STRUCTURE OF LOW-PROFILE HEAT PIPE
A structure of low-profile heat pipe includes a flat heat-transfer pipe head and an elongated flat flow-guide pipe body formed in integrity, a heat-transfer cover plate affixed to the flat heat-transfer pipe head and the elongated flat flow-guide pipe body, a cavity defined in between the flat heat-transfer pipe head and elongated flat flow-guide pipe body and the heat-transfer cover plate and holding a working fluid and defining a condensation side at its one end remote from the flat heat-transfer pipe head and an evaporation side at its other end within the flat heat-transfer pipe head, and a wick structure surrounding and in communication with the cavity.
1. Field of the Invention
The present invention relates to heat sink technology and more particularly, to a structure of low-profile heat pipe that simplifies the fabrication and enhances the heat dissipation efficiency.
2. Description of the Related Art
A heat pipe design is known comprising a heat-transfer pipe head and a heat pipe body. The heat-transfer pipe head defines therein a recessed hole. The heat pipe body has its one end embedded in the recessed hole of the heat-transfer pipe head. During application of the heat sink, the heat-transfer pipe head is attached to the surface of an electronic component to absorb waste heat. When the heat-transfer pipe head absorbs heat energy from the electronic component, it heats the heat pipe body, causing vaporization of a fluid at one end of the heat pipe body and release of heat energy at the other end of the heat pipe body by condensation of the vapor. However, the heat pipe body and heat-transfer pipe head of this design of heat pipe must be separately made and then joined together. In consequence, the fabrication of this design of heat pipe requires much labor and time and can cause a defective product problem. Following the market trend of the electronic industry toward a low profile design, the vertical installation space in an electronic device for heat pipe must be minimized. Further, it is the market trend to create electronic products having a low profile. In consequence, the vertical installation space in an electronic device for heat pipe must be minimized. However, according to the aforesaid prior art heat pipe design, the heat pipe body has its one end embedded in the recessed hole of the heat-transfer pipe head. This design does not allow significant reduction of the vertical thickness of the heat pipe, restricting the range of applications. Further, if the bonding tightness between the heat pipe body and the recessed hole of the heat-transfer pipe head is insufficient, the heat transfer efficiency will be affected, lowering the performance of the heat pipe. Further, more of the working fluid cannot be accommodated due to the limited volume of the heat pipe body, resulting in poor cooling effect.
SUMMARY OF THE INVENTIONThe present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a structure of low-profile heat pipe, which simplifies the fabrication, increases the yield, and enhances the heat dissipation efficiency.
To achieve this and other objects of the present invention, a low-profile heat pipe comprises a flat heat-transfer pipe head, an elongated flat flow-guide pipe body formed integral with and extended from one side of the flat heat-transfer pipe head, an elongated recessed cavity located at the top wall of the flat heat-transfer pipe head and the top wall of the elongated flat flow-guide pipe body and extending along the length of the elongated flat flow-guide pipe body and defining a condensation side at its one end remote from the flat heat-transfer pipe head and an evaporation side at its other end within the flat heat-transfer pipe head, a heat-transfer cover plate fixedly fastened to the flat heat-transfer pipe head and the elongated flat flow-guide pipe body to keep the elongated recessed cavity airtight, a plurality of flow-guide grooves formed in the elongated recessed cavity, a working fluid sealed in the elongated recessed cavity, and a wick structure sintered on the flat heat-transfer pipe head and the elongated flat flow-guide pipe body within the elongated recessed cavity and the bottom wall of the heat-transfer cover plate corresponding to the elongated recessed cavity.
Referring to
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In the aforesaid first embodiment of the present invention, as shown in
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In conclusion, the invention provides a structure of low-profile heat pipe 10;20 that has the advantages and features as follows:
1. When the flat heat-transfer pipe head 1 of the structure of low-profile heat pipe 10 or the expanded head portion 71 of the flat base member 7 absorbs heat energy from the electronic component A, it directly transfers absorbed heat energy to the working fluid 34;93, causing vaporization of the working fluid 34;93.
2. The structure of low-profile heat pipe 10;20 can be configured subject to user's or designer's demand, having the characteristics of low thickness, ease of fabrication and low manufacturing cost.
3. The volume of the cavity 3;9 of the structure of low-profile heat pipe 10;20 can be determined subject to the designer's demand for accommodating a large amount of working fluid 34;93.
Claims
1. A structure of low-profile heat pipe, comprising:
- a flat heat-transfer pipe head;
- an elongated flat flow-guide pipe body formed integral with and extended from one side of said flat heat-transfer pipe head;
- an elongated recessed cavity located at a top wall of said flat heat-transfer pipe head and a top wall of said elongated flat flow-guide pipe body and extending along the length of said elongated flat flow-guide pipe body, said elongated recessed cavity defining a condensation side at one end thereof remote from said flat heat-transfer pipe head and an evaporation side at an opposite end thereof within said flat heat-transfer pipe head; and
- a heat-transfer cover plate fixedly fastened to said flat heat-transfer pipe head and said elongated flat flow-guide pipe body to keep said elongated recessed cavity airtight.
2. The structure of low-profile heat pipe as claimed in claim 1, further comprising an endless groove located at said flat heat-transfer pipe head and said elongated flat flow-guide pipe body in communication with and around said elongated recessed cavity; said heat-transfer cover plate is press-fitted into said endless groove and peripherally bonded to said flat heat-transfer pipe head and said elongated flat flow-guide pipe body.
3. The structure of low-profile heat pipe as claimed in claim 1, further comprising a wick structure sintered on said flat heat-transfer pipe head and said elongated flat flow-guide pipe body within said elongated recessed cavity and a bottom wall of said heat-transfer cover plate corresponding to said elongated recessed cavity.
4. The structure of low-profile heat pipe as claimed in claim 1, further comprising a plurality of flow-guide grooves formed in said elongated recessed cavity.
5. The structure of low-profile heat pipe as claimed in claim 1, further comprising a working fluid sealed in said elongated recessed cavity.
6. A structure of low-profile heat pipe, comprising:
- a flat base member being a single piece member comprising an expanded head portion, a narrow elongated body portion extended from a middle part of one side of said expanded head portion and a peripheral endless upright wall extending around said expanded head portion and said narrow elongated body portion;
- a flat cover member fixedly fastened to said flat base member; and
- an enclosed cavity defined in between said flat base member and said flat cover member, said enclosed cavity defining an evaporation side at one end thereof within said expanded head portion of said base member and a condensation side at an opposite end thereof within said narrow elongated body portion of said flat base member and remote from said expanded head portion.
7. The structure of low-profile heat pipe as claimed in claim 6, wherein said flat base member further comprises an endless groove located on an inner surface of said peripheral endless upright wall; said flat cover member is press-fitted into said endless groove and then fixedly fastened to said flat base member.
8. The structure of low-profile heat pipe as claimed in claim 6, further comprising a wick structure sintered on said flat base member and said flat cover member in communication with and around said enclosed cavity.
9. The structure of low-profile heat pipe as claimed in claim 6, further said flat base member further comprises a plurality of flow-guide grooves formed in said enclosed cavity.
10. The structure of low-profile heat pipe as claimed in claim 6, further comprising a working fluid sealed in said enclosed cavity.
Type: Application
Filed: Nov 18, 2012
Publication Date: May 22, 2014
Inventor: Chin-Hsing HORNG (KUEISHAN HSIANG)
Application Number: 13/680,085
International Classification: F28D 15/04 (20060101); F28D 15/02 (20060101);