Abstract: Embodiments disclosed therein generally pertain to selectively strengthening glass. More particularly, techniques are described for selectively strengthening cover glass, which tends to be thin, for electronic devices, namely, portable electronic devices.

Abstract: An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; attaching an adhesive member onto the first substrate; and performing a curve attaching step, so that the first substrate and the second substrate are attached to each other through the adhesive member to form a curved composite component, wherein the curve attaching step is performed at a temperature of 20 degrees Celsius to 160 degrees Celsius.

Abstract: Embodiments of the application provide a printed circuit board, a display module, a display device and a method of bonding the printed circuit board to a display screen. The printed circuit board includes a plurality of sub-circuit boards and a flexible connector between adjacent sub-circuit boards of the plurality of sub-circuit boards. The flexible connector is configured to connect the adjacent sub-circuit boards of the plurality of sub-circuit boards with each other. For the printed circuit board provided in the embodiments of the application, each sub-circuit board of the printed circuit board can be bonded independently, thereby avoiding pitch accumulation in the bonding region and thus controlling the total pitch within a satisfactory range.

Abstract: A display apparatus includes a substrate having adjacent first and second areas for displaying an image, the first area including a transmission area and a pixel area, a first inorganic insulating layer on the transmission area and the pixel area, a thickness of the first inorganic insulating layer in the transmission area being less than a thickness of the first inorganic insulating layer in the pixel area, a second inorganic insulating layer on the first inorganic insulating layer to correspond to the pixel area, and defining a transmission hole corresponding to the transmission area, a first organic insulating layer on the second inorganic insulating layer, and a second organic insulating layer on the first organic insulating layer.

Abstract: A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.

Abstract: An object of the present invention is to provide, in the manufacture of a membrane-catalyst assembly including a polymer electrolyte membrane and a catalyst layer bonded to the polymer electrolyte membrane, a method that achieves both the relaxation of thermocompression bonding conditions and the improvement of adhesion between the catalyst layer and the electrolyte membrane with high productivity. A main object of the present invention is to provide a method of manufacturing a membrane-catalyst assembly including an electrolyte membrane and a catalyst layer bonded to the electrolyte membrane, the method including a liquid application step of applying a liquid to a surface of the catalyst layer before bonding, and a thermocompression bonding step of bonding, to the electrolyte membrane, the catalyst layer to which the liquid is applied by thermocompression bonding.

Abstract: A component with an exterior decorative surface and with signaling or operating elements arranged in the surface or near the surface, in particular an interior trim component of a vehicle, wherein the component comprises a component carrier as supporting structure or substructure and a multilayered film arranged on the exterior thereof, wherein the film comprises a layer composite composed of at least one outer cover layer which is at least partly light-transmissive and is optionally provided with a coating, and at least one further layer which is at least partly light-transmissive and is arranged on the rear side of the cover layer, wherein the layers forming the film consist of a flexible, elastomeric and reversibly deformable polymer, and the component carrier comprises devices which act on the film for the at least regional deformation of the film, i.e. deformation that concerns partial regions of the surface, and also devices for the at least regional transillumination of the film.

Abstract: Provided are a separator, a method of manufacturing the separator, and an electrochemical device including the separator. According to an embodiment of the present disclosure, a separator including: a porous substrate and an inorganic particle layer provided on at least one surface of the porous substrate may be provided, wherein a value of the following Formula (1) is 0.135 or more: (1) BDV/t, wherein BDV is a voltage (kV) when a leakage current value is 5 mA, and t is an overall average thickness (?m) of the separator.

Abstract: In an example of a method of making a flowcell, an organic solid support including sidewalls and a top is provided. A bottom surface of the organic solid support adjacent to the sidewalls provides a laser bonding foot. In the method, the laser bonding foot is bonded to an inorganic solid support to form a channel having sidewalls and a top defined by the organic solid support.

Abstract: A separator, a method of manufacturing the separator, and an electrochemical device including the separator. The separator includes: a porous substrate; and an inorganic particle layer formed on at least one surface of the porous substrate, wherein a release rate of the inorganic particle layer is 70% or more when measured by immersing the separator in a water tank at room temperature and then subjecting the separator to sonication under conditions of a frequency of 40 kHz, an output of 1,000 W, and an application time of 60 seconds.

Abstract: Provided is a container including a container portion configured to form a storage space in which contents are stored, a head portion disposed at an upper side of the container portion and configured to promote discharge of the contents, which enter the head portion from the container portion, through an internal pressure change caused by a pressing portion which is formed at one side of the head portion and made of an elastic material, and a nozzle configured to discharge the contents, which enter the nozzle from the head portion, in fixed amounts.

Abstract: A microfluidic device for thermocycling of a reaction mixture is provided. The device comprises an inlet opening, an outlet opening, a flow channel connecting the inlet opening and the outlet opening and defining a flow direction from the inlet opening through the flow channel to the outlet opening, wherein the flow channel comprises a first flow channel surface and a second flow channel surface opposite to the first flow channel surface, and an array of wells provided in the first flow channel surface for fluidic communication with the inlet opening and the outlet opening. Further, the first flow channel surface provides a first hydrophilicity and at least a part of the second flow channel surface provides a second hydrophilicity, wherein the first hydrophilicity is greater than the second hydrophilicity.

Abstract: The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 ?m or more and 20 ?m or less.

Abstract: The present disclosure relates to an electrolyte membrane for an all-solid-state battery, an all-solid-state battery comprising the electrolyte membrane and a method for manufacturing the solid electrolyte membrane. The solid electrolyte membrane may be obtained by stacking a first protective layer, a first film-type solid electrolyte material, a porous substrate, a second film-type solid electrolyte material and a second protective layer successively to prepare a laminate structure; and carrying out pressurization of the laminate structure so that the first and the second solid electrolyte materials may be pressed into the porous substrate and the pores of the porous substrate may be filled with the solid electrolyte materials.

Abstract: A deposition mask for making a display device, the deposition mask includes: a frame including a first opening; a first member disposed above the first opening of the frame and including a first portion surrounding at least one second opening and a second portion disposed in the second opening and physically separated from the first portion; and a second member disposed on the first member and including a first connecting portion connected to the frame and a second mesh portion overlapping the second portion.

Abstract: System includes a haptic garment comprising an integrated circuit (IC) controller coupled to the haptic garment. A sensing circuit configured to cause to transmit a motion signal sensed by a portion of the haptic garment surface to the IC controller is provided. The motion signal is based on one or more of a touch pattern, a gesture pattern, and a movement pattern associated with a user of the haptic garment. The IC controller is configured to transmit a first data associated with the motion signal to an external device. Conductive traces embedded in the haptic garment that electrically couple with the sensing circuit.

Abstract: An indexing apparatus includes a fixture tool, movable relative to an operation cell, and an indexing feature, fixed relative to the fixture tool. The indexing apparatus also includes a sensor, configured to detect the indexing feature. The indexing apparatus further includes a controller, in communication with the sensor. The controller is configured to locate the fixture tool relative to the operation cell from an indexing-feature location of the indexing feature, identified by the sensor.

Abstract: A protective cover member includes a laminate including: a protective membrane having a shape configured to cover an opening when the protective cover member is placed on the face of an object; a substrate film joined to the protective membrane; and a first adhesive layer configured to fix the protective cover member to the face, wherein an outer peripheral surface of the protective cover member has a step in a laminating direction of the laminate, a first portion of the protective cover member protrudes at the step more outward than a second portion of the protective cover member does when the protective cover member is placed on the face, the first portion being positioned farther from the face than the step, the second portion being positioned closer to the face than the step, and the protective membrane and the substrate film are positioned in the first portion.

Abstract: Support structures are used in certain additive fabrication processes to permit fabrication of a greater range of object geometries. For additive fabrication processes with materials that are subsequently sintered into a final part, an interface layer is formed between the object and support in order to inhibit bonding between adjacent surfaces of the support structure and the object during sintering.

Abstract: Provided is an acrylic resin composition having high chemical resistance and high oil resistance. This acrylic resin composition contains a polymer that includes a unit derived from a predetermined monomer, wherein the proportion of the unit derived from the predetermined monomer contained in the polymer to 100% by mass of all monomer units constituting the polymer is 40-99% by mass, and the tensile strength of the acrylic resin composition after being immersed in oleic acid for 24 hours is 50% or more of the value of the tensile strength thereof before being immersed in oleic acid.

Abstract: A cutting apparatus includes: a stage on which is disposed a preliminary stacked body from which a cut stacked body having an edge is formed; a cutting unit movable along a first direction corresponding to an extension direction of the edge of the cut stacked body and with which the preliminary stacked body is cut to form the cut stacked body; a first detaching unit movable in a direction forming an acute angle with the first direction and including a first detaching tool which contacts the cut stacked body in detaching of the cut stacked body from the carrier substrate; and a second detaching unit movable in a direction parallel to the first direction and including a second detaching tool which is inserted between the cut stacked body and the carrier substrate in the detaching of the cut stacked body from the carrier substrate.

Abstract: A plurality of structural fibers are laid onto a substrate. The plurality of structural fibers are stitched together with a thread in a specified stitching pattern to form a composite preform. The thread in the specified stitching pattern secures the structural fibers to each other such that the structural fibers provide a tailored load path within the composite preform and presents a visible image on an outer surface of the composite preform.

Abstract: A method of manufacturing a display device includes forming a first light-emitting area on a substrate, and forming a first color adjustment pattern on the first light-emitting area by emitting first light from the first light-emitting area, wherein the first light-emitting area includes a first semiconductor layer, a second semiconductor layer provided on the first semiconductor layer, a first active layer arranged between the first semiconductor layer and the second semiconductor layer, a first contact electrically connecting the substrate and the first semiconductor layer, and a first preliminary common electrode electrically connected to the second semiconductor layer.

Abstract: A manufacturing system includes a cutting machine, an adhesion machine, and a pick-and-place system. The cutting machine sequentially cuts a continuous length of a unidirectional prepreg into prepreg segments. Each prepreg segment has an opposing pair of segment cut edges that are non-parallel to a lengthwise direction of the unidirectional prepreg. The adhesion machine has a conveyor belt and an adhesion station. The pick-and-place system sequentially picks up the prepreg segments from the cutting machine, and places the prepreg segments in end-to-end relation on the conveyor belt, and in an orientation such that the segment cut edges are generally parallel to a lengthwise direction of the conveyor belt. The conveyor belt feeds the prepreg segments to the adhesion station. The adhesion station adheres the prepreg segments to a continuous length of a backing material, thereby resulting in a continuous length of a backed cross-ply prepreg.

Abstract: Stopper intended for bottling still wines, characterized in that it includes cork strips laterally joined by a polyurethane binder so as to form a plurality of cork strips, the cork strips being disposed such that the thickness thereof is perpendicular to the axis of the stopper, at least one lateral cork strip joined by a polyurethane binder to each face of the plurality of cork strips revealing all cork strips, the lenticels possibly present in the cork strips extending parallel to the thickness of the strips while those in the lateral cork strips extend perpendicular to the thickness of the strips, such that all lenticels of the stopper are disposed perpendicular to the axis of the stopper in order to limit the variation in oxygen permeability from one stopper to the other.

Abstract: The present invention relates to heatable garments, comprising a garment body and a heating pad adhered to at least a portion of the garment body, wherein the heating pad comprises graphene particles dispersed in a polymer matrix material. The invention also provides fabrics for making such garments, and methods of making such garments and fabrics. Also provided are heatable bedding incorporating a heating pad as described above.

Abstract: A system moves items, like containers and/or pallets, through a label printing station. The station has a label printer that prints adhesive labels; and a robot arm terminating at a movable end with a suction pad or vacuum device and sensors. The station has sensors configured to measure a height of the item; and a processor coupled to receive the height of the item, to control the robot arm and label printer, and to receive label information from a server. The processor has a memory containing code that computes desired label positions based on height of the container/pallet. A method of labeling an item includes printing an adhesive label with the label information obtained from a server; receiving the adhesive label on a suction pad or vacuum device attached to a movable end of a robot arm, and determining a first labeling position from measured height of the container/pallet.

Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a carbon structure on a handle substrate at a first surface of the handle substrate. The method further includes attaching a first surface of a semiconductor substrate to the first surface of the handle substrate. The method further includes processing the semiconductor substrate and performing a separation process to separate the handle substrate from the semiconductor substrate. The separation process comprises modifying the carbon structure.

Abstract: Dressings, systems, and methods for treating a tissue site with negative pressure are described. The dressing includes a manifold having a first surface and a second surface opposite the first surface, a first layer adjacent to the first surface, and a second layer adjacent to the second surface. The first layer and the second layer each are formed from a polymer film. A plurality of fluid restrictions are formed in the polymer film adjacent to at least the first surface. A first plurality of bonds is formed between the first layer and the second layer. The first plurality of bonds define separable sections of the manifold. A second plurality of bonds is formed between the first layer and the second layer. The second plurality of bonds define a plurality of openings.

Abstract: A method of the invention produces a composite material conjugate in which a first composite material and a second composite material are adhered without using an adhesive, wherein a first prepreg laminate to which a release member is attached is cured to form the first composite material, the release member being made of a material that does not transfer silicone and fluorine to the first prepreg laminate, after detaching the release member from the first composite material, surface treatment that imparts polar functional groups to the surface of the first composite material to which the release member was bonded is carried out to activate the surface, a second prepreg laminate is placed directly on the activated surface of the first composite material, and the second prepreg laminate is cured to form a second composite material adhered to the first composite material.

Abstract: A method for producing a semiconductor package, capable of suppressing damage of a device, and dissolving or softening a tacky layer quickly to peel off a reinforcing sheet, is provided. This method includes: providing a tacky sheet including a soluble tacky layer, making a first laminate, obtaining a second laminate having a second support substrate bonded to the first laminate, peeling off a first support substrate to obtain a third laminate, mounting a semiconductor chip thereon to obtain a fourth laminate, sealing a right end surface and a left end surface of the fourth laminate with sealing members and immersing a lower end surface of the fourth laminate selectively in a solution, giving a pressure difference between an inner space and the solution to allow the solution to penetrate into the internal space and dissolve or soften the soluble tacky layer, and peeling off the second support substrate.

Abstract: A labeling device (1) for applying a label to a product (2) located on a conveyor (3), includes an application cell (4), at least two label dispensers (5a,b) arranged outside the application cell (4) and an applicator (6), mounted inside the application cell (4), the applicator (6) being adapted to label the product (2) at variable positions on the conveyor (3) individually detected by a measuring system (9) at variable conveyor speeds, such that the labels are applied by a method for applying a label by the labeling device (1).

Abstract: A multi-eye interchangeable lens is disclosed. In one example, it includes a lens barrel, a movable unit, individual-eye lenses, and a light source. The movable unit is movable along an optical axis with respect to the lens barrel. The individual-eye lenses are integrally movable with the movable unit and are arranged such that emission positions of imaging lights emitted via the individual-eye lenses do not overlap with one another. The light source is movable along the optical axis integrally with the movable unit and the individual-eye lenses, and is arranged such that an emission position of a parallel light emitted to an image sensor provided in a camera body does not overlap with the emission position of the imaging light of each of the plurality of individual-eye lenses.

Abstract: A method for manufacturing a composite includes providing a first template including a cutout for a first layer of the composite, disposing the first layer in the cutout, and disposing a tablet, provided with an adhesive, on the first layer such that the first layer adheres to the tablet. Next, the tablet is removed, together with the first layer adhered thereto, from the cutout, and an adhesive is applied to a side of the first layer facing away from the tablet. A second template is provided that includes a cutout for a second layer of the composite, and then the second layer is disposed in the cutout. The tablet, together with the first layer adhered thereto, is disposed on the second layer disposed in the cutout of the second template, and the tablet is removed, together with the composite produced from the first and second layers, from the second template.

Abstract: A semiconductor package includes a redistribution substrate having a semiconductor chip mounted on a top surface thereof with and a connection terminal between the semiconductor chip and the redistribution substrate. The redistribution substrate includes a first redistribution pattern on a bottom surface of the connection terminal and comprising a first via and a first interconnection on the first via, a pad pattern between the first redistribution pattern and the connection terminal and comprising a pad via and a pad on the pad via, and a second redistribution pattern between the first redistribution pattern and the pad pattern and comprising a second via and a second interconnection on the second via with a recess region where a portion of a top surface of the second interconnection is recessed. A bottom surface of the recess region is located at a lower level than a topmost surface of the second interconnection.

Abstract: A personal shielding device applicable to a screen, in particular a touch screen of an electronic device, has a continuous absorbent sheet at least partially made of metal material. The continuous absorbent sheet is adapted to absorb electromagnetic waves emitted by the electronic device in direction of a user.

Abstract: A liquid crystal retardation film, a polarizing plate for light emitting displays including the same, and a light emitting display including the same are provided. The liquid crystal retardation film includes: a first retardation layer having no alignment layer, a UV absorbent primer layer, and a second retardation layer sequentially formed in the stated order, wherein each of the first retardation layer and the second retardation layer may be a liquid crystal layer.

Abstract: A semiconductor device includes first and second members. In the first member, a first electronic circuit including a semiconductor element is formed. The second member is joined to an area of part of a first surface of the first member, and includes a second electronic circuit including a semiconductor element formed of a semiconductor material different from that of the semiconductor element of the first electronic circuit. An interlayer insulating film covers the second member and an area of the first surface of the first member to which the second member is not joined. An inter-member connection wire on the interlayer insulating film couples the first and second electronic circuits through an opening in the interlayer insulating film. A shield structure including a first metal pattern disposed on the interlayer insulating film shields a shielded circuit, which is part of the first electronic circuit, in terms of radio frequencies.

Abstract: Provided are a glass substrate multilayer structure including a glass substrate; a polyimide-based shatter-proof layer formed on one surface of the glass substrate; and a hard coating layer formed on the polyimide-based shatter-proof layer. The polyimide-based shatter-proof layer has a thickness of 5 to 50 ?m, the hard coating layer has a thickness of 5 to 20 ?m, and the glass substrate multilayer structure has a retardation in a thickness direction (Rth) of 200 nm or less. A method for manufacturing the glass substrate multilayer structure, and a display panel including the glass substrate multilayer structure are also provided.

Abstract: A set of protective layers configured to protect and enhance a display or interface of a device is provided. The layers may include layers of material to strengthen the respective device components to increase durability and reduce damage from impacts. When the layers are impacted by a foreign object, the force may be absorbed by the strengthened component or transferred to other areas of the device, rather than catastrophically damaging the display, encasement or interface of the device. Additionally, the use of functional layers is provided to enhance device performance and user experience. Related assemblies and methods are also provided.

Abstract: A composite printed wiring board that allows for reflow heating for mounting electronic components using solder includes a first printed wiring board, an intermediate member, a second printed wiring board, and a bonding layer. The intermediate member is stacked on the first printed wiring board. The intermediate member has a cavity. The second printed wiring board is stacked on a surface on the opposite side to a surface opposed to the first printed wiring board in the intermediate member. The bonding layer is arranged at a bonding section between the first printed wiring board and the intermediate member and at a bonding section between the second printed wiring board and the intermediate member. The bonding layer contains high melting point metal and low melting point metal. The melting point of the bonding layer is higher than the melting point of the low melting point metal.

Abstract: A probe fastening system has a plate having at least one coupling-on recess and having at least one alignment element, which is arranged in the outer region of the plate, a backplate which has a fastening device for the fastening of a static probe and at least one recess which corresponds with the alignment element, at least one peelable shim which corresponds with the alignment element and which is arranged between the plate and the backplate, at least one alignment device which corresponds with the alignment element, and a coupling-on element which defines a cavity and which is designed for isobarically coupling the static probe onto the coupling-on recess.

Abstract: A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

Abstract: A electronic device is provided. The electronic device includes a circuit board, a first light-emitting element and a second light-emitting element disposed on the circuit board along a first direction. The backlight module includes a light guide plate and an adhesive structure between the circuit board and the light guide plate and having a first opening and a second opening. The first and second light-emitting elements are disposed in the first and second openings respectively. A portion of the adhesive structure disposed between the first and second openings includes a first part and a second part, the first part is disposed between the first and second light-emitting elements, and the second part is connected with the first part and extends toward the light guide plate. A second maximum width of the second part is greater than a first maximum width of the first part along the first direction.

Abstract: A kit for labelling an object with a target label comprises an instrument having an end(s) for manipulating labels. Transfer label(s) adhered to the end of the instrument, the transfer label having a facestock having adhesive on at least one of its surfaces, an adhesion force A between a first surface of the facestock of the transfer label and the instrument being greater than an adhesion force B between a second surface of the transfer label and a target label. The instrument and transfer label are used to manually transfer the target label from a target label liner to an object by releasable adherence of the target label to the second surface of the transfer label. A method for labelling an object is also provided.

Abstract: A display device includes a window film with light leak prevention layers that may withstand repeated folding operations. The window film includes a first film having a first surface configured to provide an outermost surface and a second surface, a second film disposed below the first film and having a third surface and a fourth surface, a first color layer disposed on at least one of the second surface and the third surface, and a second color layer disposed below the first color layer and disposed on at least one of the third surface and the fourth surface.

Abstract: Disclosed is a buffer component and a pressing device, the buffer component is applied to the pressing device. The pressing device includes an anisotropic conductive film pressure knife, the buffer component includes an inserting part, which is made of a first elastic material, and the inserting part is configured to insert into a lower end of the anisotropic conductive film pressure knife; and a buffering part, which is made of a second elastic material, the buffering part is configured to closely attach to a lower end surface of the lower end of the anisotropic conductive film pressure knife.

Abstract: The present disclosure provides a three-dimensional chip packaging structure and a method of making thereof. The structure includes: a plurality of chips stacked to form a staggered structure, each chip has one end hanging out from a lower chip and another end exposed out and connecting to a pad disposed on the chip, metal connecting pillars formed on the pads, a packaging layer disposed on the metal connecting pillars and the chips, a rewiring layer formed on the packaging layer, and a metal bump formed on the rewiring layer. The structure and method making it do not involve the Through-Silicon-Via (TSV) process, which is commonly used to achieve three-dimensional stacking of chips but is costly at the same time. Instead, the structure and method adopt pads and metal connecting pillars for electric connection. Also, the packaging structure does not necessitate a substrate for support, which reduces the package size.

Abstract: A semiconductor device includes an interposer having a first side and a second side opposite to the first side, at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps, at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area, a molding compound disposed on the first side. The molding compound covers the at least one active chip and the at least one dummy chip. A plurality of solder bumps is mounted on the second side.

Abstract: The described method enables removal of any flexible material from a temporary carrier for transfer to another surface. In particular, a semiconductor wafer is commonly held by a temporary adhesive to a carrier substrate for support during a variety of processing steps, including thinning of the semiconductor device layer. Subsequent to processing, the described method attaches the ultra-thin device layer to a roll of tape for removal from the temporary adhesive, followed by transfer to a demount roller, which then releases it onto a desired permanent surface. Utilizing the flexible nature of the ultra-thin device layer, the sequence of rollers is able to peel it from the temporary adhesive without any need for laser release processing or chemical adhesive removal while maintaining the thinned wafer in a planar form during processing. This transfer supports operations that include a change of orientation, such as from face up to face down.