Combinatorial Flow System and Method
A reactor assembly having a plurality of reaction chambers defined therein is provided. The reactor assembly includes a fluid flow module that provides a pressurized control flow of fluid from an open container. In another embodiment, the reactor block includes a plurality of passageways defined over a surface of a substrate to accommodate the combinatorial processing in order to obtain multiple data points from a single substrate.
This is a Continuation application of U.S. patent application Ser. No. 12/074,882, filed on Mar. 6, 2008, which claims priority to United States provisional patent application number 61/017,529 filed Dec. 28, 2007, entitled “COMBINATORIAL FLOW SYSTEM AND METHOD,” each of which is incorporated herein by reference for all purposes.
BACKGROUNDCombinatorial processing enables rapid evaluation of semiconductor processing operations. The systems supporting the combinatorial processing are flexible to accommodate the demands for running the different processes either in parallel, serial or some combination of the two.
Some exemplary semiconductor wet processing operations includes operations for adding (e.g., electro- or electroless depositions) and removing layers (etch), defining features, preparing layers (e.g., cleans), etc. Similar processing techniques apply to the manufacture of integrated circuits (IC) semiconductor devices, flat panel displays, optoelectronics devices, data storage devices, magneto electronic devices, magneto optic devices, packaged devices, and the like. As feature sizes continue to shrink, improvements, whether in materials, unit processes, or process sequences, are continually being sought for the deposition processes. However, semiconductor companies conduct R&D on full wafer processing through the use of split lots, as the deposition systems are designed to support this processing scheme. This approach has resulted in ever escalating R&D costs and the inability to conduct extensive experimentation in a timely and cost effective manner. Combinatorial processing as applied to semiconductor manufacturing operations enables multiple experiments to be performed on a single substrate.
An improved technique for accommodating gathering of additional data for multiple process variations on a single substrate is provided to enhance the evaluation of the viability of different materials, unit processes, or process sequences.
The present invention will be readily understood by the following detailed description in conjunction with the accompanying drawings, and like reference numerals designate like structural elements.
The embodiments described herein provide a method and apparatus for performing combinatorial processing of semiconductor processing operations. It will be obvious, however, to one skilled in the art, that the present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.
The embodiments described herein enable the application of combinatorial techniques to process sequence integration, unit processes and material evaluation. Combinatorial processing applied to semiconductor manufacturing operations assists in arriving at a globally optimal sequence of semiconductor manufacturing operations by considering interaction effects between the unit manufacturing operations, the process conditions used to effect such unit manufacturing operations, as well as materials characteristics of components utilized within the unit manufacturing operations. Rather than only considering the series of local optimums, i.e., where the best conditions and materials for each manufacturing unit operation is considered in isolation, the embodiments described below consider interaction effects introduced due to the multitude of processing operations that are performed in the order in which such multitude of processing operations are performed when fabricating a semiconductor device. A global optimum sequence order is therefore derived and is part of this derivation, the unit processes, unit process parameters, and materials used in the unit process operations of the optimum sequence order are also considered.
The embodiments are capable of analyzing a portion or subset of the overall process sequence used to manufacture semiconductor devices. Once the subset of the process sequence is identified for analysis, combinatorial process sequence integration testing is performed to optimize the materials, unit processes, and process sequence used to build that portion of the device or structure. During the processing of some embodiments described herein, the processing may take place over structures formed on the semiconductor substrate, which are equivalent to the structures formed during actual production of the semiconductor device. For example, structures may include, but not be limited to, trenches, vias, interconnect lines, capping layers, masking layers, diodes, memory elements, gate stacks, transistors, or any other series of layers or unit processes that create an intermediate structure found on semiconductor chips. While the combinatorial processing varies certain materials, unit processes, or process sequences, the composition or thickness of the layers or structures, or the action of the unit process is substantially uniform for each region. Furthermore, while different materials or unit process may be used for corresponding layers or steps in the formation of the structure, the application of each layer or use of a given unit process is substantially consistent or uniform throughout the different regions in which it is intentionally applied. It should be noted that the process can be varied between regions, for example, for a thickness of a layer is varied or one of various process parameters, such as a voltage, may be varied between regions, etc., as desired by the design of the experiment.
The result is a series of regions on the substrate that contains structures or unit process sequences that have been uniformly applied within that region and, as applicable, across different regions. This process uniformity allows comparison of the properties within and across the different regions such that variations and test results are due to the parameter being modified, e.g., materials, unit processes, unit process parameters, or process sequences, and not the lack of process uniformity.
The embodiments described below provide details for a multi-region processing system and associated reaction chambers that enable processing a substrate in a combinatorial fashion. Thus, different regions of the substrate may have different properties, which may be due to variations of the materials, unit processes, e.g., processing conditions or parameters, and process sequences. Within each region the conditions are preferably substantially uniform so as to mimic conventional full wafer processing within each region, however, valid results can be obtained for certain experiments without this requirement. In one embodiment, the different regions are isolated so that there is no interdiffusion or interaction between the different regions.
In addition, the combinatorial processing of the substrate may be combined with conventional processing techniques where substantially the entire substrate is uniformly processed, e.g., subjected to the same materials, unit processes, and process sequences. Thus, the embodiments described herein can pull a substrate from a manufacturing process flow, perform combinatorial processing, and return the substrate to the manufacturing process flow for further processing. Alternatively, a substrate can be processed in an integrated tool that allows both combinatorial and conventional processing in various chambers attached around the central chamber. Consequently, in one substrate, information concerning the varied processes and interaction of the varied processes with conventional processes can be evaluated. Accordingly, a multitude of data is available from a single substrate for desired process.
The embodiments described below provide for the influencing of wet processing operations within a reaction chamber for a combinatorial processing system. Through some of the embodiments described below, a forced flow from an open container is enabled so that processing conditions for site isolated regions can mimic processing conditions for conventional full processing operations when using an open deck configuration. In addition, or alternatively, the reactor block design may enable channels of fluid flows over the surface of a substrate being processed so that different regions of the substrate are processed differently. In one embodiment, each of the channels may include one or more windows or shutters so that the channel includes a plurality of regions where operating parameters or materials may be varied.
In another embodiment multiple formulations may be sequentially dispensed into the staging vessel and primed into the sample loop. In this embodiment the sample loop contains different formulations in different regions along its length. When this series of mixtures is dispensed to the reactor the effect is a multi-step processing sequence. Alternatively a multi-way valve at the bottom of the staging vessel may be connected to multiple pumps allowing sequencing by priming different fluids into different lines.
In summary, the embodiments described above provide for the aspiration of a fluid from an open vessel and thereafter providing a forced flow through a flow cell to combinatorially process a substrate. Numerous patterns may be applied either through rotation of the substrate, configuration of the flow cell, or a combination of both. While the embodiments have been described with regard to wet chemical processing operations, this is not meant to be limiting. That is, the embodiments may be extended to use with gas flow operations also.
It should be appreciated that the embodiments described herein accommodate a multi- channel site-isolated reactor having electrical contacts on a surface of a substrate undergoing combinatorial processing. The contacts may be positioned within a reaction region or outside a reaction region. The contacts, coupled to leads in communication with monitoring devices or power supplies external to the reaction chambers, enables manipulation and/or monitoring of the reactions taking place in the reaction chambers. These localized contacts provide for accurate measurements and providing accurate potentials to each of the isolated regions, even as seed layers become thinner and give rise to discontinuities when attempting to connect to a peripheral region of the substrate being evaluated. As mentioned above, a monitoring circuit may measure capacitance as a chemical reaction is taking place. In this embodiment, the test substrate includes a capacitor circuit. Some exemplary operations where this would be useful include electro-less depositions and etching operations. One skilled in the art will appreciate that resistance may also be measured through this embodiment. In another embodiment a resistance thermal detector or thermistor may be included in the test substrate, thereby enabling the temperature of the substrate to be monitored while the reaction is taking place. In embodiments influencing the reaction taking place, the contacts may be connected to a voltage potential plane, thereby enabling the voltage potential for the reaction to be controlled by external equipment. In another embodiment, the voltage potential planes are separated or isolated from voltage potential planes in adjacent reaction regions so that the voltage may be varied from region to region, further enhancing the combinatorial capabilities of the system for electrodeposition processes, among other semiconductor processes in which a variable voltage may impact a result of the process. Thus, the embodiments enable real time comparative analysis of differential processing through the conductive leads and corresponding power supply/monitoring equipment.
Any of the operations described herein that form part of the invention are useful machine operations. The invention also relates to a device or an apparatus for performing these operations. The apparatus can be specially constructed for the required purpose, or the apparatus can be a general-purpose computer selectively activated or configured by a computer program stored in the computer. In particular, various general-purpose machines can be used with computer programs written in accordance with the teachings herein, or it may be more convenient to construct a more specialized apparatus to perform the required operations.
Although the foregoing invention has been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications can be practiced within the scope of the appended claims. Accordingly, the present embodiments are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein, but may be modified within the scope and equivalents of the appended claims. In the claims, elements and/or steps do not imply any particular order of operation, unless explicitly stated in the claims.
Claims
1. A fluid dispensing system comprising:
- a container having an opening for introduction of fluids and an outlet;
- a pump in fluid communication with the outlet through a multi-way valve; and
- a reactor in fluid communication with the multi-way valve such that the pump withdraws an amount of fluid from the container into a segment defined between the multi-way valve and the pump and forces the amount of the fluid from the segment into the reactor after transitioning the multi-way valve, wherein an outlet of the reactor constricts a flow of the fluid so that the flow of the fluid through the reactor is pressurized.
2. The fluid dispensing system of claim 1, wherein the flow of the fluid is laminar.
3. The fluid dispensing system of claim 1, wherein the reactor is one of a plurality of reactors disposed over a substrate, the plurality of reactors configured to process regions of the substrate in a combinatorial manner.
4. The fluid dispensing system of claim 3, wherein each region is processed in a substantially uniform manner and differences between regions processed differently are due to a parameter being modified for the differently processed regions.
5. The fluid dispensing system of claim 1, wherein the pump is bi-directional and is one of a syringe pump or a peristaltic pump, and wherein a heating element provides heat for the fluid in the segment.
6. The fluid dispensing system of claim 1, wherein the reactor includes a plurality of partitions contacting a surface of the substrate, the plurality of partitions defining fluid lanes therebetween, the fluid lanes enabling access to the surface of the substrate.
7. The fluid dispensing system of claim 6, wherein one of the partitions includes a window providing access to the surface of the substrate through corresponding fluid lane.
8. The fluid dispensing system of claim 1, wherein an inlet to the reactor is along an axis of the reactor and the flow of the fluid proceeds radially across a surface of a substrate disposed under the reactor.
9. A combinatorial processing system, comprising;
- a plurality of open staging vessels configured to receive fluid for wet processing operations;
- a plurality of pumps in fluid communication with respective staging vessels through corresponding fluid lines; and
- a plurality of reactors in fluid communication with respective pumps, wherein the pumps are configured to provide a forced flow of fluid from the respective staging vessels through respective reactors such that the fluid is pressurized within the reactor.
10. The system of claim 9, wherein the respective reactors include partitions contacting a surface of a substrate disposed below the respective reactors, the plurality of partitions defining fluid lanes therebetween, the fluid lanes enabling access to the surface of the substrate.
11. The system of claim 9, wherein each of the fluid lanes includes a valve configured to isolate a fluid path between one of the respective staging vessels and the respective pumps or the respective pumps and the respective reactors.
12. The system of claim 9, wherein an inlet to the reactor is along an axis of the reactor and the flow of the fluid proceeds radially across a surface of a substrate disposed under the reactor.
13. The system of claim 9, wherein the plurality of reactors operate in parallel to process different regions of a substrate disposed thereunder differently.
14. A combinatorial processing system, comprising;
- a plurality of fluid flow mechanisms, each having an open staging vessel configured to receive fluid for wet processing operations and a pump in fluid communication with an outlet of the staging vessel through a fluid line; and
- reactors corresponding to respective fluid flow mechanisms, the reactors defining a reaction region on a surface of a substrate, the reactor in fluid communication with the pump,
- wherein the pump is configured to provide a forced flow of the fluid from the staging vessel through the reactor such that the fluid is pressurized within the reactor, the reactor including fluid separation partitions configured to contact the surface of the substrate, wherein gaps between the plurality of partitions define fluid lanes enabling access to the forced flow of the fluid to the surface of the substrate.
15. The system of claim 14, further comprising:
- a substrate support configured to rotate the substrate.
16. The system of claim 14, wherein the fluid lanes have windows defined therein, the windows providing the access to the forced flow of the fluid to the surface ofthe substrate.
17. The system of claim 14, wherein access to the fluid lanes is controlled by respective access doors.
18. The system of claim 17, wherein each of the respective access doors are pivotably mounted alongside an end of a corresponding fluid separation partition.
19. The system of claim 14, wherein the pump is configured to operate in a bidirectional manner.
20. The system of claim 14, further comprising;
- a valve configured to fill the fluid line from the staging vessel when the pump provides flow in a first direction, the valve further configured to isolate the staging vessel from the fluid line when the pump provides flow in a second direction.
Type: Application
Filed: Dec 17, 2014
Publication Date: Apr 16, 2015
Inventors: Zachary Fresco (Santa Rosa, CA), Rich Endo (San Carlos, CA)
Application Number: 14/573,872
International Classification: B01J 19/00 (20060101); H01L 21/67 (20060101);