HEAT-DISSIPATING MODULE FOR DIGITAL LIGHT PROCESSING PROJECTOR
A heat-dissipating module includes a thermal conduction structure, at least one heat pipe, and plural fins. The thermal conduction structure includes a connecting part. The connecting part has a first surface and a second surface opposed to the first surface. The first surface is contacted with a digital micromirror device. The heat pipe includes a penetrating part and a suspension arm. The penetrating part runs through the connecting part of the thermal conduction structure from the second surface to the first surface. The penetrating part is contacted with the digital micromirror device. The plural fins are contacted with the suspension arm. After the heat generated by the digital micromirror device is transferred to the suspension arm through the thermal conduction structure and the penetrating part, the heat is transferred from the plural fins to the plural fins and then dissipated to surroundings through the plural fins.
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The present invention relates to a heat-dissipating module, and more particularly to a heat-dissipating module for a digital micromirror device of a digital light processing projector.
BACKGROUND OF THE INVENTIONWith rapid development of digitalized techniques, projectors become essential image display devices in business centers, homes, exhibition halls or other places. Generally, the projectors are classified into two types, i.e. a liquid crystal display (LCD) projector and a digital light processing (DLP) projector. Since the DLP projector has high contrast, rapid response speed and high reliability, the DLP projector becomes a predominant product of the contemporary display devices. Generally, the core element of a DLP projector comprises a main board and a digital micromirror device (DMD). The main board comprises a plurality of digital video signal processors. The digital micromirror device comprises a micromirror set. The micromirror set of the digital micromirror device is a principal display unit of the DLP projector.
During the projecting operation of the DLP projector is performed, since the light beam is collected on the digital micromirror device, a great deal of heat is generated. It is important to take a heat-dissipating measure to effectively remove the heat.
Generally, the heat-dissipating module for the digital micromirror device at least comprises a thermal conduction structure. The thermal conduction structure is attached on the surface of the digital micromirror device. After the heat from the digital micromirror device is transferred to the thermal conduction structure, the heat is further dissipated away to the surroundings through heat pipes (not shown), fins (not shown) or a cold plate (not shown).
In the above-mentioned heat-dissipating module, the heat generated by the digital micromirror device is transferred to the heat pipes through the thermal conduction structure 1. The thermal conductivity of the thermal conduction structure 1 as shown in
The present invention provides a heat-dissipating module for a digital micromirror device of a digital light processing projector. The inventive heat-dissipating module comprises a thermal conduction structure and a heat pipe, wherein a penetrating part of the heat pipe runs through a connecting part of the thermal conduction structure so that the penetrating part of the heat pipe can be directly contacted with the digital micromirror device. Therefore, the heat-dissipating efficiency along the vertical direction is increased, the thermal spreading resistance is largely reduced, and the overall heat-dissipating efficiency of the heat-dissipating module is enhanced.
In accordance with an aspect of the present invention, there is provided a heat-dissipating module for a digital light processing projector. The digital light processing projector includes a digital micromirror device. The heat-dissipating module includes a thermal conduction structure, at least one heat pipe, and plural fins. The thermal conduction structure includes a connecting part. The connecting part has a first surface and a second surface opposed to the first surface. The first surface of the connecting part is contacted with the digital micromirror device. The heat pipe includes a penetrating part and a suspension arm. The suspension arm is connected with the penetrating part. The penetrating part runs through the connecting part of the thermal conduction structure from the second surface of the connecting part to the first surface of the connecting part. The penetrating part is contacted with the digital micromirror device. The plural fins are contacted with the suspension arm. After the heat generated by the digital micromirror device is transferred to the suspension arm of the heat pipe through the thermal conduction structure and the penetrating part of the heat pipe, the heat is transferred from the suspension arm to the plural fins and then dissipated to surroundings through the plural fins.
The above contents of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
In this embodiment, the at least one heat pipe 22 comprises two heat pipes 22a and 22b. The number of the heat pipes is not restricted. That is, the number of the heat pipes may be varied according to the practical requirements. Moreover, the heat pipe 22a comprises a penetrating part 221a and a suspension arm 225a, and the heat pipe 22b comprises a penetrating part 221b and a suspension arm 225b. The suspension arms 225a and 225b are connected with the penetrating parts 221a and 221b, respectively. Consequently, the heat may be transferred to the suspension arms 225a and 225b through the penetrating parts 221a and 221b. Moreover, the suspension arms 225a and 225b are contacted with the plural fins 23. Consequently, the heat may further transferred from the suspension arms 225a and 225b to the surroundings through the plural fins 23.
The two penetrating parts 221a and 221b run through the connecting part 21 downwardly from the second surface 21b of the connecting part 21 to the first surface 21a of the connecting part 21. Moreover, in this embodiment, the penetrating part 221a has a terminal surface 220a, and the penetrating part 221b has a terminal surface 220b. After the two penetrating parts 221a and 221b run through the connecting part 21 vertically, the terminal surfaces 220a and 220b are coplanar with the first surface 21a of the connecting part 21. Consequently, the penetrating parts 221a and 221b may be directly contacted with the digital micromirror device 3 through the terminal surfaces 220a and 220b. Moreover, since the heat pipes 22a and 22b are made of the materials with high thermal conductivity, the heat can be quickly transferred to the plural fins 23 through the heat pipes 22a and 22b, and then dissipated to the surroundings.
In this embodiment, the suspension arm 225a of the heat pipe 22a comprises a first extension segment 222a, a bent segment 223a, and a second extension segment 224a. Similarly, the suspension arm 225b of the heat pipe 22b comprises a first extension segment 222b, a bent segment 223b, and a second extension segment 224b. The first extension segment 222a is connected with the penetrating part 221a, so that the heat from the penetrating part 221a may be transferred to the first extension segment 222a. Similarly, the first extension segment 222b is connected with the penetrating part 221b, so that the heat from the penetrating part 221b may be transferred to the first extension segment 222b. A first end of the bent segment 223a is connected with the first extension segment 222a, and a second end of the bent segment 223a is connected with the second extension segment 224a. Consequently, the heat from the first extension segment 222a may be further transferred to the second extension segment 224a through the bent segment 223a. Similarly, a first end of the bent segment 223b is connected with the first extension segment 222b, and a second end of the bent segment 223b is connected with the second extension segment 224b. Consequently, the heat from the first extension segment 222b may be further transferred to the second extension segment 224b through the bent segment 223b. Moreover, the first extension segments 222a, 222b and the second extension segments 224a, 224b run through the plural fins 23. Consequently, when the cooling liquid (not shown) within the heat pipes 22a and 22b flow through the heat pipes 22a and 22b, the heat may be further transferred from the first extension segments 222a, 222b and the second extension segments 224a, 224b of the heat pipes 22a and 22b to the plural fins 23. Moreover, due to the large surface of the plural fins 23, the heat exchange between the plural fins 23 and the ambient air is enhanced. In such way, the heat-dissipating efficacy is enhanced.
Please refer to
Since the at least one heat pipe 22 runs through the connecting part 21 to be contacted with the digital micromirror chip 30, the heat can be directly and efficiently transferred from the digital micromirror chip 30 to the at least one heat pipe 22. In addition, the heat is also transferred to the surroundings through the thermal conduction structure 20. Consequently, the heat-dissipating efficiency along the vertical direction of the at least one heat pipe is enhanced, the thermal spreading resistance is largely reduced, and the overall heat-dissipating efficiency of the heat-dissipating module is enhanced. When compared with the conventional heat-dissipating module of transferring the heat to the heat pipe through the thermal conduction structure, the heat-dissipating module of the present invention can directly transfer the heat to the fins through the heat pipe.
Please refer to
In this embodiment, the at least one heat pipe 43 also comprises a penetrating part 431 and a suspension arm 432. In addition, the suspension arm 432 also comprises a first extension segment 433, a bent segment 434, and a second extension segment 435. The configurations of the connecting part 41 of the thermal conduction structure 40, the heat pipe 43 and the plural fins 44 are similar to those of the above embodiments, and are not redundantly described herein.
In this embodiment, the thermal conduction structure 40 further comprises a base 42. The base 42 is a flat plate, but is not limited to the flat plate. The base 42 has a third surface 42a and a fourth surface 42b, wherein the third surface 42a and the fourth surface 42b are opposed to each other. The third surface 42a of the base 42 is connected with the second surface 41b of the connecting part 41. In addition, the area of the third surface 42a of the base 42 is greater than the area of the second surface 41b of the connecting part 41 in order to increase the structural strength of the thermal conduction structure 40 and the base 42. In this embodiment, the penetrating part 431 of the heat pipe 43 runs through the base 42 vertically from the fourth surface 42b of the base 42 to the first surface 42a of the base 42, and then runs through the connecting part 41 from the second surface 41b of the connecting part 41 to the first surface 41a of the connecting part 41. In such way, the terminal surface 431a of the penetrating part 431 is directly contacted with the digital micromirror device 5. Consequently, the heat is directly transferred to the heat pipe 43. Since the heat pipe 43 is made of the material with high thermal conductivity, the heat can be quickly transferred to the plural fins 44 through the heat pipe 43, and then dissipated to the surroundings. In other words, the heat-dissipating efficiency along the vertical direction of the heat pipe 43 is enhanced, the thermal spreading resistance is largely reduced, and the overall heat-dissipating efficiency of the heat-dissipating module 4 is enhanced.
In this embodiment, the thermal conduction structure 40 further comprises a base 42. The base 42 comprises a flat plate 420 and a frame 421. The flat plate 420 is enclosed by the frame 421. In addition, two edges of the flat plate 420 are connected to inner surfaces of the frame 421. The arrangement of the frame 421 may increase the structural strength of the flat plate 420 and support the plural fins 44. Moreover, as shown in
In this embodiment, the thermal conduction structure 60 further comprises a base 62. The base 62 is a flat plate with plural heat-dissipating slices 62c. The base 62 has a third surface 62a and a fourth surface 62b, wherein the third surface 62a and the fourth surface 62b are opposed to each other. The third surface 62a of the base 62 is connected with the second surface 61b of the connecting part 61. The plural heat-dissipating slices 62c are extended from the fourth surface 62b of the base 62 for facilitating the thermal conduction structure 60 to dissipate the heat. Similarly, the penetrating part 631 of the heat pipe 63 runs through the connecting part 61 vertically from the second surface 61b of the connecting part 61 to the first surface 61a of the connecting part 61. In such way, the terminal surface 631a of the penetrating part 631 is directly contacted with the digital micromirror chip 70 of the digital micromirror device 7. Consequently, the heat can be directly and efficiently transferred from the digital micromirror chip 70 to the at least one heat pipe 63. Since the heat is further transferred to the surroundings through the thermal conduction structure 60, the heat-dissipating efficiency along the vertical direction of the at least one heat pipe 62 is enhanced, and the thermal spreading resistance is largely reduced. Moreover, due to the large areas of the plural fins 64 and the plural heat-dissipating slices 62c, the efficacy of the heat exchange between the heat-dissipating module 6 and the ambient air is increased. Consequently, the overall heat-dissipating efficiency of the heat-dissipating module 6 is enhanced.
From the above descriptions, the present invention provides a heat-dissipating module for a digital light processing projector. The heat-dissipating module comprises a thermal conduction structure, at least one heat pipe, and plural fins. The thermal conduction structure comprises a connecting part. A penetrating part of the heat pipe runs through the connecting part of the thermal conduction structure from a second surface of the connecting part to a first surface of the connecting part. Consequently, the terminal surface of the penetrating part is coplanar with the first surface of the connecting part, and directly contacted with the digital micromirror device of the digital light processing projector. Since the heat pipe is made of the material with high thermal conductivity, the heat can be quickly transferred to the large-area fins through the suspension arm of the heat pipe, and then dissipated to the surroundings. In such way, the heat-dissipating efficiency along the vertical direction is increased, the thermal spreading resistance is largely reduced, and the overall heat-dissipating efficiency of the heat-dissipating module is enhanced. When compared with the conventional heat-dissipating module of transferring the heat to the heat pipe through the thermal conduction structure, the heat-dissipating module of the present invention can directly transfer the heat to the fins through the heat pipe.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
Claims
1. A heat-dissipating module for a digital light processing projector, said digital light processing projector comprising a digital micromirror device, said heat-dissipating module comprising:
- a thermal conduction structure comprising a connecting part, wherein said connecting part has a first surface and a second surface opposed to said first surface, wherein said first surface is contacted with said digital micromirror device;
- at least one heat pipe comprising a penetrating part and a suspension arm, wherein said suspension arm is connected with said penetrating part, wherein said penetrating part runs through said connecting part of said thermal conduction structure from said second surface to said first surface, and said penetrating part is contacted with said digital micromirror device; and
- a plurality of fins contacted with said suspension arm,
- wherein after the heat generated by said digital micromirror device is transferred to said suspension arm of said heat pipe through said thermal conduction structure and said penetrating part of said heat pipe, the heat is transferred from said suspension arm to said plural fins and then dissipated to surroundings through said plural fins.
2. The heat-dissipating module according to claim 1, wherein said penetrating part of said heat pipe has a terminal surface, wherein said terminal surface of said penetrating part is coplanar with said first surface of said connecting part, and said terminal surface of said penetrating part is contacted with said digital micromirror device.
3. The heat-dissipating module according to claim 1, wherein said digital micromirror device comprises a digital micromirror chip, wherein said first surface of said connecting part and said penetrating part of said heat pipe are contacted with said digital micromirror chip.
4. The heat-dissipating module according to claim 1, wherein said suspension arm of said heat pipe comprises a first extension segment, a bent segment and a second extension segment, wherein said first extension segment is connected with said penetrating part, said bent segment is connected with said first extension segment and said second extension segment, and said first extension segment and said second extension segment are contacted with said plural fins.
5. The heat-dissipating module according to claim 4, wherein said first extension segment and said second extension segment are parallel with each other.
6. The heat-dissipating module according to claim 1, wherein said thermal conduction structure further comprises a base, wherein said base is connected with said connecting part, and said base has a third surface and a fourth surface opposed to said third surface, wherein said third surface of said base is connected with said second surface of said connecting part.
7. The heat-dissipating module according to claim 6, wherein after said penetrating part runs through said base from said fourth surface to said third surface, said penetrating part runs through said connecting part of said thermal conduction structure from said second surface to said first surface, and said penetrating part is contacted with said digital micromirror device.
8. The heat-dissipating module according to claim 6, wherein said base further comprises plural heat-dissipating slices, which are extended from said fourth surface of said base.
9. The heat-dissipating module according to claim 6, wherein said base further a frame for supporting said plural fins, and said frame has plural positioning structures for facilitating positioning said heat-dissipating module.
10. The heat-dissipating module according to claim 1, wherein said connecting part of said thermal conduction structure and said digital micromirror device are connected with each other through an adhesive, wherein said adhesive is an insulated and thermally-conductive adhesive.
Type: Application
Filed: Mar 14, 2013
Publication Date: Jan 2, 2014
Applicant: DELTA ELECTRONICS, INC. (Taoyuan Hsien)
Inventor: Hui-Hsiung Wang (Taoyuan Hsien)
Application Number: 13/831,339
International Classification: F28D 15/02 (20060101);