ELECTRONIC COMPONENT HANDLER HAVING GAP SET DEVICE
A gap set device for an electronic component handler is provided. The electronic component handler includes a test accessory mounted to it. The test accessory is movable between a first position away from a tool and a second position closer to the tool. A gap set device is mounted to the test accessory and the tool and has a portion movable with respect to the test accessory. When the test accessory is in the second position, the portion of the gap set device contacts the component support structure to define a gap between the test accessory and the component support structure.
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This application is a continuation of U.S. patent application Ser. No. No. 11,742,262, filed Apr. 30, 2007, which claims priority to U.S. Provisional patent application No. 60/887,126, filed Jan. 29, 2007.
TECHNICAL FIELDThis disclosure relates to setting a predefined and repeatable gap between an electronic component support structure and an electronic component test accessory.
BACKGROUNDElectronic components are handled by a wide variety of different electronic component handlers. These different handlers include but are not limited to products sold by Electro Scientific Industries Inc. of Portland, Oreg., the assignee of the present patent application. Electro Scientific Industries sells a variety of electronic component handlers including, but not limited to, a high volume MLCC tester sold as the model No. 3300, a chip array tester sold as the model No. 3400, a visual test system sold as the model No. 6650, and a chip array terminator sold as the model No. 753.
One such electronic component testing machine is described in prior art U.S. Pat. No. 5,842,579 entitled Electrical Circuit Component Handler. With reference to
With more specific reference to loading frame 12 and with specific reference to
Test plate 20 indexes in a direction toward test modules 14 as indicated by Arrow B as shown in
With continued reference to U.S. Pat. No. 5,842,579, it may be necessary to change test plate 20. For example, test plate 20 may require changing if it becomes worn or by way of another example, test plate 20 may be changed to accommodate handling of different types of electronic components. In such situations, the test accessories, such as load frame 20, must be moved out of the way so that the old test plate may be removed and the new test plate added. The test accessories must then be put back in place setting a proper gap between the test accessories and test plate. As described in U.S. Pat. No. 5,842,579, this gap, and in particular the gap between the load frame and the test plate, was set by using shims. The exclusive use of shims is time consuming and cumbersome.
SUMMARYAn electronic component handler according to one embodiment comprises a component support structure received on a support surface of the handler, a test accessory mounted to the handler for movement between a first position remote from the component support structure and a second position closer to the component support structure than the first position and a gap set device mounted to the test accessory and having a portion movable with respect to the test accessory, wherein the portion of the gap set device is configured to contact the component support structure such that a gap is defined between the test accessory and the component support structure when the test accessory is in the second position.
A method according to one embodiment taught herein comprises arranging a first component support structure on a support surface of an electronic component handler, after arranging the first component support structure on the support surface, moving a test accessory and a gap set device toward the first component support structure, the test accessory movable relative to the support surface and the gap set device coupled to the test accessory and having a portion movable with respect to the test accessory, such that the portion of the gap set device contacts the first component support structure and the test accessory is spaced apart from the component support structure to define a gap between the test accessory and the first component support structure, and, after defining the gap, moving the portion of the gap set device relative to the test accessory and away from the first component support structure.
A method according to another embodiment comprises moving a test accessory and a gap set device away from a first component support structure disposed on a support surface of an electronic component handler, the test accessory movable relative to the support surface and the gap set device coupled to the test accessory and having a portion movable with respect to the test accessory, replacing the first component support structure with a second component support structure, after replacing the first component support structure with the second component support structure, moving the test accessory and the gap set device toward the second component support structure such that the portion of the gap set device contacts the second component support structure and the test accessory is spaced apart from the second component support structure to define a gap between the test accessory and the second component support structure, and after defining the gap, moving the portion of the gap set device relative to the test accessory and away from the second component support structure.
Other applications of the present invention will become apparent to those skilled in the art when the following description is read in conjunction with the accompanying drawings.
The description herein makes reference to the accompanying drawings wherein like reference numerals refer to like parts throughout the several views, and wherein:
With reference to the figures, wherein like elements are numbered alike, there is shown a gap set device for use with an electrical circuit component handler. Electronic component handlers sometimes include a moving test component, for example a test plate that holds electronic components. A stationary piece, typically a test accessory, sits adjacent the moving test component. In systems such as that described in U.S. Pat. No. 5,842,579 the gap, for example between the stationary load frame 12 and the moving test plate 20, is set with the exclusive use of shims. Shims are difficult to handle and create a time consuming effort to set a gap.
The preferred embodiments are described with reference to the electrical circuit component handler illustrated in U.S. Pat. No. 5,842,579 and in particular describe an apparatus and method used to set the gap between a load frame 12 and a test plate 20. The present invention is not limited for use with load frames and test plates. The present invention applies equally to other electronic component handling devices, for example the devices sold by Electro Scientific Industries as model Nos. 6650, 3400 and 753.
With respect to the electronic component handler of U.S. Pat. No. 5,842,579, the load frame 12 is mounted on a linear bearing. The linear bearing allows the load frame to move vertically away from the test plate such that the test plate may be replaced. A retractable setting post can extend beneath the load frame such that when the load frame is lowered back into position, by sliding the load frame down the linear bearing, the gap between the load frame fences and the test plate will be determined by the amount the setting post extends beyond the load frame fences. After the gap has been set the load frame may be locked into place and the setting post retracted out of the way. As described herein, examples of setting posts include hollow air cylinders and micrometers.
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While the invention has been described in connection with certain embodiments, it is to be understood that the invention is not to be limited to the disclosed embodiments but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims, which scope is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures as is permitted under the law.
Claims
1-21. (canceled)
22. An electronic component handler comprising:
- a component support structure received on a support surface of the handler;
- a test accessory mounted to the handler for movement between a first position remote from the component support structure and a second position closer to the component support structure than the first position; and
- a gap set device mounted to the test accessory and having a portion movable with respect to the test accessory, wherein the portion of the gap set device is configured to contact the component support structure such that a gap is defined between the test accessory and the component support structure when the test accessory is in the second position.
23. The electronic component handler of claim 22 wherein the gap set device comprises a pneumatic cylinder having an extendable shaft, the extendable shaft mounted to contact the component support structure and wherein an airflow through the extendable shaft is obstructed when the extendable shaft contacts the component support structure.
24. The electronic component handler of claim 23 wherein the extendable shaft includes a shoulder extending therefrom for engagement with a flange to limit movement of the extendable shaft relative to the pneumatic cylinder.
25. The electronic component handler of claim 24 wherein the flange is machined into the test accessory.
26. The electronic component handler of claim 22, further comprising:
- a test accessory support coupled to the handler and the test accessory, the test accessory support configured to guide movement of the test accessory between the first position and the second position.
27. The electronic component handler of claim 26, further comprising:
- a lock engaged with the test accessory support to fix a position of the test accessory relative to the component support structure.
28. The electronic component handler of claim 22, further comprising:
- a kinematic coupling configured to adjust an orientation of the test accessory relative to the component support structure.
29. The electronic component handler of claim 28 wherein the kinematic coupling includes a plurality of pins on the support surface of the handler and a plurality of adjustable mounts positioned on a base of a component supporting the test accessory, the plurality of pins positioned for engagement with respective ones of the plurality of pins.
30. The electronic component handler of claim 22 wherein the test accessory is a load frame and the component support structure is a test plate.
31. The electronic component handler of claim 22 wherein the gap set device comprises a pneumatic cylinder with an extendable shaft mounted therein and through the test accessory.
32. An electronic component handler of claim 22, further comprising:
- at least one borehole through the gap set device to permit inspection of the gap.
33. A method comprising:
- arranging a first component support structure on a support surface of an electronic component handler;
- after arranging the first component support structure on the support surface, moving a test accessory and a gap set device toward the first component support structure, the test accessory movable relative to the support surface and the gap set device coupled to the test accessory and having a portion movable with respect to the test accessory, such that the portion of the gap set device contacts the first component support structure and the test accessory is spaced apart from the component support structure to define a gap between the test accessory and the first component support structure; and
- after defining the gap, moving the portion of the gap set device relative to the test accessory and away from the first component support structure.
34. The method of claim 33, further comprising:
- fixing a position of the test accessory relative to the support surface after defining the gap and before moving the portion of the gap set device away from the first component support structure.
35. The method of claim 33 wherein the first component support structure defines a first plane and the test accessory defines a second plane, the method further comprising:
- adjusting the test accessory to make the second plane parallel with the first plane.
36. The method of claim 33 wherein moving the test accessory toward the first component support structure comprises linearly moving the test accessory.
37. The method of claim 33, further comprising:
- inspecting the gap through at least one borehole extending through the gap set device.
38. The method of claim 33, further comprising:
- moving the test accessory away from the first component support structure;
- after moving the test accessory away from the first component support structure, removing the first component support structure from the support surface;
- after removing the first component support structure from the support surface, arranging a second component support structure on the support surface; and
- after arranging the second component support structure on the support surface, moving the test accessory and the gap set device toward the second component support structure such that the portion of the gap set device contacts the second component support structure and the test accessory is spaced apart from the second component support structure to define a gap between the test accessory and the second component support structure.
39. The method of claim 33, further comprising:
- maintaining the gap between the test accessory and the first component structure while moving the portion of the gap set device away from the first component support structure.
40. A method comprising:
- moving a test accessory and a gap set device away from a first component support structure disposed on a support surface of an electronic component handler, the test accessory movable relative to the support surface and the gap set device coupled to the test accessory and having a portion movable with respect to the test accessory;
- replacing the first component support structure with a second component support structure;
- after replacing the first component support structure with the second component support structure, moving the test accessory and the gap set device toward the second component support structure such that the portion of the gap set device contacts the second component support structure and the test accessory is spaced apart from the second component support structure to define a gap between the test accessory and the second component support structure; and
- after defining the gap, moving the portion of the gap set device relative to the test accessory and away from the second component support structure.
41. The method of claim 40, further comprising:
- maintaining the gap between the test accessory and the second component structure while moving the portion of the gap set device away from the second component support structure.
Type: Application
Filed: Jun 25, 2012
Publication Date: Oct 18, 2012
Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. (Portland, OR)
Inventors: David James McKeever (Beaverton, OR), Martin Frederick Bamberger (Beaverton, OR), Blaine Michael (Beaverton, OR), Doug J. Garcia (Beaverton, OR)
Application Number: 13/532,407
International Classification: B65G 1/00 (20060101);