will be apparent to one of the ordinary skill in the art that modifications to the described embodiments may be made without departing from the spirit of the invention. Accordingly, the scope of the invention will be defined by the attached claims rather than by the above detailed descriptions.
Claims
1. An apparatus for reducing etching marks on a solar cell surface, the apparatus being adapted to a process of etching a solar cell, the apparatus at least comprising:
- an etching bath;
- an etchant-feeding pipe configured in the etching bath; and
- a bubble guiding device covering the etchant-feeding pipe, so as to guide bubbles discharged from the etchant-feeding pipe to move toward at least one end of the etchant-feeding pipe.
2. The apparatus as claimed in claim 1, wherein the bubble guiding device comprises a filter.
3. The apparatus as claimed in claim 2, wherein the bubble guiding device further comprises a fixing member configured in the middle of the etchant-feeding pipe for fixing the filter.
4. The apparatus as claimed in claim 2, wherein the bubble guiding device further comprises at least one supporting member configured at the at least one end of the etchant-feeding pipe for supporting the filter.
5. The apparatus as claimed in claim 1, wherein a plurality of etchant outlets are configured between the ends of the etchant-feeding pipe.
6. The apparatus as claimed in claim 1, further comprising an etchant-feeding bath connected to the etchant-feeding pipe, so as to continuously provide the etching bath with an etchant.
7. The apparatus as claimed in claim 6, further comprising a motor for pumping the etchant from the etchant-feeding bath and moving the pumped etchant into the etching bath.
8. The apparatus as claimed in claim 6, further comprising an etchant recycling pipe connected between the etching bath and the etchant-feeding bath, so as to cyclically provide the etchant.
9. The apparatus as claimed in claim 1, further comprising a silicon substrate moving device configured above the etchant-feeding pipe in the etching bath.
10. The apparatus as claimed in claim 9, wherein the silicon substrate moving device comprises a plurality of rollers for continuously moving a silicon substrate.
Type: Application
Filed: Sep 21, 2011
Publication Date: Oct 18, 2012
Applicant: TOPCELL SOLAR INTERNATIONAL CO.,LTD (Taoyuan County)
Inventor: Chi-Chen Chen (Taoyuan County)
Application Number: 13/239,371
International Classification: C23F 1/08 (20060101);