Module with Integrated Power Electronic Circuitry and Logic Circuitry
A integrated power module with integrated power electronic circuitry and logic circuitry includes an embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material, a multi-layer logic printed circuit board with one or more logic dies mounted to a surface of the logic printed circuit board, and a flexible connection integrally formed between the embedded power semiconductor module and the logic printed circuit board. The flexible connection mechanically connects the embedded power semiconductor module to the logic printed circuit board and provides an electrical pathway between the embedded power semiconductor module and the logic printed circuit board. A method of manufacturing the integrated power module is also provided.
The present application relates to power electronic circuitry, in particular integrating power electronic circuity with the logic circuitry that controls operation of the power circuitry.
BACKGROUNDMany applications such as automotive and industrial applications utilize power electronic circuitry such as IGBTs (insulated gate bipolar transistors), power MOSFETs (metal oxide semiconductor field effect transistors), power diodes, etc. For example, common power circuits include single and multi-phase half-wave rectifiers, single and multi-phase full-wave rectifiers, voltage regulators, etc. Integrated power modules (IPMs) include both power electronic circuitry and the logic circuitry for controlling operation of the power electronic circuitry. In some conventional IPMs, the power dies (chips) are attached to a power electronic substrate such as a DBC (direct bonded copper), IMS (insulated metal substrate) or AMB (active metal brazed) substrate. The logic dies are surface mounted to a separate logic printed circuit board. The power electronic substrate is then connected to the logic printed circuit board by a rigid connector. In other conventional IPMs, the connection mechanism is not as bulky. However, the power dies are typically surface mounted to a second printed circuit board. In both IPM implementations, significant area is needed to accommodate the various parts, increasing the overall size and cost of the IPM. Other conventional IPMs inlay a power semiconductor module within the logic printed circuit board. While this approach reduces the area needed to implement the IPM, it has significantly more process steps and is costly. As such, a smaller, simpler, and more cost-effective IPM solution is needed.
SUMMARYAccording to an embodiment of a method of interconnecting power electronic circuitry with logic circuitry, the method comprises: providing a multi-layer logic printed circuit board and an embedded power semiconductor module, the embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material; mounting one or more logic dies to a surface of the logic printed circuit board; and forming an integral flexible connection between the embedded power semiconductor module and the logic printed circuit board, the integral flexible connection mechanically connecting the embedded power semiconductor module to the logic printed circuit board and providing an electrical pathway between the embedded power semiconductor module and the logic printed circuit board.
According to an embodiment of an integrated power module, the module comprises a embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material, a multi-layer logic printed circuit board with one or more logic dies mounted to a surface of the logic printed circuit board, and a flexible connection integrally formed between the embedded power semiconductor module and the logic printed circuit board. The flexible connection mechanically connects the embedded power semiconductor module to the logic printed circuit board and provides an electrical pathway between the embedded power semiconductor module and the logic printed circuit board.
Those skilled in the art will recognize additional features and advantages upon reading the following detailed description, and upon viewing the accompanying drawings.
The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts. The features of the various illustrated embodiments can be combined unless they exclude each other. Embodiments are depicted in the drawings and are detailed in the description which follows.
The embodiments described herein provide an IPM (integrated power module) with a flexible connection integrally formed between an embedded power semiconductor module and a logic printed circuit board (PCB). PCBs mechanically support and electrically connect electronic components using conductive tracks (traces), pads and other features etched from copper sheets (foils) laminated onto a non-conductive substrate material. PCBs can be single-sided (e.g. one copper layer), double-sided (e.g. two copper layers) or multi-layer. Conductors on different layers are connected with plated-through hole vias, laser drilled micro-vias, conductive paste vias (e.g. ALIVH, B2it), etc. Advanced PCBs can contain components such as capacitors, resistors or active devices, embedded in the PCB resin material and/or mounted to a surface of the PCB. In each case, the logic PCB of the IPM includes logic circuitry for controlling the power circuitry of the embedded power semiconductor module. The flexible connection of the IPM mechanically connects the embedded power semiconductor module to the logic printed circuit board, and provides an electrical pathway between the embedded power semiconductor module and the logic printed circuit board. The IPM solution described herein allows for combining high-density logic PCB with embedded power technology e.g. by using flexible interconnection technology such as flexible FR-4, flexible PCB technology, flexible printed circuit (FCP) technology, etc.
Additional active and/or passive components 112 can be mounted to a surface 101 of the embedded power semiconductor module 100. The additional components 112 can be electrically connected to the power semiconductor die(s) 106 through a patterned metal foil 114 at the mounting surface 101 of the embedded power semiconductor module 100 and through conductive vias 116 which extend between the patterned metal foil 114 and the power semiconductor die(s) 106. In one embodiment, the IPM module is formed by a lamination process and the patterned metal foil 114 is part of an uppermost lamination substrate which is laminated onto the embedded power semiconductor module 100 and the multi-layer logic PCB 102. One or more logic dies 118 for controlling operation of the power semiconductor die(s) 106 and corresponding passive components 120 are mounted to an exterior surface 103 of the logic PCB 102. For example, the logic die(s) 118 and passive components 120 can be SMT (surface mount technology) devices. The logic die(s) 118 can include any type of electronic device for controlling operation of the power semiconductor die(s) 106 such as a controller, driver, etc.
In each case, the flexible connection 104 integrally formed between the embedded power semiconductor module 100 and the logic PCB 102 mechanically connects the embedded power semiconductor module 100 to the logic PCB 102 and also provides an electrical pathway between the embedded power semiconductor module 100 and the logic PCB 102. The flexible connection 104 is ‘integrally formed’ between the embedded power semiconductor module 100 and the logic PCB 102 in that the flexible connection 104 is not readily separable from the embedded power semiconductor module 100 or the logic PCB 102. Instead, the flexible connection 104 becomes an integral or constituent part of both the embedded power semiconductor module 100 and the logic PCB 102 during the IPM manufacturing process. In one embodiment the IPM is formed by a lamination process as described in more detail later herein, and the flexible connection 104 comprises a lamination substrate laminated to the embedded power semiconductor module 100 and the logic PCB 102. According to this embodiment, the electrical pathway provided by the integral flexible connection is formed by a metal foil 122 disposed on a dielectric material 124 of the lamination substrate. A heat sink or board 126 can be attached to the metal foil 122 under the embedded power semiconductor module 100 e.g. to improve heat dissipation in this region of the IPM or to provide a connection to another assembly.
In general, the integral flexible connection 104 can have one or more electrical connection layers formed e.g. by laminating a laminate and copper layer(s). The integral flexible connection 104 bridges a gap or space between the embedded power semiconductor module 100 and the logic PCB 102 and provides a flexible mechanical and electrical connection between the power module 100 and logic PCB 102. The integral flexible connection 104 can be bent in various configurations depending on the application in which the IPM is to be used. For example in
The IPMs described herein combine high-density logic PCBs with embedded power semiconductor modules using an integral flexible connection approach which allows for 3D system design (e.g. folding, stacking), simplifies the assembly process by using a single PCB board concept, lowers overall IPM cost while offering separately optimized technologies for high-density PCB and embedded power semiconductor modules, and allows for IPM module miniaturization (shrinking).
Spatially relative terms such as “under”, “below”, “lower”, “over”, “upper” and the like, are used for ease of description to explain the positioning of one element relative to a second element. These terms are intended to encompass different orientations of the package in addition to different orientations than those depicted in the figures. Further, terms such as “first”, “second”, and the like, are also used to describe various elements, regions, sections, etc. and are also not intended to be limiting. Like terms refer to like elements throughout the description.
As used herein, the terms “having”, “containing”, “including”, “comprising” and the like are open-ended terms that indicate the presence of stated elements or features, but do not preclude additional elements or features. The articles “a”, “an” and “the” are intended to include the plural as well as the singular, unless the context clearly indicates otherwise.
With the above range of variations and applications in mind, it should be understood that the present invention is not limited by the foregoing description, nor is it limited by the accompanying drawings. Instead, the present invention is limited only by the following claims and their legal equivalents.
Claims
1. A method of interconnecting power electronic circuitry with logic circuitry, the method comprising:
- providing a multi-layer logic printed circuit board and an embedded power semiconductor module, the embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material;
- mounting one or more logic dies to a surface of the logic printed circuit board; and
- forming an integral flexible connection between the embedded power semiconductor module and the logic printed circuit board, the integral flexible connection mechanically connecting the embedded power semiconductor module to the logic printed circuit board and providing an electrical pathway between the embedded power semiconductor module and the logic printed circuit board.
2. The method of claim 1, further comprising:
- bending the integral flexible connection such that the logic printed circuit board lies in a different plane than the embedded power semiconductor module.
3. The method of claim 2, wherein the integral flexible connection is bent such that the logic printed circuit board lies in a plane that is perpendicular to the plane in which the embedded power semiconductor module lies.
4. The method of claim 1, further comprising:
- bending the integral flexible connection such that the logic printed circuit board is positioned over or under the embedded power semiconductor module.
5. The method of claim 4, wherein the integral flexible connection is bent such that the one or more logic dies mounted to the surface of the logic printed circuit board face toward the embedded power semiconductor module.
6. The method of claim 1, wherein forming the integral flexible connection between the embedded power semiconductor module and the logic printed circuit board comprises:
- forming a laminate that includes the logic printed circuit board and the embedded power semiconductor module interposed between first and second lamination substrates, with a dielectric-filled gap between the logic printed circuit board and the embedded power semiconductor module; and
- thinning the laminate in a region of the dielectric-filled gap such that the thinned region of the laminate forms the integral flexible connection.
7. The method of claim 6, wherein the electrical pathway provided by the integral flexible connection is formed by a copper foil of the first lamination substrate.
8. The method of claim 6, further comprising:
- etching a metal foil of the second lamination substrate that faces away from the logic printed circuit board and the embedded power semiconductor module, to form contact pads for mounting the one or more logic dies to the surface of the logic printed circuit board.
9. The method of claim 6, further comprising:
- etching a metal foil of the second lamination substrate that faces away from the logic printed circuit board and the embedded power semiconductor module, to form external electrical connections on the embedded power semiconductor module for the one or more power semiconductor dies embedded in the embedded power semiconductor module.
10. The method of claim 6, wherein forming the laminate comprises:
- arranging the logic printed circuit board and a metal block to which the one or more power semiconductor dies are attached on the first lamination substrate such that the dielectric-filled gap between the logic printed circuit board and the embedded power semiconductor module is filled with dielectric material of the logic printed circuit board;
- arranging the second lamination substrate on the logic printed circuit board and the metal block to form a stack; and
- laminating the stack.
11. The method of claim 10, wherein thinning the laminate comprises:
- milling through the second lamination substrate and the dielectric material of the logic printed circuit board in the region of the dielectric-filled gap.
12. The method of claim 6, wherein the embedded power semiconductor module is a pre-laminated embedded power semiconductor module, and wherein forming the laminate comprises:
- arranging the pre-laminated embedded power semiconductor module on the first lamination substrate and the second lamination substrate on the pre-laminated embedded power semiconductor module to form a stack; and
- laminating the stack.
13. The method of claim 12, wherein thinning the laminate comprises:
- milling through the second lamination substrate in the region of the dielectric-filled gap.
14. An integrated power module with integrated power electronic circuitry and logic circuitry, comprising:
- an embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material;
- a multi-layer logic printed circuit board with one or more logic dies mounted to a surface of the logic printed circuit board; and
- a flexible connection integrally formed between the embedded power semiconductor module and the logic printed circuit board, the flexible connection mechanically connecting the embedded power semiconductor module to the logic printed circuit board and providing an electrical pathway between the embedded power semiconductor module and the logic printed circuit board.
15. The integrated power module of claim 14, wherein the flexible connection is bent such that the logic printed circuit board lies in a different plane than the embedded power semiconductor module.
16. The integrated power module of claim 15, wherein the flexible connection is bent such that the logic printed circuit board lies in a plane that is perpendicular to the plane in which the embedded power semiconductor module lies.
17. The integrated power module of claim 14, wherein the flexible connection is bent such that the logic printed circuit board is positioned over or under the embedded power semiconductor module.
18. The integrated power module of claim 17, wherein the flexible connection is bent such that the one or more logic dies mounted to the surface of the logic printed circuit board face toward the embedded power semiconductor module.
19. The integrated power module of claim 14, wherein the flexible connection comprises a lamination substrate laminated to a same first side of the embedded power semiconductor module and the logic printed circuit board.
20. The integrated power module of claim 19, wherein the electrical pathway provided by the integral flexible connection is formed by a copper foil of the lamination substrate.
21. The integrated power module of claim 14, wherein the embedded power semiconductor module is inlaid into the logic printed circuit board, and wherein dielectric material of the logic printed circuit board is thinned in a region adjacent to the inlaid power semiconductor module such that a thin dielectric layer and metal layer of the logic printed circuit board form the integral flexible connection between the logic printed circuit board and the inlaid power semiconductor module.
Type: Application
Filed: Aug 12, 2014
Publication Date: Feb 18, 2016
Patent Grant number: 9681558
Inventors: Liu Chen (Muenchen), Markus Dinkel (Unterhaching), Toni Salminen (Muenchen)
Application Number: 14/457,663