DEVICES, SYSTEMS AND METHODS OF COOLING THE SKIN

Abstract

According to some embodiments, a thermal conditioning system for selectively cooling skin of a subject comprises at least one thermal conditioning device comprising a first side and second side, the second side being generally opposite of the first side. In some embodiments, the system further comprises a heat sink positioned along the second side of the at least one thermal conditioning device, wherein the first side of the at least one thermal conditioning device is configured to be placed in contact with or in close proximity to a skin surface of the subject to selectively cool or heat the skin surface.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority benefit under 35 U.S.C. §119(e) of U.S. Provisional Application No. 61777,629, filed Mar. 12, 2013, the entirety of which is hereby incorporated by reference herein.

BACKGROUND

1. Field

This application relates to climate control devices, systems and methods, and more specifically, to devices, systems and method of cooling and/or heating a skin surface of a subject (e.g., human, other mammalian, etc.) and/or for other medical thermal conditioning purposes.

2. Description of the Related Art

Cooling of human or other mammalian skin can provide one or more benefits, particularly in situations or circumstances where a subject's skin and/or body temperature is elevated relative to normal, acceptable, comfortable and/or safe levels. For example, in some instances, a person's skin and/or body temperature may be dangerously high because of fever and/or another medical condition (e.g., infection, allergy or other adverse reaction, disease, etc.). In other cases, a subject's temperature may be elevated due to exposure to heat or sun and/or other source of heat (e.g., workspace). In other circumstances, it may be desirable to heat a person's skin or other anatomical location, either in lieu of or in addition to cooling, as desired or required. For example, heating can be used to treat hypothermia, chills and/or any other condition or ailment. Therefore, a need exists to provide devices, systems and methods of cooling and/or heating skin and/or other portions of a subject's anatomy.

SUMMARY

According to some embodiments, a thermal conditioning system for selectively cooling and/or heating skin of a subject comprises at least one thermal conditioning device comprising a first side and second side, the second side being generally opposite of the first side. In some embodiments, the system further comprises a heat sink positioned along the second side of the at least one thermal conditioning device, wherein the first side of the at least one thermal conditioning device is configured to be placed in contact with or in close proximity to a skin surface of the subject to selectively cool or heat the skin surface. In some embodiments, the heat sink comprises one or more heat transfer members (e.g., fins, pins, etc.).

According to some embodiments, a method of selectively cooling and/or heating skin of a subject includes placing a thermal conditioning system adjacent a skin surface of a subject, wherein the thermal conditioning system comprises at least one thermal conditioning device (e.g., a thermoelectric device, a convective heater, a heat pump, another heating or cooling device, etc.) having a first side and second side, wherein the second side being generally opposite of the first side, wherein the thermal conditioning system further comprises a heat sink positioned along the second side of the at least one thermal conditioning device, wherein the first side of the at least one thermal conditioning device is configured to be placed in contact with or in close proximity to a skin surface of the subject to selectively cool or heat the skin surface.

According to some embodiments, the method further comprises activating the at least one thermal conditioning device so at to selectively heat or cool the subject's skin, and deactivating the at least one thermal conditioning device after a time period (e.g., 0-10 seconds, 10-20 seconds, 20-30 seconds, 30-45 seconds, 445-60 seconds, 1-2 minutes, 2-3 minutes, 3-5 minutes, 5-10 minutes, 10-15 minutes, 15-20 minutes, 20-30 minutes, 30 minutes-60 minutes, 1-1.5 hours, 1.5-2 hours, 2-3 hours, 3-4 hours, 4-5 hours, 5-10 hours, more than 10 hours, etc.). In some embodiments, the system is removably fastened to the subject using at least one fastener (e.g., strap, connector, buckles, clamp, clasp, etc.). In one embodiment, the system is positioned against or near the subject without fastening or otherwise securing the system to the subject.

According to some embodiments, the method further comprises detecting a temperature of the at least one thermal conditioning device and/or the subject's skin using at least one sensor (e.g., temperature sensor, thermocouple, etc.). In some embodiments, the system is configured to deactivate, at least in part (e.g., one or more of the thermal conditioning devices are deactivated), when a threshold temperature is detected by the at least one sensor. In some embodiments, the thermal conditioning system comprises a plurality of thermal conditioning devices, the thermal conditioning devices being arranged in at least two zones, wherein each of the at least two zones can be separately controlled and operated during use.

According to some embodiments, the at least one thermal conditioning device comprises a thermoelectric device (e.g., Peltier circuit or device). In some embodiments, the at least one thermal conditioning device comprises a convective heater, a heat pump and/or any other type of heating or cooling device. In some embodiments, the first side of the at least one thermal conditioning device is configured to contact, at least partially, a skin surface of the subject. In some embodiments, the first side of the at least one thermal conditioning device is configured to not contact the skin surface. Therefore, the system can be positioned, during use, so as to provide a desired clearance or spacing from the subject's skin.

According to some embodiments, the system further comprises at least one spacer or other feature, device or member configured to maintain a clearance between the first side of the at least one thermal conditioning device and the skin surface of the subject during use. In one embodiment, the spacer comprises a smooth surface and/or a slidable or other movable feature or portion. In some embodiments, such a clearance distance can be 1 mm to 20 mm (e.g., 1, 2, 3, 4, 5, 10, 15, 20 mm, values between the foregoing, etc.). In other embodiments, the clearance is less than about 1 mm (e.g., 0.01, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.9, 0.9 mm, values between the foregoing, etc.) or more than about 20 mm (e.g., 21, 22, 25, 30, 35, 40, 50, 60 mm, more than 60 mm, values between the foregoing, etc.).

According to some embodiments, the system further comprises at least one intermediate member or base configured to support the at least one thermal conditioning device, wherein the at least one intermediate member or base is configured to at least partially contact the skin surface of the subject during use. In some embodiments, the at least one intermediate member or base comprises a layer of fabric, plastic or the like. In some embodiments, the base can be shaped, sized and otherwise configured to fit on or around a portion of the subject's body (e.g., particular surface, limb, etc.). In some embodiments, the at least one intermediate member or base is at least partially flexible so as to generally conform to a shape of the subject's skin surface.

According to some embodiments, the system comprises a plurality of (e.g., 2, 3, 4, 5, 6, 7, 8, 9, 10, 10-15, 15-20, more than 20, etc.) thermal conditioning devices. In one embodiment, at least two of the plurality of thermal conditioning devices are electrically and/or mechanically coupled to each other by at least one interconnecting member (e.g., post, wire, other rigid, semi-rigid or flexible member or feature, etc.). In some embodiments, the system further comprises at least one joint or movable feature (e.g., hinge, bendable portion or feature, etc.) along or near the at least one interconnecting member to provide additional flexibility to the system. In some embodiments, the thermal conditioning devices are arranged in a hexagonal pattern. In some embodiments, the thermal conditioning devices are arranged in a rectangular, triangular, other polygonal, circular (e.g., along one or more concentric circles), oval (e.g., along one or more concentric ovals), irregular, etc. pattern.

According to some embodiments, the system further comprises at least one sensor (e.g., temperature sensor, a humidity sensor, a condensation sensor, a pressure, contact or occupant sensor, etc.). In some embodiments, the system additionally includes at least one thermal switch or fuse configured to automatically cease power delivery to the at least one thermal conditioning device when a temperature associated with the at least one thermal switch or fuse rises above a maximum threshold or drops below a minimum threshold. In some embodiments, the system further includes thermal insulation (e.g., layers, components, etc.) along one or more outer surfaces and/or other portions of the heat sink (e.g., fins, pins, base, etc.).

According to some embodiments, the system further includes at least one of a power supply and a control module, wherein the power supply is configured to electrically activate the at least one thermal conditioning device, and wherein the control module is configured to regulate at least one aspect of the system. In one embodiment, the power supply comprises a battery, a connection to an AC or DC power supply and/or the like.

According to some embodiments, the at least one thermal conditioning device is configured to only cool the subject's skin. In some embodiments, the at least one thermal conditioning device is configured to only heat the subject's skin. In other embodiments, the at least one thermal conditioning device is configured to selectively cool and/or heat the subject's skin.

According to some embodiments, the system further comprises at least one fastener (e.g., strap, buckle, latch, etc.) configured to removably secure the system to the subject during use. In some embodiments, at least one component of the system comprises a non-linear (e.g., curved, irregular, undulating, etc.) surface to enable the system to better conform to a shape of the subject's skin. In some embodiments, the at least one thermal conditioning device and the heat sink are collectively assembled into a single thermal conditioning assembly. In some embodiments, the plurality of thermal conditioning devices are divided or assembled into at least two zones (e.g., 2, 3, 4, 5, 6, 7, 9, 10, more than 10, etc.), each of the at least two zones being configured to be controlled independently of at least one other zone.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the present application are described with reference to drawings of certain embodiments, which are intended to illustrate, but not to limit, the concepts disclosed herein. The attached drawings are provided for the purpose of illustrating concepts of at least some of the embodiments disclosed herein and may not be to scale.

FIG. 1 illustrates a perspective view of one embodiment of a thermal conditioning system configured for use on a subject's limb;

FIG. 2 illustrates a front perspective view of one embodiment of a thermal conditioning system configured for use on a subject's limb;

FIG. 3 illustrates a side perspective view of one embodiment of a thermal conditioning system configured for use on a subject's limb;

FIG. 4 illustrates a side view of one embodiment of a heat sink of a thermal conditioning assembly;

FIG. 5 illustrates a perspective view of a heat sink comprising one or more layers of thermal insulation according to one embodiment;

FIG. 6 illustrates a perspective view of another embodiment of a thermal conditioning system configured for use on a subject's limb;

FIG. 7 illustrates one embodiment of a heat sink of a thermal conditioning assembly comprising a plurality of pins;

FIG. 8a schematically illustrates a side view of one embodiment of a thermal conditioning assembly comprising a sensor;

FIG. 8b schematically illustrates a side view of one embodiment of a thermal conditioning assembly comprising at least one spacer to provide clearance between the assembly and the adjacent skin surface;

FIG. 8c schematically illustrates a side view of one embodiment of a thermal conditioning assembly comprising an intermediate or base layer positioned between the thermal conditioning device and the subject's skin;

FIG. 9 schematically illustrates a perspective view of one embodiment of a glove-shaped thermal conditioning system configured to cool and/or heat a subject's skin;

FIG. 10 illustrates a side view of thermal conditioning assemblies positioned along a subject's arm, according to one embodiment;

FIG. 11 schematically illustrates a thermal conditioning system comprises a plurality of thermal zones;

FIG. 12 schematically illustrates a side view of thermal conditioning assemblies according to one embodiment;

FIG. 13 schematically illustrates a side view of curved (e.g., non-linear) thermal conditioning assemblies according to one embodiment;

FIG. 14 schematically illustrates a top view of a thermal conditioning system comprises a plurality of thermal conditioning assemblies generally arranged in a hexagonal layout or pattern;

FIG. 15 schematically illustrates thermal conditioning assemblies forming a generally triangular pattern and having interconnecting members connecting each other according to one embodiment;

FIG. 16 schematically illustrates one embodiment of two interconnecting members attached to a thermal conditioning assembly; and

FIG. 17 schematically illustrates one embodiment of a thermal conditioning system positioned around a limb of a subject and comprising at least one fastener to keep the system in place, relative to the subject, during use.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This application is generally directed to climate control systems for the cooling (and/or heating) of skin and/or other portions of a person's anatomy. Accordingly, the climate control system and the various devices, systems and features associated with it are described herein in the context of such skin and/or medical cooling or heating applications because they have particular utility in this context. However, the devices, systems and the methods described herein, as well as their various systems and features, can be used in other contexts as well, such as, for example, but without limitation, cooling or temperature regulation of surfaces and/or other portion of living or non-living beings or things, such as, for example, animals, plants, electronic devices or components, seating assemblies and/or the like.

Various embodiments disclosed herein utilize one or more thermoelectric devices to selectively cool and/or heat a desired skin surface or other surface. In alternative embodiments, the thermal conditioning of skin or a target surface can be accomplished using one or more other thermal conditioning devices (e.g., cooling, heating and/or ventilation devices), such as, for example, heat pumps, convective heaters, refrigerant-based systems, other thermal conditioning device, etc, either in lieu of or in addition to thermoelectric devices. A thermoelectric device or TED can comprise a Peltier device. According to some embodiments, a thermoelectric device comprises a first substrate and a second substrate disposed apart from each other. In some embodiments, the first and second substrates can be configured to provide electrical insulation (e.g., between adjacent layers or members). In addition, the thermoelectric device can comprise a plurality of semiconductor elements (e.g., pellets) comprising a first set of semiconductor elements and a second set of semiconductor elements, the first and second sets of semiconductor elements can include dissimilar electrical properties. In some embodiments, each of the semiconductor elements include a first end positioned toward the first substrate and a second end positioned toward the second substrate. In some embodiments, electrical conductors are used to electrically couple the ends of two adjacent semiconductor elements to one another. In some embodiments, the conductors are arranged and otherwise configured to electrically connect the semiconductor elements of the thermoelectric device to one another in series.

In some embodiments, when a voltage is applied to the thermoelectric device, the thermoelectric device is activated, causing a first side of the thermoelectric device (e.g., along or near the first substrate) to heat and the second side of the thermoelectric device (e.g., along or near the second, opposite substrate) to cool. Such a heating or cooling effect can be reversed (e.g., wherein the first side is cooled and the second side is heated) by reversing the electrical current through the thermoelectric device. In addition, the amount of heating and/or cooling desired can be regulated by modifying the duty cycle of the thermoelectric device. Accordingly, thermoelectric devices can be used to selectively heat or cool an adjacent surface.

Additional details regarding thermoelectric devices, convective heaters and/or other thermal conditioning devices or systems are provided in U.S. patent application Ser. No. 11/546,928, filed on Oct. 12, 2006 and published as U.S. Publ. No. 2008/0087316 on Apr. 17, 2008; U.S. patent application Ser. No. 11/833,892, filed on Aug. 3, 2007 and issued as U.S. Pat. No. 8,222,511 on Jul. 17, 2012; U.S. patent application Ser. No. 11/972,544, filed on Jan. 10, 2008 and published as U.S. Publ. No. 2008/0173022 on Jul. 24, 2008; U.S. patent application Ser. No. 12/049,120, filed on Mar. 14, 2008 and issued as U.S. Pat. No. 8,143,554 on Mar. 27, 2012; and U.S. patent application Ser. No. 12/695,602, filed on Jan. 28, 2010 and published as U.S. Publ. No. 2010/0193498 on Aug. 5, 2010, all of which are hereby incorporated by reference herein and made a part of the present application.

Thermal conditioning using thermoelectric devices can be accomplished via conductive heating or cooling, wherein the heat is transferred directly to or from the surface to be conditioned. For example, in conductive conditioning, a thermoelectric device and/or other thermal conditioning device can be placed in contact with and/or in close proximity to the object that will be thermally conditioned (e.g., skin, other anatomical location, a surface or other portion of an electronic device or other inanimate object, etc.). Once the thermal conditioning device is activated, the portion of the thermal conditioning device adjacent the target surface (e.g., a first or second side of a thermoelectric device) can be cooled or heated. As a result of the heating or cooling of the thermoelectric device and/or any other thermal conditioning device can cause the transfer of heat either away or to the surface to be thermally conditioned (e.g., a subject's skin or other anatomical area, a surface or portion of a device, etc.).

In other embodiments, the heat transfer between a thermal conditioning device (e.g., a thermoelectric device) and a subject's skin or other surface targeted for cooling or heating can be accomplished convectively. For example, air or other fluid can be delivered past or near a heated or cooled portion of a thermal conditioning device to selectively heat or cool such air or other fluid. The heated or cooled fluid can then be transferred to a subject's skin or other target surface. For any of the embodiments disclosed herein, such convective thermal conditioning of skin can be performed either in addition to or in lieu of conductive techniques.

With respect to either conductive or convective cooling or heating of skin (or any other target surface), such thermal conditioning can be performed either directly to the skin or indirectly. For example, in conductive arrangements, a cooled or heated surface of a thermoelectric device or other thermal conditioning device can be placed either in direct contact (e.g., partially or fully) with the subject's skin or in very close proximity to it (e.g., without the use of any intermediate layers, membranes or other devices or components). Similarly, for devices and systems that utilize convective cooling or heating, cooled or heated air or other fluid can be delivered directly to the skin.

In some embodiments, however, one or more thermoelectric devices and/or other thermal conditioning devices are positioned along an intermediate layer or device. For example, a thermal conditioning device can be positioned along an exterior surface of a glove, sleeve, brace, adhesive strip or layer, article of clothing (e.g., shirt, pants, shorts, helmet, hat, etc.). In other configurations, one or more thermal conditioning devices are embedded within an intermediate layer and one or more other exterior layers, as desired or required.

In embodiments that incorporate one or more intermediate layers, such intermediate layers can comprise one or more materials, such as, for example, natural and/or synthetic fabric, neoprene or other rubber-based materials, other thermoplastics and/or the like. In some embodiments, intermediate layers are sized, shaped and/or otherwise configured to facilitate heat transfer between the thermal conditioning device(s) and the subject's skin (or other target surface). For example, the one or more intermediate layers can comprise a structure and/or thickness that generally promote the transfer of heat thereacross (e.g., either toward or away from the thermal conditioning device).

One embodiment of a thermal conditioning system 2 for selectively cooling or heating the skin and/or other portions of a subject S is schematically illustrated in FIG. 1. In the depicted embodiment, the skin surface being treated (e.g., cooled) is located along a limb (e.g., arm, leg, etc.) of the subject S, which in the illustrated embodiment is illustrated as a cylinder for convenience. However, the thermal conditioning system or components thereof can be used to cool and/or heat any other portion of the subject's skin or anatomy.

With continued reference to FIG. 1, a plurality of the thermal conditioning assemblies 10 can be strategically positioned along the skin of the subject. In the depicted embodiment, a total of nine assemblies 10 have been positioned along various portions of the subject's limb in order to cool adjacent portions of the subject skin. However, in other embodiments, fewer (e.g., 1, 2, 3, 4, 5, 6, 7, 8) or more (e.g., 10, 11, 12, 13, 14, 15, more than 15, etc.) assemblies 10 can be used, as desired or required for a particular application, protocol or use. For example, the exact number of thermal conditioning assemblies that are required or desired can depend on one or more factors, such as, for example, the size of the individual assemblies, the cooling or heating capacity of the assemblies, the size, type and other details of the subject's target skin or other anatomical location, the amount of cooling or heating that is required and/or the like.

In the embodiment illustrated in FIG. 1, the assemblies 10 are located in an aligned or substantially aligned orientation along a longitudinal axis of the subject's limb. As shown, the assemblies 10 are located along three distinct rows, with each row having a total of three assemblies 10. In other embodiments, the orientation, quantity, type, spacing, the inclusion of additional components or features (e.g., sensors, intermediate layers, etc.) and/or other details related to the thermal assemblies 10 of a skin conditioning system 2 can be different than illustrated in FIG. 1 and/or otherwise disclosed herein. For example, to further clarify the point that great variations in design can exist between various embodiments, in some configurations, a skin conditioning system can comprise only a single thermal conditioning assembly. The terms thermal conditioning assembly, thermal assembly and cooling assembly are used interchangeably herein.

As illustrated in FIG. 1, as well as the related views in FIGS. 2 and 3, a thermal conditioning assembly 10 can comprise a heat sink 20 (e.g., a plurality of fins or other heat transfer members) that extend from a base 30. The fins or other heat transfer members 20 can form a single, unitary structure with the base 30. Alternatively, the heat sink (e.g., heat transfer members) 20 are separate from the base (and/or each other), as desired or required. Accordingly, one or more portions of the thermal assembly 10 can be attached (and/or otherwise positioned adjacent) to one another using one or more connection devices, methods and/or features, such as, for example, adhesives, mechanical or other types of fasteners (e.g., screws, rivets, clips, etc.), pressure or friction fit connections and/or the like. As used herein, the term “heat sink” should be given its ordinary meaning and may include, without limitation, one or more fins, pins and/or other heat transfer members or portions. For example, in some embodiments, the heat sink 20 includes a base 30. In other embodiments, the heat sink is separate and distinct from the base (e.g., structurally, thermally, etc.).

One or more thermoelectric devices or other thermal conditioning devices 100 (e.g., other cooling or heating devices, convective heaters, etc.) can be positioned along, within or near the heat transfer members 20 and/or the base 30 of the assembly 10. For example, in the depicted embodiment, one or more thermoelectric devices 100 are located along the base 30 (e.g., above and/or below the base) of the thermal assembly 10. Accordingly, in some embodiments, when activated, the lower surface of the thermal conditioning device 100 conductively cools (or heats, as desired or required) by transferring heat away (or to) the skin of the subject S. In arrangements where the thermal conditioning device 100 comprises a thermoelectric device (or a similar device), a waste side that is generally opposite of the main side being cooled, will be heated (or vice versa).

Thus, in such embodiments, when the thermal conditioning device 100 is activated and the subject's skin is being selectively cooled by the thermal conditioning system 2, heat is being produced along the opposite (e.g., top) side of the conditioning device 100. Accordingly, the heat exchange members (e.g., fins) 20 of the assembly 10 can help transfer that waste heat away from the system 2 and the subject S. As shown, the heat exchange members 20 can include a plurality of spaced apart fins or portions (e.g., plates, pins, sheets, etc.). In some embodiments, such heat exchange members 20 comprise one or more high heat transfer materials (e.g., copper, aluminum, etc.), a relatively large surface area, relatively thin profile and/or one or more other features for promoting more efficient heat transfer between the surrounding environment (e.g., ambient air) and the heat being produced by the thermoelectric device or other thermal conditioning device 100. In some embodiments, in order to further enhance the transfer of waste heat away from the thermal assembly 10 and the subject's skin, one or more fluid transfer devices (e.g., blowers, fans, etc.) can be used to deliver air through and/or near the heat transfer members 20, as desired or required.

As illustrated in FIGS. 2 and 3, during use, heat H can pass through the heat transfer members 20 (e.g., fins) and be carried away from the electrically activated thermal assemblies 10. Meanwhile, the side of the thermal conditioning device (e.g., thermoelectric device) 100 adjacent the subject can conductively cool the subject's skin. With reference to the embodiment of the system 2 illustrated in FIGS. 1-3, each thermal conditioning assembly 10 can include one or more (e.g., 2, 3, 4, 5, 6, 7, 8, 9, 10, more than 10, etc.) thermal conditioning devices 100, as desired or required. As noted above, the thermal conditioning device 100 can be located along any location of a thermal assembly, such as, for example, without limitation, at, along or near the bottom of the assembly (e.g., along an upper and/or lower surface of a base 30, at least partially within a base or other portion of the assembly, etc.), along a side of an assembly (e.g., at or near one of the fins or other heat transfer members, etc.) and/or at or near any other location of the assembly. Accordingly, depending on the exact locations of the thermal conditioning device or devices 100, one or more thermal conditioning devices 100 (e.g., thermoelectric devices) of the assembly can be in direct or substantially direct contact with the subject's skin. Such contact can be continuous or partial (e.g., intermittent).

Further, in some embodiments, the system 2 can be used to transfer heat from or to the subject's skin (e.g., to selectively cool or heat the subject's skin) without direct contact between the cooled or heated surface(s) of a thermal conditioning device 100. For example, the thermoelectric device or other thermal conditioning device 100 can be a particular distance away from the adjacent skin surface. In some embodiments, such a clearance distance can be 1 mm to 20 mm (e.g., 1, 2, 3, 4, 5, 10, 15, 20 mm, values between the foregoing, etc.). In other embodiments, the clearance is less than about 1 mm (e.g., 0.01, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.9, 0.9 mm, values between the foregoing, etc.) or more than about 20 mm (e.g., 21, 22, 25, 30, 35, 40, 50, 60 mm, more than 60 mm, values between the foregoing, etc.).

In some embodiments, as discussed herein, the subject's skin can be selectively cooled and/or heated using a convective cooling and/or heating device, either in lieu of or in addition to conductive heating techniques. For example, in some embodiments, cooled and/or heated air can be delivered to a targeted skin area to thermally condition it. Convective thermal conditioning can use one or more fluid transfer devices (e.g., blowers, fans, etc.), ducts or other fluid conduits and/or any other component to help transfer fluids through the necessary fluid path.

The view of FIG. 3, schematically illustrates a side view of a plurality of thermal conditioning assemblies 10 aligned in several rows. As shown, the assemblies 10 can be placed next to each other, in the longitudinal and/or radial direction, as desired or required to cool or heat an area of the subject's skin. In embodiments comprising thermoelectric devices or related technology to cool the skin, heat H produced along the opposite side of the thermoelectric device can rise through the heat transfer members 20 and be transferred (e.g., with or without the use of a fan or other fluid transfer device.

FIGS. 4 and 5 illustrate different views of one embodiment of a thermal conditioning assembly 10 for use in skin cooling or heating systems and applications. As shown, one or more outer surfaces of the assembly 10 can comprise a thermally insulation layer, component or material 40. The use of insulation can help protect a user who comes in contact with the various assemblies against dangerously hot portions of the heat transfer members 20 or other portion of the assembly 10. In some embodiments, the thermal insulation layer or component 40, which can be secured to the assembly using adhesives, mechanical fasters and/or the like, is positioned along the sides of the assembly (e.g., adjacent the heat transfer members 20), along the top of the heat transfer members and/or along any other surface of the assembly 10.

In other embodiments, as schematically illustrated in FIG. 6, the plurality of thermal conditioning assemblies 10 can be arranged so the heat transfer members 20 of longitudinally assemblies 10 align with one another. This is different than the alignment of longitudinally adjacent members 10 of the embodiment illustrated in FIGS. 1-3. The specific arrangement of heat transfer members can be selected to create a desired orientation of heat transfer members (e.g., in relation to one another and/or to the subject).

As illustrated in FIG. 7, in some embodiments, the heat transfer members 20′ of a thermal conditioning assembly comprise a plurality of pins that extend from a base 30′. As with any other assembly embodiments disclosed herein, the pins, fins and/or other heat transfer members 20, 20′ can form a unitary structure with the base 30, 30′. Alternatively, however the heat transfer members 20, 20′ can be separate from the base 30, 30′. In such arrangements, the heat transfer members 20, 20′ can be attached to the base 30, 30′ using one or more connection devices, features or methods (e.g., welds, adhesives, screws, rivet, other fasteners, press fit or friction fit connections, etc.). The pins 20′ can comprise a generally cylindrical shape (e.g., as illustrated in FIG. 7). Alternatively, however, the pins can comprise any other cross-sectional shape (e.g., square, rectangular, triangular, oval, irregular, etc.). Further, the overall shape, spacing, quantity, orientation and/or other details regarding the fins 20, pins 20′ and/or other heat transfer members can be different than illustrated herein, as desired or required. As with other embodiments disclosed herein, one or more thermoelectric devices and/or other thermal conditioning devices (not shown) can be positioned on, within and/or near the base 30′ so that, when activated, the thermal conditioning assembly 10′ can selectively cool (or heat) a subject skin or other target anatomical location.

FIG. 8a illustrates one embodiment of a thermal conditioning assembly 10 configured for direct placement along a portion of a subject's skin. As shown, the assembly 10 comprises one or more heat transfer members 20 (e.g., fins, pins, etc.) that extend from a base 30. One or more thermoelectric devices and/or other thermal conditioning devices 100 can be positioned along (e.g., top, bottom, etc.), within, adjacent or near the base (and/or any other portion of the assembly 10). When activated, the thermal conditioning device 100 can selectively cool or heat the adjacent skin surface. For example, during a cooling procedure using the assembly, a thermoelectric device 100 can be placed on or near the target skin surface of the subject. Thus, the thermal conditioning device 100 can contact (e.g., partially or completely) or not contact the subject (e.g., the subject's skin).

According to some embodiments, as illustrated in FIG. 8b, the assembly 10 can comprises one or more spacers 120 that are configured to contact the subject's skin during use of the cooling system. In the illustrated embodiments, the spacers 120 are secured to the bottom of the base 30 of the assembly 10. However, in other embodiments, the spacers can be secured to the thermal conditioning device 100 and/or any other portion of the assembly or cooling system, either in lieu of or in addition to the base 30, as desired or required. The spacers 120 can include posts or other protruding members having generally smooth bottom surfaces that engage the subject's skin. In some embodiments, the spacers 120 can include a long continuous lip and/or other generally continuous members that extend along a longer portion (e.g., partially or completely) of the assembly 10. In some embodiments, the spacers 120 comprise one or more rollers and/or other low friction devices or components to assist in moving or repositioning the assembly along the subject's skin. As shown, the spacers 120 can help maintain a particular clearance 124 between the subject's skin (or other surface being thermally conditioned) and the thermal conditioning device 100. For example, as noted above, in some embodiments, the clearance 124 is 1 mm to 20 mm (e.g., 1, 2, 3, 4, 5, 10, 15, 20 mm, values between the foregoing, etc.). In other embodiments, the clearance is less than about 1 mm (e.g., 0.01, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.9, 0.9 mm, values between the foregoing, etc.) or more than about 20 mm (e.g., 21, 22, 25, 30, 35, 40, 50, 60 mm, more than 60 mm, values between the foregoing, etc.).

With any of the embodiments disclosed herein, the various cooling or other conditioning system can include one or more sensors. For example, as illustrated in FIG. 8a, a thermocouple or other temperature sensor 200 can be positioned adjacent the thermoelectric device 100 of the thermal conditioning assembly 10 and/or the subject's skin. Such sensors can help ensure that the level of cooling (and/or heating, if heating of the subject is desired) is maintained within particular limits. This can help prevent or reduce the likelihood of potentially harmful and/or otherwise damaging temperature extremes during use of the system. Such sensors 200 can be positioned along one or more thermal conditioning assemblies 10 and/or any other component, device and/or portion of the cooling system. Sensors can include temperature sensors, humidity sensors, condensation sensors and/or any other type of sensor, as desired or required.

For any of the skin conditioning systems disclosed herein, one or more intermediate layers or components can be positioned adjacent the thermal conditioning assemblies 10 and/or other components of a system. For example, as illustrated in FIG. 8c, one or more intermediate layers I, such as, for example, at least a portion of a glove, sleeve, brace, adhesive strip or layer, article of clothing (e.g., shirt, pants, shorts, helmet, hat, etc.) can be positioned between a thermal conditioning device 100 (or, e.g., a thermal conditioning assembly 10 to which the device 100 is secured) and the subject's skin being thermally conditioned. Such intermediate layers or components I can help prevent direct contact between the subject's skin and the various assemblies and device of a cooling system. In some embodiments, intermediate layers or components can be reusable (e.g., via sterilization, other cleaning, etc.) or disposable (e.g., replaceable with a new layer I), as desired or required.

One embodiment of a skin conditioning system 2 in the shape of a glove is illustrated in FIG. 9. As shown, the system can include one or more intermediate layers or components I that are shaped, sized and otherwise configured to be worn (e.g., like a glove). Alternatively, the system 2 can include a glove-shaped intermediate layer I that is configured to simply be placed over a subject's hand. The system 2 can include any other shape to match the corresponding portion of the subject's anatomy being cooled or otherwise thermally conditioned. For example, a system 2 can include one or more intermediate layers I (e.g., positioned between one or more thermal conditioning assemblies 10 and the subject) that are in the shape of (or configured to be worn on), at least in part, a foot, a leg, an arm, a hand, a torso, a neck, a head, etc.). As shown in FIG. 9, the system 2 can include one or more (e.g., 2, 3, 4, 5, more than 5, etc.) thermal conditioning assemblies 10 placed along at least a portion of the intermediate layer I.

As discussed herein, a thermal conditioning assembly 10 can be positioned directly on the subject's skin S. For example, in the embodiment illustrated in FIG. 10, two separate assemblies 10 have been positioned along a subject's arm A. In other arrangements, the quantity, spacing, size and/or other details the thermal conditioning assemblies 10 included in a particular system 2 can vary, as desired or required. In any of the embodiments disclosed herein, the various assemblies 10 and/or other electrical components of a system can comprise one or more of the following: a power supply (e.g., battery, connections to a central or main power source, a controller, a sensor and/or the like). Where a temperature sensor is included in a particular system, such a sensor can be configured to automatically disable a thermal conditioning device 100 (e.g., a thermoelectric device) when the sensor reaches a particular temperature. Such sensors can be incorporated into any of the embodiments disclosed herein.

FIG. 11 illustrates one embodiment of a cooling or other thermal conditioning system 2 comprising a plurality of zones Z₁, Z₂, Z₃, Z₄. In the illustrated embodiment, the system 2 comprises a total of four zones. However, in other arrangements, more or fewer zones can be included, as desired or required. For example, each zone can be associated with particular sub-portions of the subject's anatomical region being cooled (e.g., if the system is used for cooling the subject's arm, the various zones can be aligned with, e.g., the upper arm or shoulder, elbow, forearm, hand, etc.). In addition, each zone Z₁, Z₂, Z₃, Z₄ can include one or more thermal conditioning assemblies 10, in accordance with the various embodiments disclosed herein. Regardless of the exact layout and configuration of the zones, and the various assemblies and/or other components 10 included therein, the use of separate zones can enable for customized cooling (or other thermal conditioning, e.g., heating) along the portion of the subject's body along which the system 2 is placed.

In some embodiments, due to the non-linear (e.g., curved, convex, irregular, etc.) shape of various regions of the anatomy of a subject, systems can be customized to a particular shape. For example, as illustrated in FIG. 12, heat sinks of adjacent assemblies 10 can be angled along theirs ends E to accommodate the curvature of the body portion being cooled (e.g., arm, leg, other limb, etc.). Likewise, as shown in FIG. 13, one or more assemblies 10 (e.g., heat sinks) and/or other portions of the conditioning system can include a curvature to accommodate the shape of the subject's skin being cooled or heated.

In some embodiments, one or more membranes, layers and/or other devices are placed over and/or around the targeted skin portion of a subject before commencing a cooling or heating procedure, either in addition to or in lieu of including an intermediate layer or other layer in the thermal conditioning system itself. For example, in some arrangements, one or more thin layers of plastic (e.g., vinylidene chloride or saran wrap, polyethylene, other polymeric materials, etc.), can be positioned along or around an arm, leg, foot, neck and/or any other anatomical portion before applying the thermal conditioning system to the subject's skin.

In any of the embodiments disclosed herein, the various heat transfer assemblies 10 (e.g., heat sinks and thermal conditioning devices) of a system 2 can be arranged in a hexagonal arrangement, as illustrated schematically in FIG. 14. Such an arrangement can provide more uniform thermal coverage. However, in other embodiments, a different layout or arrangement can be used, such as, for example, rectangular (e.g., grid), circular or oval (e.g., plurality of concentric circles or ovals), etc., as desired or required.

As noted herein, the system can also be configured to at least partially flex or bend to generally conform to the subject's anatomy. Thus, a hexagonal arrangement, defining triangularly-shaped panels T (FIG. 14) between adjacent assemblies 10, can provide for a more enhanced flexibility of the system 2. As illustrated in FIG. 15, in any of the embodiments disclosed herein, adjacent assemblies 10 of a system 2 can include one or more interconnecting members 300 that connect two or more of the assemblies 10 to each other. Such interconnecting members 300 can mechanically and/or electrically couple adjacent assemblies 10 to each other, and may include, without limitation, one or more rigid, semi-rigid and/or flexible materials or components (e.g., metals, alloys, plastic, etc.). In some embodiments, for example, the interconnecting members comprise tubes (e.g., solid or hollow) that include a circular, oval, rectangular, triangular, other polygonal and/or any other cross sectional shape. One or more wires or other electrical conductors can be routed through hollow embodiments of interconnecting members 300. This can provide a convenient manner in which to electrically couple the various assemblies 10 to each other and/or to a power supply or control module. With continued reference to FIG. 15, the ends 320 of the interconnecting members 300 can comprise rigid or movable connections to the corresponding assemblies 10. For example, as illustrated in FIG. 16, in some embodiments, the end 320 can include a flexible joint or other rotatable feature J to improve the overall flexibility of the system 2.

In any of the embodiments disclosed herein, the thermal conditioning system 2 can include assemblies that only comprise a thermal conditioning device 100 (e.g., thermoelectric device, other cooling or heating element, etc.) without the need for additional portions or features (e.g., heat sink).

As discussed herein, the system can include one or more intermediate or other base layers onto which the various thermal conditioning devices 100 or assemblies 10 are positioned. Such a layer can comprise a flexible structure or features so that the system can generally conform to the subject's anatomy. For example, in some arrangements, the thermal conditioning components (e.g., devices, assemblies, etc.) are secured to a vinyl sheet or other fabric or layer.

As illustrated in FIG. 17, a cooling or other thermal conditioning system 2 configured for placement around a subject's limb S, can include a plurality of heat transfer assemblies 10 (e.g., thermoelectric devices or other thermal conditioning devices, heat sinks and/or the like). As shown, adjacent assemblies 10 can be mechanically and/or electrically coupled to each other using one or more interconnecting members 300. In addition, a securement device 400 can be used to hold the system 2 in place during use. For example, the securement device or feature 400 can comprise a strap having a latch or other fastener 420 (e.g., Velcro, tab, other mechanical coupling, etc.). In some embodiments, the securement device or feature is at least partially flexible or extendable to facilitate securement of the system 2 to the subject S.

In any of the embodiments disclosed herein, the heat sink (e.g., fins, pins, other heat transfer members, base, etc.) can be extruded as one, two or more portions. In heat sink arrangements having two or more portions, such separate portions (e.g., fins, pins, base, etc.) can be attached to each other using welds, adhesives, other bonding agents, mechanical connections or fasteners, etc. In some embodiments, for example, the heat sinks comprise an extruded aluminum shape.

In any of the embodiments disclosed herein, the spacing of the thermal assemblies 10 (e.g., thermoelectric devices) can be reduced by taking advantage of the body's thermo-regulatory response (e.g., as the body can naturally spread the effect of cooling or heating to an area larger that the physical footprint of the individual assemblies).

In any of the embodiments disclosed herein, the various assemblies 10 (e.g., thermoelectric devices) of a system can be arranged on a pad or other base member, with spacing of the assemblies 10 controlled, at least in part, by the structure of the pad or other base member. The spacing of the assemblies can be maintained as a result of the stiffness of the pad structure.

For any of the embodiments disclosed herein, the various thermoelectric devices and/or other thermal conditioning devices 100 of the system 2 can be configured in a series and/or parallel arrangement, as desired or required. Accordingly, the cooling system 2 can be configured to continue to function even if one or more individual thermoelectric devices or other thermal conditioning devices 100 were to fail. In some embodiments, a series and/or parallel arrangement of thermoelectric devices and/or other thermal conditioning devices 100 can be configured so that power is relatively uniform to the thermoelectric devices 100 that are in use.

In some embodiments, a system can be configured to enable a user to select which (and/or to what extent) the various thermal transfer assemblies (e.g., thermoelectric devices or other thermal conditioning devices) are activated at any particular time. For example, in some embodiments, the specific thermoelectric devices can be selected using a control module and/or locally at each device (e.g., via a switch or other controller).

For embodiments where temperature regulation or monitoring is desired (e.g., to prevent low or high operating or treatment temperatures), one or more thermal fuses can be incorporated into the system, either in addition to or in lieu of other temperature detection and/or control devices (e.g., thermistors, temperature sensors, etc.). Accordingly, each thermoelectric device and/or other thermal conditioning device 100 can have its power automatically (e.g., fully or partially), based on, for example, a skin temperate, a temperature of the thermal conditioning device or assembly, a temperature of the base layer of the system and/or the like.

In any of the embodiments disclosed herein, a skin conditioning system can be configured for alternating heating and cooling of the adjacent skin of a subject. Such alternating heating and cooling of the subject's skin can offer one or more therapeutic or other benefits or advantages (e.g., promoting a desired therapeutic response, maintaining the body temperature within a particular range, etc.). In some embodiments, a heat sink (e.g., fins, pins, etc.) in thermal communication with a thermoelectric device or other thermal conditioning device 100 can be sized, shaped and/or otherwise configured to take advantage of the thermal mass of the heat sink and the transient condition of operation. For example, when the thermoelectric device is being operated in cooling mode, the heat sink temperature can increase with time. When, however, the thermoelectric device is switched to heating mode, the thermoelectric device can cool the heat sink. Accordingly, the temperature of the thermoelectric device can swing p and down when the device is switched between heating and cooling modes. Thus, in some embodiments, the size, thermal mass and/or other features of the heat sink can be advantageously selected based on the expected switching between heating and cooling mode of the system.

The features and attributes of the specific embodiments disclosed herein may be combined in different ways to form additional embodiments, all of which fall within the scope of the present disclosure. Although the concepts presented herein have been disclosed in the context of certain embodiments and examples, the present application extends beyond the specifically disclosed embodiments to other alternative embodiments and/or uses of the concepts disclosed herein and obvious modifications and equivalents thereof. The disclosure herein of any particular feature, aspect, method, property, characteristic, quality, attribute, element, or the like in connection with an embodiment can be used in all other embodiments set forth herein. The ranges disclosed herein also encompass any and all overlap, sub-ranges, and combinations thereof. Language such as “up to,” “at least,” “greater than,” “less than,” “between,” and the like includes the number recited. Numbers preceded by a term such as “about” or “approximately” include the recited numbers. For example, “about 10 mm” includes “10 mm.” For all of the embodiments described herein the steps of the methods need not be performed sequentially. Thus, it is intended that the scope of the concepts disclosed herein should not be limited by the particular disclosed embodiments described above.

Claims

1-35. (canceled)

36. A thermal conditioning system for selectively cooling or heating a skin surface of a subject, the system comprising:

at least one thermal conditioning device comprising a first side and second side, the second side being generally opposite of the first side;

a heat sink positioned along the second side of the at least one thermal conditioning device;

wherein the first side of the at least one thermal conditioning device is configured to be placed in contact with or in close proximity to a skin surface of the subject to selectively cool or heat the skin surface.

37. The system of claim 36,

wherein the heat sink comprises one or more heat transfer members, the heat transfer members comprising fins or pins;

wherein the at least one thermal conditioning device comprises a thermoelectric device;

wherein the first side of the at least one thermal conditioning device is configured to not contact the skin surface; and

further comprising at least one spacer configured to maintain a clearance between the first side of the at least one thermal conditioning device and the skin surface of the subject during use.

38. The system of claim 36, wherein the heat sink comprises one or more heat transfer members.

39. The system of claim 36, wherein the heat transfer members comprise fins or pins.

40. The system of claim 36, wherein the at least one thermal conditioning device comprises a thermoelectric device.

41. The system of claim 36, wherein the first side of the at least one thermal conditioning device is configured to contact the skin surface.

42. The system of claim 36, wherein the first side of the at least one thermal conditioning device is configured to not contact the skin surface.

43. The system of claim 42, further comprising at least one spacer configured to maintain a clearance between the first side of the at least one thermal conditioning device and the skin surface of the subject during use.

44. The system of claim 43, wherein the spacer comprises a smooth surface and/or a slidable or other movable feature or portion.

45. The system of claim 36, further comprising at least one intermediate member or base, the at least one intermediate member or base being configured to support the at least one thermal conditioning device, wherein the at least one intermediate member or base is configured to at least partially contact the skin surface of the subject during use.

46. The system of claim 45, wherein the at least one intermediate member or base comprises a layer of fabric or plastic.

47. The system of claim 45, wherein the at least one intermediate member or base is at least partially flexible so as to generally conform to a shape of the subject's skin surface.

48. The system of claim 36, wherein the system comprises a plurality of thermal conditioning devices.

49. The system of claim 48, wherein at least two of the plurality of thermal conditioning devices are electrically and/or mechanically coupled to each other by at least one interconnecting member.

50. The system of claim 49, further comprising at least one joint or movable feature along or near the at least one interconnecting member to provide additional flexibility to the system.

51. The system of claim 48, wherein the thermal conditioning devices are arranged in a hexagonal pattern.

52. The system of claim 36, further comprising at least one sensor.

53. The system of claim 52, wherein the sensor comprises at least one of a temperature sensor, a humidity sensor, a condensation sensor and a pressure sensor.

54. The system of claim 36, further comprising at least one thermal switch or fuse configured to automatically cease power delivery to the at least one thermal conditioning device when a temperature associated with the at least one thermal switch or fuse rises above a maximum threshold or drops below a minimum threshold.

55. The system of claim 36, further comprising thermal insulation along at least a portion the surfaces of the heat sink.