SEMICONDUCTOR DEVICE INCLUDING A LEADFRAME OR A DIODE BRIDGE CONFIGURATION
A monolithic semiconductor device has a substrate with a power region and control region. The substrate can be a silicon-on-insulator substrate. An opening is formed in the power region and extends partially through the substrate. A semiconductor material is formed within the opening. A power semiconductor device, such as a vertical power transistor, is formed within the semiconductor material. A control logic circuit is formed in the control region. A first isolation trench is formed in the power region to isolate the power semiconductor device and control logic circuit. A second isolation trench is formed in the control region to isolate a first control logic circuit from a second control logic circuit. An interconnect structure is formed over the power region and control region to provide electrical interconnect between the control logic circuit and power semiconductor device. A termination trench is formed in the power region.
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The present application claims the benefit of U.S. Provisional Application No. 62/363,449, filed Jul. 18, 2016, by Jefferson W. HALL and Gordon M. GRIVNA, which application is incorporated herein by reference.
FIELD OF THE INVENTIONThe present invention relates in general to semiconductor devices and, more particularly, to a semiconductor device and method for a monolithically integrated power device and control logic.
BACKGROUNDA semiconductor wafer or substrate can be made with a variety of base substrate materials, such as silicon (Si), germanium, aluminum phosphide, aluminum arsenide, gallium arsenide (GaAs), gallium nitride (GaN), aluminum gallium nitride over gallium nitride (AlGaN/GaN), indium phosphide, silicon carbide (SiC), or other bulk material for structural support. A plurality of semiconductor die is formed on the wafer separated by a non-active, inter-die substrate area or saw street. The saw street provides cutting areas to singulate the semiconductor wafer into individual semiconductor die.
A power metal oxide semiconductor field effect transistor (MOSFET) is commonly used to switch relatively large currents. Many applications require several power MOSFETs, for example, to independently control electrical current in different loads. For instance, an automobile may require separate power MOSFETs to switch current through actuators that roll windows up and down, adjust rear-view mirrors, and adjust the position of car seats. Power MOSFETs may also be used to switch electrical current to heating elements within windows and mirrors, or as part of a switch-mode power supply to convert battery voltage to another voltage. In such applications, the electrical currents can be relatively high, leading to a need for high density, low loss switches resulting in high efficiency.
Each power device used to switch an electrical current requires control logic to determine when to turn the switch on and off. Commonly, the control logic for each power device is located in a control logic semiconductor package, and each of the power devices are separately packaged and placed on a common printed circuit board (PCB) or remotely from the control logic package. The plurality of separate semiconductor packages adds cost and consumes PCB area.
The following describes one or more embodiments with reference to the figures, in which like numerals represent the same or similar elements. While the figures are described in terms of the best mode for achieving certain objectives, the description is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the disclosure. The term “semiconductor die” as used herein refers to both the singular and plural form of the words, and accordingly, can refer to both a single semiconductor device and multiple semiconductor devices.
The following figures illustrate manufacturing high density power MOSFETs on a common die with control logic for switching the power MOSFETs. In
An N-type epitaxial (EPI) layer 124 can be grown on base substrate 122. Wafer 126 is relatively light doped with donor atoms. Wafer 126 and base substrate 122 each have an oxide layer grown on surfaces of the wafers. The oxide layers on wafer 126 and base substrate 122 are cleaned and atomically bonded to form buried oxide (BOX) layer 128. Base substrate 122 with EPI layer 124 bonded to wafer 126 through BOX layer 128 forms SOI substrate 120. In some embodiments, where a high voltage power MOSFET is formed, EPI layer 124 can be grown to a greater thickness. SOI substrate 120 de-couples the drain regions from the control logic regions.
In
In
In
In
An isolation trench 174 is formed in control region 144 to isolate control region 144a from control region 144b. Isolation trenches 166 and 174 can be formed by LDA, plasma etching, or other etching process. Isolation trench 174 has a ring, rectangular, or otherwise enclosing shape and extends through wafer 126 to BOX layer 128 in control region 144. Oxide layer 168 is conformally applied on the sidewall of isolation trench 174. Polysilicon material 170 can be deposited in a remaining portion of isolation trench 174 over oxide layer 168 to form isolation structure 175 in control region 144. Alternatively, isolation trench 174 is filled with oxide layer 168 or other dielectric. Isolation trench 174 isolates control logic between multiple power devices in control regions 144a and 144b.
Additional isolation trenches 166 can be used with more power devices monolithically integrated on a common SOI substrate 120. In some embodiments, wider isolation regions or multiple concentric trench rings 166a and 166b in
Returning to
In
A P-type region 214 is formed between gate structures 202 in power regions 140a and 140b as the channel region of the power MOSFETs. In some embodiments, a charge balanced superjunction can be used.
In
Conductive plug 234 operates as a front-side source contact through conductive vias 222 to the power MOSFET in power regions 140a and 140b and is configured for a leadframe to be coupled to the source of the power MOSFET by a clip, bond wire, or other appropriate mechanism. Conductive layer 236 routes electrical signals from the control logic in control regions 144a and 144b to contact pads for connection to the leadframe by wire bonding or other appropriate connection method. Insulating layer or encapsulant 238 is formed over conductive layer 236 and conductive plug 234 for environmental protection and structural integrity. An opening is etched through insulating layer 238 to expose conductive plug 234 and contact pads of conductive layer 236 for subsequent interconnect.
In
In
Trench 240 surrounds power regions 140a and 140b and creates a lateral separation between portion 122a and portion 122b of base substrate 122. Trench 240 electrically isolates the drain terminal of a power MOSFET in power region 140a from the drain terminal of a power MOSFET in power region 140b. Vertical isolation between the control logic and power device drain terminals is provided by buried oxide layer 128. Portion 122a of base substrate 122 includes a branch that extends under control region 144a, and portion 122b extends under control region 144b, so that control logic is able to contact the drain of power MOSFETs formed in power region 140a using a conductive via through BOX layer 128. If a bonding wire is used to couple control region 144 to the drain leadframe contacts, or if no backside connection is required, base substrate 122 may be completely removed under control region 144. Removing additional material of base substrate 122 and EPI layer 124 under control region 144, or electrically isolating the material from all power devices, reduces interference in the control logic caused by the high voltage drain contacts.
Semiconductor device 250 is disposed on a leadframe and attached by metallurgical bonding between drain contacts 244 and the leadframe. A clip from the leadframe to source contacts 234 provides an external source contact for each of the vertical power MOSFETs. Likewise, drain contact 244 can be routed by bond wire or clip to the top surface of semiconductor device 250, e.g. for drain sensing. Bonding wires are used to couple other leadframe contacts to terminals of control region 144 for I/O of signals necessary for control of power MOSFETs formed in power regions 140a and 140b. Semiconductor device 250 is encapsulated electrical interconnect and singulated to finish the package.
Semiconductor device 250 combines one or more power devices and control logic fully isolated (source, drain, and gate of power MOSFET and control logic) in an integrated monolithic semiconductor package using an SOI substrate or non-SOI substrate. The power devices and control logic can be lateral or high density vertical trench-based semiconductor devices with vertical conduction path from active surface 110 to back surface 108 in semiconductor die 102. Conductive layers 226 and 236 provide electrical interconnect on a first major surface for control logic circuits 213a and 213b. Conductive layer 234 provides electrical interconnect on the first major surface for the power MOSFET, e.g. source connection. Conductive layer 244 provides electrical interconnect on a second major surface for the power MOSFET, e.g. drain connection. Semiconductor device 250 provides a flexible platform for different voltages based on vertical thickness and/or trench depth. Semiconductor device 250 containing one or more isolated power devices and associated control logic can be used in many applications, such as automotive, switch mode power supplies, and diode bridges for sine-wave rectification.
In
Gate structures 290 for power MOSFETs are formed within power regions 140a and 140b, similar to
In
Conductive plug 314 operates as a front-side source contact through conductive vias 302 to the power MOSFET in power regions 140a and 140b and is configured for a leadframe to be coupled to the source of the power MOSFET by a clip, bond wire, or other appropriate mechanism. Drain contact 346 can be routed by bond wire or clip to the top surface of semiconductor device 340, e.g. for drain sensing. Conductive layer 316 routes electrical signals from the control logic in control regions 144a and 144b to contact pads for connection to the leadframe by wire bonding or other appropriate connection method. Insulating layer or encapsulant 320 is formed over conductive layer 316 and conductive plug 314 for environmental protection and structural integrity. An opening is etched through insulating layer 320 to expose conductive plug 314 and contact pads of conductive layer 316 for subsequent interconnect.
In
Semiconductor device 340 combines one or more power devices and control logic fully isolated (source, drain, and gate of power MOSFET and control logic) in an integrated monolithic semiconductor package using an SOI substrate or non-SOI substrate. The power devices and control logic can be lateral or high density vertical trench-based semiconductor devices with vertical conduction path from active surface 110 to back surface 108 in semiconductor die 102. Conductive layers 306 and 316 provide electrical interconnect on a first major surface for control logic circuits. Conductive layer 314 provides electrical interconnect on the first major surface for the power MOSFET, e.g. source connection. Conductive layer 346 provides electrical interconnect on a second major surface for the power MOSFET, e.g. drain connection. The drain of the power MOSFET can be routed to the first major surface for drain sensing by the control logic, see
While one or more embodiments have been illustrated and described in detail, the skilled artisan will appreciate that modifications and adaptations to those embodiments may be made without departing from the scope of the present disclosure.
Claims
1-20. (canceled)
21. A semiconductor device, comprising:
- a die having a top side and a backside opposite the top side, wherein the die includes: a first region having a first contact along the backside of the die; a second region having a second contact along the top side of the die; and a first isolation electrically isolating the first region from the second region along the backside of the die;
- a first lead finger electrically connected to the first contact, wherein the first lead finger extends along the backside of the die; and
- a second lead finger electrically connected to the second contact.
22. The semiconductor device of claim 21, wherein the first region includes a power semiconductor device, and the second region includes a control logic circuit.
23. The semiconductor device of claim 21, wherein the die further comprises a second isolation electrically isolating the first region from the second region along the top side of the die.
24. The semiconductor device of claim 21, further comprising a third lead finger, wherein the first region further includes a third contact along the top side of the die, wherein the third contact is electrically connected to the third lead finger.
25. The semiconductor device of claim 21, wherein:
- the second region further includes a control logic circuit and a buried oxide layer,
- the control logic circuit is closer to the top side of the die than to the backside of the die, and
- the buried oxide layer is disposed between the control logic circuit and the backside of the die.
26. The semiconductor device of claim 21, wherein the second region further includes a third contact that is electrically connected to the first lead finger.
27. The semiconductor device of claim 21, further comprising a third lead finger spaced apart from the first lead finger and the second lead finger, wherein:
- the die further includes a third region, wherein the second region is disposed between the first region and the third region,
- the third lead finger is electrically connected to the first region, and the third lead finger extends along the top side of the die, and
- no lead finger extends along the backside of the die.
28. A semiconductor device, comprising:
- a die including a first region, a second region, and a third region;
- a first lead finger electrically connected to the first region, wherein the first lead finger extends along a backside of the die; and
- a second lead finger electrically connected to the third region, wherein the second lead finger extends along backside of the die and is spaced apart from the first lead finger.
29. The semiconductor device of claim 28, wherein the die further comprises an isolation electrically isolating the first region from the second region along the top side of the die.
30. The semiconductor device of claim 28, wherein the die further includes:
- a substrate including a semiconductor wafer lying along a backside surface of the substrate, wherein the semiconductor wafer includes a first portion associated with the first region and a second portion associated with the second region; and
- an isolation trench along the backside surface of the substrate and extending through the semiconductor wafer, wherein the isolation trench separates the first portion of the substrate from the second portion of the substrate.
31. The semiconductor device of claim 28, wherein the first region includes a power semiconductor device, and the second region includes a control logic circuit.
32. The semiconductor device of claim 28, wherein:
- the die further comprises a conductive layer that includes a drain contact within the third region, wherein the conductive layer lies along the backside of the die, and
- the drain contact is electrically connected to the second lead finger.
33. The semiconductor device of claim 28, further comprising a fourth region, wherein:
- the second region further includes a first contact that is electrically connected to the first lead finger, and
- the fourth region includes a second contact that is electrically connected to the second lead finger.
34. The semiconductor device of claim 28, wherein each of the first lead finger and the second lead finger does not extend over or under the second region.
35. A semiconductor device, comprising:
- a die having a first side and a second side opposite the first side and including a diode bridge, wherein the diode bridge includes: a first diode within a first region, wherein the first diode has an anode and a cathode; a second diode within a second region, wherein the second diode has an anode and a cathode; a third diode within a third region, wherein the third diode has an anode and a cathode; and a fourth diode within a fourth region, wherein the fourth diode has an anode and a cathode, wherein: the anode of the first diode is electrically coupled to the cathode of the fourth diode, the cathode of the first diode is electrically coupled to the cathode of the second diode, the anode of the second diode is electrically coupled to the cathode of the third diode, the anode of the third diode is electrically coupled to the anode of the fourth diode, first contacts to the anodes of the first, second, third, and fourth diodes are along the first side of the die, and second contacts to the cathodes of the first, second, third, and fourth diodes are along the second side of the die.
36. The semiconductor device of claim 35, wherein the die further comprises:
- a substrate that includes at least parts of the first, second, third, and fourth diodes;
- a first isolation trench extending into the substrate along one of the first side and the second side of the die, wherein the first isolation trench electrically isolates the first region from the second region, the third region, or the fourth region; and
- a second isolation trench extending into the substrate along the other of the first side and the second side of the die, wherein the second isolation trench electrically isolates the third region from the first region, the second region, or the fourth region.
37. The semiconductor device of claim 35, further comprising a first conductor that contacts the anodes of the third diode and the fourth diode, and a second conductor that contacts the cathodes of the first diode and the second diode.
38. The semiconductor device of claim 35, wherein at one of the first diode, the second diode, the third diode, and the fourth diode is a Schottky diode.
39. The semiconductor device of claim 35, further comprising a first conductor and a second conductor, wherein the first conductor is along the first side or the second side of the die, and the second conductor is electrically connected to the first conductor and the die along the other of the first side or the second side of the die.
40. The semiconductor device of claim 35, further comprising a first conductor and a second conductor, wherein both of the first conductor and the second conductor are along the first side or the second side of the die, and the first conductor is spaced apart from the second conductor.
Type: Application
Filed: Sep 10, 2020
Publication Date: Dec 31, 2020
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (Phoenix, AZ)
Inventors: Jefferson W. HALL (Chandler, AZ), Gordon M. GRIVNA (Mesa, AZ)
Application Number: 17/017,089