GAPLESS HEAT PIPE COMBINATION STRUCTURE AND COMBINATION METHOD THEREOF
A gapless heat pipe combination structure and a combination method thereof are provided. An open slot being open is formed on a bottom surface of a heat dissipation device, an adhesive layer is disposed on a surface of grooves in the open slot, and a plurality of heat pipes is provided, which are adhered to the surface of the grooves closely through the adhesive layer respectively. A jig is used to press heating segments of the heat pipes at least once, so that the heating segments exposed from the open slot form a plane heating surface, and the heating surface of the heat pipes completely contact with an area of a heat source, thereby improving overall thermal conduction performance.
1. Field of Invention
The present invention relates to a gapless heat pipe combination structure and a combination method thereof, and more particularly to a combination structure that arranges heat pipes closely to combine the heat pipes gaplessly to increase a direct contact area between the heat pipes and a heat source, and a combination method thereof.
2. Related Art
In recent years, with rapid development of an integration process of semiconductor devices, the semiconductor devices are increasingly integrated. However, the semiconductor device having gradually smaller volume makes a growing heat production, thus requiring higher heat dissipation performance, which becomes a more and more important issue to be solved. In order to meet the requirement, various heat dissipation manners, such as fan heat dissipation, water cooling assisted heat dissipation, and heat pipe heat dissipation, are widely applied, and a certain heat dissipation effect is achieved.
Two most important heat transfer mechanisms in a radiator are thermal conduction and thermal convection. The thermal conduction refers to energy exchange between molecules. After contacting with a molecule with more energy, a molecule with less energy acquires energy (by physical direct contact). If no temperature difference between two objects exists (for example, an independent heat sink), thermal conduction cannot be realized. In a conventional radiator, a Thermal Interface Material (TIM) of a high thermal conductivity is usually added between a heat sink and a heat source (a semiconductor integrated device), so that thermal energy produced by the semiconductor integrated device can be conducted to the heat sink more effectively.
The thermal convection refers to heat transfer realized by motion of matter. Thermal energy comes from a heat source surrounded by a gas or a liquid, and the thermal energy is transferred in a radiator by motion of molecules. Heat produced by a semiconductor integrated device is transferred into air through a heat sink eventually, and thermal energy is then carried away by a convection phenomenon.
Besides a plurality of heat pipes, a heat pipe heat dissipation apparatus includes a plurality of heat sinks and a fixing seat. The heat sinks are usually made of aluminum or copper. The heat pipe is a metal pipe having two closed ends and filled with a working fluid. The fixing seat is made of aluminum or copper, thereby also being called an aluminum base or a copper base.
The heat pipe heat dissipation apparatus is such designed that the fixing seat contacts with a heat dissipation portion of the semiconductor device, heat of the semiconductor device is first conducted to the fixing seat, and then the heat is conducted to the heat pipes and the heat sinks, thereby achieving an objective of heat dissipation. The heat is conducted in an indirect manner, that is, first through the fixing seat, and then the heat is transferred to the heat pipes and the heat sinks, so that the heat pipe heat dissipation apparatus has a low efficiency.
Therefore, after improvement an existing heat pipe heat dissipation apparatus of high efficient heat dissipation is designed that heat pipes contact with a heat dissipation portion of a semiconductor device directly, heating segments on pipe bodies of the heat pipes form a flat heating surface, which can make a direct face to face contact with a heat dissipation area of a surface of the semiconductor device, exothermic segments are formed above the fixing seat, the heat sinks contact with the exothermic segments of the heat pipes closely, and heat is transferred to air through the heat sinks, thereby achieving the objective of heat dissipation. According to a binding manner of the fixing seat and the heat pipes, a bottom surface of the fixing seat is opened with a plurality of open rabbets matching the heat pipes, so that the heat pipes are inserted into the rabbets in a matched manner. During implementation, a pressing tool is used to insert the heat pipes into the rabbets by pressing the heat pipes flat, so that the heat pipes are covered by the fixing seat in a half-exposed manner, and heating surfaces of the heat pipes are exposed at the bottom surface of the fixing seat. The heating surfaces directly contact with the heat dissipation portion of the semiconductor device, so that indirect transfer for heat dissipation is not required, thereby achieving very efficient heat dissipation.
In addition, the heat pipes and the fixing seat are made of different materials, so that pretreatment of nickel plating is required before welding, which makes overall processing complex, increases cost, makes assembly inconvenient, and does not comply with requirements on environmental protection. Particularly, the fixing seat of the radiator is made of a solid metal block, which not only is heavy and big, but also consumes a large amount of metal and makes manufacturing cost high, so that some products already remove the fixing seat by directly combining the heat pipes and the heat sinks to form heat dissipation apparatuses without seats.
However, no matter in a heat dissipation structure in which heat pipes are inserted into rabbets of a fixing seat or in a heat dissipation structure in which heat pipes and heat sinks are combined, the following problems still exist during actual use. During combination of heat pipes and a fixing seat, the fixing seat or heat sinks are required to serve as a support, and then a pressing tool is used to press the heat pipes flat to insert the heat pipes into rabbets. Spacer bars are disposed between the rabbets, so that after being inserted into the rabbets in a matched manner the heat pipes are stably held and positioned by the spacer bars. Therefore, no matter which manufacturing process is used by a manufacturer to make the heating surfaces of the heat pipes be aligned with the bottom surface of the fixing seat or combine the heating surfaces of the heat pipes and the heat sinks directly, the spacer bars are disposed to separate the heat pipes, so that the heating surfaces of the heat pipes cannot be concentrated. Under a trend of smaller volume of the semiconductor device and smaller area of the heat source, the number of heat pipes on the limited area of the heat source is limited seriously, which greatly affects an area by which the heating surfaces directly contact with a heat dissipation portion of the semiconductor device, thereby causing undesired thermal conduction performance.
SUMMARY OF THE INVENTIONTherefore, in order to eliminate the above defects, a major objective of the present invention is to provide a gapless heat pipe combination structure and a combination method thereof, so that heating segments of heat pipes are bound more closely, each of the heat pipes can perform well, and an objective of making the heat pipes completely contact with an area of a heat source is achieved, thereby fully achieving thermal conduction performance and increasing heat dissipation efficiency.
Another objective of the present invention is to provide a gapless heat pipe combination structure and a combination method thereof, so that heating segments of heat pipes are bound more closely, more heat pipes are buried in a smaller width of a rabbet, and the number of the heat pipes contacting with an area of a heat source increases, thereby fully achieving thermal conduction performance and increasing heat dissipation efficiency.
In order to achieve the above objectives, the present invention provides a gapless heat pipe combination structure, which comprises: a heat dissipation device, where a bottom surface of the heat dissipation device is formed into an open slot, a surface of the open slot is disposed with a plurality of grooves, the heat dissipation device is a fixing seat for heat dissipation or is formed by a plurality of heat sink fins arranged in parallel and adjacent to each other; an adhesive layer, disposed on a surface of the grooves of the open slot; and a plurality of heat pipes, where the heat pipes have heating segments and exothermic segments, the exothermic segments extend from the open slot to the outside, side edges of the heating segments are arranged in parallel closely, received in the open slot, and adhered to the surface of the grooves closely through the adhesive layer respectively, and the heating segments are exposed at the open slot to form a plane heating surface.
A combination method of the present invention comprises: providing a heat dissipation device, where a bottom surface of the heat dissipation device is formed into an open slot, and a surface of the open slot is disposed with a plurality of grooves; disposing an adhesive layer on a surface of the grooves of the open slot; and providing a plurality of heat pipes, where the heat pipes have heating segments and exothermic segments, the exothermic segments extend from the open slot to the outside, side edges of the heating segments are arranged in parallel closely, received in the open slot, and adhered to the surface of the grooves closely through the adhesive layer respectively, the heating segments of the heat pipes are pressed flat at least once by a jig, and the heating segments are exposed at the open slot to form a plane heating surface.
A jig is used to process two sides of the heating segments of the heat pipes, so that the heating segments get slimmer, and the side edges are arranged in parallel closely and are received in the open slot.
Advantages of the present invention are as follows. Heat pipes are arranged and combined closely, so that the gapless heat pipes are combined with a heat dissipation device, no conventional spacer bar exists between adjacent heating surfaces, spacing kept between conventional heat pipes is decreased dramatically, so that the heating surfaces of the heat pipes completely contact with an area of a heat source, thereby fully achieving thermal conduction performance of each of the heat pipes and improving overall thermal conduction performance. Accordingly, a jig is used to process two sides of the heating segments of the heat pipes, so that the heating segments get slimmer, and the side edges of the heating segments of the heat pipes are arranged in parallel closely and are received in the open slot. With the same area of a heat dissipation portion of a semiconductor device, according to the combination of the heat pipes of the present invention, more heat pipes can be buried in the same contact area, so that more heat pipes contact with a heat source, thereby improving the overall thermal conduction performance.
The present invention will become more fully understood from the detailed description given herein below for illustration only, and thus are not limitative of the present invention, and wherein:
Detailed contents and technical specifications of the present invention are further illustrated below with reference to embodiments. It should be understood that the embodiments are only for illustration, and are not construed as a limit to implementation of the present invention.
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Furthermore, the jig 600 is used to process two sides of the heating segments of the heat pipes 300, so that the heating segments 310 get slimmer, and the side edges are arranged in parallel closely and are received in the open slot 110. With the same area of a heat dissipation portion of a semiconductor device, according to the combination of the heat pipes 300 of the present invention, more heat pipes can be buried in the same contact area, so that more heat pipes 300 contact with a heat source, thereby improving overall thermal conduction performance.
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What is described in the foregoing is only an exemplary embodiment of the present invention, and definitely is not intended to limit the scope of the present invention, that is, all simple equivalent changes and modifications made according to the claims or the summary of the present invention fall within the scope of the present invention.
Claims
1. A gapless heat pipe combination structure, comprising:
- a heat dissipation device, wherein a bottom surface of the heat dissipation device is formed into an open slot, and a surface of the open slot is disposed with a plurality of grooves;
- an adhesive layer, disposed on a surface of the grooves of the open slot; and
- a plurality of heat pipes, wherein the heat pipes have heating segments and exothermic segments, the exothermic segments extend from the open slot to the outside, side edges of the heating segments are arranged in parallel closely, received in the open slot, and adhered to the surface of the grooves closely through the adhesive layer respectively, and the heating segments are exposed at the open slot to form a plane heating surface.
2. The gapless heat pipe combination structure according to claim 1, wherein the heat dissipation device is a fixing seat for heat dissipation.
3. The gapless heat pipe combination structure according to claim 1, wherein the heat dissipation device is formed by a plurality of heat sink fins arranged in parallel and adjacent to each other, recessed portions corresponding to each other are formed on bottom sides of the heat sink fins, and the recessed portions are arranged in parallel and adjacent to each other to form the open slot.
4. The gapless heat pipe combination structure according to claim 1, wherein a cross-sectional shape of the grooves in the open slot corresponds to a cross-sectional shape of the heating segments.
5. The gapless heat pipe combination structure according to claim 1, wherein the heating surface of the heating segments is aligned with the side edges of the open slot.
6. The gapless heat pipe combination structure according to claim 1, wherein the heating surface of the heating segments protrudes from the side edges of the open slot.
7. The gapless heat pipe combination structure according to claim 1, wherein the heating surface of the heating segments is recessed in the open slot.
8. A combination method of gapless heat pipes, comprising:
- providing a heat dissipation device, wherein a bottom surface of the heat dissipation device is formed into an open slot, and a surface of the open slot is disposed with a plurality of grooves;
- disposing an adhesive layer on a surface of the grooves of the open slot; and
- providing a plurality of heat pipes, wherein the heat pipes have heating segments and exothermic segments, the exothermic segments extend from the open slot to outside, side edges of the heating segments are arranged in parallel closely, received in the open slot, and adhered to the surface of the grooves closely through the adhesive layer respectively, the heating segments of the heat pipes are pressed flat at least once by a jig, and the heating segments are exposed at the open slot to form a plane heating surface.
9. The combination method of gapless heat pipes according to claim 8, wherein the heat dissipation device is a fixing seat for heat dissipation.
10. The combination method of gapless heat pipes according to claim 8, wherein the heat dissipation device is formed by a plurality of heat sink fins arranged in parallel and adjacent to each other, recessed portions corresponding to each other are formed on bottom sides of the heat sink fins, and the recessed portions are arranged in parallel and adjacent to each other to form the open slot.
11. The combination method of gapless heat pipes according to claim 8, wherein a cross-sectional shape of the grooves in the open slot corresponds to a cross-sectional shape of the heating segments.
12. The combination method of gapless heat pipes according to claim 8, wherein the jig is used to process two sides of the heating segments of the heat pipes, so that the heating segments get slimmer, and the side edges are arranged in parallel closely and are received in the open slot.
13. The combination method of gapless heat pipes according to claim 12, wherein a cross-sectional shape of the heating segments corresponds to a cross-sectional shape of the grooves in the open slot.
Type: Application
Filed: Jun 8, 2011
Publication Date: Dec 13, 2012
Inventor: Chih-Yeh SHEN (New Taipei City)
Application Number: 13/155,692
International Classification: F28D 15/04 (20060101); B21D 53/02 (20060101);