HEAT PIPE ASSEMBLY

Abstract

A heat pipe assembly used to transfer heat generated by an electronic component to a heat sink includes a first heat pipe, a second heat pipe, and a heat conducting member. A first end of the first heat pipe is connected to the electronic component. A second end of the first heat pipe is connected to the heat conducting member by welding. A first end of the second heat pipe is connected to the second heat sink. A second end of the second heat pipe is connected to the heat conducting member by welding.

Description

BACKGROUND

1. Technical Field

The present disclosure relates to cooling components and, particularly, to a heat pipe assembly.

2. Description of Related Art

Heat pipes are widely used for cooling electronic products because of their high heat transfer efficiency. If hot and cold sources are too far apart from each other, the resulting heat pipe may not be very efficient, because heat transfer efficiency has an inverse relationship with length, meaning longer heat pipes are less efficient in heat dissipation.

BRIEF DESCRIPTION OF THE DRAWING

Many aspects of the present embodiments can be better understood with reference to the following drawing. The components in the drawing are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments.

The FIGURE is an isometric view of an exemplary embodiment of a heat pipe assembly, an electronic component, and two heat sinks.

DETAILED DESCRIPTION

The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

Referring to the FIGURE, an exemplary embodiment of a heat pipe assembly is connected between an electronic component 100 which can generate heat and a heat sink 200. In one embodiment, the electronic component 100 is a semiconductor chip with a heat sink 101 disposed on the semiconductor chip. An engagement slot is defined in a bottom of the heat sink 101. The heat pipe assembly includes a first heat pipe 10, a second heat pipe 20, and a heat conducting member 30.

The heat conducting member 30 is a substantially rectangular block made of copper or copper alloy. A first slot 31 and a second slot 32 are defined in a top of the heat conducting member 30, respectively extending through opposite sides of the heat conducting member 30.

A first end of the first heat pipe 10 is connected to the electronic component 10. In one embodiment, the first end of the first heat pipe 10 is engaged in the engagement slot the heat sink 101, and sandwiched between the heat sink 101 and the electronic component 100. A second end of the first heat pipe 10 is engaged in the first slot 31, and secured to the heat conducting member 30 by welding.

A first end of the second heat pipe 20 is connected to the heat sink 200. A second end of the second heat pipe 20 is engaged in the second slot 32, and secured to the heat conducting member 30 by welding.

In use, the heat generated by the electronic component 100 is transferred to the heat conducting member 30 through the heat sink 101 and the first heat pipe 10. The heat absorbed by the heat conducting member 30 is further transferred to the heat sink 200 through the second heat pipe 20.

Since the first and second heat pipes 10 and 20 are connected in series through the heat conducting member 30, each of the heat pipes 10 and 20 can have an efficient length. Therefore, the heat pipes 10 and 20 can satisfy heat transfer requirements.

It is to be understood, however, that even though numerous characteristics and advantages of the embodiment have been set forth in the foregoing description, together with details of the structure and function of the embodiment, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat pipe assembly for heat transferring from an electronic component to a heat sink apart from the electronic component, the heat pipe assembly comprising:

a heat conducting member;

a first heat pipe comprising a first end to be connected to the electronic component, and a second end fixed to the heat conducting member; and

a second heat pipe comprising a first end connected to the heat sink, and a second end fixed to the heat conducting member.

2. The heat pipe assembly of claim 1, wherein the heat conducting member is a substantially rectangular block defining a first slot receiving the second end of the first heat pipe, and a second slot receiving the second end of the second heat pipe.

3. The heat pipe assembly of claim 2, wherein the heat conducting member is made of copper or copper alloy.

4. The heat pipe assembly of claim 3, wherein the second ends of the first and second heat pipes are fixed to the heat conducting member by welding.

5. A heat dissipation assembly, comprising:

a first heat sink attached on a heat-generating component;

a heat conducting member;

a first heat pipe comprising a first end connected to the first heat sink, and a second end fixed to the heat conducting member;

a second heat sink apart from the first heat sink; and

a second heat pipe comprising a first end connected to the second heat sink, and a second end fixed to the heat conducting member.

6. The heat dissipation assembly of claim 5, wherein the heat conducting member is a substantially rectangular block defining a first slot receiving the second end of the first heat pipe, and a second slot receiving the second end of the second heat pipe.

7. The heat dissipation assembly of claim 6, wherein the heat conducting member is made of copper or copper alloy.

8. The heat dissipation assembly of claim 6, wherein the second ends of the first and second heat pipes are fixed to the heat conducting member by welding.