Heat Dissipating Device
A heat dissipating device includes an outer heat conducting unit, disposed with outer heat conducting plates, and an inner heat conducting unit. The outer heat conducting unit includes an outer surrounding wall having inner and outer wall surfaces. The inner wall surface defines a space. The outer surrounding wall further has an opening sealed by a cover. The inner heat conducting unit is formed as a separate component from the outer heat conducting unit, is received in the space, and is in thermal contact with the inner wall surface of the outer surrounding wall.
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This application claims priority of Taiwanese application no. 101208225, filed on May 2, 2012.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to a heat dissipating device.
2. Description of the Related Art
Referring to
Due to the heat conducting unit 11 and the outer heat conducting plates 12 being formed integrally as a unit, they are commonly manufactured by aluminum extrusion or casting. However, when manufacturing by aluminum extrusion, the greater the number of the outer heat conducting plates 12 and plates 113, the greater will be the force a manufacturing machine needs to generate, and such high output manufacturing machine increases manufacturing costs. Also, the greater the number of the outer heat conducting plates 12 and plates 113, the higher frictional forces may also wear out the components in the manufacturing machine faster, decreasing the service life of the machines. When manufacturing by casting, the flow of material within a molding equipment and mold release may be affected due to the highly dense arrangements of the outer heat conducting plates 12 and plates 113, and manufacturing defects may result. Such drawbacks restrict the number of the outer heat conducting plates 12 and plates 113 that can be formed in the heat dissipating device 1 during manufacturing.
SUMMARY OF THE INVENTIONThe object of the present invention is to provide a heat dissipating device that is relative to manufacture and that can effectively dissipate heat from a heat source.
According to the present invention, there is provided a heat dissipating device. The heat dissipating device includes an outer heat conducting unit which includes an outer surrounding wall having an inner wall surface and an outer wall surface. The inner wall surface defines a space. The outer surrounding wall further has a first opening. The outer heat conducting unit further includes a first cover to seal the first opening.
The heat dissipating device further includes a plurality of outer heat conducting plates spacedly disposed on and extending away from the outer wall surface.
The heat dissipating device further includes an inner heat conducting unit formed as a separate component from the outer heat conducting unit. The inner heat conducting unit is received in the space, and is in thermal contact with the inner wall surface of the surrounding wall.
Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:
Referring to
The outer heat conducting unit 3 includes an outer surrounding wall 31 and a first cover 32. The outer surrounding wall 31 has an inner wall surface 311, an outer wall surface 312, and a space 313 defined by the inner wall surface 311. The space 313 has a form of a blind hole and has a first opening 314. The first cover 32 seals the first opening 314. The outer heat conducting plates 41 are spacedly disposed on and extend away from the outer wall surface 312.
The inner heat conducting unit 5 is formed as a separate component from the outer heat conducting unit 3 and is received in the space 313. In this preferred embodiment, the inner heat conducting unit 5 includes an inner surrounding wall 51 corresponding in shape to the inner wall surface 311 of the outer surrounding wall 31, a plurality of inner heat conducting plates 52 spacedly disposed in and connected to the inner surrounding wall 51, and a plurality of flow channels 53 cooperatively defined by the inner surrounding wall 51 and the inner heat conducting plates 52. The flow channels 53 are defined by a plurality of surfaces 511. The inner surrounding wall 51 is welded to the inner wall surface 311 of the outer surrounding wall 31. The inner heat conducting plates 52 extend in a direction away from the first opening 314. The first cover 32 has a retaining portion 321 extending towards the inner heat conducting unit 5 and fittingly insertable into one of the flow channels 53. More than one retaining portion 321 may be provided to enhance retention of the first cover 32 on the inner heat conducting unit 5. Use of the retaining portion 321 is only one of many types of engagement applicable between the first cover 32 and the outer surrounding wall 31, and the invention should not be limited in this respect.
As illustrated in
Referring to
Referring to
In this invention, the inner heat conducting unit 5 is formed as a separate component from the outer heat conducting unit 3. This effectively mitigates the problem of excessively large friction that arises when simultaneously forming the plurality of outer heat conducting plates 41 and the plurality of inner heat conducting plates 52 during aluminum extrusion in manufacturing, and the problem of uniformity in material flow during casting due to the highly dense arrangements of the plurality of outer heat conducting plates 41 and the plurality of inner heat conducting plates 52 in the molding equipment. By overcoming such problems, manufacturing costs can be effectively reduced and a greater number of the outer heat conducting plates 41 and the inner heat conducting plates 52 may be formed to increase the efficiency of heat dissipation.
Referring to
Referring to
In summary, the heat dissipating device 2, by separating the inner heat conducting unit 5 and the outer heat conducting unit 3, effectively mitigates the problem of excessively large friction and the problem of material uniformity during casting. By such, the manufacturing costs can be effectively reduced and a greater number of the outer heat conducting plates 41 and the inner heat conducting plates 52 may be formed to increase the efficiency of heat dissipation.
While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all suchmodifications and equivalent arrangements.
Claims
1. A heat dissipating device comprising:
- an outer heat conducting unit including an outer surrounding wall having an inner wall surface and an outer wall surface, said inner wall surface defining a space, said outer surrounding wall further having a first opening, said outer heat conducting unit further including a first cover 32 to seal said first opening;
- a plurality of outer heat conducting plates spacedly disposed on and extending away from said outer wall surface; and
- an inner heat conducting unit formed as a separate component from said outer heat conducting unit, received in said space, and in thermal contact with said inner wall surface of said surrounding wall.
2. The heat dissipating device as claimed in claim 1, wherein said first cover has a retaining portion extending towards said inner heat conducting unit.
3. The heat dissipating device as claimed in claim 1, wherein said inner heat conducting unit includes an inner surrounding wall corresponding in shape to said inner wall surface of said outer surrounding wall, a plurality of inner heat conducting plates spacedly disposed in and connected to said inner surrounding wall, and a plurality of flow channels cooperatively defined by said inner surrounding wall and said inner heat conducting plates;
- said inner surrounding wall being welded to said inner wall surface of said outer surrounding wall, and said inner heat conducting plates extending in a direction away from said first cover.
4. The heat dissipating device as claimed in claim 3, wherein said space of said outer heat conducting unit has a form of a blind hole.
5. The heat dissipating device as claimed in claim 3, wherein said outer surrounding wall further has a second opening opposite to said first opening, said outer heat conducting unit further including a second cover to seal said second opening, said inner heat conducting plates extending in a direction from said first opening towards said second opening, said second cover having a retaining portion extending toward said inner heat conducting unit.
6. The heat dissipating device as claimed in claim 3, wherein said outer wall surface of said outer surrounding wall has a contact portion for contacting a heat source, said outer heat conducting plates being disposed on a region of said outer wall surface of said outer surrounding wall other than said contact portion.
7. The heat dissipating device as claimed in claim 3, wherein said inner heat conducting unit has surfaces that define said flow channels and that are serrated surfaces.
8. The heat dissipating device as claimed in claim 1, wherein said inner heat conducting unit includes an inner surrounding wall, and a plurality of inner heat conducting plates spacedly disposed on said inner surrounding wall and welded to said outer surrounding wall, said inner heat conducting plates extending in a direction away from said first cover, said inner surrounding wall and said inner heat conducting plates cooperating with said outer surrounding wall to define a plurality of flow channels.
9. The heat dissipating device as claimed in claim 8, wherein at least one of said outer heat conducting plates and said inner heat conducting plates is a curved plate.
10. The heat dissipating device as claimed in claim 1, wherein said inner heat conducting unit includes an inner surrounding wall, a plurality of inner heat conducting plates spacedly disposed on said inner surrounding wall and extending towards said outer surrounding wall, a surrounding plate surrounding and connected to said inner heat conducting plates, and a plurality of flow channels cooperatively defined by said inner surrounding wall, said surrounding plate and said inner heat conducting plates;
- said surrounding plate corresponding in shape to said inner wall surface of said outer surrounding wall and being welded to said inner wall surface of said outer surrounding wall, and said inner heat conducting plates extending in a direction away from said first cover.
11. The heat dissipating device as claimed in claim 10, wherein at least one of said outer heat conducting plates and said inner heat conducting plates is a curved plate.
Type: Application
Filed: Apr 30, 2013
Publication Date: Nov 7, 2013
Applicant: MICROTIPS ELECTRONICS CO., LTD. (Kaohsiung)
Inventors: Takeshi Omori (Kaohsiung City), Hsin-Hung Lin (Pingtung City)
Application Number: 13/873,535
International Classification: F28D 15/02 (20060101);