GRAIN BIN SENSOR CABLE FORMING METHOD AND APPARATUS
A method and apparatus for forming a grain bin sensor cable including a plurality of mold members defining a mold cavity. A pre-formed cable with wires disposed therein is placed into the mold cavity, heated, and formed into a post-formed cable. The post-formed cable includes a recessed portion and a pair of end caps. Apertures are created within the recessed portion so as to expose a portion of the wires. The end caps are generally cone-shaped and include vertical walls. The post-formed cable is removed from the mold cavity and a sensor package is coupled to the wires exposed in the recessed portion and captured between the vertical walls of the end caps. A housing is coupled about the sensor package.
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The present disclosure relates to grain bin cables, and more particularly to methods and apparatus to form such cables.
BACKGROUNDThis section provides background information related to the present disclosure which is not necessarily prior art.
It is well known that farmers engaged in the cultivation of grain crops make use of grain bins to store harvested grain in bulk for periods of time. It is desirable for the grain to be stored in such a manner so as to prevent it from spoiling. Various factors, including excessive moisture inside the grain bin, can contribute to grain spoilage. As such, it is desirable to monitor various parameters, including moisture content, inside the grain bin.
Various methods for monitoring parameters inside grain bins are known. For example, one method involves coupling a plurality of sensors to a plurality of cables and suspending the cables from the roof structure of a grain bin, thereby disposing the sensor cables within the grain stored inside. The sensors are capable of monitoring grain bin parameters at various height and perimeter locations throughout the grain bin. The sensors can then communicate the sensed data to an external controller or reading device.
While loading grain into a grain bin, storing grain inside a grain bin, and/or unloading grain from a grain bin, grain can exert substantial downward forces onto the sensor cables disposed therein, particularly on the sensors mounted to the cables. Such downward forces can damage, displace, and/or shear the sensors off of the cables. As such, costly repairs to the sensors and cables can be required and inaccurate data from damaged sensors can be transmitted to the external controller or reading device.
SUMMARYThis section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
In one aspect of the disclosure, a grain bin sensor cable forming method is provided that includes positioning a pre-formed cable having a pair of wires encased within an outer sheath of a plastic material within a mold cavity having an end cap cavity, heating the outer sheath of the pre-formed cable, compressing the mold cavity around the heated outer sheath causing a volume of the plastic material to be displaced into the end cap cavity to provide a post-formed cable.
In another aspect of the present disclosure, a grain bin sensor cable forming method is provided. The method includes positioning a pre-formed cable having a pair of power wires and a pair of signal wires encased within an outer sheath of a plastic material within a mold cavity having a pair of end cap cavities, heating the outer sheath of the pre-formed cable, compressing the mold cavity around the heated outer sheath causing a volume of the plastic material to be displaced into the pair of end cap cavities to provide a post-formed cable.
In yet another aspect of the present disclosure, a grain bin sensor cable forming apparatus is provided that includes a plurality of mold members defining a mold cavity. The mold cavity includes an elongated cavity configured to accept a pre-formed length of cable and an end cap cavity. The plurality of mold members have a heating position and a cooling position relative to each other. A heater is coupled to one of the mold members to heat one of the mold members. A thermostat is coupled to the heater to control heating of the one of the mold members. One of the mold members is configured to heat a plastic material of an outer sheath of the pre-formed length of cable when in the heated position, and wherein the mold members are configured to displace a volume of the plastic material of the outer sheath into the end cap cavity as the mold members move from the heating position into the cooling position.
Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.
DETAILED DESCRIPTIONThe following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features.
With reference to
The grain bin sensor cable 10 includes a sensor cable assembly 50 coupled to a post-formed cable 26, an outer sheath 24 disposed about the post-formed cable 26, and a pair of end caps 38. The end caps 38 are formed to be a single and integral part of the outer sheath 24 and can be generally symmetrical, generally cone-shaped, and are generally mirror images of one another. Each end cap 38 includes a vertical wall 40 (
The process of forming the grain bin sensor cable 10 begins with a pre-formed cable 12, shown in
With reference to
Specifically, the pre-formed cable 12 is positioned within a notch channel 84 cavity located on the upper surface 78 of the lower mold 76. The notch channel 84 can be disposed along the entire length of the upper surface 78. The notch channel 84 corresponds to the lower surface 16 of the pre-formed and/or post-formed cable 12, 26. A portion of the length L of the pre-formed and/or post-formed cable 12, 26 can extend beyond the sensor cable forming apparatus 60 during operation. (See
As shown in
The upper mold 62 includes a notch channel 72 cavity and the corresponding top portions of the end cap cavities 86. The notch channel 72 can be similar to the notch channel 84, and can be disposed along the entire length of the lower surface 66 of the upper mold 62. The notch channel 72 corresponds to the upper surface 14 of the pre-formed and/or post-formed cable 12, 26. The top portions of the end cap cavities 86 are disposed along the notch channel 72 and correspond to the end caps 38 along the upper surface 14 of the post-formed cable 26.
The upper mold 62 further includes a rectangular slot 70 arranged perpendicular to the upper surface 64. Specifically, the rectangular slot 70 can be aligned along the notch channel 72, between the end cap cavities 86, and can extend throughout the entire thickness of the upper mold 62.
With the upper and lower molds 62, 76 in contact, the notch channels 72, 84 fully enclose and embrace the pre-formed cable 12. The pre-formed cable 12 can be exposed to a heat source to at least partially heat and make the outer sheath 24 impressionable. Next, a rectangular forming mechanism 88 positioned above the upper mold 62 can be drawn down into the rectangular slot 70.
The forming mechanism 88 can be of a generally rectangular block shape and includes an upper portion 90 and a lower portion 92. The lower portion 92 includes a lower surface 96. The upper portion 90 is larger than the rectangular slot 70 and as such, provides a stop 79 that locates the forming mechanism 88 in a proper position relative to upper and lower molds 62, 76 during the forming process. The lower portion 92 is of an appropriate size to allow the lower portion 92 to move up and down within the rectangular slot 70 during the forming process. The lower surface 96 is of an appropriate size to fit between the end cap cavities 86 and form the recessed portion 28 of the post-formed cable 26 during the forming process.
The upper portion 90 of the forming mechanism 88 can also include a pair of passageways 94 that extend throughout the entire length of the forming mechanism 88. Similarly, the lower mold 76 and the upper mold 62 can also include a pair of temperature control passageways 82, 68. A heater 93 is positioned in at least one of the passageways 94, 82, 68, and a thermostat 95 is positioned in the other corresponding passageway 94, 82, 68. The heater 93 and the thermostat 95 can help control the temperature of the sensor cable forming apparatus 60 during operation. In this case, the heater 93 and the thermostat 95 are positioned in passageways 94 of
With reference to
With continued reference to
As the forming mechanism 88 is pressed down into the outer sheath 24 forming the recessed portion 28, the forming mechanism 88 can transfer heat to the outer sheath 24. The springs 104 bias the pins 98, 100 against the outer sheath 24 until the pins 98, 100 eventually displace the outer sheath 24 material and make contact with the power and signal wires 20, 22. Once contact is made, the power and signal wires 20, 22 resist the bias of the springs 104 and prevent the pins 98, 100 from depressing into the wires 20, 22.
The outer sheath 24 material displaced by the pins 98, 100 also flows into the end cap cavities 86, and along with the displaced outer sheath 24 material from the recessed portion 28, forms the end caps 38 of the post-formed cable 26. Thus, the end caps 38 can become a single and integral part of the outer sheath 24.
An auxiliary passageway 58 can extend through the upper mold 62 and into the end cap cavities 86. The auxiliary passageway 58 is shown only in
With reference to
The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment. Any element(s) or feature(s) from one embodiment can be combined or interchanged with element(s) or feature(s) of any other embodiment, and even if any such combination or interchangeability is not specifically shown or described in the specification, all such possible combinations are included within this disclosure. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein (including the claims), the singular forms “a,” “an,” and “the” is intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it may be directly on, connected or coupled to the other element or layer, or intervening elements or layers may be present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Spatially relative terms, such as “inner,” “outer,” “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Claims
1. A grain bin sensor cable forming method comprising:
- positioning a pre-formed cable having a pair of wires encased within an outer sheath comprising a plastic material within a mold cavity having an end cap cavity;
- heating the outer sheath of the pre-formed cable;
- compressing the mold cavity around the heated outer sheath causing a volume of the plastic material to be displaced into the end cap cavity to provide a post-formed cable.
2. The grain bin sensor cable forming method of claim 1, wherein compressing the mold cavity comprises creating a depression in the outer sheath to expose a portion of each of the pair of wires, and wherein the volume of plastic material displaced comprises the plastic material displaced during the formation of the depression.
3. The grain bin sensor cable forming method of claim 1, wherein compressing the mold cavity comprises reducing an overall thickness of a length of the outer sheath, and wherein the volume of plastic material displaced comprises the plastic material displaced as a result of reducing the overall thickness.
4. The grain bin sensor cable forming method of claim 1, wherein the volume of plastic material displaced is equivalent to the volume of the end cap cavity.
5. The grain bin sensor cable forming method of claim 1, further comprising coupling a sensor package to the post-formed cable adjacent the end cap; and sealing a housing around the post-formed cable and the sensor package.
6. The grain bin sensor cable forming method of claim 5, wherein coupling the sensor package comprises aligning contacts with the depressions and engaging each contact with one of the pair of wires.
7. The grain bin sensor cable forming method of claim 1, further comprising providing an additional volume of plastic material to supplement the displaced volume in filling the end cap cavity.
8. A grain bin sensor cable forming method comprising:
- positioning a pre-formed cable having a pair of power wires and a pair of signal wires encased within an outer sheath comprising a plastic material within a mold cavity having a pair of end cap cavities;
- heating the outer sheath of the pre-formed cable;
- compressing the mold cavity around the heated outer sheath causing a volume of the plastic material to be displaced into the pair of end cap cavities to provide a post-formed cable.
9. The grain bin sensor cable forming method of claim 8, wherein compressing the mold cavity comprises creating a plurality of depressions in the outer sheath to expose a portion of each of the pairs of wires, and wherein the volume of plastic material displaced comprises the plastic material displaced during the formation of the plurality of depressions.
10. The grain bin sensor cable forming method of claim 8, wherein compressing the mold cavity comprises reducing an overall thickness of a length of the outer sheath, and wherein the volume of plastic material displaced comprises the plastic material displaced as a result of reducing the overall thickness.
11. The grain bin sensor cable forming method of claim 8, wherein the volume of plastic material displaced is equivalent to the volume of the end cap cavities.
12. The grain bin sensor cable forming method of claim 8, further comprising coupling a sensor package to the post-formed cable between the end caps; and sealing a housing around the post-formed cable and the sensor package.
13. The grain bin sensor cable forming method of claim 12, wherein coupling the sensor package comprises aligning contacts with the depressions and engaging each contact with one of the pair of wires.
14. The grain bin sensor cable forming method of claim 8, further comprising providing an additional volume of plastic material to supplement the displaced volume in filling the end cap cavity.
15. A grain bin sensor cable forming apparatus comprising:
- a plurality of mold members defining a mold cavity, the mold cavity comprising an elongated cavity configured to accept a pre-formed length of cable and an end cap cavity; the plurality of mold members having a heating position and a cooling position relative to each other;
- a heater coupled to one of the mold members to heat the one of the mold members;
- a thermostat coupled to the heater to control heating of the one of the mold members;
- wherein the one of the mold members is configured to heat a plastic material of an outer sheath of the pre-formed length of cable when in the heated position, and wherein the mold members are configured to displace a volume of the plastic material of the outer sheath into the end cap cavity as the mold members move from the heating position into the cooling position.
16. The grain bin sensor cable forming apparatus of claim 15, wherein the pre-formed length of cable comprises a pair of wires encased within the outer sheath, and wherein the one of the mold members further comprises a pin member aligned with and configured to contact each of the wires when the mold cavity is in the cooling position.
17. The grain bin sensor cable forming apparatus of claim 15, wherein the pin member is spring biased.
18. The grain bin sensor cable forming apparatus of claim 15, wherein the pair of wires comprises a pair of power wires and a pair of sensor wires, and the pin member comprises a plurality of pin members.
19. The grain bin sensor cable forming apparatus of claim 15, wherein the end cap cavity comprises two end cap cavities.
20. The grain bin sensor cable forming apparatus of claim 15, wherein the mold member comprise a passage configured to provide supplemental plastic material into the mold cavity to supplement the displaced volume in filling the end cap cavity.
Type: Application
Filed: Mar 9, 2013
Publication Date: Sep 11, 2014
Patent Grant number: 9409327
Applicant: CTB, Inc. (Milford, IN)
Inventor: Brent J. BLOEMENDAAL (Zionsville, IN)
Application Number: 13/791,917
International Classification: B29C 43/52 (20060101);