SUBSTRATE PEELING DEVICE, METHOD FOR PEELING SUBSTRATE, AND METHOD FOR FABRICATING FLEXIBLE DISPLAY DEVICE
A method for fabricating a display device is provided. A laser having a power density is provided to a substrate coupling body. The substrate coupling body includes a first substrate and a second substrate coupled to the first substrate. The second substrate is separated from the first substrate. An optical property of the first substrate separated from the second substrate is measured. The power density of the laser is adjusted based on the optical property of the first substrate.
Latest Samsung Electronics Patents:
- PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING SPACER HAVING SELF-ALIGNMENT FUNCTION, AND ELECTRONIC DEVICE COMPRISING SAME
- ELECTRONIC DEVICE COMPRISING HINGE DEVICE
- DEPOSITION MASK, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE MANUFACTURED USING THE SAME
- WALL MOUNT DEVICE AND DISPLAY APPARATUS INCLUDING SAME
- DISPLAY DEVICE
This application claims priority under 35 U.S.C. 119 to Korean Patent Application No. 10-2013-0025733, filed on Mar. 11, 2013 in the Korean Intellectual Property Office, and Korean Patent Application No. 10-2013-0146379, filed on Nov. 28, 2013 in the Korean Intellectual Property Office, the entire contents of both disclosures are incorporated by reference herein.
BACKGROUND1. Technical Field
The present invention relates to a substrate peeling device, a method for peeling a substrate, and a method for manufacturing a flexible display device, and more particularly to a substrate peeling device using a laser, a method for peeling a substrate, and a method for fabricating a flexible display device.
2. Discussion of Related Prior Art
When flexible display devices are fabricated, carrier substrates are used to support a structure of flexible display devices while the structure of the flexible display devices is manufactured. The carrier substrates are relatively less flexible. After completing the structure of the flexible display devices, the carrier substrates are separated from the structure of the flexible display devices using a substrate peeling device. The substrate peeling device is used to separate the structure of the flexible devices from the carrier substrates using a laser.
SUMMARYAccording to an exemplary embodiment of the present invention, a method for fabricating a display device is provided. A laser having a power density is irradiated on a substrate coupling body. The substrate coupling body includes a first substrate and a second substrate coupled to the first substrate. The second substrate is separated from the first substrate. An optical property of the first substrate separated from the second substrate is measured. The power density of the laser is adjusted based on the optical property of the first substrate.
According to an exemplary embodiment of the present invention, a method for fabricating a display device is provided. A laser having a power density is irradiated on a substrate coupling body. The substrate coupling body includes a first substrate and a second substrate coupled to the first substrate. A reflection ratio of the substrate coupling body is measured. The first substrate and the second substrate are separated from each other. The power density of the laser is adjusted based on the reflection ratio.
According to an exemplary embodiment of the present invention, a substrate peeling device includes a laser irradiation unit and an optical property detection unit. The laser irradiation unit is configured to generate a laser having a power density and to irradiate the laser on a substrate coupling body. The substrate coupling body includes a first substrate and a second substrate coupled to the first substrate. The optical property detection unit is configured to measure an optical property of the first substrate separated from the second substrate using the laser. The power density of the laser is adjusted based on the optical property of the first substrate.
According to an exemplary embodiment of the present invention, a substrate peeling device includes a laser irradiation unit and an optical property detection unit. A laser irradiation unit is configured to irradiate a laser having a power density on a substrate coupling body. The substrate coupling body includes a first substrate and a second substrate coupled to the first substrate. The optical property detection unit is configured to measure a light reflection ratio of the substrate coupling body. The power density of the laser is adjusted based on the light reflection ratio of the substrate coupling body.
These and other features of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings of which:
Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings. However, the inventive concept may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the thickness of layers and regions may be exaggerated for clarity. It will also be understood that when a layer is referred to as being “on” another layer or substrate, it may be directly on the other layer or substrate, or intervening layers may also be present. Like reference numerals may refer to the like elements throughout the specification and drawings.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The laser output unit 11 may generate the laser and provide the laser to the substrate coupling body. The laser is irradiated onto the substrate coupling body, and reduces a coupling force between the first substrate and the second substrate to facilitate the peeling of the substrate. The output of the laser that is generated by the laser output unit 11 may be adjusted.
The control unit 12 may control the laser output unit 11 to adjust the output of the laser generated by the laser output unit 11. For example, the control unit 12 may control the laser output unit 11 based on an optical property of the first substrate measured by the optical property measurement unit 13. In an exemplary embodiment, the laser output unit 11 may be manually controlled based on the optical property of the first substrate measured by the optical property measurement unit 13.
The optical property measurement unit 13 may measure the optical property of the substrate coupling body after or before the substrate is peeled. The optical property may include a light permeability, a light reflection ratio, or a retro reflection ratio, but are not limited thereto. The optical property measured by the optical property measurement unit 13 may relate to the output of the laser generated from the laser output unit 11. The details thereof will be described later with reference to
Hereinafter, referring to
In the peeling region R1, the substrate coupling body may be peeled. For example, the substrate coupling body may be divided into a first substrate and a second substrate. For example, the first substrate may include a transparent glass substrate, and the second substrate may include a flexible display. The substrate peeling device 10 further includes a first stage 14. The first stage 14 is arranged in the peeling region R1 together with the laser output unit 11. The substrate coupling body is placed on the first stage 14, and the laser output unit 11 provides a laser to the substrate coupling body to separate the substrate coupling body into the first substrate and the second substrate. In an exemplary embodiment, the laser output unit 11 may be arranged over the first stage 14, and provide the laser to the substrate coupling body as it moves in a horizontal direction. In other embodiments, the laser output unit 11 may be arranged under the first stage 14, and provide the laser to the substrate coupling body as it moves in a horizontal direction. The first stage 14 may include a transparent material to transmit the laser L.
The first substrate, which is separated from the second substrate in the peeling region R1, may be conveyed to the loading region R3 through the conveyance region R2. The substrate peeling device 10 further includes a roller 15 arranged in the conveyance region R1 together with the optical property measurement unit 10. The roller 15 may convey the first substrate from the peeling region R1 to the loading region R3. The roller 15 may include a plurality of rotating shafts 15a that extend in the horizontal direction and a plurality of contact members 15b arranged in the circumferences of the rotating shafts 15a. The rotating shafts 15a may receive a rotating force from a power providing means (not illustrated) to be rotated. The contact members 15b may come in contact with the first substrate that is conveyed by the conveyance means 15, and may convey the first substrate through transferring the rotating force of the rotating shafts 15a to the first substrate. The contact members 15b may include an elastic material to protect the first substrate. The transferring of the first substrate is not limited to using the roller 15. For example, the first substrate may be transferred using a conveyance arm.
The optical property measurement unit 13 includes a light irradiation unit 13a and a light receiving unit 13b. The light irradiation unit 13a is arranged over the roller 15, and the light receiving unit 13b is arranged under the roller 15. However, the arrangement of the light irradiation unit 13a and the light receiving unit 13b may vary according to exemplary embodiments. The optical property measurement unit 13 may measure the optical property of the first substrate that is conveyed by the roller 15 after the first substrate is separated from the substrate coupling body. In an exemplary embodiment, when the optical property measurement unit 13 measures the optical property of the first substrate, the roller 15 may stop the first substrate so that the optical property measurement unit 13 measures the optical property of the first substrate in a state where the first substrate is stopped. The details of the optical property measurement unit 13 will be described later with reference to
The first substrate may be loaded in the loading region R3 through the roller 15. The substrate peeling device 10 further includes a second stage 16, and the second stage 16 is arranged in the loading region R3. On the second stage 16, the first substrate is loaded after the optical property of the first substrate is measured.
Hereinafter, referring to
In S10, the substrate coupling body is irradiated with the laser L while the substrate coupling body is placed on the first stage 14. The substrate coupling body includes a first substrate 20 and a second substrate 30. The first substrate 20 may include a material that is optically transparent and transmit the laser L. For example, the first substrate 20 may include glass. The first substrate 20 may have a relatively lower degree of flexibility than the second substrate 30. The first substrate 20 may serve as a carrier substrate by supporting the second substrate 30, but is not limited thereto.
The second substrate 30 is arranged on the first substrate 20. The second substrate 30 is attached to the first substrate 20. The second substrate 30 may include a flexible substrate, but is not limited thereto. In addition, the second substrate 30 may include pixels arranged on the flexible substrate.
Specifically, the second substrate 130 may include a flexible substrate, a thin film transistor layer arranged on the flexible substrate, and a display layer connected to the thin film transistor layer.
The flexible substrate may include a material including kapton, polyethersulphone (PES), polycarbonate (PC), polyimide (PI), polyethyleneterephthalate (PET), polyethylenenaphthalate (PEN), polyacrylate (PAR), or fiber reinforced plastic (FRP), but is not limited thereto.
The thin film transistor layer may include thin film transistors and wirings for driving the thin film transistors. The thin film transistors may be connected to the display layer to control the display layer, and thus an image may be displayed on the display layer of the flexible display device.
The display layer may be connected to the thin film transistor layer. The display layer may be arranged on the thin film transistor layer. The detailed configuration of the display layer may vary depending on the kind of the flexible display device. The flexible display device may include an organic light emitting display device, a liquid crystal display device, or an electrophoretic display, but is not limited thereto. For example, if the flexible display device is an organic light emitting display device, the display layer may include an organic light emitting layer arranged between a cathode electrode and an anode electrode. Further, if the flexible display device is a liquid crystal display device, the display layer may include a first electrode and a second electrode to form an electric field therebetween, and may also include a liquid crystal layer that includes liquid crystal molecules of which the arrangement is changed by the electric field formed between the first electrode and the second electrode.
The substrate coupling body further includes the adhesive layer 40. The adhesive layer 40 is arranged between the first substrate 20 and the second substrate 30. The adhesive layer 40 may serve to assist the coupling between the first substrate 20 and the second substrate 30. The adhesive layer 40 may include a material that is optically transparent or that transmits at least the laser L. The adhesive layer 40 may have a high thermal resistance. For example, the adhesive layer 40 may have a glass transition temperature equal to or 220° C. higher than that of the first substrate 20. For example, the adhesive layer 40 may include silicon or acrylic polymer adhesives. In the case that the adhesive layer 40 includes polysilicon, the adhesive layer 40 has a glass transition temperature equal to or 220° C. higher than the first substrate 20. The polysilicon that is used as the adhesive layer 40 may include PDMS (polydimethylsiloxane) having silicon oxide as a main component, and this may be used together with silica nanopowder. The adhesive layer 40 may be formed on the first substrate 20 in a printing method, a slit coating method, a spin coating method, or a dipping method.
In an exemplary embodiment, the adhesive layer 40 may be omitted and the first substrate 20 may be directly coupled to the second substrate 30 without the adhesive layer 40. The base substrate of the second substrate 20 may be formed by depositing or coating the base material on the first substrate 30. The first substrate 20 and the second substrate 30 may be coupled to each other physically or chemically at the interface between the first substrate 20 and the second substrate 30. The coupling force between the first substrate 20 and the second substrate 30 may be enhanced by heat treatment process.
The laser L is provided from the laser output unit 11 to the substrate coupling body. The laser L may be incident on the first substrate 20 of the substrate coupling body. The laser L incident on the first substrate 20 may transmit the first substrate 20 and may reach the adhesive layer 40. The laser L transmitted to the adhesive layer 40 may remove the adhesive layer 40 by ablation. The adhesive layer 40 may be completely removed or remain partially. The coupling force between the first substrate 20 and the second substrate 30 may be reduced as the adhesive layer 40 is removed.
In an exemplary embodiment that the first substrate 20 may be directly coupled to the second substrate 30 without the adhesive layer 40, the laser L incident on the first substrate 20 may transmit the first substrate 20 and may reach the interface between the first substrate 20 and the second substrate 30. The laser L transmitted to the interface may separate the first substrate 20 from the second substrate 30. In an exemplary embodiment, the laser L may reach the second substrate 30 adjacent the first substrate 20 and separate the first substrate 20 from the second substrate 30.
When the laser L is irradiated onto the adhesive layer 40 or the interface between the adhesive layer 40 and the second substrate 30, soot may be generated. The soot generated may remain on the first substrate 30. The amount of the soot generated may relate to the output of the laser L. For example, as the output of the laser L is increased, more soot may be generated. Accordingly, by detecting the degree of soot generated, the output of the laser L may be estimated. If the output of the laser L is excessive, the second substrate 30 may be damaged by the laser L. If the output of the laser L is insufficient, the coupling force between the first substrate 20 and the second substrate 30 is insufficiently degraded, and thus the first substrate 20 and the second substrate 30 might not be separated from each other without causing some damage to the second substrate 30. If an external force is applied to the substrate coupling body in a state where the coupling force between the first substrate 20 and the second substrate 30 is insufficiently degraded, the second substrate 30 may be damaged. According to an exemplary embodiment of the present invention, the degree of the soot generated may be detected using the optical property of the first substrate 20 separated from the second substrate 30 using the laser L. The output of the laser L may be adjusted using the measured optical property of the first substrate 20 so that the laser L has an appropriate power density to avoid causing some damage on the second substrate 30. Accordingly, it is possible to prevent the damage of the second substrate that may occur in the process of separating the first substrate 20 and the second substrate 30. The details thereof will be described later.
In S20, the first substrate 20 and the second substrate 30 are separated from each other and spaced apart from each other, as shown in
In S30, the optical property of the first substrate 20 (S30) may be measured in the conveyance region R2. Referring to
In S30, the measuring of the optical properties of the first substrate 20 further includes measuring the optical property of the first substrate 20 from the test light T that is received by the light receiving unit 13b. The optical property of the first substrate 20 that is measured by the optical property measurement unit 13 may be a light permeability of the first substrate 20. The light permeability is calculated by dividing the light intensity of the test light T that is received in the light receiving unit 13b by the light intensity of the test light T that is provided from the light irradiation unit 13a.
Referring to
For example, if the light permeability measured in S30 is in the first reference range R1, the output of the laser is kept without adjustment in S40. However, the output of the laser L is adjusted in S40 if the light permeability measured in S30 is out of the first reference range R1. For example, the output of the laser L is decreased if the light permeability measured in S30 is lower than the first reference range R1. The output of the laser L is increased if the light permeability measured in S30 is higher than the first reference range R1. Accordingly, the substrate peeling device 10 may be controlled to maintain the output of the laser L at an appropriate level based on the permeability of the first substrate 20 separated from the second substrate 30. The output of the laser L may be automatically adjusted using the control unit 12 based on the permeability of the first substrate 20, or may be manually adjusted based on the permeability of the first substrate 20.
As described above, in the method for peeling a substrate according to an exemplary embodiment of the present invention, the optical property of the first substrate 20 is measured to monitor the output of the laser L. The output of the laser L is adjusted based on the optical property of the first substrate 20 to have an appropriate range of the output of the laser L if the output of the laser L deviates from the proper range R1 as shown in
Hereinafter, referring to
Referring to
Hereinafter, referring to
For example, the reflection ratio is calculated by dividing the light intensity of the test light Ta that is received in the light receiving unit 13b by the light intensity of the test light T that is provided from the light irradiation unit 13a.
For example, if the reflection ratio measured in S30 is in the second reference range R2, the output of the laser L may remain unchanged. However, if the reflection ratio measured in S30 is out of the second reference range R2, the output of the laser L may be adjusted. For example, if the light reflection ratio measured is lower than the second reference range R2, the output of the laser L is insufficient, and thus the substrate peeling device may be controlled to increase the output of the laser L to an appropriate level corresponding to the second reference range R2. If the light reflection ratio measured is greater than the second reference range R2, the output of the laser L is excessive, and thus the substrate peeling device 10 may be controlled to decrease the output of the laser L to the appropriate level corresponding to the second reference range R2. Except for using the reflection ratio to monitor the output of the laser L, the adjustment of the output of the laser is performed in a manner substantially similar to that described with reference to
Hereinafter, referring to
Hereinafter, referring to
Referring to
The measuring of the optical property of the first substrate 20 may further include measuring the optical property of the first substrate 20 from the test light Tb that is received by the light receiving unit 13b. The optical property of the first substrate 20 measured by the optical property measurement unit 13 includes a retro reflection ratio. The retro reflection ratio is calculated by dividing the light intensity of the test light Tb that is received in the light receiving unit 13b by the light intensity of the test light T that is provided from the light irradiation unit 13a. Since the retro reflection ratio is calculated from the test light Tb that has passed through the first substrate 20 twice, the retro reflection ratio has a variation greater than the permeability calculated from the test light that has once permeated the first substrate 20, and thus the output levels of the laser L may be discriminated more precisely.
Referring to
Hereinafter, referring to
Hereinafter, referring to
Referring to
Referring to
The measuring of the optical property of the substrate coupling body (S120) may further include calculating the optical property of the substrate coupling body from the test light Tc that is received by the light receiving unit 13b. The optical property of the substrate coupling body that is measured by the optical property measurement unit 13 is a light reflection ratio. The light reflection ratio is calculated by dividing the light intensity of the test light Tc that is received in the light receiving unit 13b by the light intensity of the test light T that is provided from the light irradiation unit 13a.
A relationship between the light reflection ratio of the substrate coupling body and the output of the laser L may be substantially the same as the relationship between the light reflection ratio of the first substrate 20 and the output of the laser L. Since the explanation of the adjusting of the output of the laser L based on the optical property (S140) is substantially the same as the explanation of the adjusting of the output of the laser L to correspond to the optical property (S40) in
The separating of the first substrate 20 and the second substrate 30 from each other (S13) precedes the adjusting of the output of the laser L using the optical property (S140). Alternatively, the adjusting of the output of the laser L may be performed between the measuring of the optical property of the substrate coupling body (S120) and the separating of the first substrate 20 and the second substrate 30 (S130).
As described above, referring to
Hereinafter, referring to
Referring to
In the attaching of the protection film to the substrate coupling body (S220), first protection film is attached to the second substrate. If the protection 150 is attached to the second substrate, the protection film may support the second substrate after the separating the first substrate and the second substrate from each other (S240). Accordingly, the protection film may facilitate the process of fabricating the flexible display device after the second substrate is separated from the first substrate. The protection film may include plastic including polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyethersulfone, or metal foil including stainless steel (SUS).
In the peeling of the protection film (S270), the protection film may be separated from the second substrate. In an exemplary embodiment, the attaching of the protection film to the substrate coupling body (S220) and the peeling of the protection film (S270) may be omitted.
Referring to
The measuring of the optical property of the substrate coupling body (S340) may include receiving a light which is irradiated onto one surface of the first substrate and is reflected by the substrate coupling body. The optical property measurement unit includes a light irradiation unit and a light receiving unit. The light irradiation unit and the light receiving unit may be formed separately or integrally. The optical property measurement unit may be arranged in the peeling region. The light irradiation unit provides the test light to the first substrate. The test light is reflected by the substrate coupling body. For example, the test light may be reflected from the interface between the first substrate and the second substrate.
The measuring of the optical property of the substrate coupling body (S340) may further include calculating of the optical property of the first substrate from the test light that is received by the light receiving unit. The optical property of the substrate coupling body measured by the optical property measurement unit includes a light reflection ratio. The light reflection ratio is calculated by dividing the light intensity of the test light that is received in the light receiving unit by the light intensity of the test light that is emitted from the light irradiation unit.
A relationship between the light reflection ratio of the substrate coupling body and the output of the laser may be substantially the same as the relationship between the light reflection ratio of the first substrate and the output of the laser illustrated in
While the present inventive concept has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the inventive concept as defined by the following claims.
Claims
1. A method for fabricating a display device, comprising:
- providing a laser having a power density to a substrate coupling body, wherein the substrate coupling body includes a first substrate and a second substrate coupled to the first substrate;
- separating the second substrate from the first substrate;
- measuring an optical property of the first substrate separated from the second substrate; and
- adjusting the power density of the laser based on the optical property of the first substrate.
2. The method for peeling a substrate of claim 1, wherein the optical property includes a light permeability of the first substrate, and
- the measuring the optical property of the first substrate comprises:
- providing a test light to the first substrate so that the test light passes through the first substrate;
- receiving the test light that has passed through the first substrate; and
- calculating the light permeability of the first substrate from the received test light.
3. The method for peeling a substrate of claim 2, wherein the adjusting the power density of the laser comprises decreasing the power density of the laser if the light permeability is less than a predetermined reference range.
4. The method for peeling a substrate of claim 2, wherein the adjusting the power density of the laser comprises increasing the power density of the laser if the light permeability is greater than a predetermined reference range.
5. The method for peeling a substrate of claim 1, wherein the optical property includes a light reflection ratio, and
- the measuring the optical property of the first substrate comprises:
- providing a test light to the first substrate so that the test light is reflected from the first substrate;
- receiving the light reflected from the first substrate; and
- calculating the light reflection ratio using a first intensity of the test light provided to the first substrate and a second intensity of the test light reflected from the first substrate.
6. The method for peeling a substrate of claim 5, wherein the adjusting the power density of the laser comprises decreasing the power density of the laser if the light reflection ratio is less than a predetermined reference range.
7. The method for peeling a substrate of claim 5, wherein the adjusting the power density of the laser comprises increasing the power density of the laser if the light transmission ratio is greater than a predetermined reference range.
8. The method for peeling a substrate of claim 1, wherein the optical property includes a retro reflection ratio, and
- the measuring the optical property of the first substrate comprises:
- providing a test light to the first substrate so that the test light passes through the first substrate in a first direction;
- reflecting the test light that has passed through the first substrate to the first substrate so that the test light reflected passes through the first substrate in a second direction opposite to the first direction;
- receiving the test light that has passed through the first substrate in the second direction; and
- calculating the retro reflection ratio from the a first intensity of the test light provided to the first substrate and a second intensity of the test light that has passed through the first substrate in the second direction.
9. The method for peeling a substrate of claim 8, wherein the adjusting the power density of the laser comprises decreasing the power density of the laser if the retro reflection ratio is less than a predetermined reference range.
10. The method for peeling a substrate of claim 8, wherein the adjusting the power density of the laser comprises increasing the power density of the laser if the retro reflection ratio is greater than a predetermined reference range.
11. The method of claim 1, wherein the second substrate includes a flexible base material and a thin film transistor layer arranged on the flexible base material.
12. A method for fabricating a display device comprising:
- providing a laser having a power density to a substrate coupling body, wherein the substrate coupling body includes a first substrate and a second substrate coupled to the first substrate;
- measuring a reflection ratio of the substrate coupling body;
- separating the first substrate and the second substrate from each other; and
- adjusting the power density of the laser to based on the reflection ratio.
13. The method for peeling a substrate of claim 12, wherein the laser is provided to a surface of the first substrate, and
- the measuring of the reflection ratio of the substrate coupling body comprises:
- providing a light to the substrate coupling body so that the light is reflected from the substrate coupling body;
- receiving the light reflected from the substrate coupling body; and
- calculating the reflection ratio from the received test light
14. The method for peeling a substrate of claim 13, wherein the power density of the laser is increased if the reflection ratio is less than a predetermined reference range.
15. The method for peeling a substrate of claim 13, wherein the power density of the laser is decreased if the reflection ratio is greater than a predetermined reference range.
16. The method of claim 12, wherein the second substrate includes a flexible base material and a thin film transistor layer arranged on the flexible base material.
17. The method of claim 16, further comprising attaching a first protection film to the second substrate before the laser is provided to the substrate coupling body.
18. The method for fabricating a flexible display device of claim 17, further comprising attaching a second protection film to the second substrate after the first substrate and the second substrate is separated from each other.
19. The method for fabricating a flexible display device of claim 18, further comprising removing the first protection film from the second substrate after the second protection film is coupled to the second substrate.
20. A substrate peeling device comprising:
- a laser irradiation unit configured to generate a laser having a power density and to irradiate the laser on a substrate coupling body, wherein the substrate coupling body includes a first substrate and a second substrate coupled to the first substrate; and
- an optical property detection unit configured to measure an optical property of the first substrate separated from the second substrate using the laser,
- wherein the power density of the laser is adjusted based on the optical property of the first substrate.
21. The substrate peeling device of claim 20, wherein the optical property detection unit comprises:
- a light irradiation unit arranged over the first substrate and configured to irradiate a test light on the first substrate, wherein the test light passes through the first substrate;
- a light receiving unit arranged under the first substrate and configured to receive the test light that has passed through the first substrate; and
- an optical property calculation unit configured to calculate a light permeability of the first substrate from an intensity of the test light that the light irradiation unit provides to the first substrate and an intensity of the test light that the light receiving unit receives.
22. The substrate peeling device of claim 20, wherein the optical property detection unit comprises:
- a light irradiation unit arranged over the first substrate and configured to irradiate a test light on the first substrate, wherein the test light is reflected from the first substrate;
- a light receiving unit arranged over the first substrate and configured to receive the test light reflected from the first substrate; and
- an optical property calculation unit configured to calculate a light reflection ratio of the first substrate from an intensity of the test light that the light irradiation unit provides to the first substrate and an intensity of the test light that the light receiving unit receives.
23. The substrate peeling device of claim 20, wherein the optical property detection unit comprises:
- a light irradiation unit arranged over the first substrate and configured to irradiate a test light on the one surface, wherein the test light passes through the first substrate in a first direction;
- a reflection plate arranged under the first substrate and configured to reflect the test light that has passed through the first substrate to the first substrate, wherein the test light reflected from the reflection plate passes through the first substrate in a second direction opposite to the first direction;
- a light receiving unit arranged over the first substrate and configured to receive the test light that has passed through the first substrate in the second direction; and
- an optical property calculation unit configured to calculate a retro reflection ratio of the first substrate from an intensity of the test light that the light irradiation unit provides to the first substrate and an intensity of the test light that the light receiving unit receives.
24. The substrate peeling device of claim 20, further comprising a control unit configured to adjust the power density of the laser based on the optical property of the first substrate.
25. A substrate peeling device comprising:
- a laser irradiation unit configured to irradiate a laser having a power density on a substrate coupling body, wherein the substrate coupling body includes a first substrate and a second substrate coupled to the first substrate; and
- an optical property detection unit configured to measure a light reflection ratio of the substrate coupling body,
- wherein the power density of the laser is adjusted based on the light reflection ratio of the substrate coupling body.
26. The substrate peeling device of claim 25, further comprising a control unit configured to wherein the optical property detection unit comprises:
- a light irradiation unit arranged over the first substrate and configured to irradiate a test light on the first substrate;
- a light receiving unit arranged over the first substrate and configured to receive the test light that is reflected from the substrate coupling body; and
- an optical property calculation unit configured to calculate a light reflection ratio of the first substrate from an intensity of the test light that the light irradiation unit provides and an intensity of the test light that the light receiving unit receives.
27. The substrate peeling device of claim 25, further comprising a control unit configured to adjust the power density of the laser based on the light reflection ratio of the substrate coupling body.
Type: Application
Filed: Nov 29, 2013
Publication Date: Sep 11, 2014
Applicant: SAMSUNG DISPLAY CO., LTD. (YONGIN-CITY)
Inventors: Hyung Chul Lim (Chungcheongnam-do), Young Gu Kim (Chungcheongnam-do), Hyun Jun Cho (Chungcheongnam-do)
Application Number: 14/093,193
International Classification: B32B 43/00 (20060101);