With Stripping Of Adhered Lamina Patents (Class 156/247)
  • Patent number: 11884444
    Abstract: A system moves items, like containers and/or pallets, through a label printing station. The station has a label printer that prints adhesive labels; and a robot arm terminating at a movable end with a suction pad or vacuum device and sensors. The station has sensors configured to measure a height of the item; and a processor coupled to receive the height of the item, to control the robot arm and label printer, and to receive label information from a server. The processor has a memory containing code that computes desired label positions based on height of the container/pallet. A method of labeling an item includes printing an adhesive label with the label information obtained from a server; receiving the adhesive label on a suction pad or vacuum device attached to a movable end of a robot arm, and determining a first labeling position from measured height of the container/pallet.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: January 30, 2024
    Assignee: SHAW INDUSTRIES GROUP, INC.
    Inventors: Brian Michael Ghere, Timothy David Ralston
  • Patent number: 11878107
    Abstract: Dressings, systems, and methods for treating a tissue site with negative pressure are described. The dressing includes a manifold having a first surface and a second surface opposite the first surface, a first layer adjacent to the first surface, and a second layer adjacent to the second surface. The first layer and the second layer each are formed from a polymer film. A plurality of fluid restrictions are formed in the polymer film adjacent to at least the first surface. A first plurality of bonds is formed between the first layer and the second layer. The first plurality of bonds define separable sections of the manifold. A second plurality of bonds is formed between the first layer and the second layer. The second plurality of bonds define a plurality of openings.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: January 23, 2024
    Assignee: KCI Licensing, Inc.
    Inventors: Timothy Mark Robinson, Christopher Brian Locke
  • Patent number: 11881406
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a carbon structure on a handle substrate at a first surface of the handle substrate. The method further includes attaching a first surface of a semiconductor substrate to the first surface of the handle substrate. The method further includes processing the semiconductor substrate and performing a separation process to separate the handle substrate from the semiconductor substrate. The separation process comprises modifying the carbon structure.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: January 23, 2024
    Assignee: Infineon Technologies AG
    Inventors: Francisco Javier Santos Rodriguez, Roland Rupp, Hans-Joachim Schulze
  • Patent number: 11876070
    Abstract: A method for producing a semiconductor package, capable of suppressing damage of a device, and dissolving or softening a tacky layer quickly to peel off a reinforcing sheet, is provided. This method includes: providing a tacky sheet including a soluble tacky layer, making a first laminate, obtaining a second laminate having a second support substrate bonded to the first laminate, peeling off a first support substrate to obtain a third laminate, mounting a semiconductor chip thereon to obtain a fourth laminate, sealing a right end surface and a left end surface of the fourth laminate with sealing members and immersing a lower end surface of the fourth laminate selectively in a solution, giving a pressure difference between an inner space and the solution to allow the solution to penetrate into the internal space and dissolve or soften the soluble tacky layer, and peeling off the second support substrate.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: January 16, 2024
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Toshimi Nakamura, Tetsuro Sato
  • Patent number: 11872779
    Abstract: A method of the invention produces a composite material conjugate in which a first composite material and a second composite material are adhered without using an adhesive, wherein a first prepreg laminate to which a release member is attached is cured to form the first composite material, the release member being made of a material that does not transfer silicone and fluorine to the first prepreg laminate, after detaching the release member from the first composite material, surface treatment that imparts polar functional groups to the surface of the first composite material to which the release member was bonded is carried out to activate the surface, a second prepreg laminate is placed directly on the activated surface of the first composite material, and the second prepreg laminate is cured to form a second composite material adhered to the first composite material.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: January 16, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Hiromichi Akiyama, Kiyoka Takagi
  • Patent number: 11865795
    Abstract: A method for manufacturing a composite includes providing a first template including a cutout for a first layer of the composite, disposing the first layer in the cutout, and disposing a tablet, provided with an adhesive, on the first layer such that the first layer adheres to the tablet. Next, the tablet is removed, together with the first layer adhered thereto, from the cutout, and an adhesive is applied to a side of the first layer facing away from the tablet. A second template is provided that includes a cutout for a second layer of the composite, and then the second layer is disposed in the cutout. The tablet, together with the first layer adhered thereto, is disposed on the second layer disposed in the cutout of the second template, and the tablet is removed, together with the composite produced from the first and second layers, from the second template.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: January 9, 2024
    Assignee: LISA DRAEXLMAIER GMBH
    Inventor: Robert Thalhammer
  • Patent number: 11868029
    Abstract: A multi-eye interchangeable lens is disclosed. In one example, it includes a lens barrel, a movable unit, individual-eye lenses, and a light source. The movable unit is movable along an optical axis with respect to the lens barrel. The individual-eye lenses are integrally movable with the movable unit and are arranged such that emission positions of imaging lights emitted via the individual-eye lenses do not overlap with one another. The light source is movable along the optical axis integrally with the movable unit and the individual-eye lenses, and is arranged such that an emission position of a parallel light emitted to an image sensor provided in a camera body does not overlap with the emission position of the imaging light of each of the plurality of individual-eye lenses.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: January 9, 2024
    Assignee: Sony Group Corporation
    Inventors: Kengo Hayasaka, Hidenori Kushida, Katsuhisa Ito
  • Patent number: 11866219
    Abstract: A labeling device (1) for applying a label to a product (2) located on a conveyor (3), includes an application cell (4), at least two label dispensers (5a,b) arranged outside the application cell (4) and an applicator (6), mounted inside the application cell (4), the applicator (6) being adapted to label the product (2) at variable positions on the conveyor (3) individually detected by a measuring system (9) at variable conveyor speeds, such that the labels are applied by a method for applying a label by the labeling device (1).
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: January 9, 2024
    Assignee: Weber Marking Systems GmbH
    Inventors: Timo Boje, Jörg Emrich, Andres Frings
  • Patent number: 11837551
    Abstract: A semiconductor package includes a redistribution substrate having a semiconductor chip mounted on a top surface thereof with and a connection terminal between the semiconductor chip and the redistribution substrate. The redistribution substrate includes a first redistribution pattern on a bottom surface of the connection terminal and comprising a first via and a first interconnection on the first via, a pad pattern between the first redistribution pattern and the connection terminal and comprising a pad via and a pad on the pad via, and a second redistribution pattern between the first redistribution pattern and the pad pattern and comprising a second via and a second interconnection on the second via with a recess region where a portion of a top surface of the second interconnection is recessed. A bottom surface of the recess region is located at a lower level than a topmost surface of the second interconnection.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: December 5, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jongyoun Kim, Seokhyun Lee, Gwangjae Jeon
  • Patent number: 11818284
    Abstract: A personal shielding device applicable to a screen, in particular a touch screen of an electronic device, has a continuous absorbent sheet at least partially made of metal material. The continuous absorbent sheet is adapted to absorb electromagnetic waves emitted by the electronic device in direction of a user.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: November 14, 2023
    Assignee: Tiziana VIGNI
    Inventor: Tiziana Vigni
  • Patent number: 11809044
    Abstract: A liquid crystal retardation film, a polarizing plate for light emitting displays including the same, and a light emitting display including the same are provided. The liquid crystal retardation film includes: a first retardation layer having no alignment layer, a UV absorbent primer layer, and a second retardation layer sequentially formed in the stated order, wherein each of the first retardation layer and the second retardation layer may be a liquid crystal layer.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: November 7, 2023
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jin Hee Choi, Jin Sook Kim, Jung Hun You, Sun Hong Park, Sang Hum Lee
  • Patent number: 11804450
    Abstract: A semiconductor device includes first and second members. In the first member, a first electronic circuit including a semiconductor element is formed. The second member is joined to an area of part of a first surface of the first member, and includes a second electronic circuit including a semiconductor element formed of a semiconductor material different from that of the semiconductor element of the first electronic circuit. An interlayer insulating film covers the second member and an area of the first surface of the first member to which the second member is not joined. An inter-member connection wire on the interlayer insulating film couples the first and second electronic circuits through an opening in the interlayer insulating film. A shield structure including a first metal pattern disposed on the interlayer insulating film shields a shielded circuit, which is part of the first electronic circuit, in terms of radio frequencies.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: October 31, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Satoshi Goto, Masayuki Aoike, Mikiko Fukasawa
  • Patent number: 11794446
    Abstract: Provided are a glass substrate multilayer structure including a glass substrate; a polyimide-based shatter-proof layer formed on one surface of the glass substrate; and a hard coating layer formed on the polyimide-based shatter-proof layer. The polyimide-based shatter-proof layer has a thickness of 5 to 50 ?m, the hard coating layer has a thickness of 5 to 20 ?m, and the glass substrate multilayer structure has a retardation in a thickness direction (Rth) of 200 nm or less. A method for manufacturing the glass substrate multilayer structure, and a display panel including the glass substrate multilayer structure are also provided.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: October 24, 2023
    Assignees: SK Innovation Co., Ltd., SK ie technology Co., Ltd.
    Inventors: Hyun Joo Song, Cheol Min Yun
  • Patent number: 11791858
    Abstract: A set of protective layers configured to protect and enhance a display or interface of a device is provided. The layers may include layers of material to strengthen the respective device components to increase durability and reduce damage from impacts. When the layers are impacted by a foreign object, the force may be absorbed by the strengthened component or transferred to other areas of the device, rather than catastrophically damaging the display, encasement or interface of the device. Additionally, the use of functional layers is provided to enhance device performance and user experience. Related assemblies and methods are also provided.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: October 17, 2023
    Inventor: Paul Beaulieu
  • Patent number: 11781574
    Abstract: A probe fastening system has a plate having at least one coupling-on recess and having at least one alignment element, which is arranged in the outer region of the plate, a backplate which has a fastening device for the fastening of a static probe and at least one recess which corresponds with the alignment element, at least one peelable shim which corresponds with the alignment element and which is arranged between the plate and the backplate, at least one alignment device which corresponds with the alignment element, and a coupling-on element which defines a cavity and which is designed for isobarically coupling the static probe onto the coupling-on recess.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: October 10, 2023
    Inventor: Pasquale Mauro
  • Patent number: 11785718
    Abstract: A composite printed wiring board that allows for reflow heating for mounting electronic components using solder includes a first printed wiring board, an intermediate member, a second printed wiring board, and a bonding layer. The intermediate member is stacked on the first printed wiring board. The intermediate member has a cavity. The second printed wiring board is stacked on a surface on the opposite side to a surface opposed to the first printed wiring board in the intermediate member. The bonding layer is arranged at a bonding section between the first printed wiring board and the intermediate member and at a bonding section between the second printed wiring board and the intermediate member. The bonding layer contains high melting point metal and low melting point metal. The melting point of the bonding layer is higher than the melting point of the low melting point metal.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: October 10, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takamichi Kono, Hitoshi Arai, Tatsuya Sakamoto
  • Patent number: 11774660
    Abstract: A electronic device is provided. The electronic device includes a circuit board, a first light-emitting element and a second light-emitting element disposed on the circuit board along a first direction. The backlight module includes a light guide plate and an adhesive structure between the circuit board and the light guide plate and having a first opening and a second opening. The first and second light-emitting elements are disposed in the first and second openings respectively. A portion of the adhesive structure disposed between the first and second openings includes a first part and a second part, the first part is disposed between the first and second light-emitting elements, and the second part is connected with the first part and extends toward the light guide plate. A second maximum width of the second part is greater than a first maximum width of the first part along the first direction.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: October 3, 2023
    Assignee: Innolux Corporation
    Inventors: Fu Kuo, May Pan, Maggy Hsu, Lavender Cheng
  • Patent number: 11778739
    Abstract: A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: October 3, 2023
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo Hsun Chen, Cheng Tsung Yang, Feng-Chun Yu, Kai-Wei Lo
  • Patent number: 11760525
    Abstract: A kit for labelling an object with a target label comprises an instrument having an end(s) for manipulating labels. Transfer label(s) adhered to the end of the instrument, the transfer label having a facestock having adhesive on at least one of its surfaces, an adhesion force A between a first surface of the facestock of the transfer label and the instrument being greater than an adhesion force B between a second surface of the transfer label and a target label. The instrument and transfer label are used to manually transfer the target label from a target label liner to an object by releasable adherence of the target label to the second surface of the transfer label. A method for labelling an object is also provided.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: September 19, 2023
    Inventor: Gourgen Ambartsoumian
  • Patent number: 11745486
    Abstract: Disclosed is a buffer component and a pressing device, the buffer component is applied to the pressing device. The pressing device includes an anisotropic conductive film pressure knife, the buffer component includes an inserting part, which is made of a first elastic material, and the inserting part is configured to insert into a lower end of the anisotropic conductive film pressure knife; and a buffering part, which is made of a second elastic material, the buffering part is configured to closely attach to a lower end surface of the lower end of the anisotropic conductive film pressure knife.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: September 5, 2023
    Assignees: HKC Corporation Limited, Chongqing HKC Optoelectronics Technology Co., Ltd.
    Inventor: Guanghui Zhang
  • Patent number: 11747521
    Abstract: A display device includes a window film with light leak prevention layers that may withstand repeated folding operations. The window film includes a first film having a first surface configured to provide an outermost surface and a second surface, a second film disposed below the first film and having a third surface and a fourth surface, a first color layer disposed on at least one of the second surface and the third surface, and a second color layer disposed below the first color layer and disposed on at least one of the third surface and the fourth surface.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: September 5, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventor: SungWoo Eo
  • Patent number: 11735717
    Abstract: A lithium electrode and a lithium secondary battery including the same. By using an olefin-based ion conducting polymer as a protective layer-forming material of a lithium electrode having a protective layer formed on a lithium metal layer, the lithium electrode may be protected from moisture or open air during a lithium electrode preparation process, lithium dendrite formation and growth from the lithium electrode may be prevented, and performance of a battery using the lithium electrode may be enhanced.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: August 22, 2023
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Suk Il Youn, Byoungkuk Son, Junghun Choi, Woongchul Choi, Minehul Jang
  • Patent number: 11735464
    Abstract: The described method enables removal of any flexible material from a temporary carrier for transfer to another surface. In particular, a semiconductor wafer is commonly held by a temporary adhesive to a carrier substrate for support during a variety of processing steps, including thinning of the semiconductor device layer. Subsequent to processing, the described method attaches the ultra-thin device layer to a roll of tape for removal from the temporary adhesive, followed by transfer to a demount roller, which then releases it onto a desired permanent surface. Utilizing the flexible nature of the ultra-thin device layer, the sequence of rollers is able to peel it from the temporary adhesive without any need for laser release processing or chemical adhesive removal while maintaining the thinned wafer in a planar form during processing. This transfer supports operations that include a change of orientation, such as from face up to face down.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: August 22, 2023
    Assignee: American Semiconductor, Inc.
    Inventors: Douglas R. Hackler, Sr., Randall S. Parker
  • Patent number: 11735564
    Abstract: The present disclosure provides a three-dimensional chip packaging structure and a method of making thereof. The structure includes: a plurality of chips stacked to form a staggered structure, each chip has one end hanging out from a lower chip and another end exposed out and connecting to a pad disposed on the chip, metal connecting pillars formed on the pads, a packaging layer disposed on the metal connecting pillars and the chips, a rewiring layer formed on the packaging layer, and a metal bump formed on the rewiring layer. The structure and method making it do not involve the Through-Silicon-Via (TSV) process, which is commonly used to achieve three-dimensional stacking of chips but is costly at the same time. Instead, the structure and method adopt pads and metal connecting pillars for electric connection. Also, the packaging structure does not necessitate a substrate for support, which reduces the package size.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: August 22, 2023
    Assignee: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
    Inventors: Yenheng Chen, Chengchung Lin, Chengtar Wu
  • Patent number: 11735540
    Abstract: A semiconductor device includes an interposer having a first side and a second side opposite to the first side, at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps, at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area, a molding compound disposed on the first side. The molding compound covers the at least one active chip and the at least one dummy chip. A plurality of solder bumps is mounted on the second side.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: August 22, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Shing-Yih Shih, Neng-Tai Shih
  • Patent number: 11723260
    Abstract: A deposition mask for making a display device, the deposition mask includes: a frame including a first opening; a first member disposed above the first opening of the frame and including a first portion surrounding at least one second opening and a second portion disposed in the second opening and physically separated from the first portion; and a second member disposed on the first member and including a first connecting portion connected to the frame and a second mesh portion overlapping the second portion.
    Type: Grant
    Filed: June 28, 2020
    Date of Patent: August 8, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Min Ho Moon, Jin Oh Kwag, Seung Yong Song, Duck Jung Lee, Seul Lee, Sung Soon Im
  • Patent number: 11709468
    Abstract: User comfort control system having non-invasive bio-patch. In some embodiments, a system for providing comfort of a person can include a wearable patch configured to be attached to a skin of the person and sense a biological condition of the skin, and to transmit information representative of the sensed biological condition. The system can further include a controller configured to receive the information and generate a control signal. The system can further include an adjustment element associated with a furniture item implemented to support and provide comfort for the person. The adjustment element can be in communication with the controller and be configured to adjust a comfort level of the furniture item for the person in response to the control signal.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: July 25, 2023
    Assignee: Life Patch International
    Inventor: Donald Bollella
  • Patent number: 11699671
    Abstract: A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: July 11, 2023
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Yong-Chao Wei, Jia-He Li
  • Patent number: 11686970
    Abstract: Provided is a display device including a display panel, a polarizing layer on the display panel and including a linear polarizer having a stretched polymer film, an adhesive member directly on the linear polarizer, and a window on the adhesive member, wherein the adhesive member absorbs 90% or greater of light having a wavelength in a range of about 300 nm to about 380 nm, and may thus effectively protect the polarizing layer from ultraviolet light incident from the outside. In addition, the display device may obtain thinner thickness, thereby exhibiting excellent reliability.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: June 27, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Beong-Hun Beon, Minha Kim, Dukjin Lee, Woosuk Jung
  • Patent number: 11682732
    Abstract: According to one embodiment, a semiconductor layer includes a base, a scanning line disposed over the base, a signal line disposed over the base, a transistor overlapping the scanning line and the signal line and including a first oxide semiconductor layer connected to the signal line, and second oxide semiconductor layers disposed in a same layer as the first oxide semiconductor layer. The second oxide semiconductor layers are disposed around the transistor, and the second oxide semiconductor layers are floating.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: June 20, 2023
    Assignee: Japan Display Inc.
    Inventors: Hirotaka Hayashi, Masataka Ikeda
  • Patent number: 11676949
    Abstract: A semiconductor package includes a lower substrate including a lower passivation layer, a lower pad, element pads and a supporting pad that are disposed on a lower surface of the lower substrate. The lower passivation layer partially covers the lower pad, the element pads and the supporting pad. A semiconductor chip is disposed on an upper surface of the lower substrate. An upper substrate is disposed on the semiconductor chip and is connected to the lower substrate. An encapsulator is disposed between the lower substrate and the upper substrate. An element is disposed on the lower surface of the lower substrate. The element is bonded to the element pads. A lower supporting member is disposed on the lower surface of the lower substrate. A supporting bonding member bonds the lower supporting member to the supporting pad.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: June 13, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taeseok Choi, Jihwang Kim, Jongbo Shim
  • Patent number: 11676936
    Abstract: A manufacturing method includes the step of forming a diced semiconductor wafer (10) including semiconductor chips (11) from a semiconductor wafer (W) typically on a dicing tape (T1). The diced semiconductor wafer (10) on the dicing tape (T1) is laminated with a sinter-bonding sheet (20). The semiconductor chips (11) each with a sinter-bonding material layer (21) derived from the sinter-bonding sheet (20) are picked up typically from the dicing tape (T1). The semiconductor chips (11) each with the sinter-bonding material layer are temporarily secured through the sinter-bonding material layer (21) to a substrate. Through a heating process, sintered layers are formed from the sinter-bonding material layers (21) lying between the temporarily secured semiconductor chips (11) and the substrate, to bond the semiconductor chips (11) to the substrate.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: June 13, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Ryota Mita, Tomoaki Ichikawa
  • Patent number: 11660833
    Abstract: A duplex liner for a label. A method for making a label comprises providing a printable face ply. The method comprises making a duplex liner by: (a) providing a transparent first liner ply; (b) providing a second liner ply that is configured to be printable; and (c) using a binder to bind the first liner ply to the second liner ply. The method includes releasably securing the duplex liner to the printable face ply.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: May 30, 2023
    Assignee: Rekon, LLC
    Inventor: Jesse D. Crum
  • Patent number: 11649032
    Abstract: Interior panels for an interior of a vehicle, vehicles, and methods for making interior panels for an interior of a vehicle are provided. In one example, the interior panel includes an outer covering having a first surface exposed to the interior and a second surface disposed opposite the first surface. The second surface has a pattern formed therein that is covered by the first surface. A board assembly is disposed proximate the second surface and has a third surface facing towards the second surface. The board assembly includes a light source that is generally aligned with the pattern. An adhesive layer is disposed between the second surface and the third surface and couples the second surface and the third surface together. When the light source generates light, the light passes through the adhesive layer and the pattern to produce an illuminated pattern on the first surface.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: May 16, 2023
    Assignee: Gulfstream Aerospace Corporation
    Inventors: John Bullock, Gregg Kendryna, Laburn DeBenion Saxon
  • Patent number: 11648762
    Abstract: A system includes a separation tool that separates a carrier wafer to form a plurality of chiplet carriers. The carrier wafer having sheets of thin film material attached. A sensor and processor of the system determine an orientation of the portions of the sheets of thin film material relative to the chiplets to determine a mapping therebetween. A fluid carrier of the system places the chiplet carriers on an assembly surface in a disordered pattern. The system includes a micro assembler that arranges the chiplet carriers from the disordered pattern to a predetermined pattern based on the mapping. A carrier of the system transfers the portions of the thin film material from the chiplet carriers to a target substrate.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: May 16, 2023
    Assignee: Palo Alto Research Center Incorporated
    Inventors: JengPing Lu, Eugene M. Chow, Sourobh Raychaudhuri
  • Patent number: 11630341
    Abstract: A display panel, a touch display panel, and a display device are provided. The touch display panel includes a first polarizer, a liquid crystal cell, and a backlight assembly, wherein a pencil hardness of the first polarizer is not less than 3H and not greater than 9H; the first polarizer is arranged at a side of the liquid crystal cell distal to the backlight assembly.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: April 18, 2023
    Assignees: Beijing BOE Display Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yu Zhang, Miao Liu, Shixin Geng, Bochang Wang, Zhanchang Bu
  • Patent number: 11612468
    Abstract: The invention relates to a polymerization and post-tempering device (10) for tempering, in particular post-tempering, dental restoration parts (54) made of polymerizable plastics. At least one light source (38) which emits light in the visible and/or ultraviolet wavelength range and a light chamber with a door (14) to the light chamber are provided. The door (14) comprises a window (20) with a window pane (22) which consists of at least two layers (56, 58) whose layer facing the light chamber reflects at least 90%, in particular approximately 95%, of light, and whose layer facing away from the light chamber filters out UV light and/or blue light.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: March 28, 2023
    Assignee: Ivoclar Vivadent AG
    Inventors: Oliver Benz, Stefan Geissbühler
  • Patent number: 11584109
    Abstract: A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: February 21, 2023
    Assignee: Advanced Copper Foil Inc.
    Inventor: Kieran Healy
  • Patent number: 11581381
    Abstract: A display apparatus and a method of manufacturing the same are provided. According to an embodiment, a display apparatus includes: a substrate; a thin-film transistor located on the substrate; and a buffer layer, a conductive layer, and an insulating layer sequentially located from the substrate between the substrate and the thin-film transistor, and a thickness of the insulating layer is less than a thickness of the buffer layer.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: February 14, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hun Kim, Sucheol Gong, Namjin Kim
  • Patent number: 11571840
    Abstract: A reusable countertop mold in accordance with the present invention includes a bracket member detachably secured to a rail portion of a cabinet member for a substantially horizontal substrate that receives deformable material upon a surface of the substrate. The bracket member includes vertical, horizontal and channel members integrally joined together for enabling a channel member to removably receive the rail member. The mold further includes a locking bolt for detachably securing the bracket member to the rail portion of the support member.
    Type: Grant
    Filed: November 7, 2020
    Date of Patent: February 7, 2023
    Inventor: Gregory Walter
  • Patent number: 11533393
    Abstract: A control button decal assembly for enhancing visibility of control buttons on an electronic device includes a set of first decals, a set of second decals and a set of third decals that can each be chosen for positioning on a respective control button on an electronic device. Each of the first decals, the second decals and the third decals is brightly colored to enhance visibility of the respective control button. Each of the first decals, the second decals and the third decals has a color that is unique with respect to each other. In this way the set of first decals, the set of second decals and the set of third decals facilitate the user to have a variety of choices of colors which can be associated with the respective control button.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: December 20, 2022
    Inventor: Kristie Campitelli
  • Patent number: 11518708
    Abstract: Embodiments disclosed therein generally pertain to selectively strengthening glass. More particularly, techniques are described for selectively strengthening cover glass, which tends to be thin, for electronic devices, namely, portable electronic devices.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: December 6, 2022
    Assignee: APPLE INC.
    Inventor: Douglas J. Weber
  • Patent number: 11518066
    Abstract: A method for treating a solid layer includes: providing a multi-layer assembly having a carrier substrate and a solid layer bonded to the carrier substrate by a bonding layer, the solid layer having an exposed surface including a defined surface structure, the defined surface structure resulting from a removal, which is effected by a crack, from a donor substrate, at least in sections; processing the solid layer, which is arranged on the carrier substrate; and separating the solid layer from the carrier substrate by a destruction of the bonding layer.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: December 6, 2022
    Assignee: Siltectra GmbH
    Inventors: Franz Schilling, Wolfram Drescher, Jan Richter
  • Patent number: 11515264
    Abstract: A method for processing a semiconductor wafer is proposed. The method may include reducing a thickness of the semiconductor wafer. A carrier structure is placed on a first side of the semiconductor wafer, e.g. before or after reducing the thickness of the semiconductor wafer. The method further includes providing a support structure on a second side of the semiconductor wafer opposite to the first side, e.g. after reducing the thickness of the semiconductor wafer. Methods for welding a support structure onto a semiconductor wafer are proposed. Further, semiconductor composite structures with support structures welded onto a semiconductor wafer are proposed.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: November 29, 2022
    Assignee: Infineon Technologies AG
    Inventors: Francisco Javier Santos Rodriguez, Alexander Breymesser, Erich Griebl, Michael Knabl, Matthias Kuenle, Andreas Moser, Roland Rupp, Hans-Joachim Schulze, Sokratis Sgouridis, Stephan Voss
  • Patent number: 11502218
    Abstract: A method of manufacturing a display device includes forming a first light-emitting area on a substrate, and forming a first color adjustment pattern on the first light-emitting area by emitting first light from the first light-emitting area, wherein the first light-emitting area includes a first semiconductor layer, a second semiconductor layer provided on the first semiconductor layer, a first active layer arranged between the first semiconductor layer and the second semiconductor layer, a first contact electrically connecting the substrate and the first semiconductor layer, and a first preliminary common electrode electrically connected to the second semiconductor layer.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: November 15, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Nakhyun Kim, Junhee Choi, Kiho Kong, Deukseok Chung
  • Patent number: 11490520
    Abstract: A PCB, a method of manufacturing the PCB, and a mobile terminal are provided. The PCB includes a PCB body and a PCB element. A first surface of the PCB body is provided with a groove. The PCB element includes a connection terminal, and a part of the PCB element is arranged within the groove. The connection terminal includes a first portion arranged within the groove and a second groove arranged outside the groove, and the first portion is electrically connected to conductive layers in the PCB body.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: November 1, 2022
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventor: Houxun Tang
  • Patent number: 11478192
    Abstract: An apparatus includes a flexible substrate; at least one sensor mounted on the flexible substrate arranged to provide an electrical output signal dependent upon a first parameter; and at least one conductive trace provided on the flexible substrate arranged to provide a direct current path to the at least one sensor and having an electrical property dependent upon a second parameter and arranged to provide an electrical output signal indicative of the second parameter.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: October 25, 2022
    Assignee: Nokia Technologies Oy
    Inventors: Matteo Bruna, Ugo Sassi, Salvatore Zarra, Zoran Radivojevic
  • Patent number: 11469162
    Abstract: The present invention provides a chip packaging method, which includes: providing a base material, which includes plural finger contacts; disposing plural chips on the base material by flip chip mounting technology, and disposing plural vertical heat conducting elements surrounding each of the chips to connect the finger contacts on the base material; providing a packaging material to encapsulate the base material, the chips, and the vertical heat conducting elements; adhering a metal film on the packaging material via an adhesive layer, to form a package structure; and cutting the package structure into plural chip package units, wherein each of the chip package units includes one of the chips, a portion of the base material, a portion of the metal film, and a portion of the vertical heat conducting elements surrounding the chip.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: October 11, 2022
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Hao-Lin Yen, Heng-Chi Huang, Yong-Zhong Hu
  • Patent number: 11462432
    Abstract: A system is disclosed, which comprises a component carrier having a first side, and a second side opposite the first side; and a light source to couple light into the carrier. In an example, the carrier is to propagate, through internal reflection, at least a portion the light to both the first and second sides of the carrier. The portion of light may be sufficient to release a first component and second component affixed to the first and second sides of the carrier via a first photosensitive layer and second photosensitive layer, respectively.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 4, 2022
    Assignee: Intel Corporation
    Inventors: Frank Truong, Praneeth Akkinepally, Chelsea M. Groves, Whitney M. Bryks, Jason M. Gamba, Brandon C. Marin
  • Patent number: 11440149
    Abstract: An apparatus, system and method for adhesive fixturing include UV light sources in alignment with gripper pins communicating through a fixture. A bus connector operably connects the UV light sources to a control box of the workcell. The control box controls the illumination of the UV light sources through the bus connector.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: September 13, 2022
    Assignee: Advanced Simulation Technology, Incorporated
    Inventors: Matthew T. Jarvis, Mark A. Rogers, Steven B. Lelinski, Alvin Andrew Potter