HEAT DISSIPATION SYSTEM

Abstract

A heat dissipation system for a computer enclosure comprises a base plate comprising a motherboard mounted thereon; and a first heat-generating component fixed on the motherboard; a front plate defining a second air outlet opening and a third air outlet opening; and a second heat-generating component mounted on the base plate; and an air guiding device fixed on the first heat-generating component; the air guiding device defining a first air inlet opening, a second air inlet opening, and a first air outlet opening, wherein airflow flows into the computer enclosure through the first air inlet opening and the second air inlet opening, the air guiding device directs the airflow toward the first heat-generating component and the second heat-generating component via the first air outlet opening, and the airflow flows out of the computer enclosure via the second air outlet opening and the third air outlet opening.

Description

BACKGROUND

1. Technical Field

The present disclosure relates to heat dissipation systems, and particularly to a heat dissipation system for a computer enclosure.

2. Description of Related Art

Industrial personal computers (PCs) are used primarily for process control and/or data acquisition. In some cases, an Industrial PC is simply used as a front-end to another control computer in a distributed processing environment. A subset of industrial PCs is the Panel PC where a display, typically an LCD, is incorporated into a same enclosure as a motherboard and other electronic devices. The displays are typically mounted on panels and are often incorporated with touch screens for user interaction. Industrial PCs are usually placed at different angles according to their working environment. When an Industrial PC is placed at a particular angle, the heat dissipation channel of the Industrial PC may be closed or blocked, which may adversely affect a heat dissipation efficiency of the Industrial PC.

Therefore there is a need for improvement in the art.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric and exploded view of an exemplary embodiment of a heat dissipation system with an air guiding device.

FIG. 2 is an isometric and exploded view of the air guiding device of FIG. 1.

FIG. 3 is an assembled view of the heat dissipation system of FIG. 1.

DETAILED DESCRIPTION

The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

Referring to FIGS. 1 and 2, wherein an embodiment of a heat dissipation system comprises a computer enclosure 10, an air guiding device 20 fixed in the computer enclosure 10. The computer enclosure 10 comprises a base plate 11, a first side plate 12, a second side plate 13, a back plate 14, and a front plate 15.

The base plate 11 has a motherboard 30 mounted thereon adjacent to the back plate 14. A first heat-generating component 40 is fixed on the motherboard 30. A first fan 41 is fixed on the first heat-generating component 40. A second heat-generating component 50 is mounted on the base plate 11 adjacent to the front plate 15. The first side plate 12 defines a plurality of first air inlet holes 121. The back plate 14 defines a plurality of second air inlet holes 141. The second side plate 13 defines a plurality of third air inlet holes 131. The front plate 15 defines a second air outlet opening 151 aligned with the first heat-generating component 40. A second fan (not shown) is fixed in the computer enclosure 10 adjacent to the second air outlet opening 151. The front plate 15 defines a third air outlet opening 152 aligned with the second heat-generating component 50. A third fan (not shown) is fixed in the computer enclosure 10 adjacent to the third air outlet opening 152.

The air guiding device 20 comprises a bottom wall 21, a front wall 22, and a back wall 23. The front wall 22 and the back wall 23 are substantially parallel to each other and perpendicular to the bottom wall 21. A first air inlet opening 221 is defined between the front wall 22 and the back wall 23. The first air inlet opening 221 is aligned with the plurality of first air inlet holes 121. A second air inlet opening 231 is defined on the back wall 23. The second air inlet opening 231 is aligned with the plurality of second air inlet holes 141. A third air inlet opening 241 is defined between the front wall 22 and the back wall 23. The third air inlet opening 241 is aligned with the plurality of third air inlet holes 131. A first air outlet opening 211 is defined on the bottom wall 21 and is aligned with the first fan 41.

Each of the first air inlet opening 221, the second air inlet opening 231, and the third air inlet opening 241 has an air deflecting member 25 fixed therein. The air deflecting member 25 comprises a bracket 251, and a piece of conductive foam 252 fixed on the bracket 251. The bracket 251 comprises a first surface and a second surface. A plurality of bending portions 2511 extends from the first surface to accommodate the piece of conductive foam piece 252 therebetween. A handle 2512 extends from the second surface for slidably fixing the bracket 251 into each of the first air inlet opening 221, the second air inlet opening 231 and the third air inlet opening 241.

A plurality of parallel guiding portions 26 are mounted on two sides of each of the first air inlet opening 221, the second air inlet opening 231, and the third air inlet opening 241. Each of the brackets 251 is slidable into each of the first air inlet opening 221, the second air inlet opening 231, and the third air inlet opening 241 along each of the plurality of parallel guiding portions 26. In one embodiment, a distance between two adjacent pluralities of parallel guiding portions 26 is equal to a width of the bracket 251. The air guiding device 20 is fixed on the computer enclosure 10 by fasteners, such as rivets, or other fixing means.

Referring to FIG. 3, in use, the first fan 41, the second fan and the third fan start to rotate. When the computer enclosure 10 is placed on a platform such as a desk by the first side plate 12, the plurality of first air inlet holes 121 are closed. Each of the air deflecting members 25 in the second air inlet opening 231 and the third air inlet opening 241 may be removed by each of the corresponding handles 2512. Cool air from outside may be drawn into the air guiding device 20 via the plurality of second air inlet holes 141, the plurality of third air inlet holes 131, the second air inlet opening 231, and the third air inlet opening 241. The cool air flows through the first air outlet opening 211 and displaces warm air from around the first heat-generating component 40.

A first branch of the cooled air from outside displaces warm air around the second heat-generating component 50 and flows through the third fan. The speed of the first branch of the cool air is accelerated when passing through the third fan. Warm air from the second heat-generating component 50 is taken away from the computer enclosure 10 through the third air outlet opening 152. The second branch of cool air from outside flows through the second fan. The speed of the second branch of cool air is accelerated when passing through the second fan. Warm air from the first heat-generating component 40 is taken away from the computer enclosure 10 through the second air outlet opening 151.

Even though numerous characteristics and advantages of the present disclosure have been set forth in the foregoing description, together with details of the structure and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation system for a computer enclosure, comprising:

a base plate comprising a motherboard mounted thereon; and a first heat-generating component fixed on the motherboard;

a front plate perpendicular to the base plate; the front plate defining a second air outlet opening and a third air outlet opening; and a second heat-generating component mounted on the base plate adjacent to the front plate; and

an air guiding device fixed on the first heat-generating component; the air guiding device defining a first air inlet opening, a second air inlet opening, and a first air outlet opening, wherein

airflow flows into the computer enclosure through the first air inlet opening and the second air inlet opening, the air guiding device directs the airflow toward the first heat-generating component and the second heat-generating component via the first air outlet opening, and the airflow flows out of the computer enclosure via the second air outlet opening and the third air outlet opening.

2. The heat dissipation system of claim 1, further comprising a first side plate perpendicular to the base plate, and a back plate perpendicular to the first side plate; the first side plate defining a plurality of first air inlet holes aligned with the first air inlet opening; the back plate defining a plurality of second air inlet holes aligned with the second air inlet opening; and the air guiding device is adapted to guide airflow from outside of the computer enclosure via the plurality of first air inlet holes and the plurality of second air inlet holes.

3. The heat dissipation system of claim 1, wherein the first air outlet opening and the second air outlet opening are aligned with the first heat-generating component; and the third air outlet opening is aligned with the second heat-generating component.

4. The heat dissipation system of claim 1, wherein a first fan is fixed in the first heat-generating component; a second fan is fixed in the second air outlet opening; and a third fan is fixed in the third air outlet opening.

5. The heat dissipation system of claim 2, further comprising a second side plate perpendicular to the base plate and opposite to the first side plate; the second side plate defines a plurality of third air inlet holes thereon; and the air guiding device defines a third air inlet opening aligned with the plurality of third air inlet holes.

6. The heat dissipation system of claim 5, wherein each of the first air inlet opening, the second air inlet opening, and the third air inlet opening has an air deflecting member fixed therein; the air deflecting member comprises a bracket and a conductive foam piece fixed on the bracket; the bracket comprises a first surface; and a plurality of bending portions extending from the first surface for accommodating the conductive foam piece therebetween.

7. The heat dissipation system of claim 6, wherein the bracket further comprises a second surface; and a handle extends from the second surface for slidably fixing the brackets in each of the first air inlet opening, the second air inlet opening and the third air inlet opening.

8. The heat dissipation system of claim 7, wherein the air guiding device comprises a bottom wall, a front wall, and a back wall perpendicular to the bottom wall; the first air inlet opening and the third air inlet opening are defined between the front wall and the back wall; and the second air inlet opening is defined on the back wall.

9. The heat dissipation system of claim 7, wherein a plurality of parallel guiding portions are mounted on two sides of each of the first air inlet opening, the second air inlet opening, and the third air inlet opening; and the brackets are slid along the plurality of parallel guiding portions into each of the first air inlet opening, the second air inlet opening, and the third air inlet opening.

10. The heat dissipation system of claim 9, wherein a distance between two adjacent pluralities of parallel guiding portions is equal to a width of the bracket.

11. A heat dissipation system for a computer enclosure, comprising:

a base plate having a motherboard mounted thereon; and a first heat-generating component is mounted on the motherboard;

a front plate perpendicular to the base plate; the front plate defines a second air outlet opening and a third air outlet opening; and a second heat-generating component mounted on the base plate adjacent to the front plate; and

an air guiding device mounted on the first heat-generating component; the air guiding device defines a first air inlet opening, a second air inlet opening, and a first air outlet opening thereon; each of the first air inlet opening and the second air inlet opening has an air deflecting member fixed therein; and the air deflecting member comprises a bracket and a conductive foam piece fixed on the bracket, wherein

the air guiding device is adapted to guide airflow from outside of the computer enclosure via the first air inlet opening and the second air inlet opening, and direct the airflow toward the first heat-generating component and the second heat-generating component via the first air outlet opening and out of the computer enclosure via the second air outlet opening and the third air outlet opening.

12. The heat dissipation system of claim 11, further comprising a first side plate perpendicular to the base plate, and a back plate perpendicular to the first side plate; the first side plate defines a plurality of first air inlet holes aligned with the first air inlet opening; the back plate defines a plurality of second air inlet holes aligned with the second air inlet opening; and the air guiding device is adapted to guide airflow from outside of the computer enclosure via the plurality of first air inlet holes and the plurality of second air inlet holes.

13. The heat dissipation system of claim 11, wherein the first air outlet opening and the second air outlet opening are aligned with the first heat-generating component; and the third air outlet opening is aligned with the second heat-generating component.

14. The heat dissipation system of claim 11, wherein a first fan is fixed on the first heat-generating component; a second fan is fixed on the second air outlet opening; and a third fan is fixed on the third air outlet opening.

15. The heat dissipation system of claim 12, further comprising a second side plate perpendicular to the base plate and opposite to the first side plate; the second side plate defines a plurality of third air inlet holes thereon; and the air guiding device defines a third air inlet opening aligned with the plurality of third air inlet holes.

16. The heat dissipation system of claim 15, wherein the air deflecting member comprises a bracket and a conductive foam piece fixed on the bracket; the bracket comprises a first surface; and a plurality of bending portions extending from the first surface for accommodating the conductive foam piece therebetween.

17. The heat dissipation system of claim 16, wherein the bracket further comprises a second surface; and a handle extends from the second surface for slidably fixing the brackets in each of the first air inlet opening, the second air inlet opening and the third air inlet opening.

18. The heat dissipation system of claim 17, wherein the air guiding device comprises a bottom wall, a front wall and a back wall perpendicular to the bottom wall; the first air inlet opening and the third air inlet opening are between the front wall and the back wall; and the second air inlet opening is on the back wall.

19. The heat dissipation system of claim 17, wherein a plurality of parallel guiding portions are mounted on two sides of each of the first air inlet opening, the second air inlet opening and the third air inlet opening; and the brackets are slid along the plurality of parallel guiding portions into each of the first air inlet opening, the second air inlet opening, and the third air inlet opening.

20. The heat dissipation system of claim 19, wherein a distance between two adjacent pluralities of parallel guiding portions is equal to a width of the conductive foam piece.