With Stripping Of Adhered Lamina Patents (Class 156/247)
  • Patent number: 11515264
    Abstract: A method for processing a semiconductor wafer is proposed. The method may include reducing a thickness of the semiconductor wafer. A carrier structure is placed on a first side of the semiconductor wafer, e.g. before or after reducing the thickness of the semiconductor wafer. The method further includes providing a support structure on a second side of the semiconductor wafer opposite to the first side, e.g. after reducing the thickness of the semiconductor wafer. Methods for welding a support structure onto a semiconductor wafer are proposed. Further, semiconductor composite structures with support structures welded onto a semiconductor wafer are proposed.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: November 29, 2022
    Assignee: Infineon Technologies AG
    Inventors: Francisco Javier Santos Rodriguez, Alexander Breymesser, Erich Griebl, Michael Knabl, Matthias Kuenle, Andreas Moser, Roland Rupp, Hans-Joachim Schulze, Sokratis Sgouridis, Stephan Voss
  • Patent number: 11502218
    Abstract: A method of manufacturing a display device includes forming a first light-emitting area on a substrate, and forming a first color adjustment pattern on the first light-emitting area by emitting first light from the first light-emitting area, wherein the first light-emitting area includes a first semiconductor layer, a second semiconductor layer provided on the first semiconductor layer, a first active layer arranged between the first semiconductor layer and the second semiconductor layer, a first contact electrically connecting the substrate and the first semiconductor layer, and a first preliminary common electrode electrically connected to the second semiconductor layer.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: November 15, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Nakhyun Kim, Junhee Choi, Kiho Kong, Deukseok Chung
  • Patent number: 11490520
    Abstract: A PCB, a method of manufacturing the PCB, and a mobile terminal are provided. The PCB includes a PCB body and a PCB element. A first surface of the PCB body is provided with a groove. The PCB element includes a connection terminal, and a part of the PCB element is arranged within the groove. The connection terminal includes a first portion arranged within the groove and a second groove arranged outside the groove, and the first portion is electrically connected to conductive layers in the PCB body.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: November 1, 2022
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventor: Houxun Tang
  • Patent number: 11478192
    Abstract: An apparatus includes a flexible substrate; at least one sensor mounted on the flexible substrate arranged to provide an electrical output signal dependent upon a first parameter; and at least one conductive trace provided on the flexible substrate arranged to provide a direct current path to the at least one sensor and having an electrical property dependent upon a second parameter and arranged to provide an electrical output signal indicative of the second parameter.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: October 25, 2022
    Assignee: Nokia Technologies Oy
    Inventors: Matteo Bruna, Ugo Sassi, Salvatore Zarra, Zoran Radivojevic
  • Patent number: 11469162
    Abstract: The present invention provides a chip packaging method, which includes: providing a base material, which includes plural finger contacts; disposing plural chips on the base material by flip chip mounting technology, and disposing plural vertical heat conducting elements surrounding each of the chips to connect the finger contacts on the base material; providing a packaging material to encapsulate the base material, the chips, and the vertical heat conducting elements; adhering a metal film on the packaging material via an adhesive layer, to form a package structure; and cutting the package structure into plural chip package units, wherein each of the chip package units includes one of the chips, a portion of the base material, a portion of the metal film, and a portion of the vertical heat conducting elements surrounding the chip.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: October 11, 2022
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Hao-Lin Yen, Heng-Chi Huang, Yong-Zhong Hu
  • Patent number: 11462432
    Abstract: A system is disclosed, which comprises a component carrier having a first side, and a second side opposite the first side; and a light source to couple light into the carrier. In an example, the carrier is to propagate, through internal reflection, at least a portion the light to both the first and second sides of the carrier. The portion of light may be sufficient to release a first component and second component affixed to the first and second sides of the carrier via a first photosensitive layer and second photosensitive layer, respectively.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 4, 2022
    Assignee: Intel Corporation
    Inventors: Frank Truong, Praneeth Akkinepally, Chelsea M. Groves, Whitney M. Bryks, Jason M. Gamba, Brandon C. Marin
  • Patent number: 11440149
    Abstract: An apparatus, system and method for adhesive fixturing include UV light sources in alignment with gripper pins communicating through a fixture. A bus connector operably connects the UV light sources to a control box of the workcell. The control box controls the illumination of the UV light sources through the bus connector.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: September 13, 2022
    Assignee: Advanced Simulation Technology, Incorporated
    Inventors: Matthew T. Jarvis, Mark A. Rogers, Steven B. Lelinski, Alvin Andrew Potter
  • Patent number: 11420381
    Abstract: A machine can include a base including a first cradle. The first cradle can include a device slot being configured to securely hold a first electronic device. The machine also can include an alignment piece hingedly attached to the base at a hinge. The alignment piece can include an alignment base configured to engage with an alignment mechanism of an overlay applicator. The machine additionally can include a pulling piece movably attached to the base. The pulling piece can be configured to remove an adhesive release liner of the overlay applicator to expose an adhesive agent of an overlay of the overlay applicator when the alignment piece is rotated relative to the base around the hinge from a first alignment piece position to a second alignment piece position. Other embodiments are described.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: August 23, 2022
    Assignee: BELKIN INTERNATIONAL, INC.
    Inventors: Steven Lane, John Wadsworth
  • Patent number: 11411242
    Abstract: A lithium secondary battery including a positive electrode, a negative electrode, and a separator disposed between the positive electrode and the negative electrode, wherein the negative electrode is lithiated by pre-lithiation, a total capacity of a negative electrode active material of the negative electrode is larger than a total capacity of a positive electrode active material of the positive electrode, and a charge capacity of the negative electrode is smaller than a charge capacity of the positive electrode by the pre-lithiation.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: August 9, 2022
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Oh Byong Chae, Yoon Ah Kang, Jun Hyuk Song, Eun Kyung Kim, Sang Wook Woo
  • Patent number: 11380953
    Abstract: The present invention provides a fiber-reinforced aerogel material which can be used as insulation in thermal battery applications. The fiber-reinforced aerogel material is highly durable, flexible, and has a thermal performance that exceeds the insulation materials currently used in thermal battery applications. The fiber-reinforced aerogel insulation material can be as thin as 1 mm less, and can have a thickness variation as low as 2% or less. Also provided is a method for improving the performance of a thermal battery by incorporating a reinforced aerogel material into the thermal battery. Further provided is a casting method for producing thin fiber-reinforced aerogel materials.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: July 5, 2022
    Assignee: ASPEN AEROGELS, INC.
    Inventors: Owen Richard Evans, Nicholas Anthony Zafiropoulos, Shannon Olga White, Wenting Dong, Wendell E. Rhine
  • Patent number: 11346111
    Abstract: A mechanically-interlocked decorative column assembly, and methods for forming such a column assembly without the use of adhesives. The column assembly includes at least first and second panel members that may be joined together form a column. Each panel member may be formed from extruded from cellular foam polyvinyl chloride (PVC) material. First and second interlocking structures provided on the first and second panel members, respectively, engage to maintain the panel members in the assembled condition during the service life of the column assembly, without the need for adhesives.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: May 31, 2022
    Assignee: Superior Aluminum Products, Inc.
    Inventors: Matthew F. Purpus, Anton J. Luthman, Douglas E. Borchers, Christopher A. Haynes, Scott L. Sayer
  • Patent number: 11340526
    Abstract: A template and a template blank are used for imprint lithography transferring a transfer pattern in a concave and convex structure to a resin on a transfer substrate, in which a first step structure is formed on a main surface of a base, a second step structure is formed on the first step structure, and an outside region of the second step structure on an upper surface of the first step structure is covered with a light shielding film to solve the above problem.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: May 24, 2022
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Takaharu Nagai, Katsutoshi Suzuki, Koji Ichimura, Kouji Yoshida
  • Patent number: 11309196
    Abstract: A method of detecting adhesive residue on a wafer after peeling an adhesive film from the wafer by using a peeling tape is described. According to a first aspect, the method includes illuminating the peeling tape with first UV light after the peeling and acquiring a fluorescence image from the peeling tape. According to a second aspect, the method includes illuminating the wafer with second UV light after the peeling and acquiring a fluorescence image from the wafer.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: April 19, 2022
    Assignee: Infineon Technologies AG
    Inventors: Robert Muhr, Matthias Fehr, Walter Leitgeb
  • Patent number: 11286679
    Abstract: A repair seal that is resistant to cracking and peeling during an attachment procedure and that is not noticeable after repair is provided. In addition, this repair seal is manufactured. Furthermore, a repair structure that is resistant to cracking and peeling during an attachment procedure and that is not noticeable after repair is provided. A repair seal 7 or 8 of the present invention is used for a decorative panel 1 including at least one undercoat layer 1b or 1c, a colored layer 1d, and a clear layer 1e stacked in this order on a substrate 1a. The repair seal 7 or 8 includes a repair multilayer body 70 and an adhesive layer 71. The repair multilayer body 70 includes a transparent or translucent resin base material sheet 70a, a repair colored layer 70b disposed on a front surface of the base material sheet 70a and formed from the same paint as the colored layer 1d, and a repair clear layer 70c formed from the same paint as the clear layer 1e.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: March 29, 2022
    Assignee: NICHIHA CORPORATION
    Inventor: Hiroaki Yamamoto
  • Patent number: 11280685
    Abstract: A method of making a resistance temperature detector includes additively manufacturing a conductive ink on a flexible substrate and applying the resistance temperature detector to a geometrically complex surface of a component requiring heating, or directly additive manufacturing the resistance temperature detector onto that surface.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: March 22, 2022
    Assignee: Goodrich Corporation
    Inventors: James A. Mullen, Reid Philip Beery, Brandon Hein
  • Patent number: 11259443
    Abstract: Heat resistant RFID tags can be formed by embedding RFID tags between laminates of glass fiber meshes. The glass fiber meshes can be woven tightly. Air gaps between the glass fibers can be filled with a high temperature adhesive. Mica sheets can be used with the glass fiber meshes.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: February 22, 2022
    Assignee: SMARTRAC INVESTMENT B.V.
    Inventors: Syamala Gauri T. Kunasekaran, Muthuk Kumaran Subramaniam
  • Patent number: 11246226
    Abstract: Laminate structures including hole plugs, and methods for forming a hole plug in a laminate structure are provided. A laminate structure may be formed with at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. A blind hole may be formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the blind hole including a hole depth to hole diameter aspect ratio of less than ten (10) to one (1). Via fill ink may be disposed in the blind hole, and the via fill ink may be dried and/or cured to form a hole plug.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: February 8, 2022
    Assignee: SANMINA CORPORATION
    Inventors: Shinichi Iketani, Dale Kersten
  • Patent number: 11241897
    Abstract: A method for adjusting a printing apparatus, which the printing apparatus includes: a platen for supporting the medium, an imaging unit, a winding shaft for winding the medium, a shaft adjusting mechanism configured to adjust the position of the winding shaft, and a notifying unit configured to perform notification, comprising: a jig installing step for attaching one end of a strip-shaped jig, on which graduations are formed, to the winding shaft, and locking the jig to the platen, along a transporting path at both ends in a width direction of the medium, an imaging step for imaging the graduations by the imaging unit at two locations different from each other, in a direction orthogonal to a transport direction of the medium on the platen, a notifying step for notifying a result based on an image imaged by the imaging unit, and an adjusting step for adjusting the shaft adjusting mechanism.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: February 8, 2022
    Assignee: Seiko Epson Corporation
    Inventor: Mikio Kitagishi
  • Patent number: 11239104
    Abstract: A chip ejecting apparatus includes a table configured to be provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape, an ejector unit including a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape, and a control unit configured to separately control on/off operations of the plurality of gas holes and select an active gas hole group from the plurality of gas holes. The active gas hole group is selected to overlap the target chip, and is configured to inject the gas toward the dicing tape along a direction from a first edge of the target chip toward a second edge of the target chip opposite to the first edge of the target chip.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: February 1, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Ryoung Lee, Sang Hwan Kim, Min Sung Kim
  • Patent number: 11215737
    Abstract: A display device includes a window film with light leak prevention layers that may withstand repeated folding operations. The window film includes a first film having a first surface configured to provide an outermost surface and a second surface, a second film disposed below the first film and having a third surface and a fourth surface, a first color layer disposed on at least one of the second surface and the third surface, and a second color layer disposed below the first color layer and disposed on at least one of the third surface and the fourth surface.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: January 4, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventor: SungWoo Eo
  • Patent number: 11207855
    Abstract: The invention provides a machine for manufacturing an ophthalmic article molded by casting and having a straight peripheral edge, comprising a mold assembly (2) having first and second molding shells (10, 13) provided with first and second predetermined molding surfaces (12, 14) and facing to each other, an adhesive tape member (20) joining said shells for forming a molding cavity (8), having a Young's modulus greater than 200 MPa and a maximum shear stress smaller than 0.05 MPa when measured at a temperature of polymerization of a molding material, and also configured to form a peripheral case of the mold assembly in which said first molding shell is able to be displaced relative to the second molding shell without affecting an intermediate portion (22) of the adhesive tape member which define said cavity, and a filling aperture formed in said adhesive tape member for introducing by casting said material into said cavity for forming the article.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: December 28, 2021
    Assignee: Essilor International
    Inventors: Laurent Chippaux, Somporn Wichitworatham, Natrada Wiwattanapongpan
  • Patent number: 11193042
    Abstract: The present invention generally relates to a method for creating a chemically structured surface with structural elements as small as 1 nm, on a material that does not itself display a high degree of ordering, using thin molecular layers that minimize the material added through the coating. In particular, the present invention discloses a method for assembling a chemical pattern on a surface, comprising pattern elements with scales that can be as small as 1 nm, and then transferring that pattern to another substrate, on which the pattern would not form natively. In the described method, the patterned monolayer is comprised of polymerizable amphiphiles such as diyne phospholipids or diynoic acids, which are transferred from the ordering substrate using a transferring material such as poly(dimethylsiloxane).
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: December 7, 2021
    Assignee: Purdue Research Foundation
    Inventors: Shelley A. Claridge, Tyson C. Davis
  • Patent number: 11186906
    Abstract: A holding arrangement for holding a substrate is described. The holding arrangement includes a body having a first wall of flexible material; an adhesive arrangement configured for attaching the substrate, wherein the adhesive arrangement is provided on a first side of the first wall, and a force transmission arrangement configured for applying a force to a second side of the first wall opposing the first side of the first wall.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: November 30, 2021
    Assignee: Applied Materials, Inc.
    Inventor: Simon Lau
  • Patent number: 11175455
    Abstract: A manufacturing system performs a deposition of an etch-compatible film over a substrate. The etch-compatible film includes a first surface and a second surface opposite to the first surface. The manufacturing system performs a partial removal of the etch-compatible film to create a surface profile on the first surface with a plurality of etch heights relative to the substrate. The manufacturing system performs a lithographic patterning of a photoresist deposited over the created profile in the etch-compatible film to obtain the plurality of etch heights and one or more duty cycles corresponding to the etch-compatible film deposited over the substrate.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: November 16, 2021
    Assignee: Facebook Technologies, LLC
    Inventors: Matthew E. Colburn, Giuseppe Calafiore, Matthieu Charles Raoul Leibovici, Nihar Ranjan Mohanty
  • Patent number: 11160164
    Abstract: A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, interlayer insulating layers interposed between the first conductor layers and between the second conductor layers, and via conductors formed in the core layer such that each via conductor decreases in diameter from one of the inner conductor layers toward the other one of the inner conductor layers and that the other one of the inner conductor layers has thickness greater than thickness of the one of the inner conductor layers. The first and/or second inner conductor layers includes a first laminated structure including metal foil and plating film layers, the first and/or second outer conductor layers includes the first laminated structure, and the first and/or second intermediate conductor layers includes a second laminated structure including metal foil and plating film layers.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: October 26, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Takenobu Nakamura, Takahiro Yamazaki, Takashi Yamauchi, Toshihide Makino
  • Patent number: 11124679
    Abstract: Provided is a laminated sheet including an upper paper layer and a release sheet layer, the upper paper layer including synthetic paper and an adsorbing layer, the synthetic paper, the adsorbing layer and the release sheet layer, in order, being laminated, wherein the adsorbing layer is a foam sheet of a resin composition, the resin composition containing crosslinking resultant of 100 parts by mass of a (meth)acrylic acid ester copolymer resin and 1 to 20 parts by mass of a carbodiimide crosslinking agent, the (meth)acrylic acid ester copolymer resin having a N-methylol group, a glass transition temperature of the (meth)acrylic acid ester copolymer resin being no more than ?10° C., the release sheet layer consists of a thermoplastic resin sheet, and a rate of tensile elastic moduli is 0.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: September 21, 2021
    Assignees: ZEON CORPORATION, YUPO CORPORATION
    Inventors: Shinsuke Ashida, Atsushi Sone, Tamio Shikano, Hiroshi Koike
  • Patent number: 11124717
    Abstract: Methods for operating a hydroprocessing reactor and preventing corrosion in a hydroprocessing unit are provided. The hydroprocessing reactor includes surfaces exposed to corrosive compounds. In one aspect, a graphene-based coating is applied to the surfaces of the reactor. A feed comprising crude oil or its fractions and hydrogen is introduced into the reactor, and the operating temperature of the reactor is increased to 36° C.-600° C. The reactor is operated at a pressure of 10 bar-250 bar. The feed is then hydroprocessed in the reactor and the coating defines a barrier on the surfaces of the reactor to prevent corrosion. In another aspect, after application of the coating, the coated surface is tested to determine whether the coating covers the entire surface. Additional coating is then applied to one or more areas of the surface that were determined not to be covered by the initial coating.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: September 21, 2021
    Assignee: Saudi Arabian Oil Company
    Inventors: Omer Refa Koseoglu, Ata Can Koseoglu, Anas Farkad Alkhani
  • Patent number: 11114650
    Abstract: According to a flexible OLED device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with laser light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (212). The first portion (110) includes a plurality of OLED devices (1000) which are in contact with the stage (212). The OLED devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: September 7, 2021
    Assignee: Sakai Display Products Corporation
    Inventors: Kohichi Tanaka, Katsuhiko Kishimoto
  • Patent number: 11097439
    Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: August 24, 2021
    Assignee: SAXUM, LLC
    Inventor: Teo Chong Teck
  • Patent number: 11097514
    Abstract: Shaped glass structures, in particular to curved glass structures, having optically improved transmittance are provided along with methods of making such glass structures. Articles and methods described herein mask tube or reforming defects with help of refractive index-matching substances (e.g. optically clear adhesives) and/or additional glass layers. The articles and methods are applicable to any shaped glass, and is particularly useful for 3D-shaped parts for use in portable electronic devices.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: August 24, 2021
    Assignee: CORNING INCORPORATED
    Inventors: Jaymin Amin, Patrick Joseph Cimo, Thierry Luc Alain Dannoux, Vladislav Yuryevich Golyatin, Santona Pal
  • Patent number: 11077498
    Abstract: The present disclosure relates to manufacturing methods. The teachings thereof may be used to manufacture a component in which the component is applied by thermal spraying with a coating jet carrying building material. For example, a method for manufacturing a component may include: producing a mold for the component layer-by-layer on a building platform using a generative process incorporating data describing the mold; building the component in the mold by filling the mold with a building material using thermal spraying with a coating jet; and removing the mold from the component.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: August 3, 2021
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Oliver Hofacker, Ursus Krueger
  • Patent number: 11076492
    Abstract: Devices, methods, and systems for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: July 27, 2021
    Assignee: Averatek Corporation
    Inventors: Shinichi Iketani, Michael Riley Vinson, Haris Basit
  • Patent number: 11020060
    Abstract: Disclosed are a monitoring system and a monitoring method. The monitoring system includes: a collection device, configured to collect feature data of a baby; and a processor, coupled to the collection device and configured to receive the feature data collected by the collection device, determine a state condition of the baby according to the feature data, and output prompt information corresponding to the state condition.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: June 1, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Enhui Guan, Lu Tong, Shuo Chen, Tianyue Zhao, Xianzhen Li
  • Patent number: 11006522
    Abstract: Textile material having conductive elements for an interior of a vehicle includes a flat textile substrate having a first surface and an opposite second surface. At least one conductor track formed of a conductive paint is printed onto the first surface. At least one sensitive element, which is electrically conductively connected to the conductor track on the first surface, is arranged on the second surface.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: May 11, 2021
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Moritz Anton, Sophie Richter, Martin Schmid
  • Patent number: 10994384
    Abstract: An apparatus, system and method for adhesive fixturing include UV light sources that are connectable to a fixture when the fixture is not attached to the stage of a workcell. A support structure holds the UV light sources in alignment with gripper pins communicating through the fixture. A bus connector operably connects the UV light sources to a control box of the workcell. Attaching the UV light sources to the fixtures outside of the workcell increases the throughput of the workcell and reduces the cost of the fixtured work pieces.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: May 4, 2021
    Assignee: Advanced Simulation Technology, Incorporated
    Inventors: Matthew T. Jarvis, Mark A. Rogers, Steven B. Lelinski, Alvin Andrew Potter
  • Patent number: 10986465
    Abstract: An electronic device worn on a user includes one or more accelerometers. The one or more accelerometers generate acceleration information based on acceleration experienced by the electronic device. The electronic device further includes a processor and one or more associated memories, and the one or more associate memories include computer program code executable by the processor. The processor, configured by the computer program code, causes the electronic device to process the acceleration information to extract features from the acceleration information. The processor, configured by the computer program code, further causes the electronic device to process the features to determine the location of the electronic device on the user.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: April 20, 2021
    Assignee: MEDIDATA SOLUTIONS, INC.
    Inventors: Shyamal Patel, Ryan S. McGinnis, Aadithya Prakash, Roozbeh Ghaffari, Milan Raj, Ikaro Silva, Elise Jortberg
  • Patent number: 10967468
    Abstract: A machine for gluing a ring-shaped workpiece prior to machining operations. The machine includes a support assembly adapted to receive a removable support element having a top surface for receiving a workpiece; a glue dispenser system adapted to apply a predefined amount of glue on a face of at least one of the workpiece and the support element; a gripper assembly for placing a workpiece on the support element; an illuminating system adapted to illuminate the applied glue with ultraviolet light, this illuminating system including: at least one inner lighting element for radially illuminating an inner radial face of the ring-shaped workpiece with ultraviolet light, and at least one outer lighting element for radially illuminating an outer radial face of the ring-shaped workpiece with ultraviolet light.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: April 6, 2021
    Assignee: Aktiebolaget SKF
    Inventors: Marcel Escursell, Stig Giaever, Sture Johansson
  • Patent number: 10961419
    Abstract: Provided is a laminate having a gel layer on a substrate able to protect the substrate during various types of processing used in industrial production steps prior to curing. The gel layer has excellent heat resistance, softness and flexibility, a low modulus of elasticity, low stress, excellent stress buffering properties, and electronic component retention properties. The gel layer has higher shape retention before curing but changing after curing into a hard layer having excellent release properties. The laminate is easily and readily releasable from the substrate even when the cured layer is localized. Applications thereof are also provided (such as an electronic component manufacturing method). The laminate comprises a laminated reaction-curable silicone gel and a sheet-like member laminated via an adhesive layer on top of the reaction-curable silicone gel.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: March 30, 2021
    Assignee: DOW TORAY CO., LTD.
    Inventors: Hiroshi Fukui, Kyoko Toyama, Yoshito Ushio
  • Patent number: 10953315
    Abstract: A playing card having a substrate entirely of a first predetermined colour overlaid with a removable surface coating entirely of a second predetermined colour contrasting with said first predetermined colour, said removable surface being sufficiently friable so as to be able to be scratched off by a player in a pattern predetermined by said player to reveal said substrate in said pattern. The scratched playing card uses the high contrasting colors (typically primary and secondary colors) to produce letters or image(s). These cards are interchangeably used in a strategic and non gambling card game often utilising the Stroop effect.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: March 23, 2021
    Inventor: Bela Inkster
  • Patent number: 10934021
    Abstract: A method for aligning and joining a first structure to a second structure in an aircraft is provided. A spacer system having a shape memory alloy is positioned in a gap between the first structure and the second structure. The shape memory alloy is initially in a cooled state. A temperature of the shape memory alloy is increased such that the shape memory alloy changes from the cooled shape to a heated shape to fill the gap and apply a load to hold the first structure in place relative to the second structure. Additional processes may then be performed to join the first structure to the second structure.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: March 2, 2021
    Assignee: The Boeing Company
    Inventors: James Henry Mabe, Frederick Theodore Calkins, Stephen K. Kirchmeier, Edward Andrew Whalen, Donald William Ruhmann
  • Patent number: 10927543
    Abstract: An acoustic attenuation structure comprises a gas permeable composite facesheet, a cellular core, and an impermeable backing. The gas permeable composite facesheet has a designated porosity. The designated porosity causes the permeability of the gas permeable composite facesheet. The gas permeable composite facesheet comprises a carbon fiber fabric. The cellular core is bonded to the gas permeable composite facesheet using a resin of the gas permeable composite facesheet without any additional adhesive. The impermeable backing is connected to the cellular core.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: February 23, 2021
    Assignee: The Boeing Company
    Inventors: Geoffrey Allen Butler, Justin Honshune Lan
  • Patent number: 10920111
    Abstract: Disclosed herein are various embodiments of a protective packaging system suitable for use with a prefinished building article. The protective packaging system generally is designed to reduce shrink back of the flexible substrate after tension is applied. The protective packaging system generally comprises at least one outer layer, at least one core layer and at least one adhesive layer. One or more layers of the protective packaging system may include a roughening agent such that the flexible substrate will not “gloss” or burnish a coating on a prefinished building article.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: February 16, 2021
    Assignee: James Hardie Technology Limited
    Inventors: Yongjun Chen, Caidian Luo, Jimmy Lee McCammon
  • Patent number: 10900522
    Abstract: Disclosed is a self-lubricating composite friction part (1) that can be subjected, during operation, to temperatures that are at least equal to 250° C. The part includes, along the friction surface (2), a single layer of a material consisting of weft and warp yarns made of polytetrafluoroethylene, the material being impregnated with a thermostable resin having a glass transition temperature that is at least equal to 250° C. It is applied to a reinforcing layer (3).
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: January 26, 2021
    Assignee: HYDROMECANIQUE ET FROTTEMENT
    Inventors: Emmanuel Masse, Olivier Blandenet
  • Patent number: 10889083
    Abstract: Described herein is form assembly having a removable and synthetic peel out identification card and a method of making the same. The assembly is generally comprised of a laminate of a first planar form layer having an at least one aperture, a first planar layer of synthetic material, and a second planar layer of synthetic material forming the identification card. The first planar layer of synthetic material is applied to a second side of the first planar form layer across the width and over the at least one aperture forming a backer. The second planar layer of the synthetic material is placed within the at least one aperture and secured to the first planar layer of synthetic material. A controlled depth cut is then made to a second side of the first planar layer of synthetic material within a perimeter of the second planar layer of synthetic material to allow for the selective release of the second planar layer of synthetic material from the form.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: January 12, 2021
    Inventor: Tom Holmberg
  • Patent number: 10858534
    Abstract: Provided are an ultraviolet curable coating composition and an automobile part using the same. In an exemplary embodiment, the coating composition comprises a first urethane (meth)acrylate oligomer having 6 or more functional groups, a second urethane (meth)acrylate oligomer having 3 or more functional groups, a polyester (meth)acrylate oligomer, a hydroxy (meth)acrylate monomer having 3 or more functional groups, a multifunctional (meth)acrylate monomer having 3 or more functional groups, and a photopolymerization initiator, based on the total weight of the coating composition.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: December 8, 2020
    Assignee: KCC CORPORATION
    Inventor: Won Il Kim
  • Patent number: 10854495
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: December 1, 2020
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Patent number: 10847758
    Abstract: A resin film is released from a supporting substrate without using light irradiation, with ease, and without damaging the resin film or the like. Preparation for separating the supporting substrate on which the resin film is cohesively formed into a first part and a second part; and at least one of the first part and the second part is allowed or caused to move in a direction parallel to an one surface of the first part while the first part of the supporting substrate and at least an edge of the second part facing the first part being moved with respect to one another, while a close contact between the resin film and an one surface of the second part of the supporting substrate being maintained, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: November 24, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Katsuhiko Kishimoto, Kohichi Tanaka
  • Patent number: 10845696
    Abstract: A display device comprises a display panel having a plurality of pixels and configured to be wound or unwound, and a back cover attached to one surface of the display panel and having a plurality of grooves. The grooves include a plurality of first grooves placed on the one surface of the back cover and a plurality of second grooves placed on the other surface of the back cover opposite to the one surface of the back cover. A depth of each of at least one of the first grooves and at least one of the second grooves is smaller than a maximum thickness of the back cover.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: November 24, 2020
    Assignee: LG Display Co., Ltd.
    Inventors: Hyunjoo Song, Yeonjun Oh
  • Patent number: 10843400
    Abstract: A protective film peeling apparatus includes a peeling tape, a tape support portion disposed under one side of the peeling tape, a first pressing portion which is disposed on the one side of the peeling and fixes the one side of the peeling tape to the tape support portion, a second pressing portion which is disposed on another side of the peeling tape and presses and attaches the another side of the peeling tape to one side of a dummy portion of a protective film on a panel, and a grip portion disposed on the dummy portion. The tape support portion and the first pressing portion peel the one side of the dummy portion and a predetermined portion of the dummy portion, and the grip portion peel a remaining portion of the dummy portion.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: November 24, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Gyeonghee Han, Jekil Ryu, Yoongyeong Bae, Jooseob Ahn, Seongchae Jeong, Inae Han, Gyoowan Han
  • Patent number: 10828972
    Abstract: A system for bonding a windshield to a windshield frame, the system comprising: at least one layer of bonding material that bonds the windshield to the windshield frame; at least one heating element embedded in the bonding material; at least one shape memory element formed from a shape memory material embedded in the at least one layer of bonding material in close proximity to the at least one heating element; at least one electrical power source coupled to the at least one heating element; and a controller operable to control the at least one electrical power source to generate current in the at least one heating element to generate heat that softens and weakens the bonding material and causes the at least one shape memory element to transition to a remembered shape that operates to disrupt the bonding layer and free the windshield from the windshield frame.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: November 10, 2020
    Assignee: PLASAN RE'EM LTD.
    Inventor: Leor Tikotzenski