FILM PLATING MACHINE AND ELECTROPLATING PRODUCTION LINE

A film plating machine and electroplating production line are provided. The film plating machine has a plating solution tank, conductive substrate film conveying devices and a power supply. A plating solution and an anode member are provided in the plating solution tank. The conductive substrate film conveying devices are provided at both sides of the plating solution tank and configured to clamp two opposite side edges of a horizontally-placed conductive substrate film and drive the conductive substrate film to horizontally enter and exit the plating solution tank in a first direction. A positive electrode of the power supply is electrically connected with the anode member, and a negative electrode of the power supply is electrically connected with the conductive substrate film through the conductive substrate film conveying devices.

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Description
FIELD

The present application relates to the field of electroplating technology, and in particular to a film plating machine and electroplating production line.

BACKGROUND

As a green, environmentally friendly new energy source, lithium-ion batteries have certain advantages such as a large capacity, a small size, and a light weight. Lithium-ion batteries have currently been widely applied in fields such as electrical vehicles, digital products and household appliances.

A current collector is an important constituent part of a lithium-ion battery, and mainly refers to a base metal such as copper foil and aluminum foil at a positive electrode or a negative electrode of the battery for attaching active materials on the lithium-ion battery. The function of the current collector is mainly to collect current generated by the active material of the battery to form a larger current for external output. When the current collector is fabricated, a thick metal plating layer is usually formed on the conductive substrate film by electroplating to ensure conductive performance of the current collector. Specifically, a film plating machine can be used to electroplate the conductive substrate film.

In existing film plating machines, current of the negative electrode of the power supply is usually connected to the conductive substrate film by using a conductive roller, so that the conductive substrate film is electroplated in the plating solution. However, since the conductive roller is usually provided outside the plating solution tank, the conductive substrate film is also outside the plating solution tank when passing through the conductive roller, where the electrical conductivity and the cooling effect of the conductive substrate film exposed to the air will decrease, and then the conductive substrate film would have electrical breakdown through-holes, which affects the product yield and would reduce the electroplating efficiency.

SUMMARY

An embodiment of the present application discloses a film plating machine and electroplating production line, capable of preventing the conductive substrate film from being electrically broken down, and capable of improving the electroplating efficiency.

In order to achieve the above object, in a first aspect, an embodiment of the present application discloses a film plating machine, comprising:

    • a plating solution tank in which a plating solution and an anode member are provided;
    • conductive substrate film conveying devices provided at both sides of the plating solution tank and configured to clamp two opposite side edges of a horizontally-placed conductive substrate film and drive the conductive substrate film to horizontally enter and exit the plating solution tank in a first direction;
    • a power supply having a positive electrode electrically connected with the anode member, and a negative electrode electrically connected with the conductive substrate film through the conductive substrate film conveying devices.

By the film plating machine provided by the embodiment of the present application, in the process where the conductive substrate film conveying device drives the conductive substrate film to convey, the conductive substrate film conveying device horizontally clamps and conveys the conductive substrate film, and electricity is conducted to the conductive substrate film through the conductive substrate film conveying device, and there is no need of using a conductive roller for conducting electricity. Therefore, the conductive substrate film can be always located in the plating solution during the film plating process, thereby ensuring cooling effect of the conductive substrate film and preventing the conductive substrate film from being electrically broken down. Moreover, since the conductive substrate film in the plating solution has a strong ability to withstand current, the power supply current can be appropriately increased, so that the electroplating efficiency is improved.

In a possible implementation in the first aspect, the conductive substrate film conveying device comprises:

    • a first conveying device comprising a first conveying belt, a first driving assembly and a plurality of first conductive clamps, the first conveying belt being extending along the first direction; the plurality of first conductive clamps being arranged on the first conveying belt along the first direction, the plurality of first conductive clamps being electrically communicated with a negative electrode of the power supply, and the first driving assembly being configured to drive the first conveying belt to convey the first conductive clamp along the first direction;
    • a second conveying device comprising a second conveying belt, a second driving assembly and a plurality of second conductive clamps, the second conveying belt being extend along the first direction; the plurality of second conductive clamps being arranged on the second conveying belt along the first direction, the plurality of second conductive clamps being electrically communicated with a negative electrode of the power supply, and the second driving assembly being configured to drive the second conveying belt to convey the second conductive clamp along the first direction;
    • wherein the first conveying belt and the second conveying belt are symmetrically provided on both sides of the plating solution tank, and the first conductive clamps and the second conductive clamps are respectively configured to clamp the two opposite side edges of the conductive substrate film.

Thus, the conductive substrate film can be horizontally clamped and conveyed, and the conductive substrate film can be electrically connected with the negative electrode of the power supply without using a conductive roller.

In a possible implementation in the first aspect, each of the first conductive clamp and the second conductive clamp comprises:

    • a first clamping portion comprising a first clamping face, wherein the first clamping face is a conductive face and is electrically communicated with the negative electrode of the power supply;
    • a second clamping portion comprising a second clamping face, wherein the second clamping face is a conductive face and is electrically communicated with the negative electrode of the power supply;
    • wherein the first clamping portion and the second clamping portion can move relative to each other, so that the conductive clamp is in a clamping state or an opening state, and the first clamping face and the second clamping face both contact and are electrically communicated with the conductive substrate film when the conductive clamp clamps the conductive substrate film; and
    • surfaces of the first conductive clamp and the second conductive clamp are configured such that, except for the first clamping face and the second clamping face, remaining surfaces that can be immersed in the plating solution during film plating are insulating surfaces.

Thus, when the first conductive clamp and the second conductive clamp are immersed in the plating solution, their surfaces will not conduct electricity, so that current passing through the conductive substrate film will not be reduced, and the electroplating efficiency is prevented from being reduced.

In a possible implementation in the first aspect, a first sealing portion is formed on the first clamping portion around the first clamping face; a second sealing portion is formed on the second clamping portion around the second clamping face; and the first sealing portion and the second sealing portion cooperatively seal the first clamping face and the second clamping face when the conductive clamp clamps the conductive substrate film.

Thus, the plating solution is prevented from contacting the first clamping face and the second clamping face, and thus the first clamping face and the second clamping face are prevented from being plated with copper, ensuring successful opening and closing of the conductive clamp, and preventing the conductive substrate film from being punctured by the plating layer of the clamping face.

In a possible implementation in the first aspect, the first sealing portion is a first sealing ring provided around the first clamping face; the first sealing ring at least partially protrudes from the first clamping face; the second sealing portion is a first annular sealing slot provided around the second clamping face; and a portion of the first sealing ring protruding from the first clamping face cooperatively fits into the first annular sealing slot when the conductive clamp is in the clamping state.

Thus, a structure where the sealing ring and the annular sealing slot cooperate is adopted, which may increase the sealing area and further improves the sealing effect.

In a possible implementation in the first aspect, an opening and closing mechanism is further comprised; the opening and closing mechanism comprises a first guide rail and a second guide rail symmetrically provided on both sides of the plating solution tank; the first guide rail and the second guide rail both extend along the first direction; the first guide rail is configured to cooperate with the first conductive clamp to guide opening or closing of the first conductive clamp; and the second guide rail is configured to cooperate with the second conductive clamp to guide opening or closing of the second conductive clamp.

Thus, the normally open conductive clamp can be opened or closed at a preset position.

In a possible implementation in the first aspect, the first conductive clamp is a normally open conductive clamp; the first guide rail corresponds to a position of the plating solution tank; the first guide rail comprises a closing guide section, a horizontal guide section and an opening guide section provided in sequence along the first direction; the first conductive clamp is gradually closed under a guiding action of the closing guide section when the first conductive clamp slides along the closing guide section; the first conductive clamp keeps moving in the clamping state when the first conductive clamp slides along the horizontal guide section; and the first conductive clamp is gradually opened under a guiding action of the opening guide section when the first conductive clamp slides along the opening guide section.

Thus, the normally open conductive clamp can be opened or closed at a preset position.

In a possible implementation in the first aspect, the normally open conductive clamp comprises a bracket on which a guide column is provided; the first clamping portion and the second clamping portion are both slidably connected to the guide column; an elastic member is provided between the first clamping portion and the second clamping portion; the elastic member is configured to keep the first clamping portion and the second clamping portion in the opening state; a movement trajectory of the first conductive clamp is located between the upper guide rail and the lower guide rail; along a movement direction of the first conductive clamp, a gap between a lower surface of the upper guide rail and an upper surface of the lower guide rail first gradually narrows, then remains unchanged, and finally increases gradually, and a portion of the first guide rail where the gap remains unchanged corresponds to a position of the plating solution tank.

Thus, when the normally open conductive clamp moves to a portion where a gap between the upper guide rail and the lower guide rail is gradually reduced, the first clamping portion and the second clamping portion are respectively squeezed by the upper guide rail and the lower guide rail and gradually move closer to clamp the conductive substrate film; in the course where the normally open conductive clamp moves in the portion with unchanged gap, the conductive substrate film is clamped and conveyed by the normally open conductive clamp in the plating solution tank; when the normally open conductive clamp moves to the portion where a gap between the upper guide rail and the lower guide rail is gradually increased, the first clamping portion and the second clamping portion are gradually separated from each other under an action of the elastic member, so that the conductive substrate film may be released.

In a possible implementation in the first aspect, the conductive clamp is a normally closed conductive clamp; the first guide rail comprises a first guide section and a second guide section; the first guide section corresponds to an entering side of the plating solution tank; the second guide section corresponds to an exiting side of the plating solution tank; the first guide section guides the first conductive clamp to open when the first conductive clamp slides along the first guide section; the first conductive clamp is in a normally closed state when the first conductive clamp slides between the first guide section and the second guide section; and the second guide section guides the first conductive clamp to open again when the first conductive clamp slides along the second guide section.

Thus, the normally closed conductive clamp can be opened or closed at a preset position.

In a possible implementation in the first aspect, the first clamping portion is fixed relative to the first conveying belt; the second clamping portion is movably connected with the first clamping portion; the second clamping portion can move up and down relative to the first clamping portion and the second clamping face is located above the first clamping face; the first guide section and the second guide section comprise an ascending slope and a descending slope provided in sequence along the first direction; the second clamping portion is gradually lifted when the second clamping portion cooperates with the ascending slope, so that the first conductive clamp is opened; and the second clamping portion is gradually lowered under an action of gravity when the second clamping portion cooperates with the descending slope, so that the first conductive clamp is closed.

Thus, when the normally closed conductive clamp moves to the entering side of the plating solution tank, the second clamping portion cooperates with the first guide section; the second clamping portion is first lifted by the ascending slope and then lowered along the descending slope, so that the normally closed conductive clamp is opened and then closed, thereby clamping the conductive substrate film. Then, the normally closed conductive clamp, kept in the clamping state, conveys the conductive substrate film in the plating solution tank; when the normally closed conductive clamp moves to the exiting side of the plating solution tank, the second clamping portion cooperates with the second guide section and is lifted by the ascending slope of the second guide section to open the normally closed conductive clamp to release the conductive substrate film.

In a possible implementation in the first aspect, the first conveying belt and the second conveying belt are both elliptical conveying belts.

Thus, the elliptical conveying belt may circularly convey the plurality of first conductive clamps, so as to continuously convey the conductive substrate film.

In a possible implementation in the first aspect, the first conveying belt comprises a first horizontal section and a second horizontal section; the first horizontal section and the second horizontal section are parallel to each other and extend along the first direction; one end of the first horizontal section is connected with one end of the second horizontal section by a first arc section, and the other end of the first horizontal section is connected with the other end of the second horizontal section by a second arc section; the first driving assembly comprises a motor, a driving wheel and a driven wheel; a rotating shaft of the driving wheel and a rotating shaft of the driven wheel are parallel to each other; the motor is configured to drive the mater wheel to rotate, the first arc section is sleeved on the driving wheel, and the second arc section is sleeved on the driven wheel.

Thus, by providing the driving wheel and the driven wheel to drive the first conveying belt to convey, the movement stability of the conveying belt can be improved.

In a possible implementation in the first aspect, the film plating machine further comprises a first conductive clamp cleaning mechanism and a second conductive clamp cleaning mechanism symmetrically provided on both sides of the plating solution tank; the first conductive clamp cleaning mechanism is configured to clean the first conductive clamp, and the second conductive clamp cleaning mechanism is configured to clean the second conductive clamp, the first conductive clamp cleaning mechanism comprising:

    • a first water washing device provided downstream from the plating solution tank along the movement trajectory of the first conductive clamp, and the first water washing device is configured to wash the first conductive clamp with water to remove plating solution on an exterior of the first conductive clamp;
    • an acid pickling and electrolyzing device provided downstream from the first water washing device along the movement trajectory of the first conductive clamp, and the acid pickling and electrolyzing device performs acid pickling and electrolysis on the first conductive clamp with acid pickling solution to remove a metal plating layer on an exterior of the first conductive clamp; and
    • a second water washing device provided downstream from the acid pickling and electrolyzing device along the movement trajectory of the first conductive clamp, and the second water washing device is configured to wash the first conductive clamp with water to remove acid pickling solution on an exterior of the first conductive clamp.

The above cleaning method may prevent the acid pickling solution from mixing with the plating solution, while ensuring a better cleaning effect, thereby preventing the plating solution and the acid pickling solution from being polluted.

In a possible implementation in the first aspect, a conductive mechanism is further comprised, the conductive mechanism comprising:

    • a first conductive assembly comprising a plurality of first electric brushes arranged along the first direction, and a plurality of first conductive blocks provided on the first conveying belt, wherein the plurality of first electric brushes are fixed relative to the plating solution tank and are electrically connected to the negative electrode of the power supply; the first conductive block can form a sliding electrical connection with the first electric brush when the first conveying belt drives the first conductive block to move to positions of the first electric brushes; and
    • a second conductive assembly comprising a plurality of second electric brushes arranged along the first direction, and a plurality of second conductive blocks provided on the second conveying belt, wherein the plurality of second electric brushes are fixed relative to the plating solution tank and are electrically connected to the negative electrode of the power supply; the second conductive block can form a sliding electrical connection with the second electric brushes when the second conveying belt drives the second conductive block to move to positions of the second electric brushes.

Thus, the conductive clamp is powered on only when the conductive clamp clamps the conductive substrate film, thereby saving electric energy.

In a possible implementation in the first aspect, the plating solution tank comprises:

    • a main tank in which the plating solution is provided;
    • an auxiliary tank in which the plating solution is provided, and the plating solution in the main tank can overflow into the auxiliary tank after reaching a preset solution level; and
    • a circulating pump configured to extract the plating solution in the auxiliary tank and transport it into the main tank.

Thus, the plating solution can be circularly supplied, and thus the plating solution in the main tank is always in a flowing state, and metal cations in the plating solution can be uniformly distributed in concentration, so as to achieve a consistent thickness of the plating layer on the surface of the conductive substrate film.

In a possible implementation in the first aspect, the anode member is formed by splicing a plurality of anode member splicing units; the plurality of anode member splicing units are arranged along a width direction of the plating solution tank, and two adjacent anode member splicing units are separated by an insulating medium; and each anode member splicing unit is connected with the positive electrode of the power supply.

Thus, a parallel connection may be formed among the plurality of anode member splicing units, and thus current of the power supply into each anode member splicing unit is similar in magnitude, thereby ensuring consistency of the plating layer on the surface of the conductive substrate film.

In a second aspect, an embodiment of the present application further discloses an electroplating production line comprising:

    • an unwinding mechanism configured to unwind a conductive substrate film not plated with a film;
    • the film plating machine according to the first aspect; and
    • a winding mechanism configured to wind the conductive substrate film plated with the film,
      wherein the unwinding mechanism, the film plating machine and the winding mechanism are sequentially provided along a conveying direction of the conductive substrate film.

The electroplating production line provided by an embodiment of the present application adopts the film plating machine according to the first aspect. Therefore, the conductive substrate film can be kept in the plating solution during the film plating process, and thus the cooling effect of the conductive substrate film can be ensured, and the conductive substrate film is prevented from being electrically broken down. Moreover, since the conductive substrate film in the plating solution has a strong ability to withstand current, the power supply current can be appropriately increased, and the electroplating efficiency is improved.

In a possible implementation in the second aspect, the following is further comprised:

    • a cleaning tank configured to clean the plating solution on a surface of the conductive substrate film;
    • a passivation tank configured to form an anti-oxidation plating layer on a surface of the conductive substrate film;
    • an oven configured to remove antioxidant solution remaining on a surface of the conductive substrate film; and
    • a splitting device configured to cut off regions on both sides of the conductive substrate film clamped by the conductive substrate film conveying device,
      wherein the cleaning tank, the passivation tank, the oven and the splitting device are provided in sequence between the film plating machine and the winding mechanism.

Thus, a current collector belt having a uniform plating layer and an anti-oxidation effect can be formed.

BRIEF DESCRIPTION OF DRAWINGS

Drawings required for use in the description of embodiments will be introduced briefly below in order to explain the technical solutions of the embodiments of the present application more clearly, it will be apparent that the drawings described below are merely illustrative of some embodiments of the present application, and those skilled in the art can also obtain, from these drawings, other drawings without inventive efforts.

FIG. 1 is a structural schematic diagram of an existing electroplating production line;

FIG. 2 is a three dimensionally structural schematic view of a film plating machine provided by an embodiment of the present application;

FIG. 3 is a top view of FIG. 2;

FIG. 4 is a three dimensionally structural schematic view of a first conveying device;

FIG. 5 is a three dimensionally structural schematic view of a normally open conductive clamp;

FIG. 6 is an exploding view of FIG. 5;

FIG. 7 is a structural schematic view of a normally open conductive clamp entering and exiting an opening and closing mechanism;

FIG. 8 is a three dimensionally structural schematic view of a normally closed conductive clamp;

FIG. 9 is a structural schematic view of a normally closed conductive clamp entering and exiting an opening and closing mechanism;

FIG. 10 is a structural schematic view of a normally closed conductive clamp;

FIG. 11 is an enlarged view of a portion A in FIG. 10;

FIG. 12 is a cross-sectional view taken along A-A of FIG. 10;

FIG. 13 is a structural schematic view of a second clamping face of the normally closed conductive clamp;

FIG. 14 is a three dimensionally structural schematic view of a film plating machine provided with a conductive mechanism provided by an embodiment of the present application;

FIG. 15 is an enlarged view of a portion B in FIG. 14;

FIG. 16 is a top structural schematic view of a film plating machine provided with a first conductive cleaning mechanism and a second conductive cleaning mechanism provided by an embodiment of the present application;

FIG. 17 is a sectional structural view of a plating solution tank;

FIG. 18 is a structural schematic view of an anode member;

FIG. 19 is a structural schematic view of an electroplating production line provided by an embodiment of the present application.

Reference signs are described as follows:

    • 01—unwinding reel, 02—electrolyte tank, 03—plating solution bath, 04—water washing bath, 05—passivation bath, 06—drying box, 07—splitter, 08—anode plate, 09—conductive roller, 010—winding reel, 100—plating solution tank, 101—main tank, 102—auxiliary tank, 103—circulating pump, 104—liquid supply pipe, 105—spraying device, 200—conductive substrate film conveying device, 201—first conveying belt, 2011—first horizontal section, 2012—second horizontal section, 2013—first arc section, 2014—second arc section, 202—second conveying belt, 203—first conductive clamp, 2031—bracket, 2032—first clamping portion, 2033—second clamping portion, 2034—guide column, 2035—elastic member, 2036—fixed clamping portion, 2037—movable clamping portion, 20361—first clamping face, 20371—second clamping face, 2038—first sealing portion, 2039—second sealing portion, 204—second conductive clamp, 205—first driving assembly, 2051—driving wheel, 2052—driven wheel, 206—second driving assembly, 300—anode member, 301—anode member splicing unit, 302—insulating medium, 400—opening and closing mechanism, 401—upper guide rail, 402—lower guide rail, 403—first guide section, 404—second guide section, 4031—ascending slope, 4032—descending slope, 405—elliptical guide rail, 500—conductive mechanism, 510—first conductive assembly, 511—first conductive block, 512—first electric brush, 520—second conductive assembly, 521—second conductive block, 522—second electric brush, 600—first conductive clamp cleaning mechanism, 601—first water washing device, 602—acid pickling and electrolyzing device, 603—second water washing device, 700—second conductive clamp cleaning mechanism, 1—unwinding mechanism; 2—first flattening roller, 3—film plating machine, 4—cleaning tank, 5—passivation tank, 6—oven, 7—splitting device, 8—second flattening roller, 9—compression roller, 10—winding device, 800—conductive substrate film.

DETAILED DESCRIPTION OF EMBODIMENTS

The technical solutions of the present application will be described clearly and completely with reference to the drawings in embodiments of the present application. It is apparent that the embodiments described are only some, but not all of the embodiments of the present application. All the other embodiments, obtained by those skilled in the art in light of the embodiments of the present application without inventive efforts, will fall within the claimed scope of the present application.

In the present application, orientation or positional relationship indicated by terms “on”, “below”, “left”, “right”, “front”, “rear”, “top”, “bottom”, “inside”, “outside”, “center”, “vertical”, “horizontal”, “transversal”, “longitudinal”, etc. is based on the orientation or positional relationship shown in the drawings. These terms are primarily used to better describe the present application and its embodiments, and are not intended to define the indicated device, element or component must have a particular orientation, or must be configured and operated in a particular orientation.

Moreover, in addition to orientation or positional relationship, some of the above terms may be used to indicate other meanings, for example, the term “on” may also be used to indicate a certain dependency or connection relationship in some cases. For an ordinary skilled in the art, the specific meaning of the above terms in the present application may be understood according to specific circumstances.

Furthermore, terms “install”, “provide”, “arrange”, “connect”, and “couple” should be interpreted broadly. For example, the connection may be a fixed connection, a detachable connection, or a unitary structure; it may be a mechanical connection, or an electrical connection; it may be a direct connection, or an indirectly connection made through an intermediate media, or it may be an inside communication between two devices, elements, or components. For an ordinary skilled in the art, the specific meaning of the above terms in the present application may be understood according to specific circumstances.

In addition, terms “first” and “second” etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not intended to indicate or imply indicated relative importance and number of the indicated devices, elements or components. Unless stated otherwise, “plurality” means two or more than two.

Electroplating is a process in which a layer of other metals or alloys is plated on the surface of some plated members with the principle of electrolysis. For example, a plated metal or other insoluble material is used as the anode, the workpiece to be plated is used as the cathode, and the liquid containing ions of the plated metal is used as the plating solution. Before electroplating, the anode and the cathode are powered on, and the current forms a loop among the anode, the plating solution and the cathode. During the electroplating process, the cations of the plated metal are reduced on the surface of the workpiece to be plated to form a plating layer.

In the process of fabricating a current collector of the lithium ion battery, an electroplating process is usually used to form a thick metal plating layer on a conductive substrate film to fabricate the current collector. For example, the electroplating process can be completed by using a film plating machine.

FIG. 1 shows a structural schematic diagram of an electroplating production line, comprising the following provided in sequence: an unwinding reel 01, an electrolyte tank 02, a water washing bath 04, a passivation bath 05, a drying box 06, a splitter 07, and a winding reel 010. The electrolyte tank 02 is provided therein with a plurality of plating solution baths 03. Plating solution and an anode plate 08 are provided in the plating solution bath 03. A conductive roller is provided outside the plating solution bath 03. After being discharged from the unwinding reel 01, the conductive substrate film then enters each plating solution bath 03 in turn for electroplating. The anode plate 08 in the plating solution bath 03 is electrically connected with the anode of the power supply, the conductive roller 09 is electrically connected with the negative electrode of the power supply, and the conductive substrate film 800 passes through between the two conductive rollers 09 and contacts the conductive roller 09, such that the conductive substrate film 800 can be communicated with the negative electrode of the power supply, and that the conductive substrate film 800 in the plating solution bath 03 is electroplated.

Since the conductive roller 09 is made of metal, in order to prevent the surface of the conductive roller 09 from being electroplated, the conductive roller 09 can only be provided outside the plating solution bath 03. Therefore, the conductive substrate film 800 is also outside the plating solution tank 03 when passing through the conductive roller 09, where the cooling effect of the conductive substrate film 800 exposed to the air will decrease, and then the conductive substrate film 800 would have electrical breakdown through-holes, which affects the product yield. Moreover, since the ability of the conductive substrate film 800 exposed to the air to withstand current will be weakened, a larger current cannot be applied, thereby affecting the efficiency of conducting electricity.

In view of the above, an embodiment of the present application provides a film plating machine and electroplating production line, where the conductive film can be always in the plating solution during film plating, such that the conductive substrate film may be prevented from being electrically broken down, and the electroplating efficiency may be improved.

The film plating machine and electroplating production line will be described in detail below through specific embodiments:

According to an exemplary embodiment of the present application, a film plating machine is provided. As shown in FIGS. 2 and 3, the film plating machine comprises a plating solution tank 100, a conductive substrate film conveying device 200 and a power supply. Plating solution and an anode member 300 are provided in the plating solution tank 100. The anode member 300 is immersed in the plating solution and is electrically connected with the positive electrode of the power supply, acting as an electroplating anode.

The conductive substrate film conveying device 200 is configured to clamp the two opposite side edges of a horizontally-placed conductive substrate film 800 and drive the conductive substrate film 800 to horizontally enter and exit the plating solution tank 100 in a first direction; and the conductive substrate film conveying device 200 is electrically communicated with the negative electrode of the power supply, so that the current can be conducted to the conductive substrate film 800, and that the conductive substrate film 800 acts as the electroplating cathode.

In the process in which the conductive substrate film conveying device 200 drives the conductive substrate film 800 to convey, the conductive substrate film conveying device 200 horizontally clamps and conveys the conductive substrate film 800, and electricity is conducted to the conductive substrate film 800 through the conductive substrate film conveying device 200, and there is no need of using a conductive roller for conducting electricity. Therefore, the conductive substrate film 800 can be always located in the plating solution during the film plating process, thereby ensuring cooling effect of the conductive substrate film 800 and preventing the conductive substrate film 800 from being electrically broken down. Moreover, since the conductive substrate film 800 in the plating solution has a strong ability to withstand current, the power supply current can be appropriately increased, and the electroplating efficiency is improved.

It should be noted that the above first direction is the direction in which the conductive substrate film 800 is conveyed, and it can also be understood as the lengthwise direction of the plating solution tank 100, that is, the direction X in FIGS. 2 and 3.

In order to horizontally clamp and convey the conductive substrate film 800, as shown in FIGS. 2 and 3, the conductive substrate film conveying device 200 may comprise a first conveying device and a second conveying device, and the first conveying device comprises a first conveying belt 201, a first driving assembly 205 and a first conductive clamp 203. The second conveying device comprises a second conveying belt 202, a second driving assembly 206 and a second conductive clamp 204. The first conveying belt 201 and the second conveying belt 202 are parallel to each other and extend along the direction X. The first conveying belt 201 and the second conveying belt 202 are respectively provided on both sides of the plating solution tank 100. The first conveying belt 201 is provided thereon with a plurality of first conductive clamps 203 arranged in the direction X, and the second conveying belt 202 is provided thereon with a plurality of second conductive clamps 204 arranged in the direction X. The first driving assembly 205 is configured to drive the first conveying belt 201 to convey along the direction X, thereby driving the first conductive clamp 203 to move along the direction X, and the second driving assembly 206 is configured to drive the second conveying belt 202 to move along the direction X, thereby driving the second conductive clamp 204 to move in the direction X.

The first conductive clamp 203 and the second conductive clamp 204 are respectively configured to clamp the two opposite side edges of the horizontally placed conductive substrate film 800, and the first conductive clamp 203 and the second conductive clamp 204 can communicate with the negative electrode of the power supply, when the first conductive clamp 203 and the second conductive clamp 204 clamp the conductive substrate film 800. Thus, the conductive substrate film 800 can be horizontally clamped and conveyed, and the conductive substrate film 800 may be electrically connected with the negative electrode of the power supply without using a conductive roller.

In the following, the specific implementation for clamping and conveying the conductive substrate film 800 is illustrated by taking only the first conveying belt 201 and the first conductive clamp 203 as an example, and a similar reference may be made with respect to the clamping and conveying mode for the second conveying belt 202 and the second conductive clamp 204.

As shown in FIG. 4, the first conveying belt 201 is a closed elliptical structure, and is driven to rotate by the driving wheel 2051 and the driven wheel 2052. For example, the elliptical conveying belt comprises a first horizontal section 2011 and a second horizontal section 2012 parallel to each other; the first horizontal section 2011 and the second horizontal section 2012 are parallel to each other and extend along the direction X; one end of the first horizontal section 2011 is connected with one end of the second horizontal section 2012 by a first arc section 2013, and the other end of the first horizontal section is connected with the other end of the second horizontal section by a second arc section 2014. The first arc section 2013 is sleeved on the driving wheel 2051, and the second arc section 2014 is sleeved on the driven wheel 2052. The rotating shaft of the driving wheel 2051 and the rotating shaft of the driven wheel 2052 are provided vertically, and the conveying belt is provided upright, that is, the surface of the conveying belt is perpendicular to the horizontal plane. When the driving wheel 2051 rotates, the elliptical conveying belt may be driven to move along an elliptical trajectory parallel to the horizontal plane.

The process where the first conveying belt 201 conveys the conductive substrate film 800 is approximately as follows: the plating solution tank 100 is provided close to the first horizontal section 2011; the first conductive clamp 203 is provided around the circumference of the elliptical conveying belt; the first conductive clamp 203 clamps the conductive substrate film 800 when approaching the plating solution tank 100, and drives the conductive substrate film 800 to enter the plating solution tank 100, and also powers on the conductive substrate film 800 through the clamping face. After leaving the plating solution tank 100, the first conductive clamp 203 releases the conductive substrate film 800 and, driven by the elliptical conveying belt, turns to the side away from the plating solution tank 100. A first conductive clamp cleaning mechanism may be provided on a side of the first conveying belt 201 away from the plating solution tank 100 to clean the plating solution and the plating layer on the first conductive clamp 203, and the cleaned first conductive clamp 203 is again conveyed by the elliptical conveying belt to a side close to the plating solution tank 100, to clamp and convey the conductive substrate film 800 that enters subsequently. The plurality of first conductive clamps 203 provided on the first conveying belt 201 perform the above operations cyclically, so as to continuously convey the conductive substrate film 800.

In the above process, in order that the first conductive clamp 203 is opened or closed at the preset position, an opening and closing mechanism 400 for controlling the opening and closing of the first conductive clamp 203 may be provided on the movement trajectory of the first conductive clamp 203. The opening and closing mechanism 400 is also different with respect to the first conductive clamp 203 with a different structure, which will be described below by examples, respectively.

In a possible implementation, as shown in FIGS. 5 and 6, the first conductive clamp 203 is a normally open conductive clamp, comprising a bracket 2031, a first clamping portion 2032 and a second clamping portion 2033; the bracket 2031 is provided thereon with a guide column 2034, the first clamping portion 2032 and the second clamping portion 2033 are both slidably connected with the guide column 2034, an elastic member 2035 is provided between the first clamping portion 2032 and the second clamping portion 2033, and the elastic member 2035 is configured to keep the first clamping portion 2032 and the second clamping portion 2033 in the opening state.

In order that the normally open conductive clamp is opened or closed at the preset position, the opening and closing mechanism 400 may be provided as the following structure: as shown in FIG. 7, the opening and closing mechanism 400 comprises an upper guide rail 401 and a lower guide rail 402 oppositely provided, a movement trajectory of the first conductive clamp 203 is located between the upper guide rail 401 and the lower guide rail 402; along a movement direction of the first conductive clamp 203, a gap between a lower surface of the upper guide rail 401 and an upper surface of the lower guide rail 402 first gradually narrows, then remains unchanged, and finally increases gradually, and a portion of the first guide rail where the gap remains unchanged corresponds to a position of the plating solution tank 100. Thus, when the normally open conductive clamp moves to a portion where a gap between the upper guide rail 401 and the lower guide rail 402 is gradually reduced, the first clamping portion 2032 and the second clamping portion 2033 are respectively squeezed by the upper guide rail 401 and the lower guide rail 402 and gradually move closer, and when the normally open conductive clamp enters the portion where a gap between the upper guide rail 401 and the lower guide rail 402 remains unchanged, the first clamping portion 2032 and the second clamping portion 2033 fold to clamp the conductive substrate film 800; in the course where the normally open conductive clamp moves in the portion with unchanged gap, the conductive substrate film 800 is clamped and conveyed by the normally open conductive clamp in the plating solution tank 100; when the normally open conductive clamp moves to the portion where a gap between the upper guide rail 401 and the lower guide rail 402 is gradually increased, the first clamping portion 2032 and the second clamping portion 2033 are gradually separated from each other under an action of the elastic member 2035, so that the conductive substrate film 800 may be released. Thus, the normally open conductive clamp can be opened or closed at a preset position.

In another possible implementation, as shown in FIG. 8, the first conductive clamp 203 is a normally closed conductive clip, comprising a fixed clamping portion 2036 and a movable clamping portion 2037; the fixed clamping portion 2036 is fixed relative to the first conveying belt 201; the movable clamping portion 2037 is movably connected with the fixed clamping portion 2036; the movable clamping portion 2037 can move up and down relative to the fixed clamping portion 2036; and the clamping face of the movable clamping portion 2037 is located above the clamping face of the fixed clamping portion 2036.

In order that the normally closed conductive clamp is opened or closed at the preset position, the opening and closing mechanism 400 may be provided as the following structure: as shown in FIG. 9, the opening and closing mechanism 400 comprises a first guide section 403 and a second guide section 404; the first guide section 403 corresponds to an entering side of the plating solution tank 100; the second guide section 404 corresponds to an exiting side of the plating solution tank 100; the first guide section 403 and the second guide section 404 comprise an ascending slope 4031 and a descending slope 4032 provided in sequence along the first direction; the movable clamping portion 2037 is gradually lifted when the movable clamping portion 2037 cooperates with the ascending slope 4031, so that the first conductive clamp 203 is opened, and the movable clamping portion 2037 is gradually lowered under an action of gravity when the movable clamping portion 2037 cooperates with the descending slope 4032, so that the first conductive clamp 203 is closed. Thus, when the normally closed conductive clamp moves to the entering side of the plating solution tank 100, the movable clamping portion 2037 cooperates with the first guide section 403, and the movable clamping portion 2037 is first lifted by the ascending slope 4031 and then lowered along the descending slope 4032, so that the normally closed conductive clamp is opened and then closed, thereby clamping the conductive substrate film 800. Then, the normally closed conductive clamp, kept in the clamping state, conveys the conductive substrate film 800 in the plating solution tank 100; when the normally closed conductive clamp moves to the exiting side of the plating solution tank 100, the movable clamping portion 2037 cooperates with the second guide section 404 and is lifted by the ascending slope 4031 of the second guide section 404 to open the normally closed conductive clamp to release the conductive substrate film 800. Thus, the normally closed conductive clamp can be opened or closed at a preset position.

In addition to the function of driving the conductive substrate film 800 to move, the conductive clamp is also configured to electrically communicate the negative electrode of the power supply with the conductive substrate film 800. Therefore, the conductive clamp needs to be able to conduct electricity. The normally closed conductive clamp is taken as an example, and as shown in FIGS. 10 and 11, the fixed clamping portion 2036 of the conductive clamp comprises a first clamping face 20361 which is a conductive face and is electrically communicated with the negative electrode of the power supply; the movable clamping portion 2037 of the conductive clamp comprises a second clamping face 20371 which is a conductive face and is electrically communicated with the negative electrode of the power supply; when the conductive clamp clamps the conductive substrate film 800, the first clamping face 20361 and the second clamping face 20371 both contact and are electrically communicated with the conductive substrate film 800. Thus, the conductive substrate film 800 can be electrically communicated with the negative electrode of the power supply.

Since the conductive clamp does not need to be connected to a power supply when not clamping the conductive substrate film 800, in order to save electric energy, the conductive clamp may be designed such that the conductive clamp is only powered on when clamping the conductive substrate film 800, and can be disconnected from the power supply when not clamping the conductive substrate film 800. In order to perform the above function, the following conductive mechanism 500 can be used.

As shown in FIGS. 14 and 15, the conductive mechanism 500 comprises a first conductive assembly 510 and a second conductive assembly 520; the first conductive assembly 510 comprises a plurality of first conductive blocks 511 provided on an upper edge of the first conveying belt 201, and a plurality of first electric brushes 512 provided near an edge of the plating solution tank 100 and corresponding to position of the first horizontal section 2011 of the first conveying belt 201, and the plurality of first electric brushes 512 are electrically connected with the negative electrode of the power supply. The plurality of first electric brushes 512 are all fixed structures and do not move with the first conveying belt 201, and they are arranged along the moving path of the first conductive blocks 511. When the first conveying belt 201 drives the first conductive block 511 to move to the position of the first electric brush 512, a sliding electrical connection can be formed between the first conductive block 511 and the first electric brush 512, so that the corresponding first conductive clamp 203 below the first conductive block 511 is electrically communicated with the negative electrode of the power supply. And the first conductive block 511 that is not in contact with the first electric brush 512 is disconnected from the power supply, and the corresponding first conductive clamp 203 is also not powered on. Thus, the first conductive clamp 203 is powered on only when the conductive substrate film 800 is clamped, thereby saving electric energy.

Correspondingly the second conductive assembly 520 comprises a plurality of second conductive blocks 521 provided on an upper edge of the second conveying belt 202, and a plurality of second electric brushes 522 provided near an edge of the plating solution tank 100 and corresponding to the side of the second conveying belt 202 close to the plating solution tank, and the plurality of second electric brushes 522 are electrically connected with the negative electrode of the power supply. The plurality of second electric brushes 522 are all fixed structures and do not move with the second conveying belt 202, and they are arranged along the moving path of the second conductive blocks 521. The second conductive assembly 520 and the first conductive assembly 510 have similar operating principles, and details are not described here.

Further, the length that the plurality of first electric brushes 512 and the plurality of second electric brushes 522 are arranged along the first direction can be adaptive to the length of the plating solution tank 100, so that the first conductive clamp 203 and the second conductive clamp 204 can always be electrically communicated with the negative electrode of the power supply while moving in the plating solution tank 100, and the first conductive clamp 203 and the second conductive clamp 204 are disconnected from the power supply when leaving the plating solution tank.

In the process of electroplating, the conductive clamp needs to enter and exit the plating solution frequently. Moreover, because the conductive clamp is made of conductive material, a plating layer is often formed on the surface of the conductive clamp, which affects the use of the conductive clamp. Moreover, generally the electrical conductivity of the conductive clamp will be stronger than that of the plating layer, so directly contacting the conductive clamp with the plating solution will reduce the current flowing through the plating member, thereby reducing the electroplating efficiency.

Therefore, in order to prevent the above problem, all portions of the conductive clamp except the clamping face can be designed as insulating surfaces. For example, the entire conductive clamp can be made of insulating materials, with a conductive sheet provided only on the first clamping face 20361 and the second clamping face 20371, where the conductive sheet is then connected to the negative electrode of the power supply through a wire.

In addition, as shown in FIG. 10, the entire conductive clamp can also be made of conductive metal material, and then a layer of insulating sleeve is encapsulated on the surface of the conductive clamp, and the insulating sleeve is provided avoiding from the first clamping face 20361 and the second clamping face 20371. By such a provision, the entire interior of the conductive clamp may be a conductive body, so that electrically can be conducted from the interior of the conductive clamp, powering on the first clamping face 20361 and the second clamping face 20371. For example, the top of the conductive clamp may have a portion of conductive surface exposed and not encapsulated with an insulating layer, or may have a conductive hole opened at the top to connect with the negative electrode of the power supply, such that the provision of wires may be avoided, and the structure of the conductive clamp is simplified.

In order to further prevent the clamping face of the conductive clamp from being plated with copper, as shown in FIG. 11, a first sealing portion 2038 may be provided around the first clamping face 20361, and a second sealing portion 2039 may be provided around the second clamping face 20371. Thus, when the conductive clamp is in the clamping state, the first sealing portion 2038 can cooperate with the second sealing portion 2039 to seal the first clamping face 20361 and the second clamping face 20371. When the conductive clamp in the clamping state needs to enter the plating solution, the portion of the conductive clamp entering the plating solution will be completely protected by the insulating layer, so that the current flowing through the plating member will be increased and the plating efficiency will be improved. Moreover, the region where the first clamping face 20361 and the second clamping face 20371 of the conductive clamp are located will be sealed by the first sealing portion 2038 and the second sealing portion 2039 after cooperating, and thus the plating solution is prevented from contacting the first clamping face 20361 and the second clamping face 20371, and thus the first clamping face 20361 and the second clamping face 20371 are prevented from being plated with copper, so that successful opening and closing of the conductive clamp are ensured, and the conductive substrate film 800 is prevented from being punctured by plating layer on the clamping face.

For example, the first sealing portion 2038 and the second sealing portion 2039 may be implemented in various manners. As shown in FIGS. 12 and 13, the first sealing portion 2038 may be designed as a first sealing ring provided around the first clamping face 20361, and the second sealing portion 2039 may be designed as a first annular sealing slot provided around the second clamping face 20371; when the conductive clamp is in the clamping state, the portion of the first sealing ring protruding from the first clamping face 20361 cooperatively fits into the first annular sealing slot, and the conductive substrate film 800 in contact with the end of the first sealing ring is also squeezed into the first annular sealing slot along with the first sealing ring, thereby sealing the first clamping face 20361 and the second clamping face 20371 to prevent the plating solution from contacting the clamping face. With the structure being a structure where the sealing ring and the annular sealing slot cooperate, the sealing area may be increased, and the sealing effect may be further improved.

Of course, although the above protection measures are taken, the conductive clamp may still be plated with copper under some special circumstances, and the conductive clamp will also appear to have a plating solution after being removed from the plating solution tank 100. Therefore, the conductive clamp removed from the plating solution tank 100 can be cleaned, so as to improve the operating reliability of the conductive clamp. For example, a conductive clamp cleaning mechanism may be provided on the movement trajectory after the conductive clamp is removed out of the plating solution tank 100. As shown in FIG. 16, the conductive clamp cleaning mechanism comprises a first conductive clamp cleaning mechanism 600 and a second conductive clamp cleaning mechanism 700 symmetrically provided on both sides of the plating solution tank 100; the first conductive clamp cleaning mechanism 600 is configured to clean the first conductive clamp 203, and the second conductive clamp cleaning mechanism 700 is configured to clean the second conductive clamp 204. The first conductive clamp cleaning mechanism 600 is taken as an example below for illustration, and a similar reference may be made with respect to the second conductive clamp cleaning mechanism 700.

As shown in FIG. 16, the first conductive clamp cleaning mechanism 600 comprises a first water washing device 601, an acid pickling and electrolyzing device 602 and a second water washing device 603 provided in sequence along the movement trajectory of the first conductive clamp 203, wherein the first water washing device 601 is provided downstream from the plating solution tank 100, and the first water washing device 601 is configured to wash the first conductive clamp 203 with water to remove the plating solution on the exterior of the first conductive clamp 203. The acid pickling and electrolyzing device 602 performs acid pickling and electrolysis on the first conductive clamp 203 with acid pickling solution to remove a metal plating layer on the exterior of the first conductive clamp 203. The second water washing device 603 is configured to wash the first conductive clamp 203 with water to remove the acid pickling solution on the exterior of the first conductive clamp 203. The above cleaning method may prevent the acid pickling solution from mixing with the plating solution while ensuring a better cleaning effect, thereby preventing the plating solution and the acid pickling solution from being polluted.

For example, when an elliptical conveying belt is used, the first water washing device 601, the acid pickling and electrolyzing device 602 and the second water washing device 603 are sequentially provided along the conveying direction of the second horizontal section 2012. After leaving the plating solution tank 100, the first conductive clamp 203, driven by the elliptical conveying belt, turns to a side of the first conveying belt 201 away from the plating solution tank 100, passing through the first water washing device 601, the acid pickling and electrolyzing device 602 and the second water washing device 603 in sequence, where the cleaned first conductive clamp 203 is again conveyed by the elliptical conveying belt into the plating solution tank 100, to clamp and convey the conductive substrate film 800.

In the above embodiment, in order to keep the first conductive clamp 203 in the opening state when passing through the first water washing device 601, the acid pickling and electrolyzing device 602 and the second water washing device 603, as shown in FIG. 16, the opening and closing mechanism 400 may be provided as an elliptical guide rail 405 with a fracture; the elliptical guide rail 405 is provided around the elliptical conveying belt, and the fracture of the elliptical guide rail 405 corresponds to the position of the plating solution tank 100. By such a provision, the first conductive clamp 203 and the elliptical guide rail 405 are in the opening state at positions where they cooperate, and are only closed at the fracture. Thus, the first conductive clamp 203 is kept in the opening state when passing through the first water washing device 601, the acid pickling and electrolyzing device 602 and the second water washing device 603, and thus the cleaning device is facilitated to clean the clamping face of the conductive clamp, and the cleaning effect is improved.

The plating solution tank 100 is provided therein with a plating solution, and the plating solution contains metal cations for forming the electroplating layer. In order to homogenize the concentration of metal cations in the plating solution, the plating solution can be kept in a flowing state. In order to achieve the above purpose, as shown in FIG. 17, the plating solution tank 100 comprises a main tank 101 and an auxiliary tank 102. The main tank 101 and the auxiliary tank 102 are both provided with plating solution, and the plating solution in the main tank 101 can overflow into the auxiliary tank 102 after reaching the preset liquid level. A circulating pump 103 is also connected between the main tank 101 and the auxiliary tank 102, and the circulating pump 103 can extract the plating solution in the auxiliary tank 102 and transport it into the main tank 101.

Thus, the plating solution in the main tank 101 can overflow into the auxiliary tank 102 after reaching the preset liquid level, and the plating solution in the auxiliary tank 102 can be replenished into the main tank 101 under the action of the circulating pump 103 and the spraying device 105. Thus, the plating solution can be circularly supplied, and thus the plating solution in the main tank 101 is always in a flowing state, and metal cations in the plating solution can be uniformly distributed in concentration, so as to achieve a consistent thickness of the plating layer on the surface of the conductive substrate film 800.

For example, a liquid supply pipe 104 may be provided in the main tank 101 or a spraying device 105 may be provided above the main tank 101, and the circulating pump 103 is connected with the liquid supply pipe 104 or the spraying device 105 to replenish the plating solution to the main tank 101.

The anode member 300 is another factor affecting the consistency of the surface thickness of the conductive substrate film 800. Since the anode member 300 is usually an integral structure, the length of the anode member 300 is adaptive to the width specification of the film plating machine. When the width specification of the film plating machine is small, the length of the anode member 300 is small, and the current flowing in each portion of the anode member is similar, and the consistency of the plating layer on the surface of the conductive substrate film 800 can be ensured; when the width specification of the film plating machine is large, the length of the anode member 300 will be longer, and since the current is usually connected from both ends of the anode member 300, the current at both ends of the anode member 300 will be large, and the current in the middle portion of the anode member 300 will be too small. However, the magnitude of the current will directly affect the thickness of the plating layer on the conductive substrate film 800, that is, the region with a larger current on the anode member 300 will render a thicker plating layer in the corresponding region on the conductive substrate film 800, and the region with a small current on the anode member 300 will render a thinner plating layer in the corresponding region on the conductive substrate film 800.

Therefore, in order to improve the consistency of the plating layer on the surface of the conductive substrate film 800, as shown in FIG. 18, the anode member 300 may be formed by splicing a plurality of anode member splicing units 301, where the plurality of anode member splicing units 301 are arranged along a widthwise direction of the plating solution tank 100, and two adjacent anode member splicing units 301 are separated by an insulating medium 302, and each anode member splicing unit 301 is connected to the positive electrode of the power supply.

Thus, a parallel connection may be formed among a plurality of anode member splicing units 301, and thus current of the power supply into each anode member splicing unit 301 is similar in magnitude, thereby ensuring consistency of the plating layer on the surface of the conductive substrate film 800.

It should be noted that the above anode member splicing unit 301 may be a soluble anode member, such as titanium blue and phosphor bronze balls provided in the titanium blue, or may be an insoluble anode member, such as an insoluble anode plate. Limitation is not made here.

According to another exemplary embodiment of the present application, an electroplating production line is provided. As shown in FIG. 19, the electroplating production line an unwinding mechanism 1, a first flattening roller 2, a film plating machine, a cleaning tank 4, a passivation tank 5, an oven 6, a splitting device 7, a second flattening roller 8, a compression roller 9, and a winding device 10 provided in sequence along the conveying direction of the conductive substrate film 800.

The specific operation process of the above electroplating production line is as follows: before film plating, a traction film is provided on the unwinding mechanism 1, and then the mechanical transmission portion of the electroplating production line is started, and driven by the mechanical transmission portion, the traction film passes through the entire production line and reaches the winding mechanism; after connecting the traction film with the winding mechanism, a conductive substrate film 800 to be plated is provided at the unwinding mechanism 1, and the conductive substrate film 800 to be plated is bonded to the traction film, so that the traction film tracts the conductive substrate film 800 to pass through the first flattening roller 2, the plating solution tank 100 of the film plating machine, the cleaning tank 4, the passivation tank 5, the oven 6, the splitting device 7, the second flattening roller 8, and the compression roller 9, in sequence, and finally reaches the winding device 10 to be winded. Finally, the current collector product plated with the film can be obtained.

It should be noted that the mechanical transmission portion of the above starting equipment mainly refers to starting the unwinding mechanism 1, the winding mechanism, the conductive substrate film conveying device 200 of the film plating machine, and one or more driving rollers distributed on the entire production line (not shown in the figures). The function of the above portion is to provide transmission power to the conductive substrate film, and the rotation speed is the same, so that the function of conveying the conductive substrate film at a constant speed is performed, and the conductive substrate film is prevented from wrinkling or being pulled too tightly during the conveying process.

The unwinding mechanism 1 is configured to unwind the conductive substrate film 800 not film plated, and the sent out conductive substrate film 800 is flattened by the first flattening roller 2 to be transported forward in the horizontal direction, and then the conductive substrate film conveying device 200 of the film plating machine clamps two opposite side edges of the conductive substrate film 800, and conveys the conductive substrate film 800 into the plating solution tank 100 for electroplating, and the electroplated conductive substrate film 800 enters the cleaning tank 4 for cleaning to remove the remaining plating solution on the surface of the conductive substrate film 800, where the cleaned conductive substrate film 800 enters the passivation tank 5 that is configured to form an anti-oxidation plating layer on the surface of the conductive substrate film 800 to prevent the plating layer from being oxidized and discolored in the air. The conductive substrate film 800 formed with the anti-oxidation plating layer is then sent into the oven 6 to remove the anti-oxidation solution remaining on the surface of the conductive substrate film 800. The dried conductive substrate film 800 is split by the splitting device 7 to remove the region on both sides of the conductive substrate film 800 clamped by the conductive substrate film conveying device 200 or to remove the region in which the plating layer is thicker on both sides of the conductive substrate film 800 due to the edge effect of the current. The conductive substrate film 800 kept after the splitting is winded by the winding device 10, and the compression roller 9 provided on the winding device 10 can compress tightly the conductive substrate film 800 to ensure the hardness and flatness of the winding.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments or equivalently replace some or all of the technical features; and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present utility model.

Claims

1. A film plating machine comprising:

a plating solution tank for accommodating a plating solution and an anode member;
conductive substrate film conveying devices provided at both sides of the plating solution tank respectively, wherein the conductive substrate film conveying devices are configured to clamp two opposite side edges of a horizontally-placed conductive substrate film and drive the conductive substrate film to horizontally enter and exit the plating solution tank in a first direction; and
a power supply having a positive electrode electrically connected with the anode member, and a negative electrode electrically connected with the conductive substrate film through the conductive substrate film conveying devices.

2. The film plating machine according to claim 1, wherein the conductive substrate film conveying devices comprise:

a first conveying device comprising a first conveying belt, a first driving assembly and a plurality of first conductive clamps; the first conveying belt extending along the first direction; the plurality of first conductive clamps being arranged on the first conveying belt along the first direction; the plurality of first conductive clamps being electrically communicated with the negative electrode of the power supply, and the first driving assembly being configured to drive the first conveying belt to convey the first conductive clamps along the first direction; and
a second conveying device comprising a second conveying belt, a second driving assembly and a plurality of second conductive clamps; the second conveying belt extending along the first direction; the plurality of second conductive clamps being arranged on the second conveying belt along the first direction; the plurality of second conductive clamps being electrically communicated with a negative electrode of the power supply, and the second driving assembly being configured to drive the second conveying belt to convey the second conductive clamps along the first direction;
wherein the first conveying belt and the second conveying belt are symmetrically provided on both sides of the plating solution tank, and the first conductive clamps and the second conductive clamps are respectively configured to clamp the two opposite side edges of the conductive substrate film.

3. The film plating machine according to claim 2, wherein each of the first conductive clamp and the second conductive clamp comprises:

a first clamping portion comprising a first clamping face, wherein the first clamping face is a conductive face and is electrically communicated with the negative electrode of the power supply; and
a second clamping portion comprising a second clamping face, wherein the second clamping face is a conductive face and is electrically communicated with the negative electrode of the power supply;
wherein the first clamping portion and the second clamping portion can move relative to each other, so that the conductive clamps are in a clamping state or an opening state, and the first clamping face and the second clamping face both contact and are electrically communicated with the conductive substrate film when the conductive clamp clamps the conductive substrate film; and
wherein surfaces of the first conductive clamp and the second conductive clamp are configured such that, except for the first clamping face and the second clamping face, remaining surfaces that can be immersed in the plating solution during film plating are insulating surfaces.

4. The film plating machine according to claim 3, wherein

a first sealing portion is formed on the first clamping portion around the first clamping face;
a second sealing portion is formed on the second clamping portion around the second clamping face; and
the first sealing portion and the second sealing portion cooperatively seal the first clamping face and the second clamping face when the conductive clamp clamps the conductive substrate film.

5. The film plating machine according to claim 4, wherein

the first sealing portion is a first sealing ring provided around the first clamping face;
the first sealing ring at least partially protrudes from the first clamping face; and
the second sealing portion is a first annular sealing slot provided around the second clamping face, and a portion of the first sealing ring protruding from the first clamping face cooperatively fits into the first annular sealing slot when the conductive clamp is in the clamping state.

6. The film plating machine according to claim 3, further comprising an opening and closing mechanism;

wherein
the opening and closing mechanism comprises a first guide rail and a second guide rail symmetrically provided on both sides of the plating solution tank;
the first guide rail and the second guide rail both extend along the first direction; and
the first guide rail is configured to cooperate with the first conductive clamp to guide opening or closing of the first conductive clamp, and the second guide rail is configured to cooperate with the second conductive clamp to guide opening or closing of the second conductive clamp.

7. The film plating machine according to claim 6, wherein

the first conductive clamp is a normally open conductive clamp;
the first guide rail corresponds to a position of the plating solution tank;
the first guide rail comprises a closing guide section, a horizontal guide section and an opening guide section provided in sequence along the first direction;
the first conductive clamp is gradually closed under a guiding action of the closing guide section when the first conductive clamp slides along the closing guide section;
the first conductive clamp keeps moving in the clamping state when the first conductive clamp slides along the horizontal guide section; and
the first conductive clamp is gradually opened under a guiding action of the opening guide section when the first conductive clamp slides along the opening guide section.

8. The film plating machine according to claim 7, wherein the normally open conductive clamp comprises a bracket on which a guide column is provided; the first clamping portion and the second clamping portion are both slidably connected to the guide column; and an elastic member is provided between the first clamping portion and the second clamping portion, and the elastic member is configured to keep the first clamping portion and the second clamping portion in the opening state; and

wherein the first guide rail comprises an upper guide rail and a lower guide rail oppositely provided; a movement trajectory of the first conductive clamp is located between the upper guide rail and the lower guide rail; along a movement direction of the first conductive clamp, a gap between a lower surface of the upper guide rail and an upper surface of the lower guide rail first gradually narrows, subsequently remains unchanged, and finally increases gradually, and a portion of the first guide rail where the gap remains unchanged corresponds to a position of the plating solution tank.

9. The film plating machine according to claim 6, wherein the conductive clamp is a normally closed conductive clamp; the first guide rail comprises a first guide section and a second guide section; the first guide section corresponds to an entering side of the plating solution tank; the second guide section corresponds to an exiting side of the plating solution tank; the first guide section guides the first conductive clamp to open when the first conductive clamp slides along the first guide section; the first conductive clamp is in a normally closed state when the first conductive clamp slides between the first guide section and the second guide section; and the second guide section guides the first conductive clamp to open again when the first conductive clamp slides along the second guide section.

10. The film plating machine according to claim 9, wherein the first clamping portion is fixed relative to the first conveying belt; the second clamping portion is movably connected with the first clamping portion; the second clamping portion can move up and down relative to the first clamping portion and the second clamping face is located above the first clamping face, and

wherein the first guide section and the second guide section comprise an ascending slope and a descending slope provided in sequence along the first direction; the second clamping portion is gradually lifted when the second clamping portion cooperates with the ascending slope, so that the first conductive clamp is opened, and the second clamping portion is gradually lowered under an action of gravity when the second clamping portion cooperates with the descending slope, so that the first conductive clamp is closed.

11. The film plating machine according to claim 2, wherein the first conveying belt and the second conveying belt are each an elliptical conveying belt.

12. The film plating machine according to claim 11, wherein

the first conveying belt comprises a first horizontal section and a second horizontal section; the first horizontal section and the second horizontal section are parallel to each other and extend along the first direction; one end of the first horizontal section is connected with one end of the second horizontal section by a first arc section, and the other end of the first horizontal section is connected with the other end of the second horizontal section by a second arc section; and
wherein the first driving assembly comprises a motor, a driving wheel and a driven wheel; a rotating shaft of the driving wheel and a rotating shaft of the driven wheel are parallel to each other; the motor is configured to drive the mater wheel to rotate, the first arc section is sleeved on the driving wheel, and the second arc section is sleeved on the driven wheel.

13. The film plating machine according to claim 2, wherein the film plating machine further comprises a first conductive clamp cleaning mechanism and a second conductive clamp cleaning mechanism symmetrically provided on both sides of the plating solution tank; the first conductive clamp cleaning mechanism is configured to clean the first conductive clamp, and the second conductive clamp cleaning mechanism is configured to clean the second conductive clamp, the first conductive clamp cleaning mechanism comprising:

a first water washing device provided downstream from the plating solution tank along the movement trajectory of the first conductive clamp, the first water washing device being configured to wash the first conductive clamp with water to remove plating solution on an exterior of the first conductive clamp;
an acid pickling and electrolyzing device provided downstream from the first water washing device along the movement trajectory of the first conductive clamp, the acid pickling and electrolyzing device performing acid pickling and electrolysis on the first conductive clamp with acid pickling solution to remove a metal plating layer on an exterior of the first conductive clamp; and
a second water washing device provided downstream from the acid pickling and electrolyzing device along the movement trajectory of the first conductive clamp, the second water washing device being configured to wash the first conductive clamp with water to remove acid pickling solution on an exterior of the first conductive clamp.

14. The film plating machine according to claim 2, wherein a conducting mechanism is further comprised, the conducting mechanism comprising:

a first conductive assembly comprising a plurality of first electric brushes arranged along the first direction, and a plurality of first conductive blocks provided on the first conveying belt, wherein the plurality of first electric brushes are fixed relative to the plating solution tank and are electrically connected to the negative electrode of the power supply; the first conductive blocks can form a sliding electrical connection with the first electric brushes when the first conveying belt drives the first conductive blocks to move to positions of the first electric brushes; and
a second conductive assembly comprising a plurality of second electric brushes arranged along the first direction, and a plurality of second conductive blocks provided on the second conveying belt, wherein the plurality of second electric brushes are fixed relative to the plating solution tank and are electrically connected to the negative electrode of the power supply; the second conductive block can form a sliding electrical connection with the second electric brushes when the second conveying belt drives the second conductive block to move to positions of the second electric brushes.

15. The film plating machine according to claim 1, wherein the plating solution tank comprises:

a main tank in which the plating solution is provided;
an auxiliary tank in which the plating solution is provided, and the plating solution in the main tank can overflow into the auxiliary tank after reaching a preset solution level; and
a circulating pump configured to extract the plating solution in the auxiliary tank and transport it into the main tank.

16. The film plating machine according to claim 1, wherein the anode member is formed by splicing a plurality of anode member splicing units; the plurality of anode member splicing units are arranged along a width direction of the plating solution tank, and two adjacent anode member splicing units are separated by an insulating medium; and each anode member splicing unit is connected with the positive electrode of the power supply.

17. An electroplating production line comprising:

an unwinding mechanism configured to unwind a conductive substrate film not plated with a film;
the film plating machine according to claim 1; and
a winding mechanism configured to wind the conductive substrate film plated with the film,
wherein the unwinding mechanism, the film plating machine and the winding mechanism are sequentially provided along a conveying direction of the conductive substrate film.

18. The electroplating production line according to claim 17, further comprising:

a cleaning tank configured to clean the plating solution on a surface of the conductive substrate film;
a passivation tank configured to form an anti-oxidation plating layer on the surface of the conductive substrate film;
an oven configured to remove antioxidant solution remaining on a surface of the conductive substrate film; and
a splitting device configured to cut off regions on both sides of the conductive substrate film clamped by the conductive substrate film conveying device,
wherein the cleaning tank, the passivation tank, the oven and the splitting device are provided in sequence between the film plating machine and the winding mechanism.
Patent History
Publication number: 20240003039
Type: Application
Filed: Jun 29, 2022
Publication Date: Jan 4, 2024
Applicant: XIAMEN HITHIUM ENERGY STORAGE TECHNOLOGY CO.,LTD.. (Xiamen)
Inventors: Xichong ZHANG (Xiamen), Yuyuan WU (Xiamen), Qian ZHAO (Xiamen), Qin ZHANG (Xiamen), Jinhua LAN (Xiamen)
Application Number: 17/853,057
Classifications
International Classification: C25D 17/02 (20060101); C25D 5/52 (20060101); C25D 21/08 (20060101);