Abstract: A frame for a laser processing module can be characterized as including a platform having an upper surface and a lower surface, an optics bridge spaced apart from, and extending over, the upper surface of the platform and a bridge support interposed between, and coupled to, the platform and the optics bridge. At least one selected from the group consisting of the platform and the optics bridge includes a sandwich panel. The sandwich panel can include a first plate, a second plate and a core interposed between the first plate and the second plate. The first plate and the second plate can be indirectly attached to one another by the core and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port formed at an exterior of the sandwich panel and in fluid communication with the at least one channel, and a second port formed at the exterior of the sandwich panel and in fluid communication with the at least one channel.

Abstract: Numerous examples of a multi-axis beam positioner operative to deflect a beam path along which laser light along multiple axes are disclosed. The beam positioner includes a first AOD and a second AOD arranged optically in series with each other. The first and second AODs are arranged and configured to deflect the beam path along a different axes of the multi-axis beam positioner. In one example, AO cell of the first AOD and is formed from the same material as the AO cell of the second AOD but the first AOD is configured differently from the second AOD. In other example, the first AOD and the second AOD are longitudinal-mode AODs and no retarder is present between the first and second AODs. In other example, a heat exchanger is provided to cool the AO cell of the second AOD relative to the AO cell of the first AOD.

Abstract: A system includes a laser source, a galvanometer mirror system, an f-theta scan lens and an acousto-optic deflector (AOD) system. The AOD system is operated to deflect a beam path along which a laser beam propagates in a manner that corrects for scan field distortion induced by one or both of the f-theta lens and galvanometer mirror system.

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses through the first surface and through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least partially transparent, and an optical intensity less than an optical breakdown intensity of the substrate. The focused beam of laser pulses may have a pulse repetition rate, a peak optical intensity and an average power at the substrate driving a cumulative heating effect to melt a region of the substrate. The pulses may have a pulse width, and wherein the peak optical intensity, pulse repetition rate, average power and pulse width are selected such that the through-via is formed in less than 120 ?s.

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.

Abstract: Numerous embodiments of a laser-processing apparatus are disclosed. In one embodiment, the laser-processing apparatus includes a laser source operative to generate a beam of laser energy, an acousto-optic deflector (AOD) arranged within a beam path, a controller coupled to the AOD, and a beam analysis system operative to measure characteristics of the beam, generate measurement data representative of the measured beam characteristics, and transmit the measurement data to a controller operative to control the operation of the AOD based on that measurement data. In another embodiment, the laser-processing apparatus includes a system for characterization of cross-axis wobble of a galvanometer mirror, comprising a reference laser source configured to emit a reference laser beam, a reflective surface formed on the galvanometer mirror and configured to reflect the reference laser beam to a sensor configured to output a signal representative of the position of the reference beam to a controller.

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses into the substrate through the first surface of the substrate and, subsequently, through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least substantially transparent and a beam waist of the focused beam of laser pulses is closer to the second surface than to the first surface. The focused beam of laser pulses is characterized by a pulse repetition rate, a peak optical intensity at the substrate and an average power at the substrate sufficient to: melt a region of the substrate near the second surface, thereby creating a melt zone within the substrate; propagate the melt zone toward the first surface; and vaporize or boil material of the substrate and located within the melt zone.

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.

Abstract: A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.

Abstract: A laser-processing apparatus can carry out a process to form a via in a workpiece, having a first material formed on a second material, by directing laser energy onto the workpiece such that the laser energy is incident upon the first material, wherein the laser energy has a wavelength to which the first material is more reflective than the second material. The apparatus can include a back-reflection sensing system operative to capture a back-reflection signal corresponding to a portion of laser energy directed to the workpiece and reflected by the first material and generate a sensor signal based on the captured back-reflection signal; and a controller communicatively coupled to an output of the back-reflection sensing system, wherein the controller is operative to control a remainder of the process by which the via is formed based on the sensor signal.

Abstract: A method includes receiving, during a period of time, a continuous wave laser beam at an acousto-optic deflector (AOD) having a first AOD and a second AOD. A plurality of laser pulses is generated from the received beam using the first acousto-optic deflector (AOD) to the laser beam along a first axis and using the second AOD to deflect the laser beam deflected by the first AOD along a second axis.

Abstract: A laser-processing apparatus is disclosed. In one embodiment, the laser-processing apparatus includes a debris removal system with an integrated beam dump system, the beam dump system operative to selectively position an absorber within the beam path of a beam of laser energy. The beam dump system may allow the beam of laser energy to propagate through the scan lens of the laser-processing apparatus, but prevent the beam of laser energy from processing a workpiece. The beam dump system may include an actuator assembly operative to retract the absorber from the beam path, thereby allowing the beam to propagate to the workpiece and for debris from laser processing to be drawn into a vacuum nozzle, thereby preventing damage to the scan lens. The beam dump system may further include a heat transfer system operative to control the rate of heat transferred away from the absorber.

Abstract: An apparatus includes an acousto-optical deflector (AOD) system operative to deflect a beam of laser energy within a two-dimensional scan field. The AOD system includes a first AOD operative to deflect the beam of laser energy along a first axis of the two-dimensional scan field; a second AOD arranged optically downstream of the first AOD, wherein the second AOD is operative to deflect the beam of laser energy along a second axis of the two-dimensional scan field; and a controller operatively coupled to the AOD system. The controller is configured to drive each of the first AOD and the second AOD to deflect the beam of laser energy within the two-dimensional scan field and is further configured to drive the first AOD and the second AOD at at least substantially the same diffraction efficiency.

Abstract: Numerous embodiments of optical relay systems are disclosed. In one embodiment, a laser-processing apparatus includes an optical relay system configured to correct for beam placement errors by maintaining the optical path length of a beam of laser energy between a first positioner and a scan lens. In another embodiment, the optical relay system may include a first lens, a second lens, and a zoom lens assembly arranged between the first lens and the second lens, wherein the zoom lens assembly includes a first lens group and a second lens group. The zoom lens assembly may be movable relative to the first lens and the second lens (e.g., mounted on a positioner, such as a motion stage). The distance between the lenses of the first lens group and the distance between the lenses of the second lens group may be fixed or variable.

Abstract: A multilayer ceramic capacitor (MLCC) tester includes a power supply source and a station. The station can include at least one test head having a first contact and a second contact arranged and configured to simultaneously electrically connect to a common MLCC transported to a test site, and arc suppression source circuitry. The arc suppression source circuitry can be electrically connected between an output of the power supply source and the first contact, wherein the arc suppression source circuitry is configured to introduce an impedance to the electrical connection between the MLCC and the power supply source.

Abstract: A beam positioner for deflecting a beam path, along which a diffracted beam of linearly polarized laser light is propagatable, within a two-dimensional scan field, the beam positioner includes a first acousto-optic deflectors (AOD) to deflect the beam path within a first one-dimensional scan field extending along a first axis of the two-dimensional scan field, a second AOD to deflect the beam path within a second one-dimensional scan field extending along a second axis of the two-dimensional scan field, a phase retarder arranged between the first AOD and the second AOD and within the beam path along which the beam of laser light is propagatable from the first AOD and a mirror arranged between the first AOD and the second AOD and within the beam path along which the beam of laser light is propagatable from the first AOD.

Abstract: A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.

Abstract: A beam positioner can be broadly characterized as including a first acousto-optic (AO) deflector (AOD) operative to diffract an incident beam of linearly polarized laser light, wherein the first AOD has a first diffraction axis and wherein the first AOD is oriented such that the first diffraction axis has a predetermined spatial relationship with the plane of polarization of the linearly polarized laser light. The beam positioner can include at least one phase-shifting reflector arranged within a beam path along which light is propagatable from the first AOD. The at least one phase-shifting reflector can be configured and oriented to rotate the plane of polarization of light diffracted by the first AOD.

Abstract: A beam positioner includes a first acousto-optic (AO) deflector (AOD) comprising an AO cell and a transducer attached to the AO cell, and a wave plate optically contacted to the first AOD.

Abstract: Methods and apparatus for extending the lifetime of optical components are disclosed. A beam of laser energy directed along a beam path that intersects a scan lens, through which it can be transmitted. The beam path can be deflected within a scan region of the scan lens to process a workpiece with the laser energy transmitted by the scan lens. The scan region can be shifted to a different location within the scan lens, e.g., to delay or avoid accumulation of laser-induced damage within the scan lens, while processing a workpiece.