SINGLE FPC BOARD FOR CONNECTING MULTIPLE MODULES AND TOUCH SENSITIVE DISPLAY MODULE USING THE SAME
A single flexible printed circuit (FPC) board for connecting multiple modules including a thin film is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. The first module connecting portion is located on a first side of the thin film. The second module connecting portion and the third module connecting portion are located on a second side of the thin film. The first side is opposite to the second side. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion.
Latest NOVATEK MICROELECTRONICS CORP. Patents:
- Ramp generation in buck converters
- Light-emitting diode driver and light-emitting diode driving device
- Fingerprint image generation method and device for saving memory
- Touch device with FPR function and operation method thereof
- Optical fingerprint recognition device and fingerprint sensing device thereof
This application is a continuation of U.S. patent application Ser. No. 13/438,636, filed Apr. 3, 2012. This application claims the benefits of U.S. provisional application Ser. No. 61/497,505, filed Jun. 15, 2011 and Taiwan application Serial No. 100129439, filed Aug. 17, 2011, the subject matters of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION1. Field of the Invention
The invention relates in general to a flexible printed circuit (FPC) board, and more particularly to a single FPC board for connecting multiple modules and a touch sensitive display module using the same.
2. Description of the Related Art
Touch panels have now been widely used in various electronic products. Particularly, most display panels are equipped with a touch panel for allowing users to click or press the screen with a finger or a stylus. For example, the resistive touch panel detects the coordinates of the touch point by sensing voltage drop, and the capacitive touch panel calculates the coordinates of the touch point by forming a uniform electrical field on the panel and sensing the current of the touch point. Then, the coordinates of the touch point are processed through a FPC board and a control circuit so as to generate an image on the display panel and to provide a more convenient and user-friendly operating interface for the user.
Referring to
In the above assembly structure, two FPC boards 140 and 142 are used and are connected through a connector 144, and more assembly hours and a larger space are required for assembling the two FPC boards. Since two FPC boards are used, more cost will be incurred and more wastes will be generated in the manufacturing process.
SUMMARY OF THE INVENTIONThe disclosure is directed to a single FPC board for connecting multiple modules and a touch sensitive display module using the same. The disclosure allows reduction of the assembly hours of multiple modules and the assembly space of the FPC board. In addition, the discourse can be conformed to the thinning requirement. Moreover, the FPC board can be formed by a single thin film, hence incurring lower cost and generating fewer wastes in the manufacturing process.
According to an aspect of the present invention, a single FPC board for connecting multiple modules including a thin film, at least one first line and at least one second line is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion.
According to another aspect of the present invention, a touch sensitive display module including a first module, a second module, a third module and a single FPC board is provided. The second module is disposed on the first module. The third module is adjacent to the first module located between the second module and the third module. The single FPC board connects the first module, the second module and the third module.
The above and other aspects of the invention will become better understood with regard to the following detailed description of the preferred but non-limiting embodiment(s). The following description is made with reference to the accompanying drawings.
The single FPC board for connecting multiple modules of a present embodiment adopts a single thin film design for connecting three or more modules, such as a display panel, a touch panel and a motherboard for transmitting relevant electrical signals. In one embodiment, a folding connection design of the single FPC board enables the lines on the thin film to be electrically connected between the display panel and the touch panel. In another embodiment, a design of branch connection of the single FPC board enables the lines on the thin film to be electrically connected between the display panel and the touch panel. Thus, the lines on the thin film can be electrically connected between the display panel and the touch panel through one FPC board without using an extra connector, so that the time for assembling the multiple modules and the space for assembling the FPC board can be reduced and the thinning requirement can be satisfied.
The invention is elaborated below with the exemplification of a touch sensitive display module. However, the embodiments below are for exemplification purpose only, not for limiting the scope of protection of the invention.
First EmbodimentReferring to
Referring to
Referring to
Referring to
In the above assembly process, the second module 220 does not have to be stacked on the first module 210. The second module 220 can also be stacked under the first module 210 or be separated from the first module 210 for a distance in a vertical direction. Instead of the stacking design, the first module 210 and the second module 220 can be disposed in parallel or separated for a distance in a horizontal direction. In addition, the first bonding pad B1 of the first module connecting portion 242 is not necessarily connected above the first module 210, and can also be connected under the first module 210. The second bonding pad B2 of the second module connecting portion 244 is not necessarily connected under the second module 220, and can also be connected above the second module 220. The third bonding pad B3 of the third module connecting portion 246 is not necessarily connected above the third module 230, and can also be connected under the third module 230. The single FPC board 240 is not limited to a rectangle as indicated in
Referring to
Referring to
Referring to
The main differences between
Referring to
In the above assembly process, the second module 320 does not have to be stacked on the first module 310. The second module 320 can also be stacked under the first module 310 or separated from the first module 310 for a distance in a vertical direction. Instead of the stacking design, the first module 310 and the second module 320 can be disposed in parallel or separated for a distance in a horizontal direction. In addition, the first bonding pad B1 of the first module connecting portion 342 is not necessarily connected above the first module 310, and can also be connected under the first module 310. The second bonding pad B2 of the second module connecting portion 344 is not necessarily connected under the second module 320, and can also be connected above the second module 320. The third bonding pad B3 of the third module connecting portion 346 is not necessarily connected above the third module 330, and can also be connected under the third module 330. The single FPC board 340 is not limited to a rectangle as indicated in
Based on the source of the signal, the first module connecting portion 442 is divided into a first signal connecting portion 442a and a second signal connecting portion 442b according to the source of the signal. The first slot S1 separates the first signal connecting portion 442a and the second module connecting portion 444. The second slot S2 separates the second signal connecting portion 442b and the second module connecting portion 444. The first signal connecting portion 442a is electrically connected to the first line 443 for transmitting a first type signal such as a touch-sensitive signal. The second signal connecting portion 442b is electrically connected to the second line 445 for transmitting a second type signal such as a display panel driving signal.
The main differences between
The single FPC board for connecting multiple modules disclosed in above embodiments of the invention adopts the design of single thin film for connecting at least two modules for transmitting relevant electrical signals. Since only one FPC board is used and the lines on the thin film can be electrically connected between the display panel and the touch panel through one FPC board without using extra connector, the assembly procedure can be made more convenient and the time for assembling multiple modules can thus be reduced. The FPC board is formed by a single thin film, and a largest number of thin films can be manufactured if a smallest size is adopted. Therefore, unnecessary wastes can be avoided during the manufacturing process, and the cost can be further reduced.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Claims
1. A single FPC board for connecting multiple modules, comprising:
- a thin film having a first module connecting portion, a second module connecting portion and a third module connecting portion, wherein the first to the third module connecting portions are a display panel connecting portion, a touch panel connecting portion and a motherboard connecting portion, respectively;
- at least one first line disposed between the first module connecting portion and the second module connecting portion; and
- at least one second line disposed between the first module connecting portion and the third module connecting portion.
2. The single FPC board according to claim 1, wherein the first module connecting portion is located on a first side of the thin film, the second module connecting portion and the third module connecting portion are located on a second side of the thin film, and the first side is opposite to the second side.
3. The single FPC board according to claim 2, wherein the thin film further has a slot separating the second module connecting portion and the third module connecting portion.
4. The single FPC board according to claim 3, wherein the thin film further has a folding portion located between the first module connecting portion and the second module connecting portion.
5. The single FPC board according to claim 1, wherein the first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion, which are electrically connected to the at least one first line and the at least one second line, respectively.
6. The single FPC board according to claim 1, wherein the first module connecting portion and the second module connecting portion are located on a first side of the thin film, the third module connecting portion is located on a second side of the thin film, and the first side is opposite to the second side.
7. The single FPC board according to claim 6, wherein the thin film further has a first slot separating the first module connecting portion and the second module connecting portion.
8. The single FPC board according to claim 7, wherein the first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion, which are electrically connected to the at least one first line and the at least one second line, respectively.
9. The single FPC board according to claim 8, wherein the thin film further has a second slot located on the second side of the thin film, and the second slot separates the at least one first line and the at least one second line.
10. The single FPC board according to claim 8, wherein the thin film further has a second slot located on the first side of the thin film, and the second module connecting portion is located between the first slot and the second slot.
11. The single FPC board according to claim 10, wherein the first slot separates the first signal connecting portion and the second module connecting portion, and the second slot separates the second signal connecting portion and the second module connecting portion.
12. The single FPC board according to claim 11, wherein the second module connecting portion has an extension portion protruded from the first side of the thin film, such that the at least one first line is extended outwards.
13. A touch sensitive display module, comprising:
- a first to a third module; and
- the single FPC board according to claim 1, wherein the first to the third module connecting portions are connected to the first to the third modules, respectively.
14. The touch sensitive display module according to claim 13, wherein the second and the third module are located on top and bottom sides of the first module, respectively.
15. A touch sensitive display module, comprising:
- a first module;
- a second module disposed on the first module;
- a third module adjacent to the first module, wherein the first module is located between the second module and the third module; and
- a single FPC board connecting the first module, the second module and the third module, wherein the first module is a display panel, the second module is a touch panel, and the third module is a motherboard.
16. The touch sensitive display module according to claim 15, wherein the single FPC board comprises:
- a thin film having a first module connecting portion, a second module connecting portion and a third module connecting portion, wherein the first module connecting portion is located on a first side of the thin film, the second module connecting portion and the third module connecting portion are located on a second side of the thin film, and the first side is opposite to the second side;
- at least one first line disposed between the first module connecting portion and the second module connecting portion; and
- at least one second line disposed between the first module connecting portion and the third module connecting portion.
17. The single FPC board according to claim 16, wherein the thin film further has a slot separating the second module connecting portion and the third module connecting portion.
18. The single FPC board according to claim 16, wherein the thin film further has a folding portion located between the first module connecting portion and the second module connecting portion.
19. The touch sensitive display module according to claim 16, wherein the first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion, which are electrically connected to the at least one first line and the at least one second line respectively.
20. The touch sensitive display module according to claim 15, wherein the first module connecting portion and the second module connecting portion are located on a first side of the thin film, the third module connecting portion is located on a second side of the thin film, and the first side is opposite to the second side.
21. The touch sensitive display module according to claim 20, wherein the thin film further has a first slot separating the first module connecting portion and the second module connecting portion.
22. The touch sensitive display module according to claim 21, wherein the first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion, which are electrically connected to the at least one first line and the at least one second line, respectively.
23. The touch sensitive display module according to claim 22, wherein the thin film further has a second slot located on the second side of the thin film, and the second slot separates the at least one first line and the at least one second line.
24. The touch sensitive display module according to claim 22, wherein the thin film further has a second slot located on the first side of the thin film, and the second module connecting portion is located between the first slot and the second slot.
25. The touch sensitive display module according to claim 24, wherein the first slot separates the first signal connecting portion and the second module connecting portion, and the second slot separates the second signal connecting portion and the second module connecting portion.
26. The touch sensitive display module according to claim 25, wherein the second module connecting portion has an extension portion protruded from the first side of the thin film, such that the at least one first line is extended outwards.
Type: Application
Filed: Oct 9, 2014
Publication Date: Jan 22, 2015
Applicant: NOVATEK MICROELECTRONICS CORP. (HsinChu)
Inventors: Jiun-Jie TSAI (Hsinchu City), Ching-Chun LIN (New Taipei City), Tsen-Wei CHANG (Taichung City), Yu-Tsung LU (Hsinchu City), Tzu-Jen LO (Hsinchu City), Hao-Jan HUANG (Hsinchu City), Wing-Kai TANG (Hsinchu City)
Application Number: 14/511,062
International Classification: H05K 1/18 (20060101); G06F 3/041 (20060101); H05K 1/02 (20060101);