THERMAL MODULE
A thermal module includes a heat sink and a heat pipe. The heat sink has a heat absorption section and a heat dissipation section. The heat dissipation section has multiple radiating fins. The heat absorption section is formed with at least one receiving groove. The heat pipe is received in the receiving groove. The heat pipe has a first end, a second end, a middle section and at least one conduction section. The first and second ends and the middle section are arranged in adjacency to each other to together define a first section. The conduction section winds around the first section.
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This application claims the priority benefit of Taiwan patent application number 100149731 filed on Dec. 30, 2011.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates generally to a thermal module, and more particularly to a thermal module, which has better heat transfer efficiency and overcomes the shortcoming of the conventional thermal module that the ends of the heat pipe fail to conduct heat as invalid ends.
2. Description of the Related Art
Following the advance of semiconductor technique, the volume of integrated circuit has been more and more minified. With respect to an internal processor or the like integrated circuit electronic component, the faster the operation speed is, the more the heat generated per unit time is. The heat must be dissipated in time. Otherwise, the temperature will rise to cause unstable operation. In general, a heat sink is arranged on the internal processor to help in dissipating the heat so as to lower the temperature of the internal processor and the south and north bridge chips.
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A primary object of the present invention is to provide a thermal module, which has better heat transfer efficiency.
To achieve the above and other objects, the thermal module of the present invention includes a heat sink and a heat pipe.
The heat sink has a heat absorption section and a heat dissipation section. The heat dissipation section has multiple radiating fins. The heat absorption section is formed with at least one receiving groove.
The heat pipe is received in the receiving groove. The heat pipe has a first end, a second end, a middle section and at least one conduction section. The first and second ends and the middle section are arranged in adjacency to each other to together define a first section. The conduction section winds around the first section.
In the thermal module of the present invention, the heat pipe is fully utilized to conduct heat so that the heat dissipation efficiency is greatly enhanced. Also, the thermal module of the present invention overcomes the shortcoming of the conventional thermal module that the ends of the heat pipe fail to conduct heat as invalid ends, which cause decrease of heat transfer efficiency.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
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The heat sink 11 has a heat absorption section 111 and a heat dissipation section 112. The heat dissipation section 112 has multiple radiating fins 1121. The heat absorption section 111 is formed with at least one receiving groove 113.
The heat pipe 12 is received in the receiving groove 113. The heat pipe 12 has a first end 121, a second end 122, a middle section 123 and at least one conduction section 124. The first and second ends 121, 122 and the middle section 123 are arranged in adjacency to each other to together define a first section 13. The conduction section 124 winds around the first section 13.
The receiving groove 113 has a heat absorption section 1131 and a spreading section 1132. The heat absorption section 1131 is disposed on inner side of the spreading section 1132. The spreading section 1132 is disposed around the heat absorption section 1131. The first section 13 of the heat pipe 12 is disposed in the heat absorption section 1131, while the conduction section 124 is disposed in the spreading section 1132.
The heat pipe 12 has a first side 125 and a second side 126. Both the first and second sides 125, 126 have a flat form.
The first and second ends 121, 122 and the middle section 123 of the heat pipe 12 are arranged in adjacency to each other on inner side of the conduction section 124. The conduction section 124 winds around the first and second ends 121, 122 and the middle section 123 in connection with the first and second ends 121, 122 and the middle section 123.
The receiving groove 113 has an open side 1133 and a closed side 1134. The first side 125 of the heat pipe 12 is correspondingly attached to the closed side 1134 by means of brazing, adhesion, insertion or press fit. The second side 126 of the heat pipe 12 is correspondingly positioned in the open side 1133.
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The heat generated by the heat source 2 not only is spread over the heat absorption section 111 of the heat sink 11 by the heat pipe 12 in a horizontal direction, but also is directly conducted by the heat absorption section 111 from the heat source 2 to the heat dissipation section 112 of the heat sink 11 in a vertical direction. Therefore, the heat dissipation performance of the heat sink 11 is greatly enhanced.
The above embodiments are only used to illustrate the present invention, not intended to limit the scope thereof. It is understood that many changes and modifications of the above embodiments can be made without departing from the spirit of the present invention. The scope of the present invention is limited only by the appended claims.
Claims
1. A thermal module comprising:
- a heat sink having a heat absorption section and a heat dissipation section, the heat dissipation section having multiple radiating fins, the heat absorption section being formed with at least one receiving groove; and
- a heat pipe received in the receiving groove, the heat pipe having a first end, a second end, a middle section and at least one conduction section, the first and second ends and the middle section being arranged in adjacency to each other to together define a first section, the conduction section winding around the first section.
2. The thermal module as claimed in claim 1, wherein the receiving groove has a heat absorption section and a spreading section, the heat absorption section being disposed on inner side of the spreading section, the first section of the heat pipe being disposed in the heat absorption section, while the conduction section of the heat pipe being disposed in the spreading section.
3. The thermal module as claimed in claim 1, wherein the first section of the heat pipe is adjacent to the conduction section and as a whole, the heat pipe has an asymmetrical form.
4. The thermal module as claimed in claim 1, wherein the receiving groove has an open side and a closed side, the heat pipe having a first side and a second side, the first side of the heat pipe being correspondingly attached to the closed side, the second side of the heat pipe being correspondingly positioned in the open side.
5. The thermal module as claimed in claim 4, wherein one of the first and second sides of the heat pipe has a flat form.
6. The thermal module as claimed in claim 4, wherein both the first and second sides of the heat pipe have a flat form.
7. The thermal module as claimed in claim 1, further comprising a substrate attached to the first section of the heat pipe.
8. The thermal module as claimed in claim 1, further comprising a substrate attached to the heat pipe.
Type: Application
Filed: Mar 1, 2012
Publication Date: Jul 4, 2013
Applicant: ASIA VITAL COMPONENTS CO., LTD. (New Taipei City)
Inventor: Chun-Ming Wu (New Taipei City)
Application Number: 13/409,108
International Classification: F28D 15/04 (20060101);