Abstract: A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.

Abstract: A carrier head for chemical mechanical polishing includes a housing for attachment to a drive shaft, a membrane assembly beneath the housing with a space between the housing and the membrane assembly defining a pressurizable chamber, and a sensor in the housing configured to measure a distance from the sensor to the membrane assembly.

Abstract: A method includes supplying slurry onto a polishing pad. A wafer is held against the polishing pad with a first piezoelectric layer interposed between a pressure unit and the wafer. A first voltage generated by the first piezoelectric layer is detected. The wafer is pressed, using the pressure unit, against the polishing pad according to the detected first voltage generated by the first piezoelectric layer. The wafer is polished using the polishing pad.

Abstract: A control device includes: an input unit; a motor driving control unit; an amount-of-movement detecting unit; a coordinate position detecting unit; a display unit; and a rounding processing unit configured to, during an axial feed operation, repeatedly perform rounding processing for rounding to a rounding place at least one of the coordinate position and the amount of movement of an object to be moved. The motor driving control unit drives motors, after the axial feed operation has been stopped, based on the result of the rounding processing that was performed last.

Abstract: A monitoring method and system are present for process control of surface treatment associated with material deposition on the surface, which provides for achieving and maintaining a desired (according to design rules) geometrical profile of the surface while being coated by certain substance/material. The technique of the invention provides for remotely and fully-automatically monitoring/verifying the geometrical profile of the surface being treated, and providing the control/verification data for executing local corrections. The technique can be applied to various geometrical profiles such as planar geometry, round/curved surface of a predetermined curvature, multi-portions surface with predetermined angular orientations of the multiple portions (e.g. 90 degree angles at corners of a room).

Abstract: A method for processing a wafer (in a process of manufacturing semiconductor devices) may include the following steps: using a first slurry set to perform a first chemical mechanical polishing process on the wafer, wherein the wafer includes a plurality of metal gate structures; using a second slurry set to perform a second chemical mechanical polishing process on the wafer, wherein a concentration of a slurry material in the second slurry set is less than a concentration of the slurry material in the first slurry set; performing a cleaning process on the wafer; and providing an anti-reflective coating on the wafer.

Abstract: A lens processing management system (1) includes: a processing device (20) which processes lenses; a data supply device (10) which can supply design data to the processing device; and a control means (24) which limits the processing of lenses using the design data in the processing device.

Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.

Abstract: A machine tool cooling system and cooling method which allow cost reduction by reducing the number of control valves, and in which opening/closing control is simple are disclosed. The machine tool cooling system and cooling method include a hot oil tank storing hot oil, a cold oil tank storing cold oil, a first to third hot oil passages and a first to third cold oil passages, which supply the hot oil and the cold oil to a first to third heat generating portions, a hot oil return passage returning the hot oil to the hot oil tank, a first to third supply control valves interposed in the first to third cold oil passages, and a valve controller controlling opening/closing of the first to third supply control valves so that the cold oil is supplied to the first to third heat generating portions intermittently at different timings.

Abstract: A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: The invention relates to a method for machining flat workpieces in a double-sided machining tool, which has an upper and a lower work disk, wherein at least one of the work disks is rotatingly driven and the work disks each have an annular work surface, wherein the work surfaces amongst themselves limit an also annular work gap, in which at least one carrier is located, which guides at least one workpiece in the work gap, so that the at least one workpiece is machined in a double-sided manner between the work surfaces. The distance between the work disks is measured at at least two radially spaced measurement locations of the work gap and in that, from the measured distances, a distance between the work disks is determined at a location of the work gap representing the thickness of the at least one workpiece machined in the work gap.

Abstract: A device for phasing a threaded grinding stone is phased with respect to a workpiece or a disk dresser prior to the engagement of the threaded grinding stone with the workpiece or with the disk dresser during grinding or dressing. In performing this phasing, it is detected, by means of an AE fluid sensor provided to a grinding stone head which rotatably supports the threaded grinding stone, whether the threaded grinding stone has had contact with the workpiece or the disk dresser. Subsequently, on the basis of the phase of the threaded grinding stone at the time when contact was detected, the threaded grinding stone is positioned in a phase where the aforementioned engagement is feasible.

Abstract: A system for magnetorheological finishing of a substrate. A spherical wheel meant for carrying a magnetorheological finishing fluid houses a variable-field permanent magnet system having north and south iron pole pieces separated by primary and secondary gaps with a cylindrical cavity bored through the center. A cylindrical permanent magnet magnetized normal to the cylinder axis is rotatably disposed in the cavity. An actuator allows rotation of the permanent magnet to any angle, which rotation changes the distribution of flux in the magnetic circuit through the pole pieces. Thus, one can control field intensity in the gaps by positioning the permanent magnet at whatever angle provides the required field strength. Because the field also passes above the pole pieces, defining a fringing field outside the wheel surface, the variable field extends through a layer of MR fluid on the wheel, thus varying the stiffness of the MR fluid as may be desired for finishing control.

Abstract: A truing device of a grinding machine includes: a truer that corrects a shape of a grinding wheel; a swivel table that supports the truer such that the truer is swivelable about a swivel axis Ac; detecting means for directly detecting a distance from a truing edge position of the truer, which contacts the grinding wheel during correction of the shape of the grinding wheel, to a swivel center O of the swivel table; and control means for controlling the truing edge position of the truer with respect to the grinding wheel based on the distance L detected by the detecting means to true the grinding wheel.

Abstract: A machine tool 1 comprises a bed 11, a column 12, a spindle head 15, a spindle 16, a saddle 17, a table 18, a feed mechanism for moving the spindle head 15, the saddle 17 and the table 18 in Z-axis, Y-axis and X-axis directions respectively, a position detector for detecting the positions of the spindle head 15, saddle 17 and table 18, a controller for feedback controlling the feed mechanism, a position detector 51 for detecting the position of the spindle head 15, a position detector 54 for detecting the position of the spindle head 15, a position detector 57 for detecting the position of the table 18, and a measurement frame 50 which is configured with a different member from the bed 11 and the column 12 and on which readers 53, 56, 59 of the position detectors 51, 54, 57 are disposed.

Abstract: Provided is a method of phasing a threaded grinding stone, as well as a device therefor, the aforementioned method and device being such that contact or non-contact of a threaded grinding stone with a disk dresser can be detected with high accuracy, with the result that the phasing of the threaded grinding stone can be accurately performed. For the purpose of achieving the above, a threaded grinding stone (14) is phased with respect to a disk dresser (32) prior to the engagement of the threaded grinding stone (14) with the disk dresser (32) during dressing. In performing this phasing, it is determined whether or not the threaded grinding stone (14) contacted the disk dresser (32), on the basis of a voltage (V) which is commensurate with the amplitude of the elastic wave generated in the threaded grinding stone (14) at the time when the threaded grinding stone (14) contacted the disk dresser (32).

Abstract: An object of the present invention is to provide a method of polishing silicon wafers, capable of suppressing generation of undesired sounds from carriers and reducing the thickness variation of the wafers after polished. The method is a wafer polishing method in which wafers 20 are polished by supplying a polishing solution to surfaces 30a of a pair of polishing pads 30 positioned above and below carriers 10 each having a circular hole 11 for retaining the wafers 20, the carriers 10 being thinner than the wafers 20; and sliding the polishing pads 30 relatively to the carriers 10, thereby simultaneously polishing both surfaces of the wafers 20 retained in the carriers 10. The method is characterized in that information sourced from the carriers 10 when a difference between the thickness of the carriers 10 and the thickness of the wafers 20 reaches a predetermined value is detected to calculate the thickness of the wafers 20, thereby terminating polishing.

Abstract: A cooling system and method for a machining process. The system includes a coolant supply and a coolant activation assembly, where the coolant supply is configured to provide coolant to the coolant activation assembly. The coolant activation assembly includes a plurality of piezoelectric actuators. Each of the plurality of piezoelectric actuators is configured to emit a coolant stream and to impart an ultrasonic or megasonic vibration component to each coolant stream. The coolant activation assembly is configured to provide cooling to a focal point in a work zone by directing multiple coolant streams emitted by the plurality of piezoelectric actuators to the focal point such that multiple coolant streams converge at the focal point.

Abstract: A method for producing a dental shaped part includes checking an outer contour of a tool of machining equipment, using least one gauge provided on a blank formed from a tooth restoration material from which a dental shaped part is to be machined using the machining equipment. The method also includes machining the dental shaped part from the blank using the tool of the machining equipment, when the outer contour of the tool corresponds to the at least one gauge provided on the blank.

Abstract: The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.

Abstract: A gear grinding machine, whose tool spindle (18) is supported on a first swivel-motion unit (17) seated on a first linear-motion unit (15), has a second linear-motion unit (19) which is arranged on the first linear-motion unit (15) and carries a dressing spindle (21) that is capable of being driven in rotary movement.

Abstract: Some embodiments comprise an apparatus for reseating valves, where an eccentric, non-rotational motion is applied in a grinding or lapping process. Other embodiments comprise a micrometer that permits repeatable application of pressure against a plate when the apparatus is removed and reinstalled. In yet other embodiments, levered arms provide an expedient mechanism for positioning a reseating apparatus.

Abstract: The present invention relates to a grinding machine for grinding a workpiece, in particular cams, with a grinding wheel having a profile with a grinding region running substantially parallel to the axis of rotation of the grinding wheel and at least one profile section which does not run parallel to the axis of rotation of the grinding wheel, a control unit for controlling the grinding process, wherein the control unit is configured in such a manner that, with reference to position information on positions of edges of the workpiece in the direction of the longitudinal axis of the workpiece, the edges of the workpiece are successively deburred or chamfered by the at least one profile section of the grinding wheel during or after the grinding of the workpiece.

Abstract: An apparatus for grinding hand knives, in particular for meat processing, with at least one grinding tool is proposed, by means of which a knife ground finish, in particular during the reconditioning of hand knives after use, is made possible in a repeatable manner with reproducible grinding quality. This is achieved according to the invention in that a knife magazine (6, 7) for accommodating at least one hand knife is provided, in that a driven manipulating device (3, 4, 5) having at least one knife gripper (5) is provided, in that at least one sensor unit (22) for at least partly recording the knife contour is provided, and in that an electronic evaluating and control unit for evaluating the sensor data and for activating the manipulating device (3, 4, 5) is provided.

Abstract: A working machine includes a work piece, at least one signal generator and a detector. The signal generator is disposed beside the work piece for transmitting a signal. The detector is disposed beside the work piece so as to detect the signal transmitted by the signal generator and get a location information of the work piece.

Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.

Abstract: A blank and method for the production of dental shaped bodies in machining equipment having at least two tools located in the machining chamber of the machining equipment, including a corpus of tooth restoration material, from which the shaped body can be carved by means of at least one of at least two tools by material removal. The blank exhibits at least two gages, each of which is in the form of a recess, the geometry of which is such that the tool selected for the cutting operation can be recognized by means of at least one of the gages by reference to its outer contour, the at least two gages being disposed on the blank in such a way that they can be simultaneously engaged by the at least tools when the blank is clamped in the machining equipment for carving purposes.

Abstract: A method of reducing manufacturing defects of semiconductor wafers during a back-grinding process. The method includes receiving a semiconductor wafer on a chuck table, wherein said chuck table has a surface upon which a front side of the wafer is placed, and wherein said chuck table has one or more holes in surface and one or more sensors placed in said one or more holes. The method further includes grinding at least a portion of a back side of the semiconductor wafer. The method further includes monitoring a parameter, while grinding, measured by the one or more sensors and adjusting the grinding based at least on the monitored parameter.

Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.

Abstract: Some embodiments relate to a chemical mechanical polishing (CMP) system. The CMP system includes a polishing pad having a polishing surface, and a wafer carrier to retain a wafer proximate to the polishing surface during polishing. A motor assembly rotates the polishing pad and concurrently rotates the wafer during polishing of the wafer. A conditioning disk has a conditioning surface that is in frictional engagement with the polishing surface during polishing. A torque measurement element measures a torque exerted by the motor assembly during polishing. A condition surface analyzer determines a surface condition of the conditioning surface or the polishing surface based on the measured torque. Other systems and methods are also disclosed.

Abstract: Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods are disclosed. A method in accordance with one embodiment of the invention includes disposing a polishing liquid on a polishing surface of a microfeature workpiece polishing pad. The polishing pad can include a matrix material and a plurality of abrasive elements fixedly distributed in the matrix material. The polishing liquid can include a plurality of particles that are at least approximately chemically inert with respect to the abrasive elements. In a particular embodiment, the particles can have a polymeric, non-ceramic composition. The method can further include moving at least one of the polishing pad and the plurality of particles relative to the other to remove deposits from the polishing pad. This operation can be performed serially or simultaneously with using the polishing pad to remove material from a microfeature workpiece.

Abstract: A coated abrasive product, comprising a first section and a second section, the first and the second sections being continuously joined together by a splice. The first section includes at least one first splice mark adjacent to the splice, wherein the first splice mark is a marking or a cluster of markings. A method of processing an article with such a coated abrasive product, and a method of acquiring information of such a coated abrasive product, respectively, includes detecting at least one characteristic of at least one first splice mark of the first section of the abrasive product, and comparing the detected characteristic to a database, wherein the detected characteristic of the first splice mark conveys approach of the splice and the end of the first section. The method of processing an article further includes providing a signal to skip the splice to thereby prevent the article being processed with splice area of the abrasive product.

Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.

Abstract: A glass manufacturing device includes a working container, a loading device, a sand blower, a shielding device, and a supporting device. The loading device is received in the working container and configured for loading a glass substrate in place. The sand blower is arranged opposite to the loading device and configured for sandblasting the glass substrate. The supporting device is used for supporting the shielding device and pressing the shielding device onto the glass substrate during the process of sandblasting. The shielding device includes a shielding cover having a number of shielding units. The shielding units are configured to shield portions of the glass substrate and prevent the portions of the glass substrate from being cut during sandblasting.

Abstract: In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.

Abstract: An eyeglass lens processing apparatus including a lens edge position detecting unit for obtaining edge positions, an edge corner processing tool for processing an edge corner of the lens, a correction data input unit for inputting correction data to avoid interference between an edge and a nose pad arm, wherein the correction data includes data on a position of interference between the nose pad arm and the edge, data necessary for setting an amount of processing at an interference position, and an edge processing range, a processing data computing unit for determining a path of processing the edge corner, based on edge position data and the correction data, to obtain data on correction processing and a processing controller for processing the edge corner of the lens by the edge corner processing tool in accordance with the correction processing data.

Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

Abstract: A method of processing an article with a coated abrasive product, including a repeat of a single marking, comprises detecting at least two characteristics of the repeat of a single marking. The repeat is placed along the length of the abrasive product at a first major surface, wherein each of the detected characteristics conveys independent information regarding the abrasive product. The method further includes comparing the information to a database. A method of acquiring information of the coated abrasive product includes detection and comparing steps.

Abstract: The invention describes a control unit for a sanding machine, which winds and unwinds the abradant paper over a contact device. This control unit continuously detects the position of one or more of these sanding machines, the abradant unwinding, the movement of the transport system and the position of the workpiece. These parameters are used to regulate the sanding machine(s) in such a way that the workpieces are fed through and the sanding operation executed without interruption.

Abstract: In a system or method for controlling wafer back-grinding, a chuck table has a surface for supporting a semiconductor wafer during a back-grinding process, one or more holes in the surface, and one or more sensors disposed in the one or more holes for monitoring a parameter during back-grinding. A computer-implemented process control tool is coupled to receive one or mote outputs from the one or more sensors and control the back-grinding process based on the received one or more outputs.

Abstract: An eyeglass lens processing apparatus includes: a lens rotation unit rotating a lens; a processing tool rotation unit processing the lens; an axis-to-axis distance changing unit for changing an axis-to-axis distance between the chuck shaft and the processing tool rotation shaft; a lens surface configuration acquiring unit which acquires a front surface curve configuration and a rear surface curve configuration of the lens; a lens outer diameter acquiring unit which acquires an outer diameter of a lens; a calculation unit which calculates a thickness of the lens and calculates a cutting depth of the lens, so that torque applied onto the chuck shaft in rough processing becomes substantially constant, based on the calculated lens thickness and a processing distance from the rotation center of the lens; and a control unit which controls the axis-to-axis distance changing unit in accordance with the calculated cutting depth and for rough processing the lens.

Abstract: A polishing apparatus to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units to detect rotation rates of the stools, a pressurizing unit to compress the work between the pair of the stools, a slurry supply unit to supply a slurry to the stools, and a control unit to reduce, when determining that a frictional force between the polishing surface and the work exceeds a threshold, at least one of a load applied by the pressurizing unit, the rotation rate of the stools, and a supply amount of the slurry.

Abstract: The invention relates to a method for machining flat workpieces in a double-sided machining tool, which has an upper and a lower work disk, wherein at least one of the work disks is rotatingly driven and the work disks each have an annular work surface, wherein the work surfaces amongst themselves limit an also annular work gap, in which at least one carrier is located, which guides at least one workpiece in the work gap, so that the at least one workpiece is machined in a double-sided manner between the work surfaces. The distance between the work disks is measured at least two radially spaced measurement locations of the work gap and in that, from the measured distances, a distance between the work disks is determined at a location of the work gap representing the thickness of the at least one workpiece machined in the work gap.

Abstract: Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: A device for sharpening one or more cutting edges of a dental curette has a base support with a frame articulated thereon, and at least one sharpening guide. The frame supports a grinding wheel rotationally driven by a motor and a sharpening guide support intended to receive the sharpening guide(s). The guide includes at least one indicator in the form of a line marked on the guide, whose angle with the horizontal being between 10° and 50° but preferably equal to 10°, 20° or 30° and corresponding to the type of dental curette to be sharpened. The sharpening guide(s) can move with respect to the support, and the support and/or the guide include(s) indexing and positioning elements determining indexing positions of the guide on the support, each indexing position corresponding to a different indicator. A method of sharpening one or more cutting edges, and a sharpening guide are described.

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract: In a non-circular workpiece grinding machine, a proximity sensor is arranged to face a non-circular portion of a workpiece for sensing a maximum diameter portion of the non-circular portion to detect that the maximum diameter portion is rotating in a detection phase section when the work spindle is rotating in a low speed rotational phase region in which the work spindle is controlled by a numerical controller to rotate at a low speed. Abnormality judging means is provided for judging that an abnormal workpiece rotation is occurring when the maximum diameter portion of the non-circular portion is not detected by the proximity sensor in the state that the work spindle is rotating in the low speed rotational phase region.

Abstract: A wafer transferring apparatus includes a top ring for holding a wafer on a lower end surface thereof and a pusher mechanism for transferring the wafer to and from the top ring. The pusher mechanism has a wafer rest for placing the wafer thereon and is arranged to allow the wafer released from the lower end surface of the top ring to be seated on the wafer rest. The pusher mechanism also has a sensor mechanism for detecting when the wafer is properly seated on the wafer rest. The sensor mechanism is adapted to block sensor light emitted from a light-emitting device by the wafer seated on the wafer rest.