ELECTRONIC COMPONENT HANDLER HAVING GAP SET DEVICE

A gap set device for an electronic component handler is provided. The electronic component handler includes a test accessory mounted to it. The test accessory is movable between a first position away from a tool and a second position closer to the tool. A gap set device is mounted to the test accessory and the tool and has a portion movable with respect to the test accessory. When the test accessory is in the second position, the portion of the gap set device contacts the component support structure to define a gap between the test accessory and the component support structure.

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Description
TECHNICAL FIELD

This application is a continuation of U.S. patent application Ser. No. No. 11,742,262, filed Apr. 30, 2007, which claims priority to U.S. Provisional patent application No. 60/887,126, filed Jan. 29, 2007.

TECHNICAL FIELD

This disclosure relates to setting a predefined and repeatable gap between an electronic component support structure and an electronic component test accessory.

BACKGROUND

Electronic components are handled by a wide variety of different electronic component handlers. These different handlers include but are not limited to products sold by Electro Scientific Industries Inc. of Portland, Oreg., the assignee of the present patent application. Electro Scientific Industries sells a variety of electronic component handlers including, but not limited to, a high volume MLCC tester sold as the model No. 3300, a chip array tester sold as the model No. 3400, a visual test system sold as the model No. 6650, and a chip array terminator sold as the model No. 753.

One such electronic component testing machine is described in prior art U.S. Pat. No. 5,842,579 entitled Electrical Circuit Component Handler. With reference to FIG. 2, there is shown an overall pictorial view of the electrical circuit component handler of U.S. Pat. No. 5,842,579, the entirety of which is incorporated herein by reference. FIG. 2 illustrates a handler 10 having a plurality of test accessories thereon including a loading frame 12, a plurality of test modules 14 and a blowoff module 16. In operation, electronic components are passed through load frame 12 and are individually drawn into test seats 22 found on a test plate 20. Test seats 22 typically are concentric rings that are continuous about test plate 20.

With more specific reference to loading frame 12 and with specific reference to FIG. 2A, load frame 12 includes a plurality of arcuate fences 13. Arcuate fences 13 allow electronic components 14 to be collected adjacent fences 13 as shown. The bases of arcuate fences 13 are slightly spaced above test plate 20 as to prevent passing or catching of electronic components beneath arcuate fences 13. The spacing between the arcuate fences 13 and test plate 20 defines a gap labeled by the letter A. U.S. Pat. No. 5,842,579 indicates that the gap A is set by shims.

Test plate 20 indexes in a direction toward test modules 14 as indicated by Arrow B as shown in FIG. 2. The electronic components are tested by test modules 14. As test plate 20 continues to index the electronic components are then withdrawn from the component handler 10 by the blowoff module 16.

With continued reference to U.S. Pat. No. 5,842,579, it may be necessary to change test plate 20. For example, test plate 20 may require changing if it becomes worn or by way of another example, test plate 20 may be changed to accommodate handling of different types of electronic components. In such situations, the test accessories, such as load frame 20, must be moved out of the way so that the old test plate may be removed and the new test plate added. The test accessories must then be put back in place setting a proper gap between the test accessories and test plate. As described in U.S. Pat. No. 5,842,579, this gap, and in particular the gap between the load frame and the test plate, was set by using shims. The exclusive use of shims is time consuming and cumbersome.

SUMMARY

An electronic component handler according to one embodiment comprises a component support structure received on a support surface of the handler, a test accessory mounted to the handler for movement between a first position remote from the component support structure and a second position closer to the component support structure than the first position and a gap set device mounted to the test accessory and having a portion movable with respect to the test accessory, wherein the portion of the gap set device is configured to contact the component support structure such that a gap is defined between the test accessory and the component support structure when the test accessory is in the second position.

A method according to one embodiment taught herein comprises arranging a first component support structure on a support surface of an electronic component handler, after arranging the first component support structure on the support surface, moving a test accessory and a gap set device toward the first component support structure, the test accessory movable relative to the support surface and the gap set device coupled to the test accessory and having a portion movable with respect to the test accessory, such that the portion of the gap set device contacts the first component support structure and the test accessory is spaced apart from the component support structure to define a gap between the test accessory and the first component support structure, and, after defining the gap, moving the portion of the gap set device relative to the test accessory and away from the first component support structure.

A method according to another embodiment comprises moving a test accessory and a gap set device away from a first component support structure disposed on a support surface of an electronic component handler, the test accessory movable relative to the support surface and the gap set device coupled to the test accessory and having a portion movable with respect to the test accessory, replacing the first component support structure with a second component support structure, after replacing the first component support structure with the second component support structure, moving the test accessory and the gap set device toward the second component support structure such that the portion of the gap set device contacts the second component support structure and the test accessory is spaced apart from the second component support structure to define a gap between the test accessory and the second component support structure, and after defining the gap, moving the portion of the gap set device relative to the test accessory and away from the second component support structure.

Other applications of the present invention will become apparent to those skilled in the art when the following description is read in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The description herein makes reference to the accompanying drawings wherein like reference numerals refer to like parts throughout the several views, and wherein:

FIG. 1 is an exploded perspective view of a gap set device that allows a repeatable gap to be set between a load frame and a test plate;

FIG. 2 illustrates a perspective drawing of a prior art electronic component handler;

FIG. 2A is a cross section of a load frame illustrating electronic component and arcuate fences;

FIG. 3 illustrates a cutaway view of gap set device of FIG. 1 taken along lines 3-3 in an operational position;

FIG. 4 illustrates a cutaway view of the gap set device of FIG. 1 in a different operational position;

FIG. 5 illustrates a cutaway view of the gap set device of FIG. 1 in a different operational position;

FIG. 6 illustrates a cutaway view of the gap set device of FIG. 1 in a different operational position;

FIG. 6A illustrates an alternate configuration of an air cylinder and air cylinder shaft;

FIG. 7 illustrates a hollow pneumatic airshaft for use with the first preferred embodiment; and

FIG. 8 illustrates an exploded reference perspective of a load frame mounting to a base plate; and

FIG. 9 illustrates a kinematic adjustment to adjust the planarity of a load frame in the first preferred embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

With reference to the figures, wherein like elements are numbered alike, there is shown a gap set device for use with an electrical circuit component handler. Electronic component handlers sometimes include a moving test component, for example a test plate that holds electronic components. A stationary piece, typically a test accessory, sits adjacent the moving test component. In systems such as that described in U.S. Pat. No. 5,842,579 the gap, for example between the stationary load frame 12 and the moving test plate 20, is set with the exclusive use of shims. Shims are difficult to handle and create a time consuming effort to set a gap.

The preferred embodiments are described with reference to the electrical circuit component handler illustrated in U.S. Pat. No. 5,842,579 and in particular describe an apparatus and method used to set the gap between a load frame 12 and a test plate 20. The present invention is not limited for use with load frames and test plates. The present invention applies equally to other electronic component handling devices, for example the devices sold by Electro Scientific Industries as model Nos. 6650, 3400 and 753.

With respect to the electronic component handler of U.S. Pat. No. 5,842,579, the load frame 12 is mounted on a linear bearing. The linear bearing allows the load frame to move vertically away from the test plate such that the test plate may be replaced. A retractable setting post can extend beneath the load frame such that when the load frame is lowered back into position, by sliding the load frame down the linear bearing, the gap between the load frame fences and the test plate will be determined by the amount the setting post extends beyond the load frame fences. After the gap has been set the load frame may be locked into place and the setting post retracted out of the way. As described herein, examples of setting posts include hollow air cylinders and micrometers.

With reference to FIG. 1 there is shown an exploded perspective view of an electronic component handler utilizing a test plate 20. Test plate 20 includes plurality of concentric test rings 22. Electronic components are delivered into test rings 22 through the use of a load frame 12. Load frame 12 includes a plurality of arcuate fences 13. The arcuate fences 13 are operable to deliver electronic components 11 to an area adjacent test seats 22 as illustrated in FIG. 2A.

With continued reference to FIG. 1, load frame 12 is mounted to a linear bearing 30. Linear bearing 30 includes a base 32. As shown, base 32 is connected to a base plate 18 of handler 10 by a kinematic mount 70. As shown, load frame 12 is slidably received into bearing 30 via a guide 34. Guide 34 may be integral with load frame 12 or may be a separate component.

As shown in FIG. 1, a setting post 50 is mounted to load frame 12. Setting post 50 may be positioned in a variety of places on load frame 12, including but not limited to guide 34. In the first preferred embodiment, setting post 50 includes an air cylinder 52 having an extendable shaft 58. Alternatively, the setting post 50 could be a micrometer.

As shown in more detail in FIG. 7, air cylinder 52 includes an air inlet 54 and an air outlet 55. Air hoses attach to each of inlet and outlet 54 and 55 to deliver air to cylinder 52 and actuate shaft 58. The distance that shaft 58 extends from air cylinder 52 is adjustable through a collar 51. Collar 51 includes fasteners 53 that may be loosened to allow collar 51 repositioning, thereby adjusting the distance shaft 58 extends from air cylinder 52. As shown, shaft 58 includes an internal passage 59 through which air flows via a pneumatic coupling 56. As described in greater detail below, as the distal end 57 of shaft 58 approaches test plate 12 the air flow through passage 59 is obstructed. This obstruction is detected and allows a gap to be set between load frame 12 and test plate 20.

With further reference to FIG. 1, shaft 58 is extendable beneath/beyond fences 13 of load frame 12. With shaft 58 in its extended position load frame 12 may be lowered toward test plate 20 by linear bearing 30. When shaft 58 comes in close proximity with test plate 20, the airflow through the hollow portion 59 of shaft 58 is obstructed. At this point a lock 36 may be engaged to lock load frame 12 into place. As shown, lock 36 includes a knob 38 for manual actuation. An automated lock may also be used. By extending shaft 58 a known distance past the bottom of fences 13 the gap between load frame 12 and test plate 20 may be accurately and repetitiously set. In the first preferred embodiment the gap can be set to approximately 25 microns. Generally, a gap between 1 and 50 microns would be acceptable for a wide range of different electronic components.

With further reference to FIG. 1, it may be desirable for some purchasers of the device of the first preferred embodiment to radially and axially align fences with corresponding concentric test seat rings 22. As shown, such radial and axial alignment may be adjusted through the actuation or adjustment of micrometers 60. As further shown in FIG. 1, a borescope access hole 61 may be provided to enable an operator to place a borescope, not shown, into access hole 61 to visually inspect the gap between load frame 12 and test plate 20 as well as the alignment of fences 13.

With reference to FIG. 8, test plate 20 is planar. Similarly, the underside of load frame 12, and in particular the bottom edges of fences 13, define a plane. In the preferred embodiment, kinematic mount 70 allows the plane defined by fences 13 to be adjusted to be parallel with the plane defined by test plate 12. Kinematic mount 70 includes pins 72 located on base plate 18 of handler 10. Pins 72 engage corresponding adjustable mounts 74 positioned on base 32. In the first preferred embodiment, kinematic mount 70 further includes a pair of pins 76 that fit into holes 77. Pins 76 cooperate with holes 77 to prevent base 32 from sliding on handler 10.

With reference to FIG. 9, the depth of each mount 74 can be changed by adjusting shaft assemblies 78. Shaft assemblies 78 include precision adjusting knobs 79 to accomplish an adjustment of the plane defined by the underside of fences 13. To facilitate a more precise coplanar relationship between the plane of test plate 12 and the plane defined by the underside of fences 13, a borescope, not shown, may be placed into borescope access 61 for visual inspection.

With reference to FIGS. 3-6 there is shown a series of cutaway illustrations taken along line 3-3 of FIG. 1 that illustrate a first proposed sequence of operation of the gap setting device. As shown in FIG. 6, load frame 12 is spaced away from test plate 20. This allows test plate 20 to be removed from base plate 18 of handler 10. After a replacement test plate has been mated to base plate 18, air cylinder 52 is actuated to extend shaft 58 beyond the plane defined by fences 13 of load frame 12. An air flow is initiated through passage 59. As shown in FIG. 6, lock 36 is in an unlocked position, indicating that load frame 12 will shortly be moved in a direction toward test plate 20. Load frame 12 may be locked by lock 36 in its upper position.

With reference to FIG. 4, load frame 12 is moved to be adjacent to test plate 20. Because shaft 58 extends beyond the plane defined by fences 13, shaft 58 will come into close proximity of load frame 12 prior to fences 13. As shaft 58 gets in close proximity with test plate 12, the air flow through passage 59 will become obstructed. This obstructed air flow may be detected such that lock 36 may be engaged as shown by arrow 37 in FIG. 5. Obstruction of air flow may be indicated by a visual or audible alarm informing a user to actuate lock 36 to set the gap between test plate 12 and fences 13. Alternatively, obstruction of air flow through passage 59 may cause an automated lock to fix the gap.

With reference to FIG. 3, it is shown that after the gap has been set by setting post 50 and shaft 58, air cylinder 52 is actuated to retract setting post. Retraction of setting post 50 allows test plate 20 to freely rotate without obstruction from shaft 20.

With reference to FIG. 6A, there is shown an alternate configuration of an air cylinder and air cylinder shaft. As shown in FIG. 6A, shaft 158 includes a shoulder 159. When air cylinder 152 engages shaft 158 to its fullest extent, shoulder 159 will engage a flange 161 machined internally into load frame 12. By setting the location of flange 161, the distance that shaft 158 protrudes beyond fences 13 may be fixed. The location of flange 161 may be set by precisely machining load frame 12 or in the alternative flange 161 may be raised or lowered by use of shims. The shims used to raise or lower flange 161 would not have to be replaced each time test plate 20 is replaced insofar as the shims would merely fix the distance shaft 158 protruded beyond fences 13.

While the invention has been described in connection with certain embodiments, it is to be understood that the invention is not to be limited to the disclosed embodiments but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims, which scope is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures as is permitted under the law.

Claims

1-21. (canceled)

22. An electronic component handler comprising:

a component support structure received on a support surface of the handler;
a test accessory mounted to the handler for movement between a first position remote from the component support structure and a second position closer to the component support structure than the first position; and
a gap set device mounted to the test accessory and having a portion movable with respect to the test accessory, wherein the portion of the gap set device is configured to contact the component support structure such that a gap is defined between the test accessory and the component support structure when the test accessory is in the second position.

23. The electronic component handler of claim 22 wherein the gap set device comprises a pneumatic cylinder having an extendable shaft, the extendable shaft mounted to contact the component support structure and wherein an airflow through the extendable shaft is obstructed when the extendable shaft contacts the component support structure.

24. The electronic component handler of claim 23 wherein the extendable shaft includes a shoulder extending therefrom for engagement with a flange to limit movement of the extendable shaft relative to the pneumatic cylinder.

25. The electronic component handler of claim 24 wherein the flange is machined into the test accessory.

26. The electronic component handler of claim 22, further comprising:

a test accessory support coupled to the handler and the test accessory, the test accessory support configured to guide movement of the test accessory between the first position and the second position.

27. The electronic component handler of claim 26, further comprising:

a lock engaged with the test accessory support to fix a position of the test accessory relative to the component support structure.

28. The electronic component handler of claim 22, further comprising:

a kinematic coupling configured to adjust an orientation of the test accessory relative to the component support structure.

29. The electronic component handler of claim 28 wherein the kinematic coupling includes a plurality of pins on the support surface of the handler and a plurality of adjustable mounts positioned on a base of a component supporting the test accessory, the plurality of pins positioned for engagement with respective ones of the plurality of pins.

30. The electronic component handler of claim 22 wherein the test accessory is a load frame and the component support structure is a test plate.

31. The electronic component handler of claim 22 wherein the gap set device comprises a pneumatic cylinder with an extendable shaft mounted therein and through the test accessory.

32. An electronic component handler of claim 22, further comprising:

at least one borehole through the gap set device to permit inspection of the gap.

33. A method comprising:

arranging a first component support structure on a support surface of an electronic component handler;
after arranging the first component support structure on the support surface, moving a test accessory and a gap set device toward the first component support structure, the test accessory movable relative to the support surface and the gap set device coupled to the test accessory and having a portion movable with respect to the test accessory, such that the portion of the gap set device contacts the first component support structure and the test accessory is spaced apart from the component support structure to define a gap between the test accessory and the first component support structure; and
after defining the gap, moving the portion of the gap set device relative to the test accessory and away from the first component support structure.

34. The method of claim 33, further comprising:

fixing a position of the test accessory relative to the support surface after defining the gap and before moving the portion of the gap set device away from the first component support structure.

35. The method of claim 33 wherein the first component support structure defines a first plane and the test accessory defines a second plane, the method further comprising:

adjusting the test accessory to make the second plane parallel with the first plane.

36. The method of claim 33 wherein moving the test accessory toward the first component support structure comprises linearly moving the test accessory.

37. The method of claim 33, further comprising:

inspecting the gap through at least one borehole extending through the gap set device.

38. The method of claim 33, further comprising:

moving the test accessory away from the first component support structure;
after moving the test accessory away from the first component support structure, removing the first component support structure from the support surface;
after removing the first component support structure from the support surface, arranging a second component support structure on the support surface; and
after arranging the second component support structure on the support surface, moving the test accessory and the gap set device toward the second component support structure such that the portion of the gap set device contacts the second component support structure and the test accessory is spaced apart from the second component support structure to define a gap between the test accessory and the second component support structure.

39. The method of claim 33, further comprising:

maintaining the gap between the test accessory and the first component structure while moving the portion of the gap set device away from the first component support structure.

40. A method comprising:

moving a test accessory and a gap set device away from a first component support structure disposed on a support surface of an electronic component handler, the test accessory movable relative to the support surface and the gap set device coupled to the test accessory and having a portion movable with respect to the test accessory;
replacing the first component support structure with a second component support structure;
after replacing the first component support structure with the second component support structure, moving the test accessory and the gap set device toward the second component support structure such that the portion of the gap set device contacts the second component support structure and the test accessory is spaced apart from the second component support structure to define a gap between the test accessory and the second component support structure; and
after defining the gap, moving the portion of the gap set device relative to the test accessory and away from the second component support structure.

41. The method of claim 40, further comprising:

maintaining the gap between the test accessory and the second component structure while moving the portion of the gap set device away from the second component support structure.
Patent History
Publication number: 20120263559
Type: Application
Filed: Jun 25, 2012
Publication Date: Oct 18, 2012
Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. (Portland, OR)
Inventors: David James McKeever (Beaverton, OR), Martin Frederick Bamberger (Beaverton, OR), Blaine Michael (Beaverton, OR), Doug J. Garcia (Beaverton, OR)
Application Number: 13/532,407
Classifications
Current U.S. Class: Device Engages Load Holding Or Supporting Element To Fix Element Position Relative To Station (414/222.05)
International Classification: B65G 1/00 (20060101);