With Stripping Of Adhered Lamina Patents (Class 156/247)
  • Patent number: 10378989
    Abstract: In order to produce accurate sensor element in a simple way, the invention provides a method for producing a sensor element (10) for a pressure or force sensor. Steps include, providing a component (13) to be deformed. Applying to the component (13), a sensor function and contact layer (24) consisting of a material with a k-factor between 2 and 10. Performing planar ablation of the material of the sensor function and contact layer (24) by means of a laser, in such a manner that strain gauges (44) with a resistance structure with a meandering shape and contact pads (46.1, 46.2, 46.3, 46.4) remain standing.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: August 13, 2019
    Assignee: Trafag AG
    Inventors: Jan Dusing, Jurgen Koch, Oliver Suttmann, Marc Broetzmann, Armin Siber, Dieter Zeisel
  • Patent number: 10363686
    Abstract: An apparatus for melting thermoplastic material is disclosed. The apparatus includes a heated manifold and at least one heating element disposed within the heated manifold. The heated manifold defines a plurality of cavities, a pump supply passage, and a discharge passage. The plurality of cavities are spaced apart from one another, and each receives particles of thermoplastic material from a hopper. The particles of thermoplastic material are melted within the plurality of cavities. The pump supply passage receives molten thermoplastic material from the plurality of cavities and supplies the molten thermoplastic material to a pump. The discharge passage receives pressurized molten thermoplastic material from the pump and is in fluid communication with a dispenser. The heating element transfers heat substantially throughout the heated manifold.
    Type: Grant
    Filed: August 27, 2017
    Date of Patent: July 30, 2019
    Assignee: Nordson Corporation
    Inventor: Leslie J. Varga
  • Patent number: 10357992
    Abstract: A process for creating an abstract art image may include forming a wire sculpture from conductive electrical wire; mounting the wire sculpture in a framework; operatively connecting the wire sculpture to a power supply having a voltage and a current necessary to melt the wire sculpture; starting the power on the power supply to slowly melt the wire sculpture; and photographing the melting wire sculpture over an extended time period.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: July 23, 2019
    Inventor: John Stephen Van Dewerker
  • Patent number: 10336048
    Abstract: According to the utility model, there is provided a film laminator for cell phones, useful for film lamination on a surface of a cell phone, including: a cell phone fixing plate, on which a through hole for receiving the cell phone is established, and a top surface of which is a horizontal face; with at least one position limiting plate for abutting the cell phone within the through hole being also fixed on the top surface. The film laminator for cell phones further includes: a film laminating plate for fixing a cell phone film; one end of which is hinged to the cell phone fixing plate, and the other end of which is movable freely so that the film laminating plate is bonded with the top surface of the cell phone fixing plate.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: July 2, 2019
    Assignee: Alpha Comm Enterprises, LLC
    Inventors: Qiang Xiong, Shaoyu Lin, Lingbin Kong
  • Patent number: 10332775
    Abstract: Disclosed herein is a releasable carrier that includes a supporting carrier, a carrier conductive layer, and a releasable tape located between the supporting carrier and the carrier conductive layer. The releasable tape attaches the supporting carrier to the carrier conductive layer. The releasable tape is configured to release the supporting carrier from the carrier conductive layer after being exposed to an activating source. The releasable carrier further includes a thin conductive layer attached to the carrier conductive layer, the thin conductive layer creating a surface configured to receive a conductive circuit. Further disclosed is a method for fabricating the releasable carrier and a method for making a semiconductor device using the releasable carrier.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: June 25, 2019
    Assignee: CHIP SOLUTIONS, LLC
    Inventor: Sukianto Rusli
  • Patent number: 10315863
    Abstract: A method of making a laminated shingle is provided. The method includes coating a shingle mat with roofing asphalt to make an asphalt-coated sheet, adhering a reinforcement member to a portion of the asphalt-coated sheet, covering the asphalt-coated sheet, and optionally covering the reinforcement member, with granules to make a granule-covered sheet, dividing the granule-covered sheet into an overlay sheet and an underlay sheet, wherein the overlay sheet has a tab portion normally exposed on a roof and a headlap portion normally covered-up on a roof, the headlap portion having a lower zone adjacent the tab portion and an upper zone adjacent the lower zone, and wherein the reinforcement member is adhered to the lower zone of the headlap portion and laminating the overlay sheet and the underlay sheet to make the laminated shingle.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: June 11, 2019
    Assignee: Owens Corning Intellectual Capital, LLC
    Inventors: James S. Belt, Bert W. Elliott
  • Patent number: 10297377
    Abstract: A chip electronic component includes a magnetic body including an insulating substrate, and an internal coil part formed on at least one surface of the insulating substrate. The internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: May 21, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10283387
    Abstract: A peeling apparatus peels a protective member off a wafer, the protective member including a resin and a film which is fixed to one surface of the wafer with the resin interposed therebetween. The film has a protrusive marginal side extending radially outwardly beyond an outer circumferential edge of the wafer. A holding unit holds another surface of the wafer with the protective member disposed therebelow. A gripping unit grips the protrusive marginal side of the protective member. A peeling mechanism peels the protective member off the wafer by relatively moving the gripping unit and the holding unit radially inwardly from the outer circumferential edge of the wafer toward the center of the wafer. A camera then captures an image of the wafer, and a decision unit determines whether residue of the resin remains on the wafer from the image captured by the camera.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: May 7, 2019
    Assignee: Disco Corporation
    Inventor: Nobuyuki Fukushi
  • Patent number: 10266297
    Abstract: A labeling device, comprising a scale control assembly (11) and a stripping assembly (12), the scale control assembly (11) being configured to obtain a material strip (10) and to lead out a predetermined length of the material strip (10); the stripping assembly (12) being configured to grasp a target label (101) on the material strip (10) led out by the scale control assembly (11) and to affix the target label (101) to a product (D) to be labeled at a pre-set position so as to obtain a labeled product. Said device controls, by means of the scale control assembly, the length of the material strip that is led out at each time when labeling the product to be labeled, so as to improve the precision of the stripping assembly grasping the label and affixing the label to the product to be labeled.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: April 23, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Yuhua Zhou, Ting Wang, Chunlei Cao
  • Patent number: 10263216
    Abstract: A rollable display apparatus includes a rolling drum; and a flexible display panel comprising an end bonded to the rolling drum, the flexible display panel being windable around an outer circumferential surface of the rolling drum, the flexible display panel including a flexible substrate including a first surface on which a display device is arranged; and a first protection film over the first surface of the flexible substrate, the first protection film including a first layer including an elastic polymer, and a second layer on the first layer and having a smaller surface frictional force than the first layer, and the second layer includes a plurality of first grooves each indented in a depth direction of the second layer from a surface of the second layer.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: April 16, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyunwoo Koo, Taewoong Kim, Kyuyoung Kim, Jeongho Kim, Taean Seo, Junghun Lee
  • Patent number: 10259614
    Abstract: A product, system, and method for creating a film capable of allowing a user to create a custom graphical representation is described, which may allow a user to create a custom graphical representation in a film by depressing select areas of the film to form the custom graphical representation.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: April 16, 2019
    Assignee: PepsiCo, Inc.
    Inventors: Edward Peter Socci, Wenny Wingping-Ng Noha, Subhankar Chatterjee, Mikhail Laksin, Prasad K. Adhikari
  • Patent number: 10247708
    Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: April 2, 2019
    Assignee: Butterfly Network, Inc.
    Inventors: Jonathan M. Rothberg, Susan A. Alie, Keith G. Fife, Nevada J. Sanchez, Tyler S. Ralston
  • Patent number: 10243199
    Abstract: The present disclosure is intended to reduce the resistance of a high-loading electrode, to improve the impregnation ability of an electrolyte and thus to improve the rate characteristics of a battery.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: March 26, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Young-Jae Kim, Je-Young Kim
  • Patent number: 10244640
    Abstract: An object of the present invention is to provide a multilayered printed wiring board provided with split through holes excellent in through-hole formability and co-planarity in inner layer wirings around through holes for providing of a conduction isolation portion. To achieve the object, “a copper clad laminate provided with a protective layer for manufacturing of a printed wiring board having a conduction isolation portion electrically isolating a through hole, the copper clad laminate is characterized in that the copper clad laminate is provided with a protective layer on the surface that can be released after forming of the through holes for providing of a conduction isolation portion and filling of the through holes for providing of a conduction isolation portion by a plating resist” is employed.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: March 26, 2019
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Fujio Kuwako, Toshifumi Matsushima, Toshihiro Hosoi, Ayumu Tateoka
  • Patent number: 10234694
    Abstract: A novel endoscope, which can be a spectrally encoded endoscope (SEE) probe having forward-view, side-view, or a combination of forward and side views is provided herein. The SEE probe includes a light guiding component, a light focusing component, and a grating component. The probe is configured to forward a light such as a spectrally dispersed light from the grating component to a sample with no intermediate reflections between light guiding component and the grating component. A triangular grating, such as a staircase grating or an overhang grating may be used as the grating component.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: March 19, 2019
    Assignee: Canon U.S.A., Inc.
    Inventors: Zhuo Wang, Seiji Takeuchi
  • Patent number: 10209559
    Abstract: A device for dismantling a liquid crystal display includes a carrier platform, a dismantling bracket, a dividing piece and a driving component; the carrier platform includes a carrying surface for supporting the liquid crystal display to be dismantled thereon, and the liquid crystal display to be dismantled includes a display panel and a backlight unit bonded to each other; the dividing piece is located above the carrier platform and mounted onto the dismantling bracket; the dividing piece is capable of being driven by the driving component so as to move in a first direction and into a slit between the display panel and the backlight unit; and the first direction intersects with an extending direction of the dividing piece. The dismantling device for liquid crystal display can solve the problem that the display panel and the backlight unit are difficult to be dismantled.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: February 19, 2019
    Assignees: BOE Technology Group Co., Ltd., Hefei BOE Optoelectronics Technology Co., Ltd.
    Inventors: Youhao Sun, Gang Wang, Yunxiao Zhang, Bin Yang, Xianglong Meng, Jun Zhou, Wenjuan Zhang
  • Patent number: 10198107
    Abstract: Disclosed is a terminal device. The terminal device includes a haptic unit for providing a haptic effect by changing at least one of frequency, strength, wavelength, and rhythm, an input unit for receiving information corresponding to an emotional state, and a controller for controlling the haptic unit so that a haptic effect of the emotional state corresponding to the received information is provided to a user.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: February 5, 2019
    Assignees: Samsung Electronics Co., Ltd., IIIT HYDERABAD
    Inventors: Yu-dong Bae, Eun-hwa Lee, Indurkhya Bipin, Akshita, Sampath Harini
  • Patent number: 10189048
    Abstract: An object is to provide a novel peeling method and a novel peeling apparatus. A peeling method including a first step of forming a separation layer over a substrate, a second step of forming a layer to be separated over the separation layer, a third step of forming a peeling starting point by separating part of the layer to be separated from the separation layer, and a fourth step of peeling the layer to be separated from the substrate using the peeling starting point. In the fourth step, the substrate temperature is higher than or equal to 60 degrees Celsius and lower than or equal to 90 degrees Celsius.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: January 29, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Kunihiko Suzuki
  • Patent number: 10183258
    Abstract: Metallopolyimide precursor fibers for aging-resistant carbon molecular sieve hollow fiber membranes having enhanced selectivity include transition metal cations complexed with electronegative regions of a polyimide. CMS membranes are made by pyrolyzing the metallopolyimide precursor fibers. The cations are introduced by including, in the spin dope composition used to extrude the fibers, either a salt of the transition metal and an inorganic anion or a transition metal/organic ligand complex.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: January 22, 2019
    Assignee: L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude
    Inventors: Raja Swaidan, David J. Hasse, Madhava R. Kosuri, Canghai Ma, Robert A. Gagliano, Henri Chevrel
  • Patent number: 10173967
    Abstract: According to one embodiment of the present invention, an azo polymer forms a complex with a lithium ion and a sodium ion among alkali metal ions, but does not form a complex with a potassium ion. Therefore, the azo polymer is expected to be utilized as a material for a sensor capable of selectively detecting a specific alkali metal ion, or as a novel material capable of selectively trapping a specific alkali metal ion from a solution in which metal ions are mixed.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 8, 2019
    Assignees: LG Chem, Ltd., IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
    Inventors: Yang Kyoo Han, In-Joon Byun, Sung Soo Yoon, Je Gwon Lee
  • Patent number: 10170352
    Abstract: A manufacturing apparatus includes a first supporting section to support a first tape section. The first tape section has a first surface facing away from the first supporting section. For example, a semiconductor chip can be disposed on the first surface. A second supporting section of the apparatus supports a second tape section in a facing arrangement with the first tape section. The second tape section has a second surface facing away from the second supporting section. For example, a semiconductor chip can be transferred from the first surface to the second surface in a manufacturing process. A ring element is between the first and second tape sections and surrounds a space between the first and second tape sections. The ring element has a port allowing fluid communication between the space and an outlet port.
    Type: Grant
    Filed: March 1, 2015
    Date of Patent: January 1, 2019
    Assignee: ALPAD CORPORATION
    Inventors: Shuji Itonaga, Hideto Furuyama, Mitsuyoshi Endo
  • Patent number: 10145005
    Abstract: Certain example embodiments relate to methods for low temperature direct graphene growth on glass, and/or associated articles/devices. In certain example embodiments, a glass substrate has a layer including Ni formed thereon. The layer including Ni has a stress pre-engineered through the implantation of He therein. It also may be preconditioned via annealing and/or the like. A remote plasma-assisted chemical vapor deposition technique is used to form graphene both above and below the Ni-inclusive film. The Ni-inclusive film and the top graphene may be removed via tape and/or the like, leaving graphene on the substrate. Optionally, a silicon-inclusive layer may be formed between the Ni-inclusive layer and the substrate. Products including such articles, and/or methods of making the same, also are contemplated.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: December 4, 2018
    Assignee: Guardian Glass, LLC
    Inventor: Vijayen S. Veerasamy
  • Patent number: 10143250
    Abstract: A customizable garment patch having a least a first layer, the first layer being a printed graphical layer, a second layer attached to the first layer being a fabric substrate layer, the first layer attached to the second layer by sublimation printing, an adhesive applied to the second layer, the adhesive capable of connecting the garment patch to a surface and the adhesive being a water soluble glue.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: December 4, 2018
    Inventor: Richard R. W. Schulz
  • Patent number: 10132937
    Abstract: The purpose of the present invention is to provide a method for manufacturing a three-dimensional structure, a method for manufacturing a scintillator panel, a three-dimensional structure, and a scintillator panel that enable the type and thickness of a substrate of the scintillator panel to be selected freely. The present invention provides a method for manufacturing a three-dimensional structure, by which a three-dimensional structure is obtained by forming a glass pattern on a base member and then separating the glass pattern from the base member.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: November 20, 2018
    Assignee: Toray Industries, Inc.
    Inventors: Takahiro Tanino, Tsubasa Hamano, Nobuyasu Fujioka
  • Patent number: 10131822
    Abstract: The invention relates to an adhesive composition comprising at least one natural latex and at least one polymeric composition having a glass transition temperature ranging from ?50° C. to 0° C. The invention also relates to a membrane obtained after drying the adhesive composition according to the invention, to a combination of a flexible surface coating with an adhesive composition according to the invention, to a method for applying a flexible surface coating onto a substrate as well as a substrate coated with a peelable adhesive membrane according to the invention.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: November 20, 2018
    Assignee: BOSTIK S.A.
    Inventors: Jessie Casimiro, Eric Verscheure
  • Patent number: 10100544
    Abstract: The system includes support sections and locking clips. Each support section has an L-shaped base portion, a back portion, and a flange for insertion into a slot in a track around the pool. so that when the track flange is inserted in the slot, part of the base portion extends down near the pool wall, part of the base portion extends away from the pool wall to a distal end, the back portion being attached to the distal end, the back portion extends above the track, and the locking hole is proximate to the slot. Each locking clip has a protrusion sized and configured to extend through the locking hole in the support section and into the slot in the track so that the clip abuts and supports the support section and is locked into place by a friction fit between the protrusion and the track.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: October 16, 2018
    Assignee: 2214099 Ontario Limited
    Inventors: Howard Crocker, Steve Snyder
  • Patent number: 10103048
    Abstract: A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: October 16, 2018
    Assignee: Brewer Science, Inc.
    Inventors: Tony D. Flaim, Jeremy McCutcheon
  • Patent number: 10086583
    Abstract: There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: October 2, 2018
    Assignee: JSR CORPORATION
    Inventors: Torahiko Yamaguchi, Hiroyuki Ishii, Katsumi Inomata
  • Patent number: 10046550
    Abstract: A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane. Once properly attached, the bonding agent is then heated, depressurized or otherwise caused to sublimate or vaporize, thereby releasing the processed membrane from the carrier.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: August 14, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: Henry I. Smith, Corey P. Fucetola, Katherine A. Mirica, Jay J. Fucetola, Dakota S. Freeman
  • Patent number: 10035368
    Abstract: A label assembly and method of using the same to label articles durably, yet removably. In one embodiment, the method includes providing an image removing laminate. The image removing laminate includes (i) a remover support, and (ii) a remover layer secured to the remover support, the remover layer, upon being activated by at least one of heat and light, being bondable to an ink image on a garment in such a way that the bonding between the remover layer and the ink image is stronger than the bonding between the ink image and the garment. The method then includes bonding the remover layer of the image removing laminate to the ink image on the garment and, then, detaching the ink image from the garment by separating the image removing laminate away from the garment.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: July 31, 2018
    Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
    Inventors: Dong-Tsai Hseih, Kuolih Tsai, Yi-Hung Chiao, Xiao-Ming He, Li Shu, Ramin Heydarpour, Alan Morgenthau
  • Patent number: 10020709
    Abstract: A motor includes a motor housing, a motor body, and a damping member. The motor body includes a drive shaft. The motor body is housed in the motor housing. The damping member is disposed on an outer surface of the motor housing. The damping member includes a damping layer and a constraining layer. The damping layer is made of an organic polymeric material, and bonded to the outer surface of the motor housing. The constraining layer is made of at least one of a resin mixed with an inorganic compound and an elastomer mixed with an inorganic compound. The constraining layer is disposed on the damping layer.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: July 10, 2018
    Assignees: JTEKT CORPORATION, BRIDGESTONE KBG CO., LTD
    Inventors: Tetsuya Murashima, Kazuhiro Yamamoto, Takanori Kato, Masayuki Sekine, Kazuyoshi Iida, Koji Sakata
  • Patent number: 9997492
    Abstract: Microelectronic packages and methods for fabricating microelectronic packages having optical mask layers are provided. In one embodiment, the method includes building redistribution layers over the frontside of a semiconductor die. The redistribution layers includes a body of dielectric material in which a plurality of interconnect lines are formed. An optical mask layer is formed over the frontside of the semiconductor die and at least a portion of the redistribution layers. The optical mask layer has an opacity greater than the opacity of the body of dielectric material and blocks or obscures visual observation of an interior portion of the microelectronic package through the redistribution layers.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: June 12, 2018
    Assignee: NXP USA, INC.
    Inventors: Weng F. Yap, Scott M. Hayes, Alan J. Magnus
  • Patent number: 9982124
    Abstract: Disclosed is a photocurable elastomer composition that exhibits, when cured, excellent flexibility and barrier properties and has low compression set. The photocurable elastomer composition may comprise components (A) to (D) such that the mass ratio of the component (A) to the component (B) ((A):(B)) is from 25:75 to 75:25, and that the content of the component (C) is 50 mass % or less based on the total content of the components (A), (B), and (C).
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: May 29, 2018
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Toshihiko Kurata
  • Patent number: 9970475
    Abstract: An assembly that is removably mountable to a wall, the assembly including a base plate and a mounting plate that is asymmetrically deflectably coupled to the base plate.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: May 15, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Pei Chun Chang, Kenneth B. Wood
  • Patent number: 9962900
    Abstract: A lining material and method that prevent peeling at overlapping both circumferential ends (overlapping portion) of a lining material installed in a conduit. A lining material is inverted to be inside out to line a conduit. The lining material includes: an impermeable layer; a lining material main body provided inside the impermeable layer, the lining material main body made into a tubular form by rolling a base material sheet, with its both circumferential ends overlapping each other; and a tubular member provided inside the lining material main body.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: May 8, 2018
    Assignee: ASHIMORI INDUSTRY CO., LTD.
    Inventors: Yasuhiro Ueda, Shinji Onishi, Shigeki Yamashita
  • Patent number: 9950505
    Abstract: A method for manufacturing the display device (70, 80) comprises: providing a first flexible substrate (101) comprising a first and second surfaces and a second flexible substrate (102) comprising a third and fourth surfaces; joining the second surface of the first flexible substrate with the third surface of the second flexible substrate by a connecting element (11) to form a laminated structure, wherein the first surface of the first flexible substrate (101) is a first outer surface of the laminated structure, and the fourth surface of the second flexible substrate (102) is a second outer surface of the laminated structure; forming a first flexible display element layer (10a) and a second flexible display element layer (10b) respectively on the first and second outer surfaces of the laminated structure; separating the first flexible substrate (101) from the second flexible substrate (102) of the laminated structure.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: April 24, 2018
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yong Qiao, Hongli Wang, Yanli Wang
  • Patent number: 9931824
    Abstract: A method of laying up a segment on a layup surface using a layup head that is mobile with respect to the layup surface, the layup head supporting a spool of a tape of material which includes at least one layer to be laid up from which said segment is cut and at least one interliner, the method including applying the tape of material against the layup surface and removing the interliner using a separator. The tape of material is pressed firmly by a press roller against the layup surface before the interliner is removed as the layup head moves in an advancing movement. A layup head for implementing the method and a layup machine including the layup head are also described.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: April 3, 2018
    Assignee: Airbus Operations S.A.S.
    Inventors: Denis De Mattia, Bruno Burel
  • Patent number: 9925816
    Abstract: A carrier sheet (1) for a plurality of information carriers (2). The carriers can be secured to the upper side of the carrier sheet (1) and can be marked using a marking device. The carrier sheet (1) allows simple and fast marking of information carriers (2) followed by simple handling of the information carriers (2) and carrier sheet (1) by virtue of the fact that, on the upper side of the carrier sheet (1), a plurality of fields (3) is arranged, each of which can be used to position an information carrier (2) on the upper side of the carrier sheet (1), these fields (3) being able to be separated from the rest of the carrier sheet (1).
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: March 27, 2018
    Assignee: Phoenix Contact GmbH & Co. KG
    Inventors: Kilian Klages, Moez Bibani, Jörg Donoth, Nicole Probach
  • Patent number: 9925754
    Abstract: A manufacturing method of a flexible device comprises: an adjustment step of adjusting adhesive characteristics of an adhesive layer formed over a supporting substrate; a temporary bonding step of temporarily bonding the flexible substrate; an electronic device formation step of forming an electronic device; and a separation step of separating the flexible substrate. In the adjustment step, the adhesive characteristics of the adhesive layer are adjusted to satisfy a relationship of PB<PA, where PA denotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step without undergoing the adjustment step, and PB denotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step after undergoing the adjustment step.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: March 27, 2018
    Assignee: PANASONIC CORPORATION
    Inventors: Yuji Tanaka, Kenji Okumoto
  • Patent number: 9924591
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: March 20, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Phillip Duane Isaacs, David C. Long
  • Patent number: 9914290
    Abstract: The present invention relates to a peeling bar, apparatus, and method for peeling a polarizing film from a panel. This invention can minimize friction between the peeling bar and the polarizing film since the peeled polarizing film is in contact with a front part of the peeling bar. Also, in order to equalize tension applied to the polarizing film in a peeling process, this invention makes both ends of the polarizing film closely adhere to the peeling bar. According to this invention, fracture of the polarizing film is prevented, and thereby the polarizing film can be stably peeled from the panel without fracture.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: March 13, 2018
    Assignee: LG CHEM, LTD.
    Inventors: San Park, Bong su Jeung, Jea han Ryoo, Cheon ho Park, Sukjae Lee, Kyoung sik Kim
  • Patent number: 9915037
    Abstract: A method for producing a roadway structure includes: applying pellets of an adhesive composition to a non-tacky surface of a substrate having a support structure, wherein the adhesive composition has at least one solid epoxy resin and at least one thermoplastic polymer that is solid at room temperature; and applying a bitumen-based bearing course. The method permits rapid and efficient production of a roadway structure with good adhesion between the substrate and the asphalt and is suitable in particular for the restoration of asphalt coverings, which must be carried out under time pressure. The application of primer courses is not required.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: March 13, 2018
    Assignee: SIKA TECHNOLOGY AG
    Inventor: Herbert Ackermann
  • Patent number: 9914282
    Abstract: A composite component includes a plurality of layers. A fracture region includes at least one fracture inducing layer in an overlapping relationship with at least one of the plurality of layers.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: March 13, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: James T. Roach, Darin S. Lussier
  • Patent number: 9902584
    Abstract: Provided is a foil removal device and a method for removing a foil from a tire tread in a removal direction, wherein the foil removal device includes a foil collection unit with a winding element, a winding drive for receiving the foil at or near one of the ends of the foil, a gripper for engaging the foil prior to the removal of the foil and a gripper drive for moving the gripper from the gripping position towards the foil collection unit to partially remove the foil from the tire tread. The gripper is arranged for releasing the foil when the foil collection unit has received the foil. The winding drive is arranged for driving the winding element to engage and subsequently remove the foil. The removal device includes a displacement drive for moving the foil collection unit simultaneously with the winding drive driving the winding element.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: February 27, 2018
    Assignee: VMI HOLLAND B.V.
    Inventor: Roel Kramer
  • Patent number: 9900986
    Abstract: A motor driving device including a printed board on which an insulating component is mounted. The insulating component integrally includes a plate-shaped insulation part formed by a heat resistant resin having an electrical insulation property, and a plate-shaped adhesive part provided at an end portion of the insulation part and formed by a thermoplastic resin having an electrical insulation property, and the insulating component is adhered to a surface of the printed board by thermal welding by heating and melting the adhesive part.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: February 20, 2018
    Assignee: FANUC CORPORATION
    Inventor: Hironao Tanouchi
  • Patent number: 9889533
    Abstract: The invention provides a cloth taking-up device including: a platform, on which glue/cloth to be taken-up are disposed; and a clamp part movable with respect to the platform, which can clamp a roller and roll the glue/cloth to be taken-up successively onto the roller. An outside surface of the platform has an included angle of 0°-180° with respect to the horizontal plane, on which the glue/cloth to be taken-up are disposed, and the clamp part can keep the roller in parallel with the outside surface. The cloth taking-up device can avoid uneven pressure applied to the glue/cloth to be taken-up in the down-press manner, improving uniformity of taken-up glue/cloth. Meanwhile, the foreign matters on the glue/cloth to be taken-up can easily fall off, and the foreign matters on the rollers cannot drop onto the glue/cloth to be taken-up with the rotation, thereby ensuring glue/cloth taking-up quality.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: February 13, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Hui Jing, Zhubing Huang, Xiaofeng Wang
  • Patent number: 9887847
    Abstract: A conductor on glass security layer may be located within a printed circuit board (PCB) of a crypto adapter card or within a daughter card upon the crypto adapter card. The conductor on glass security layer includes a glass dielectric layer that remains intact in the absence of point force loading and shatters when a point load punctures or otherwise contacts the glass dielectric layer. The conductor on glass security layer also includes a conductive security trace upon the glass dielectric layer. A physical access attempt shatters a majority of the glass dielectric layer, which in turn fractures the security trace. A monitoring circuit that monitors the resistance of the conductive security trace detects the resultant open circuit or change in security trace resistance and initiates a tamper signal that which may be received by one or more computer system devices to respond to the unauthorized attempt of physical access.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: February 6, 2018
    Assignee: International Business Machines Corporation
    Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark J. Jeanson, Mark O. Maxson
  • Patent number: 9873241
    Abstract: A method for fabricating a flexible display device is provided. The method comprises: attaching a first flexible substrate of the flexible display device onto a conductive adhesive layer, wherein the conductive adhesive layer is disposed on a conductive rigid substrate; fabricating other parts of the flexible display device on the first flexible substrate; aging the conductive adhesive layer; peeling off the flexible substrate from the conductive rigid substrate so as to obtain the flexible display device.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: January 23, 2018
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Hongfei Cheng, Yuxin Zhang
  • Patent number: 9802357
    Abstract: A transferring assembly for transferring onto an object a RFID identification device consisting of a microchip connected to an antenna made of electrically conductive material, wherein a film of adhesive material is applied to a supporting element, the microchip is applied on the film of adhesive material in a zone of the supporting element, the antenna is formed by applying the wire made of electrically conductive material to the film of adhesive material and electrically connecting the antenna to the microchip, and the zone is pressed against a surface of the object, with the RFID identification device facing the surface, the adhesive material, and/or the supporting element, being chosen so that the adhesive material has an adhesiveness on the surface of the object that is significantly greater than the adhesiveness of the film on the supporting element.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: October 31, 2017
    Assignee: Smart Res Societa' per Azioni
    Inventor: Marcello Lolli
  • Patent number: 9773723
    Abstract: An assembly can include a first microelectronic package and a circuit structure comprising a plurality of dielectric layers and electrically conductive features thereon. The first package can include a substrate having a plurality of first contacts at a first or second surface thereof and a plurality of second contacts at the first surface thereof, and a first microelectronic element having a plurality of element contacts at a front surface thereof. The first contacts can be electrically coupled with the element contacts of the first microelectronic element. The electrically conductive features of the first circuit structure can include a plurality of bumps at the first surface of the circuit structure facing the second contacts of the substrate and joined thereto, a plurality of circuit structure contacts at a second surface of the circuit structure, and a plurality of traces coupling at least some of the bumps with the circuit structure contacts.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: September 26, 2017
    Assignee: Invensas Corporation
    Inventor: Belgacem Haba