REFRIGERATOR

Abstract

A refrigerator includes a main body, a storage compartment, and a thermoelectric module assembly. The thermoelectric module assembly includes a module plate including a plate coupling portion configured to be coupleable to an upper portion of the main body, a thermoelectric element having a heat generating portion and a heat absorbing portion, a heat sink coupleable to the module plate to be in contact with the heat generating portion, a cooling sink coupleable to the module plate to be in contact the heat absorbing portion, and a heat dissipation duct coupleable to the module plate to dissipate heat from the heat sink. While the heat dissipation duct is coupled to the module plate, a lower end of a side surface of the heat dissipation duct is below an imaginary plane extending from a bottom surface of the plate coupling portion of the module plate.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application, under 35 U.S.C. § 111(a), of international application No. PCT/KR2024/020917, filed Dec. 23, 2024, which claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2024-0026074, filed Feb. 22, 2024 and Korean Patent Application No. 10-2024-0058151, filed Apr. 30, 2024, the disclosures of which are incorporated herein by reference in their entireties.

TECHNICAL FIELD

The disclosure relates to a refrigerator, and more particularly, to a refrigerator having a thermoelectric element to cool a storage compartment.

BACKGROUND ART

A refrigerator is a home appliance for keeping food fresh, including a main body having a storage compartment, a cold air supply device for supplying cold air to the storage compartment.

A thermoelectric element may be used as the cold air supply device of the refrigerator. The thermoelectric element may have a heat generating portion formed on one side and a heat absorbing portion formed on the opposite side. When a current is applied to the thermoelectric element, the heat generating portion may generate heat and the heat absorbing portion may absorb heat.

The refrigerator may include a heat sink in contact with one side of the thermoelectric element, a cooling sink in contact with the other side of the thermoelectric element, and a heat dissipation duct for dissipating heat from the heat sink so that efficiency of a cooling action through the thermoelectric element is increased. The thermoelectric element, the heat sink, the cooling sink, and the heat dissipation duct may be integrally assembled to form a thermoelectric module assembly. The thermoelectric module assembly may be coupled to an upper surface of a main body of the refrigerator.

DISCLOSURE

Technical Problem

An embodiment of the present disclosure provides a refrigerator including a thermoelectric module assembly having a thermoelectric element, a heat sink, a cooling sink, and a heat dissipation duct.

An embodiment of the present disclosure provides a refrigerator in which a thermoelectric module assembly is coupled to an upper surface of a main body.

An embodiment of the present disclosure provides a refrigerator in which a gap between a thermoelectric module assembly and an upper surface of a main body is eliminated or minimized.

Technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the description below.

Technical Solution

According to an embodiment of the present disclosure, a refrigerator includes a main body; a storage compartment to be inside the main body; and a thermoelectric module assembly including a module plate including a plate coupling portion configured to be coupleable to an upper portion of the main body, a thermoelectric element having a heat generating portion and a heat absorbing portion, a heat sink coupleable to the module plate such that while the heat sink is coupled to the module plate, the heat sink is in to contact the heat generating portion, a cooling sink coupleable to the module plate such that while the cooling sink is coupled to the module plate, the cooling sink is in to contact the heat absorbing portion, and a heat dissipation duct coupleable to the module plate to dissipate heat from the heat sink; wherein while the heat dissipation duct is coupled to the module plate, a lower end of a side surface of the heat dissipation duct is below an imaginary plane extending from a bottom surface of the plate coupling portion of the module plate.

The bottom surface of the plate coupling portion may contact an upper surface of the main body.

The lower end of the side surface of the heat dissipation duct may contact an upper surface of the main body.

The refrigerator may further include a fastening member configured to fasten the plate coupling portion to the upper portion of the main body.

An upper wall of the main body may include an installation opening to connect the storage compartment and an outside of the main body, and the plate coupling portion may be coupled around the installation opening on an upper surface of the main body.

The module plate may include a plate base having a module plate opening in which the thermoelectric element is disposed, the heat sink may be coupled to one side of the plate base and the cooling sink may be coupled to an opposite side of the plate base.

The module plate may include a connection portion extending upwardly from an edge of the plate base, and the plate coupling portion may extend in a horizontal direction from an upper end of the connection portion.

The installation opening may be formed on a left side relative to a front-to-back center line (X) of the upper surface of the main body, and a lower end of a right side surface of the heat dissipation duct along a left-to-right center line (Y) of the upper surface of the main body may be positioned below the imaginary plane extending from the bottom surface of the plate coupling portion.

The installation opening may be formed on a right side relative to the front-to-back center line (X) of the upper surface of the main body, and a lower end of a left side surface of the heat dissipation duct along the left-to-right center line (Y) of the upper surface of the main body may be positioned below the imaginary plane extending from the bottom surface of the plate coupling portion.

The installation opening may be formed at a center along a left-to-right direction of the upper surface of the main body, and the lower end of the right side surface of the heat dissipation duct along the left-to-right center line (Y) of the upper surface of the main body and the lower end of the left side surface of the heat dissipation duct along the left-to-right center line (Y) of the upper surface of the main body may be positioned below the imaginary plane extending from the bottom surface of the plate coupling portion.

A lower end of a left side surface of the heat dissipation duct along the left-to-right center line (Y) of the upper surface of the main body may be positioned below the imaginary plane extending from the bottom surface of the plate coupling portion by a first length, and a lower end of a right side surface of the heat dissipation duct along the left-to-right center line (Y) of the upper surface of the main body may be positioned below the imaginary plane extending from the bottom surface of the plate coupling portion by a second length.

The installation opening may be formed on a left side relative to the front-to-back center line (X) of the upper surface of the main body, and the second length may be greater than the first length.

The installation opening may be formed on a right side relative to the front-to-back center line (X) of the upper surface of the main body, and the first length may be greater than the second length.

The installation opening may be formed at a center along a left-to-right direction of the upper surface of the main body, and the first length and the second length may be the same.

The installation opening may be formed on a rear side relative to the left-to-right center line (Y) of the upper surface of the main body, and a lower end of a front side surface of the heat dissipation duct along the front-to-back center line (X) of the upper surface of the main body may be positioned below the imaginary plane extending from the bottom surface of the plate coupling portion.

According to an embodiment of the present disclosure, a refrigerator includes a main body; a storage compartment formed inside the main body; a thermoelectric module assembly including a module plate, a thermoelectric element having a heat generating portion and a heat absorbing portion, a heat sink coupled to the module plate to contact the heat generating portion, a cooling sink coupled to the module plate to contact the heat absorbing portion, and a heat dissipation duct coupled to the module plate to dissipate heat from the heat sink, the thermoelectric module assembly being coupled to an upper portion of the main body; and a side cover member provided between a lower end of a side surface of the heat dissipation duct and an upper surface of the main body to cover a gap between the lower end of the side surface of the heat dissipation duct and the upper surface of the main body.

The side cover member may be formed of a polyethylene foam.

The cover member may be attached to the lower end of the side surface of the heat dissipation duct.

The module plate may include a plate coupling portion configured to be coupled to the upper portion of the main body, and the lower end of the side surface of the heat dissipation duct may be positioned below an imaginary plane extending from a bottom surface of the plate coupling portion.

An upper wall of the main body may include an installation opening to connect the storage compartment and an outside of the main body, and the plate coupling portion may be coupled around the installation opening on the upper surface of the main body.

Advantageous Effects

According to various embodiments of the present disclosure, when the thermoelectric module assembly is coupled to the upper surface of the main body, the gap between the thermoelectric module assembly and the upper surface of the main body may not be generated or minimized, thereby preventing movement and noise of the thermoelectric module assembly.

The effects to be obtained from the present disclosure are not limited to the effects mentioned above, and other unmentioned effects may be clearly understood by those of ordinary skill in the art to which the present disclosure pertains from the description below.

DESCRIPTION OF DRAWINGS

FIG. 1 is a view illustrating a refrigerator according to an embodiment of the present disclosure.

FIG. 2 is a view illustrating a state in which doors of the refrigerator according to an embodiment of the present disclosure are opened.

FIG. 3 is a view illustrating a storage compartment of the refrigerator according to an embodiment of the present disclosure.

FIG. 4 is a schematic side cross-sectional view illustrating the refrigerator according to an embodiment of the present disclosure.

FIG. 5 is a cross-sectional view taken along line I-I′ of FIG. 2 according to an embodiment of the present disclosure.

FIG. 6 is a view illustrating a top cover and a thermoelectric module assembly separated from a main body of the refrigerator according to an embodiment of the present disclosure.

FIG. 7 is a view illustrating a heat dissipation duct cover, a heat dissipation duct body, an extension duct, and a thermoelectric module according to an embodiment of the present disclosure.

FIG. 8 is a bottom perspective view illustrating the heat dissipation duct cover, the heat dissipation duct body, and the thermoelectric module according to an embodiment of the present disclosure.

FIG. 9 is an exploded perspective view illustrating the thermoelectric module according to an embodiment of the present disclosure.

FIG. 10 is a cross-sectional view illustrating a major portion of a structure in which the thermoelectric module assembly is coupled to an upper wall of the main body according to an embodiment of the present disclosure.

FIG. 11 is a cross-sectional view illustrating a state in which the thermoelectric module assembly is separated from the upper wall of the main body according to an embodiment of the present disclosure, taken along a left-to-right center line (Y) of an upper surface of the main body.

FIG. 12 is a cross-sectional view illustrating a state in which the thermoelectric module assembly is coupled to the upper wall of the main body according to an embodiment of the present disclosure, along the left-to-right center line (Y) of the upper surface of the main body.

FIG. 13 is a view illustrating FIG. 12 with the thermoelectric module assembly deleted, except for a plate coupling portion of a module plate.

FIG. 14 is an enlarged view of portion “AA” of FIG. 12 according to an embodiment of the present disclosure.

FIG. 15 is an enlarged view of portion “BB” of FIG. 12 according to an embodiment of the present disclosure.

FIG. 16 is a view illustrating the thermoelectric module assembly according to an embodiment of the present disclosure.

FIG. 17 is a view illustrating a side cover member according to an embodiment of the present disclosure.

FIG. 18 is a view schematically illustrating an upper surface of the main body and the thermoelectric module assembly according to an embodiment of the present disclosure.

FIG. 19 is a view schematically illustrating the upper surface of the main body and the thermoelectric module assembly according to an embodiment of the present disclosure.

FIG. 20 is a view schematically illustrating the upper surface of the main body and the thermoelectric module assembly according to an embodiment of the present disclosure.

FIG. 21 is a side view illustrating the thermoelectric module assembly coupled to the upper surface of the main body according to an embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

Various embodiments of the disclosure and terms used herein are not intended to limit the technical features described herein to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the corresponding embodiments.

In describing of the drawings, similar reference numerals may be used for similar or related elements.

The singular form of a noun corresponding to an item may include one or more of the items unless clearly indicated otherwise in a related context.

In the disclosure, phrases, such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together in the corresponding phrase among the phrases.

As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

Terms such as “1st”, “2nd”, “primary”, or “secondary” may be used simply to distinguish an element from other elements, without limiting the element in other aspects (e.g., importance or order).

Further, as used in the disclosure, the terms “front”, “rear”, “top”, “bottom”, “side”, “left”, “right”, “upper”, “lower”, and the like are defined with reference to the drawings, and are not intended to limit the shape and position of any element.

It will be understood that when the terms “includes”, “comprises”, “including”, and/or “comprising” are used in the disclosure, they specify the presence of the specified features, figures, steps, operations, components, members, or combinations thereof, but do not preclude the presence or addition of one or more other features, figures, steps, operations, components, members, or combinations thereof.

When a given element is referred to as being “connected to”, “coupled to”, “supported by” or “in contact with” another element, it is to be understood that it may be directly or indirectly connected to, coupled to, supported by, or in contact with the other element. When a given element is indirectly connected to, coupled to, supported by, or in contact with another element, it is to be understood that it may be connected to, coupled to, supported by, or in contact with the other element through a third element.

It will also be understood that when an element is referred to as being “on” another element, it may be directly on the other element or intervening elements may also be present.

A refrigerator according to an embodiment of the disclosure may include a main body.

The “main body” may include an inner case, an outer case positioned outside the inner case, and an insulation provided between the inner case and the outer case. The “inner case” may include a case, a plate, a panel, or a liner forming a storage compartment (also referred to as a storage room). The inner case may be formed as one body, or may be formed by assembling a plurality of plates together. The “outer case” may form an appearance of the main body, and be coupled to an outer side of the inner case such that the insulation is positioned between the inner case and the outer case. The “insulation” may insulate an inside of the storage compartment from an outside of the storage compartment to maintain inside temperature of the storage compartment at appropriate temperature without being influenced by an external environment of the storage compartment. According to an embodiment of the disclosure, the insulation may include a foaming insulation. The foaming insulation may be molded by fixing the inner case and the outer case with jigs, etc. and then injecting and foaming urethane foam as a mixture of polyurethane and a foaming agent between the inner case and the outer case. According to an embodiment of the disclosure, the insulation may include a vacuum insulation in addition to a foaming insulation, or may be configured only with a vacuum insulation instead of a forming insulation. The vacuum insulation may include a core material and a cladding material accommodating the core material and sealing the inside with vacuum or pressure close to vacuum. However, the insulation is not limited to the above-mentioned foaming insulation or vacuum insulation, and may include various materials capable of being used for insulation.

The “storage compartment” may include a space defined by the inner case. The storage compartment may further include the inner case defining the space corresponding to the storage compartment. The storage compartment may store a variety of items, such as food, medicines, cosmetics, and the like, and the storage compartment may be configured to be open on at least one side for insertion and removal of the items.

The refrigerator may include one or more storage compartments. In a case in which two or more storage compartments are formed in the refrigerator, the respective storage compartments may have different purposes of use, and may be maintained at different temperatures. To this end, the respective storage compartments may be partitioned by a partition wall including an insulation.

The storage compartment may be maintained within an appropriate temperature range according to a purpose of use, and may include a “refrigerating compartment”, a “freezing compartment”, and a “variable temperature compartment” according to purposes of use and/or temperature ranges. The refrigerating compartment may be maintained at an appropriate temperature to keep food refrigerating, and the freezing compartment may be maintained at an appropriate temperature to keep food frozen. The “refrigerating” may be keeping food cold without freezing the food, and for example, the refrigerating compartment may be maintained within a range of 0 degrees Celsius to 7 degrees Celsius. The “freezing” may be freezing food or keeping food frozen, and for example, the freezing compartment may be maintained within a range of −20 degrees Celsius to −1 degrees Celsius. The variable temperature compartment may be used as either a refrigerating compartment or a freezing compartment according to or regardless of a user's selection.

The storage compartment may also be referred to by various terms, such as “vegetable compartment”, “freshness compartment”, “cooling compartment”, and “ice-making compartment”, in addition to “refrigerating compartment”, “freezing compartment”, and “variable temperature compartment”, and the terms, such as “refrigerating compartment”, “freezing compartment”, “variable temperature compartment”, etc., as used below are to be understood as representing storage compartments having the corresponding purposes of use and the corresponding temperature ranges.

The refrigerator according to an embodiment of the disclosure may include at least one door configured to open or close the open side of the storage compartment. The respective doors may be provided to open and close one or more storage compartments, or a single door may be provided to open and close a plurality of storage compartments. The door may be rotatably or slidably mounted to the front of the main body.

The “door” may seal the storage compartment in a closed state. The door, like the main body, may include an insulation to insulate the storage compartment in a closed state.

According to an embodiment, the door may include an outer door plate forming the front surface of the door, an inner door plate forming the rear surface of the door and facing the storage compartment, an upper cap, a lower cap, and a door insulation provided therein.

A gasket may be provided on the edge of the inner door plate to seal the storage compartment by coming into close contact with the front surface of the main body when the door is closed. The inner door plate may include a dyke that protrudes rearward to allow a door basket for storing items to be fitted.

According to an embodiment, the door may include a door body and a front panel that is detachably coupled to the front of the door body and forming the front surface of the door. The door body may include an outer door plate forming the front surface of the door body, an inner door plate forming the rear surface of the door body and facing the storage compartment, an upper cap, a lower cap, and a door insulator provided therein.

The refrigerator may be classified as French Door Type, Side-by-side Type, Bottom Mounted Freezer (BMF), Top Mounted Freezer (TMF), or Single Door Refrigerator according to the arrangement of the doors and the storage compartments.

The refrigerator according to an embodiment of the disclosure may include a cold air supply device for supplying cold air to the storage compartment.

The “cold air supply device” may include a machine, an apparatus, an electronic device, and/or a combination system thereof, capable of generating cold air and guiding the cold air to cool the storage compartment.

According to an embodiment of the disclosure, the cold air supply device may generate cold air through a cooling cycle including compression, condensation, expansion, and evaporation processes of refrigerants. To this end, the cold air supply device may include a refrigeration cycle device having a compressor, a condenser, an expander, and an evaporator to drive the refrigeration cycle. According to an embodiment of the disclosure, the cold air supply device may include a semiconductor, such as a thermoelectric element. The thermoelectric element may cool the storage compartment by heating and cooling actions through the Peltier effect.

The refrigerator according to an embodiment of the disclosure may include a machine compartment in which at least some components belonging to the cold air supply device are installed.

The “machine compartment” may be partitioned and insulated from the storage compartment to prevent heat generated by the components installed in the machine compartment from being transferred to the storage compartment. To dissipate heat from the components installed in the machine compartment, the machine compartment may communicate with outside of the main body.

The refrigerator according to an embodiment of the disclosure may include a dispenser provided on the door to provide water and/or ice. The dispenser may be provided on the door to allow access by the user without opening the door.

The refrigerator according to an embodiment of the disclosure may include an ice-making device that produces ice. The ice-making device may include an ice-making tray that stores water, an ice-moving device that separates ice from the ice-making tray, and an ice-bucket that stores ice produced in the ice-making tray.

The refrigerator according to an embodiment of the disclosure may include a controller for controlling the refrigerator.

The “controller” may include a memory for storing and/or recording data and/or programs for controlling the refrigerator, and a processor for outputting control signals for controlling the cold air supply device, etc. in accordance with the programs and/or data stored in the memory.

The memory may store or record various information, data, instructions, programs, and the like necessary for operation of the refrigerator. The memory may store temporary data generated while generating control signals for controlling components included in the refrigerator. The memory may include at least one of a volatile memory or a non-volatile memory, or a combination thereof.

The processor may control the overall operation of the refrigerator. The processor may control the components of the refrigerator by executing programs stored in memory. The processor may include a separate neural processing unit (NPU) that performs an artificial intelligence (AI) model operation. In addition, the processor may include a central processing unit (CPU), a graphics processor (GPU), and the like. The processor may generate a control signal to control the operation of the cold air supply device. For example, the processor may receive temperature information of the storage compartment from a temperature sensor and generate a cooling control signal to control an operation of the cold air supply device based on the temperature information of the storage compartment.

Furthermore, the processor may process a user input of a user interface and control an operation of the user interface in accordance with the programs and/or data memorized/stored in the memory. The user interface may be provided with an input interface and an output interface. The processor may receive the user input from the user interface. In addition, the processor may transmit a display control signal and image data for displaying an image on the user interface to the user interface in response to the user input.

The processor and memory may be provided integrally or may be provided separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one sub-processor. The memory may include one or more memories.

The refrigerator according to an embodiment of the disclosure may include a processor and a memory for controlling all of the components included in the refrigerator, and may include a plurality of processors and a plurality of memories for individually controlling the components of the refrigerator. For example, the refrigerator may include a processor and a memory for controlling the operation of the cold air supply device in accordance with to an output of the temperature sensor. In addition, the refrigerator may be separately provided with a processor and a memory for controlling the operation of the user interface in accordance with the user input.

A communication module may communicate with external devices, such as servers, mobile devices, and other home appliances via a nearby access point (AP). The AP may connect a local area network (LAN) to which a refrigerator or a user device is connected to a wide area network (WAN) to which a server is connected. The refrigerator or the user device may be connected to the server via the WAN.

The input interface may include keys, a touch screen, a microphone, and the like. The input interface may receive the user input and pass the received user input to the processor.

The output interface may include a display, a speaker, and the like. The output interface may output various notifications, messages, information, and the like generated by the processor.

Hereinafter, various embodiments according to the disclosure will be described in detail with reference to the accompanying drawings.

FIG. 1 is a view illustrating a refrigerator according to an embodiment of the present disclosure. FIG. 2 is a view illustrating a state in which doors of the refrigerator according to an embodiment of the present disclosure are opened. FIG. 3 is a view illustrating a storage compartment of the refrigerator according to an embodiment of the present disclosure. FIG. 4 is a schematic side cross-sectional view illustrating the refrigerator according to an embodiment of the present disclosure. FIG. 5 is a cross-sectional view taken along line I-I′ of FIG. 2. FIG. 6 is a view illustrating a top cover and a thermoelectric module assembly separated from a main body of the refrigerator according to an embodiment of the present disclosure. FIG. 7 is a view illustrating a heat dissipation duct cover, a heat dissipation duct body, an extension duct, and a thermoelectric module according to an embodiment of the present disclosure. FIG. 8 is a bottom perspective view illustrating the heat dissipation duct cover, the heat dissipation duct body, and the thermoelectric module according to an embodiment of the present disclosure.

Referring to FIGS. 1 to 8, a refrigerator 1 may include a main body 100, storage compartments 11, 12 and 13 formed inside the main body 100, and doors 21, 22, 23 and 24 provided to open or close the storage compartments 11, 12 and 13.

The main body 100 may include an inner case 170, an outer case 180 coupled to an outer side of the inner case 170, and an insulation 190 provided between the inner case 170 and the outer case 180. The inner case 170 may form the storage compartments 11, 12 and 13, and the outer case 180 may form an appearance of the main body 100. The insulation 190 may be a urethane foaming insulation.

In another aspect, the main body 100 may include an upper wall 110, a lower wall 120, a left wall 130, a right wall 140, and a rear wall 150. The upper wall 110, the lower wall 120, the left wall 130, the right wall 140, and the rear wall 150 may form an upper surface 111, a lower surface, a left surface, a right surface, and a rear wall of the main body 100, respectively.

The upper wall 110, the lower wall 120, the left wall 130, the right wall 140, and the rear wall 150 may each be formed of the inner case 170, the outer case 180, and the insulation 190. In an example, the upper surface 111 of the upper wall 110 may be formed by the outer case 180, a lower surface of the upper wall 110 may be formed by the inner case 170, and the insulation 190 may be provided inside the upper wall 110.

The upper wall 110 may include an installation opening 115 (see FIG. 6). The storage compartment 11 and an outside of the main body 100 may be connected through the installation opening 115. At least a portion of a thermoelectric module 500, which will be described later, may be disposed inside the installation opening 115. The thermoelectric module 500 may be disposed to penetrate the installation opening 115.

The storage compartments 11, 12 and 13 may accommodate items. The storage compartments 11, 12 and 13 may be formed to be open at a front side to allow for insertion or removal of items. The main body 100 may include a horizontal partition wall 160 that partitions the storage compartments 11, 12 and 13 into a first storage compartment 11 at an upper portion and storage compartments 12 and 13 at a lower portion, and a vertical partition wall 161 that partitions the storage compartments 12 and 13 at the lower portion into a second storage compartment 12 and a third storage compartment 13. The first storage compartment 11 may be a refrigerating compartment, the second storage compartment 12 may be a freezing compartment, and the third storage compartment 13 may be a variable temperature compartment.

The doors 21, 22, 23 and 24 may open or close the storage compartments 11, 12 and 13. A first door 21 and a second door 22 may open or close the first storage compartment 11, a third door 23 may open or close the second storage compartment 12, and a fourth door 24 may open or close the third storage compartment 13. The doors 21, 22, 23 and 24 may be rotatably coupled to the main body 100.

The doors 21, 22, 23 and 24 may be rotatably coupled to the main body 100 by hinges. For example, the first door 21 and the second door 22 may be rotatably coupled to the main body 100 by a hinge 31 provided at the upper portion of the main body 100 and a hinge provided at a middle of the main body 100, respectively.

A door of either of the first door 21 and the second door 22 may be provided with a rotating bar 40 for covering a gap formed between the first door 21 and the second door 22 when the first door 21 and the second door 22 are closed. The rotating bar 40 may be rotatably provided on any one of the first door 21 and the second door 22. A guide protrusion 46 may be provided on an upper end of the rotating bar 40, and a rotation guide 119 for guiding rotation of the guide protrusion 46 may be provided on the upper portion of the main body 100.

The doors 21, 22, 23 and 24 may each include a gasket 51. The gasket 51 may be provided on rear surfaces of the doors 21, 22, 23 and 24. The gasket 51 may be in close contact with a front surface of the main body 100 when the doors 21, 22, 23 and 24 are closed. The doors 21, 22, 23 and 24 may each include a dyke 52 protruding rearwardly. The dyke 52 may be equipped with a door shelf 53 for storing items. The rotating bar 40 may be rotatably installed on the dyke 52.

While the number and arrangement of the storage compartments and the number and arrangement of the doors have been described above, there is no limitation on the number and arrangement of the storage compartments and the number and arrangement of the doors of the refrigerator according to an embodiment of the present disclosure.

The refrigerator 1 may include a thermoelectric cooling device 400 provided to cool the storage compartment 11. The thermoelectric cooling device 400 may be provided on an upper side of the storage compartment 11 to cool the storage compartment 11. In other words, the thermoelectric cooling device may be provided on the upper wall 110 of the main body 100.

The thermoelectric cooling device 400 may include a thermoelectric module assembly 450. The thermoelectric module assembly 450 may include a thermoelectric module 500 and a heat dissipation duct 700. The thermoelectric module 500 and the heat dissipation duct 700 may be assembled together to form the thermoelectric module assembly 450.

The thermoelectric module assembly 450 may be coupled to the upper wall 110 of the main body 100 in a top-to-down direction. After the thermoelectric module assembly 450 is coupled to the upper wall 110 of the main body 100 in the top-to-down direction, a cooling duct 900, which will be described later, may be coupled to a lower surface of the upper wall 110 of the main body 100 in a bottom-to-up direction.

The thermoelectric module assembly 450 may be coupled to the upper wall 110 of the main body 100 by at least one fastening member S2 (see FIG. 6). The at least one fastening member S2 may be a mechanical element for coupling, such as a screw, a bolt, or the like.

The thermoelectric module 500 may include a thermoelectric element 530, a heat sink 520, a cooling sink 570, and a module plate 550.

The thermoelectric element 530 may be a semiconductor element that converts thermal energy into electrical energy using a thermoelectric effect, and may also be referred to as a thermoelectric semiconductor element, a Peltier element, or the like.

The thermoelectric element 530 may include a heat generating portion 531 and a heat absorbing portion 532. When a current is applied to the thermoelectric element 530, a heat generating action may occur at the heat generating portion 531 and a heat absorbing action may occur at the heat absorbing portion 532. The thermoelectric element 530 may have a thin hexahedral shape. The thermoelectric element 530 may have the heat generating portion 531 on one side of the thermoelectric element 530 and the heat absorbing portion 532 on the opposite side thereof.

The thermoelectric element 530 may be provided on the upper wall 110 such that the heat generating portion 531 faces upward of the thermoelectric element 530 and the heat absorbing portion 532 faces downward of the thermoelectric element 530. In other words, the heat generating portion 531 may face the outside of the main body 100, and the heat absorbing portion 532 may face the inside of the storage compartment 11 through the installation opening 115 of the upper wall 110. Thus, air warmed by heat exchange with the heat generating portion 531 may be discharged to the outside of the main body 100, and air cooled by heat exchange with the heat absorbing portion 532 may be supplied to the storage compartment 11 to cool the storage compartment 11.

The heat sink 520 may contact the heat generating portion 531 to absorb heat from the heat generating portion 531 and dissipate heat to the outside of the main body 100. The heat sink 520 may also be referred to as a hot sink, a heat dissipating sink, a heat dissipation sink, a hot heat sink, or the like. The heat sink 520 may be formed of a metal material having good thermal conductivity. For example, the heat sink 520 may be formed of an aluminum or copper.

The heat sink 520 may include a heat sink base 521 in contact with the heat generating portion 531, and a plurality of heat sink fins 525 protruding from the heat sink base 521 to increase a heat transfer area. The heat sink base 521 may be disposed horizontally, and the plurality of heat sink fins 525 may protrude upwardly from the heat sink base 521. The heat sink base 521 and the plurality of heat sink fins 525 may be integrally formed.

The cooling sink 570 may cool the storage compartment 11 by removing heat from the storage compartment 11 and transferring the heat to the heat absorbing portion 532. The cooling sink 570 may also be referred to as a cold sink, a chilling sink, a cooling heat sink, a cold heat sink, a chilling heat sink, or the like. The cooling sink 570 may be formed of a metal material having good thermal conductivity. For example, the cooling sink 570 may be formed of an aluminum or copper.

The cooling sink 570 may include a cooling sink base 571 in contact with the heat absorbing portion 532, and a plurality of cooling fins 575 protruding from the cooling sink base 571 to increase the heat transfer area. The cooling sink base 571 may be disposed horizontally, and the plurality of cooling fins 575 may protrude downwardly from the cooling sink base 571. The cooling sink base 571 and the plurality of cooling fins 575 may be integrally formed.

The module plate 550 may support the heat sink 520 and the cooling sink 570. The heat sink 520 may be disposed on one side of the module plate 550, and the cooling sink 570 may be disposed on the other side of the module plate 550. Specifically, the heat sink 520 may be disposed on an upper side of the module plate 550, and the cooling sink 570 may be disposed on a lower side of the module plate 550.

The thermoelectric module 500 may include a heat dissipation fan 600 that flows air to efficiently exchange heat between the heat sink 520 and air outside the main body 100. The heat dissipation fan 600 may be a centrifugal fan that draws in air in an axial direction and discharges the air in a radial direction. The centrifugal fan may include a blower fan. A rotation shaft 610 of the heat dissipation fan 600 may be disposed vertically. The heat dissipation fan 600 may be installed in a fan case 650. The fan case 650 and the module plate 550 may be integrally formed. However, unlike the present embodiment, the fan case 650 and the module plate 550 may be formed separately.

The heat dissipation duct 700 may guide air outside the main body 100 to exchange heat with the heat sink 520, and may guide air that has exchanged heat with the heat sink 520 to be discharged back outside the main body 100.

The heat dissipation duct 700 may be coupled to an upper side of the thermoelectric module 500. A heat dissipation duct body 720 may be provided with a duct coupling portion 722, and the thermoelectric module 500 may be provided with a module coupling portion 651. The duct coupling portion 722 and the module coupling portion 651 may be coupled using a hooked or snapped manner. In FIGS. 7 and 8, the module coupling portion 651 is shown as being provided on the fan case 650, but the module coupling portion 651 may be provided on the module plate 550.

The heat dissipation duct 700 may include the heat dissipation duct body 720, a heat dissipation duct cover 710, and an extension duct 740.

The heat dissipation duct cover 710 may be coupled to an upper portion of the heat dissipation duct body 720 to cover an upper side of the heat dissipation duct body 720. The heat dissipation duct cover 710 may be provided with a duct cover coupling portion 711, and the heat dissipation duct body 720 may be provided with a duct body coupling portion 721 coupled to the duct cover coupling portion 711. The duct cover coupling portion 711 and the duct body coupling portion 721 may be coupled using a hooked or snapped manner.

An upper surface 701 of the heat dissipation duct 700 may be formed by an upper surface of the heat dissipation duct cover 710. A lower surface 702 of the heat dissipation duct 700 may be formed by a lower surface of the heat dissipation duct body 720. A side surface 703 of the heat dissipation duct 700 may be formed by side surfaces of the heat dissipation duct cover 710.

The extension duct 740 may be provided in front of the heat dissipation duct body 720 to be connected to the heat dissipation duct body 720. The extension duct 740 may be formed separately from the heat dissipation duct body 720. Alternatively, however, the extension duct 740 may be integrally formed with the heat dissipation duct body 720.

The extension duct 740 may be disposed below a top cover 300, and may be coupled to a lower portion of the top cover 300. To this end, the extension duct 740 may be provided with an extension duct coupling portion 745 coupled to the top cover 300.

The heat dissipation duct body 720 may be provided on the upper side of the thermoelectric module 500 to cover the heat dissipation fan 600 and the heat sink 520. An outside air inlet 751 may be formed on an upper surface of a front portion of the heat dissipation duct body 720, and the outside air inlet 751 may be covered by the top cover 300, which will be described later.

The heat dissipation duct 700 may include outside air outlets 782 and 794 that discharges air that has exchanged heat with the heat sink 520 to the outside of the main body 100. The outside air outlets 782 and 794 may include a first outside air outlet 782 for discharging warm air having exchanged heat with the heat sink 520 to the outside of the main body 100, and a second outside air outlet 794 for discharging warm air toward the rotating bar 40.

The heat dissipation duct body 720 may include the first outside air outlet 782. The first outside air outlet 782 may include a connection opening 784 configured to guide air inside the heat dissipation duct 700 into an interior of the top cover 300, and an outside outlet 783 configured to be partitioned from the connection opening 784 to discharge air in the heat dissipation duct 700 to an outside of the top cover 300.

The hot air guided to the interior of the top cover 300 through the connection opening 784 may heat the upper surface 111 of the main body 100 as it passes through the interior of the top cover 300. Accordingly, condensation may be prevented from occurring on a front upper surface of the main body 100.

The extension duct 740 may include the second outside air outlet 794. Hot air discharged toward the rotating bar 40 through the second outside air outlet 794 may heat the rotating bar 40. Accordingly, condensation may be prevented from forming on the rotating bar 40.

However, the heat dissipation duct 700 may not need to include both the first outside air outlet 782 and the second outside air outlet 794, and depending on an embodiment, the second outside air outlet 794 may be omitted.

Furthermore, the first outside air outlet 782 of the heat dissipation duct 700 may not need to include both the connection opening 784 and the outside outlet 783, and depending on an embodiment, the connection opening 784 may be omitted.

The heat dissipation duct body 720 may include a fan receiving space 762 that receives the heat dissipation fan 600. The fan receiving space 762 may be formed on the lower surface of the heat dissipation duct body 720. The heat dissipation duct body 720 may include a fan inlet 761 through which air flows into the fan receiving space 762.

The heat dissipation duct body 720 may include a sink receiving space 771 formed on a downstream side of the fan receiving space 762 to receive the heat sink 520.

The heat dissipation duct body 720 may include an intake space 752 formed on the upper surface of the heat dissipation duct body 720 to guide the air drawn-in through the outside air inlet 751 into the fan receiving space 762. An upper side of the intake space 752 may be formed to be open, and the open upper side of the intake space 752 may be covered by the heat dissipation duct cover 710. The intake space 752 may be formed on an upstream side of the fan receiving space 762. The intake space 752 may be connected to the fan receiving space 762 through the fan inlet 761.

The heat dissipation duct body 720 may include a first discharge space 781 formed on the upper surface of the heat dissipation duct body 720 to guide air that has exchanged heat with the heat sink 520 to the first outside air outlet 782. An upper side of the first discharge space 781 may be opened, and the opened upper side of the first discharge space may be covered by the heat dissipation duct cover 710. The first discharge space 781 may be formed on a downstream side of the sink receiving space 771.

The heat dissipation duct body 720 may include a second discharge space 791 formed on the upper surface of the heat dissipation duct body 720 to guide the air having exchanged heat with the heat sink 520 to the second outside air outlet 794. An upper side of the second discharge space 791 may be opened, and the opened upper side of the second discharge space 791 may be covered by the heat dissipation duct cover 710. The second discharge space 791 may be formed on the downstream side of the sink receiving space 771.

The extension duct 740 may include an extension discharge space 746 connected to the second discharge space 791 of the heat dissipation duct body 720. Air from the second discharge space 791 may be guided to the second outside air outlet 794 through the extension discharge space 746.

The refrigerator 1 may include the top cover 300 coupled to a front portion of the upper surface 111 of the main body 100 to cover the plurality of hinges 31. After the thermoelectric module assembly 450 is coupled to the upper wall 110 of the main body 100, the top cover 300 may be coupled to the upper wall 110 of the main body 100. The top cover 300 may be coupled to the upper wall 110 of the main body 100 with at least one fastening member S3.

The thermoelectric cooling device 400 may include a dust filter 390 configured to filter out foreign matter from the air entering the outside air inlet 751. The dust filter 390 may be slidably mounted to the top cover 300 in the front-to-back direction.

The top cover 300 may include an intake grille portion 350 formed on a top cover upper surface portion 310. The intake grille portion 350 may be positioned on an upper side of the dust filter 390. The intake grille portion 350 may primarily block foreign matter from being drawn into the heat dissipation duct 700 prior to the dust filter 390. The intake grille portion 350 may protect the dust filter 390 by preventing external forces from being applied to the dust filter 390.

The top cover 300 may include front protrusions 313 protruding forwardly from both end portions of the top cover 300 to cover the plurality of hinges 31. At least one of the front protrusions 313 may include a top cover outlet 340 through which air inside the top cover 300 is discharged to the outside of the top cover 300.

The thermoelectric cooling device 400 may include a cooling fan 800 that flows air to efficiently exchange heat between the cooling sink 570 and the air inside the storage compartment 11. The cooling fan 800 may be configured to blow air toward the cooling sink 570. The cooling fan 800 may be positioned in a horizontal direction of the cooling sink 570. The cooling fan 800 may be provided inside the storage compartment 11. The cooling fan 800 may be provided on a lower side of the upper wall 110.

The cooling fan 800 may be a centrifugal fan that draws in air in an axial direction and discharges the air in a radial direction. A rotation shaft 810 of the cooling fan 800 may be disposed perpendicularly to the lower surface of the upper wall 110.

The thermoelectric cooling device 400 may include the cooling duct 900 configured to guide air flowing by the cooling fan 800. The cooling duct 900 may guide air inside the storage compartment 11 to exchange heat with the cooling sink 570, and may guide the air having exchanged heat with the cooling sink 570 to be discharged back into the storage compartment 11.

The cooling fan 800 may be located inside the cooling duct 900. The cooling sink 570 may penetrate an upper portion of the cooling duct 900 and may be located inside the cooling duct 900. The cooling duct 900 may be coupled to the lower surface of the upper wall 110.

The cooling duct 900 may include an inside air inlet 991 that draws air inside the storage compartment 11 into an interior of the cooling duct 900, and an inside air outlet 992 that discharges the air having exchanged heat with the cooling sink 570 into the interior of the storage compartment 11.

The refrigerator 1 may include a refrigeration cycle device to cool the storage compartments through a refrigeration cycle. The refrigeration cycle device may include a compressor 2, a condenser (not shown), an expansion device (not shown), and an evaporator 3. The evaporator 3 may be provided at a rear side of the storage compartments 12 and 13.

The refrigerator 1 may include evaporator ducts 60 and 70 that guide cold air generated by the evaporator 3. A first evaporator duct 60 may be provided on the rear side of the second storage compartment 12 and the third storage compartment 13. A second evaporator duct 70 may be provided on a rear side of the first storage compartment 11.

The cold air generated by the evaporator 3 may be drawn into the interior of the first evaporator duct 60 by an evaporator fan 80. The cold air drawn into the interior of the first evaporator duct 60 may be discharged into the second storage compartment 12 or the third storage compartment 13 through a cold air outlet (not shown) formed at a front surface thereof. Furthermore, the cold air drawn into the interior of the first evaporator duct 60 may be guided to an inner flow path 78 of the second evaporator duct 70. The first evaporator duct 60 may be provided with a damper 61 that controls the supply of cold air inside the first evaporator duct 60 to the second evaporator duct 70. A connection duct 90 may be provided between the first evaporator duct 60 and the second evaporator duct 70 to connect the first evaporator duct 60 and the second evaporator duct 70.

The cold air introduced into the inner flow path 78 of the second evaporator duct 70 may be supplied to the first storage compartment 11 through a cold air outlet 72 formed at a front surface of the second evaporator duct 70.

As such, according to an embodiment of the present disclosure, the refrigerator may include the thermoelectric cooling device 400 and the refrigeration cycle device, but is not limited thereto, and the refrigerator may simply include the thermoelectric cooling device 400.

FIG. 9 is an exploded perspective view illustrating the thermoelectric module according to an embodiment of the present disclosure.

Referring to FIG. 9, the thermoelectric module according to an embodiment of the present disclosure will be described in detail.

The thermoelectric module 500 may include the thermoelectric element 530 having the heat generating portion 531 and the heat absorbing portion 532, the heat sink 520 in contact with the heat generating portion 531 of the thermoelectric element 530, the cooling sink 570 in contact with the heat absorbing portion 532 of the thermoelectric element 530, and the module plate 550 on which the thermoelectric element 530, the heat sink 520, and the cooling sink 570 are installed.

The module plate 550 may serve as a framework of the thermoelectric module 500. The module plate 550 may be formed of a resin material having low thermal conductivity. The module plate 550 may support the heat sink 520 and the cooling sink 570. The module plate 550 may maintain a gap between the heat sink 520 and the cooling sink 570.

The module plate 550 may include a plate base 552. The plate base 552 may be provided horizontally. The plate base 552 may support the heat sink 520. The plate base 552 may support the heat sink 520 by contacting a bottom surface of the heat sink base 521. The plate base 552 may have a size and shape corresponding to the heat sink 520. The plate base 552 may have a rectangular shape.

The module plate 550 may include a plate coupling portion 557 provided to be supported on the upper surface of the main body 100. The plate coupling portion 557 may be supported on the upper surface 111 of the upper wall 110 of the main body around the installation opening 115.

The plate coupling portion 557 may be formed horizontally. The plate coupling portion 557 may be formed to have a step with the plate base 552. In other words, the plate coupling portion 557 may be provided at a higher position than the plate base 552. Accordingly, when the plate coupling portion 557 is supported on the upper surface of the main body around the installation opening 115, the plate base 552 may be disposed inside the installation opening 115.

The module plate 550 may include a connection portion 556 connecting the plate base 552 and the plate coupling portion 557. The connection portion 556 may extend upwardly from an edge of the plate base 552. The plate coupling portion 557 may extend in a horizontal direction from an upper end of the connection portion 556.

The heat sink 520 may be disposed in a space formed by the plate base 552 and the connection portion 556. The plate base 552, the plate coupling portion 557, and the connection portion 556 may be integrally formed.

The module plate 550 may include a module plate opening 551. The thermoelectric element 530 may be disposed inside the module plate opening 551. The thermoelectric element 530 may be disposed at an upper end portion of the module plate opening 551.

Since the thermoelectric element 530 is disposed at the upper end portion of the module plate opening 551, the cooling sink 570 may include a cooling conduction portion 574 protruding from the cooling sink base 571 for contact with the heat absorbing portion 532 of the thermoelectric element 530. The cooling conduction portion 574 may be formed integrally with the cooling sink base 571. The cooling conduction portion 574 may be inserted into the module plate opening 551 from bottom to top so as to contact the heat absorbing portion 532 of the thermoelectric element 530.

The thermoelectric module 500 may include an element insulation 540 that thermally insulates the module plate 550 and the thermoelectric element 530. The element insulation 540 may be disposed in the module plate opening 551 to prevent the thermoelectric element 530 from contacting the module plate 550. The element insulation 540 may be provided to surround side surfaces of the thermoelectric element 530. The element insulation 540 may be formed of a resin material having low thermal conductivity. In an example, the element insulation 540 may be formed of a silicone material.

The thermoelectric module 500 may include a sink insulation 580 provided between the module plate 550 and the cooling sink 570. The sink insulation 580 may prevent heat from being transferred between the heat sink 520 and the cooling sink 570 through the module plate 550. The sink insulation 580 may include a sink insulation opening 581.

The sink insulation 580 may support an upper surface of the cooling sink 570. However, depending on embodiments, the sink insulation 580 may be omitted, and in this case, the cooling sink 570 may be supported by contacting the lower surface of the module plate 550. Alternatively, the sink insulation 580 may be provided between the heat sink 520 and the module plate 550.

The heat sink 520 may include the heat sink base 521 and the plurality of heat sink fins 525 protruding from the heat sink base 521. A lower surface of the heat sink base 521 may be supported by the module plate 550.

The heat sink 520 and the cooling sink 570 may be coupled to the module plate 550 through a fastening member S1. The fastening member S1 may be a mechanical element for coupling, such as a screw, a bolt, or the like.

The heat sink 520 may include a heat sink through-hole formed for the fastening member S1 to pass through. The module plate 550 may include a plate through-hole 553 formed for the fastening member S1 to pass through. The plate through-hole 553 may be formed in the plate base 552. The cooling sink 570 may include a cooling sink through-hole 573 formed for the fastening member S1 to pass through.

The thermoelectric module 500 may include a washer member 510 supported between a head portion of the fastening member S1 and the heat sink 520. The washer member 510 may be provided between the head portion of the fastening member S1 and the heat sink 520 to prevent the fastening member S1 and the heat sink 520 from contacting each other and to reduce heat from the heat sink 520 from being transferring through the fastening member S1. An anti-loosening member 502 may be provided between the head portion of the fastening member S1 and the washer member 510 to prevent the fastening member S1 from loosening.

The thermoelectric module 500 may include a nut member 590 with which an end portion opposite to the head portion of the fastening member S1 is engaged. The nut member 590 may be supported on the cooling sink 570. The nut member 590 may be provided between the end portion opposite to the head portion of the fastening member S1 and the cooling sink 570 to prevent the fastening member S1 and the cooling sink 570 from contacting each other and to reduce cold air from the cooling sink 570 from being transferred through the fastening member S1.

When coupling the heat sink 520 and the cooling sink 570 to the module plate 550 through the fastening member S1, the heat sink 520 and the cooling sink 570 may be coupled to the module plate 550 via the fastening member S1 in a state where the element insulation 540 and the thermoelectric element 530 are disposed in the opening 551 of the module plate 550. Thus, as the heat sink 520 and the cooling sink 570 are secured to the module plate 550, the thermoelectric element 530 may be secured at the same time.

The heat generating portion 531 of the thermoelectric element 530 may be supported and fixed by the heat sink 520, the heat absorbing portion 532 of the thermoelectric element 530 may be supported and fixed by the cooling sink 570, and a side surface connecting the heat generating portion 531 and the heat absorbing portion 532 of the thermoelectric element 530 may be supported and fixed by an inner surface of the element insulation 540.

As such, the heat sink 520 and the cooling sink 570 may be easily assembled to the module plate 550 by the fastening member S1. Furthermore, since the heat sink 520 and the heat generating portion 531 of the thermoelectric element 530 may be in close contact, and the cooling sink 570 and the heat absorbing portion 532 of the thermoelectric element 530 may be in close contact, the heat exchange between the heat sink 520 and the heat generating portion 531 of the thermoelectric element 530 and the heat exchange between the cooling sink 570 and the heat absorbing portion 532 of the thermoelectric element 530 may be performed efficiently, thereby increasing the efficiency of the thermoelectric module 500.

FIG. 10 is a cross-sectional view illustrating a major portion of a structure in which the thermoelectric module assembly is coupled to the upper wall of the main body according to an embodiment of the present disclosure.

Referring to FIGS. 6 and 10, a structure in which the thermoelectric module assembly is coupled to the upper wall of the main body will be described.

The thermoelectric module 500 may be coupled to the upper wall 110 through at least one fastening member S2 (see FIGS. 6 and 10). The fastening member S2 may penetrate the thermoelectric module 500 and be fastened to the upper wall 110. Specifically, the fastening member S2 may pass through the plate coupling portion 557 of the module plate 550 and be fastened to the upper wall 110. In this case, a bottom surface 558 of the plate coupling portion 557 may be supported by contacting the upper surface 111 of the main body 100 around the installation opening 115.

The upper wall 110 of the main body 100 may include a connection frame 200 provided between the inner case 170 and the outer case 180, and the fastening member S2 may be fastened to the connection frame 200. The aforementioned installation opening 115 may be formed by the connection frame 200. The connection frame 200 may include a frame base 210 and a frame body 270 provided on an upper side of the frame base 210. The frame base 210 may include a sink end supporting portion 220 configured to support an end portion 571a of the cooling sink 570. The frame body 270 may include a middle supporting portion 275 protruding to support an end portion of the plate base 552 of the module plate 550.

While four fastening members S2 are shown in the drawings, the number of fastening members S2 is not limited. The fastening members S2 (see FIGS. 6 and 10) for coupling the thermoelectric module 500 to the main body 100 may be distinguished from the fastening members S1 (see FIG. 9) for assembling the thermoelectric module 500 itself, as described above.

A plate through-hole 554 through which the fastening member S2 passes may be formed in the plate coupling portion 557 of the module plate 550. An outer case through-hole 182 through which the fastening member S2 passes may be formed in the outer case 180. A fastening hole 290 to which the fastening member S2 is fastened may be formed in the frame body 270 of the connection frame 200.

As described above, the thermoelectric module 500 may be firmly and reliably fixed to the upper wall 110 by the fastening members S2. Furthermore, the thermoelectric module 500 may be easily installed by fastening the fastening members S2 in a state where the plate coupling portion 557 of the thermoelectric module 500 is mounted on the upper surface 111 of the main body 100 around the installation opening 115, and the thermoelectric module 500 may be easily removed by releasing the fastening members S2.

Further, the heat dissipation duct 700 may also be coupled to the main body 100 through the fastening members S2. That is, the fastening members S2 may be fastened to the connection frame 200 of the main body 100 by passing through the heat dissipation duct 700 and the module plate 550 in turn. In other words, the fastening members S2 may pass through the thermoelectric module assembly 450 and be fastened to the main body 100.

A duct cover through-hole 719 may be formed in the heat dissipation duct cover 710, and a duct body through-hole 729 may be formed in the heat dissipation duct body 720. The fastening members S2 may be fastened to the connection frame 200 by passing through the duct cover through-hole 719, the duct body through-hole 729, and the plate through-hole 554.

FIG. 11 is a cross-sectional view illustrating a state in which the thermoelectric module assembly is separated from the upper wall of the main body according to an embodiment of the present disclosure, along a left-to-right center line (Y) of the upper surface of the main body. FIG. 12 is a cross-sectional view illustrating a state in which the thermoelectric module assembly is coupled to the upper wall of the main body according to an embodiment of the present disclosure, along the left-to-right center line (Y) of the upper surface of the main body. FIG. 13 is a view illustrating FIG. 12 with the thermoelectric module assembly deleted, except for the plate coupling portion of the module plate. FIG. 14 is an enlarged view of portion “AA” of FIG. 12. FIG. 15 is an enlarged view of portion “BB” of FIG. 12. FIG. 16 is a view illustrating the thermoelectric module assembly according to an embodiment of the present disclosure. FIG. 17 is a view illustrating a side cover member according to an embodiment of the present disclosure. FIG. 18 is a view schematically illustrating the upper surface of the main body and the thermoelectric module assembly according to an embodiment of the present disclosure. FIG. 19 is a view schematically illustrating the upper surface of the main body and the thermoelectric module assembly according to an embodiment of the present disclosure. FIG. 20 is a view schematically illustrating the upper surface of the main body and the thermoelectric module assembly according to an embodiment of the present disclosure. FIG. 21 is a side view illustrating the thermoelectric module assembly coupled to the upper surface of the main body according to an embodiment of the present disclosure.

As described above, the thermoelectric module assembly 450 may be coupled to the upper wall 110 of the main body 100 by the plate coupling portion 557 of the module plate 550 being supported on the upper wall 110 of the main body 100, and the fastening members S2 passing through the module plate 550 and being fastened to the upper wall 110 of the main body 100.

The main body 100 may be formed by filling liquid foaming material between the inner case 170 and the outer case 180 and foaming the same, and the shape of the outer case 180 may be deformed during or after the foaming of the liquid foaming material. In other words, the outer case 180 may be convexly deformed outwardly as a result of the foaming process (swelling phenomenon). In an example, a central portion 112 of the upper surface 111 of the main body 100 may gently protrude upward (see FIG. 11).

Such a swelling phenomenon may cause a bottom surface of another portion of the thermoelectric module assembly 450, other than the plate coupling portion 557 coupled to the upper surface 111 of the main body 100 via the fastening members S2, to lift away from the upper surface 111 of the main body 100 (lifting phenomenon).

In particular, a gap between the bottom surface of the thermoelectric module assembly 450 and the upper surface 111 of the main body 100 may increase as a distance from the installation opening 115 increases.

Specifically, as shown in FIGS. 13 to 15, when the plate coupling portion 557 of the module plate 550 is coupled to the upper surface 111 of the main body 100, gaps G1 and G2 may occur between a plane PL including the bottom surface 558 of the plate coupling portion 557 and the upper surface 111 of the main body 100, and the gaps G1 and G2 may increase toward both side ends 113 and 114 of the upper surface 111 of the main body. The plane PL including the bottom surface 558 of the plate coupling portion 557 may be an imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557.

As such, when a gap occurs between the thermoelectric module assembly 450 and the upper surface 111 of the main body 100, the thermoelectric module assembly 450 may not be fixed and a phenomenon in which the thermoelectric module assembly 450 moves may occur. In addition, noise may generated due to collision the thermoelectric module assembly 450 with the main body 100. In addition, dust or foreign matter may penetrate into the gap between the thermoelectric module assembly 450 and the upper surface 111 of the main body 100, which may deteriorate aesthetic appearance.

To prevent the gap from occurring between the thermoelectric module assembly 450 and the upper surface 111 of the main body 100 due to the swelling phenomenon caused by the foaming process as described above and to allow the thermoelectric module assembly 450 to be fixed, lower ends 704, 706 and 707 of the side surface 703 of the heat dissipation duct 700 according to an embodiment of the present disclosure may be formed to be positioned below the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557 (see FIGS. 14, 15 and 21).

Specifically, the lower end 706 of a left side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may be formed to be positioned lower than the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557 (see FIG. 14).

The lower end 706 of the left side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may be positioned lower than the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557 by a first length D1.

In another aspect, the left side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may protrude downwardly below the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557.

With such a configuration, the lower end 706 of the left side surface of the heat dissipation duct 700 may contact the upper surface 111 of the main body 100 without being spaced apart from the upper surface 111 of the main body 100.

Furthermore, the lower end 707 of a right side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may be formed to be positioned below the plane PL including the bottom surface 558 of the plate coupling portion 557 (see FIG. 15).

The lower end 707 of the right side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may be positioned lower than the plane PL including the bottom surface 558 of the plate coupling portion 557 by a second length D2.

In another aspect, the right side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may protrude downwardly below the plane PL including the bottom surface 558 of the plate coupling portion 557.

With such a structure, the lower end 706 of the right side surface of the heat dissipation duct 700 may contact the upper surface 111 of the main body 100 without being spaced apart from the upper surface 111 of the main body 100.

Both the lower end 706 of the left side surface and the lower end 707 of the right side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may be formed to be positioned below the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557.

In this case, depending on the position of the installation opening 115, the first length D1, which is a distance between the lower end 706 of the left side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 and the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557, and the second length D2, which is a distance between the lower end 707 of the right side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 and the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557, may be different from each other.

That is, as shown in FIGS. 11 to 15, when the installation opening 115 is formed on the left side relative to the front-to-back center line (X) of the upper surface 111 of the main body 100, the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557 may be inclined in an upward direction toward the right end 114 of the upper surface 111 of the main body 100.

Thus, when the installation opening 115 is formed on the left side relative to the front-to-back center line (X) of the upper surface 111 of the main body 100, the second length D2 may be greater than the first length D1.

Conversely, when the installation opening 115 is formed on the right side relative to the front-to-back center line (X) of the upper surface 111 of the main body 100, the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557 may be inclined in an upward direction toward the left end 113 of the upper surface 111 of the main body 100.

Thus, when the installation opening 115 is formed on the left side relative to the front-to-back center line (X) of the upper surface 111 of the main body 100, the first length D1 may be greater than the second length D2.

As shown in FIG. 20, when the installation opening 115 is formed at a center along a left-to-right direction of the upper surface 111 of the main body 100, the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557 may be formed horizontally relative to the upper surface 111 of the main body 100.

Thus, when the installation opening 115 is formed at the center along the left-to-right direction of the upper surface 111 of the main body 100, the first length D1 and the second length D2 may be the same.

In contrast to the embodiments described above, only one of the lower end 706 of the left side surface and the lower end 707 of the right side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may be formed to be positioned below the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557.

As shown in FIG. 18, when the installation opening 115 is formed on the left side relative to the front-to-back center line (X) of the upper surface 111 of the main body 100, only the lower end 707 of the right side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may be formed to be positioned below the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557.

As shown in FIG. 19, when the installation opening 115 is formed on the right side relative to the front-to-back center line (X) of the upper surface 111 of the main body 100, only the lower end 706 of the left side surface of the heat dissipation duct 700 along the left-to-right center line (Y) of the upper surface 111 of the main body 100 may be formed to be positioned below the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557.

In accordance with an embodiment, instead of the lower ends 704, 706 and 707 of the side surface 703 of the heat dissipation duct 700 being formed to be positioned below the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557, a side cover member 797 may be provided between the lower ends 704, 706 and 707 of the side surface 703 of the heat dissipation duct and the upper surface 111 of the main body 100 to cover a gap between the lower ends 704, 706 and 707 of the side surface 703 of the heat dissipation duct and the upper surface 111 of the main body 100.

The side cover member 797 may cover the gap between the lower ends 704, 706 and 707 of the side surface 703 of the heat dissipation duct and the upper surface 111 of the main body 100, prevent movement of the thermoelectric module assembly 450, and have elasticity to absorb shock. The side cover member 797 may be formed of polyethylene foam. However, a material of the side cover member 797 is not limited to polyethylene foam, and may include a variety of materials capable of closing the gap between the lower ends 704, 706 and 707 of the side surface 703 of the heat dissipation duct and the upper surface 111 of the main body 100 and cushioning the shock.

One surface of the side cover member 797 may be provided to have adhesiveness or tackiness. Thus, the side cover member 797 may be attached to the lower ends 704, 706 and 707 of the side surface 703 of the heat dissipation duct.

As shown in FIG. 21, the installation opening 115 may be formed on a rear side relative to the left-to-right center line (Y) of the upper surface 111 of the main body 100, and the lower end 704 of a front side surface of the heat dissipation duct 700 along the front-to-back center line (X) of the upper surface 111 of the main body 100 may be formed to be positioned below the imaginary plane PL extending from the bottom surface 558 of the plate coupling portion 557.

Thus, the lower end 704 of the front side surface of the heat dissipation duct 700 along the front-to-back center line (X) of the upper surface 111 of the main body 100 may contact the upper surface 111 of the main body 100 without being spaced apart from the upper surface 111 of the main body 100.

Although the technical ideas of the present disclosure have been described above by means of specific embodiments, the scope of the present disclosure is not limited to these embodiments; various embodiments that can be modified or adapted by one having ordinary skill in the art without departing from the technical ideas of the present disclosure as set forth in the claims will be deemed to fall within the scope of the present disclosure.

Claims

1. A refrigerator, comprising:

a main body;

a storage compartment to be inside the main body; and

a thermoelectric module assembly including: a module plate including a plate coupling portion configured to be coupleable to an upper portion of the main body, a thermoelectric element having a heat generating portion and a heat absorbing portion, a heat sink coupleable to the module plate such that while the heat sink is coupled to the module plate, the heat sink is in contact with the heat generating portion, a cooling sink coupleable to the module plate such that while the cooling sink is coupled to the module plate, the cooling sink is in to contact the heat absorbing portion, and a heat dissipation duct coupleable to the module plate to dissipate heat from the heat sink;

wherein while the heat dissipation duct is coupled to the module plate, a lower end of a side surface of the heat dissipation duct is below an imaginary plane extending from a bottom surface of the plate coupling portion of the module plate.

2. The refrigerator of claim 1, wherein the bottom surface of the plate coupling portion is in contact with an upper surface of the main body.

3. The refrigerator of claim 1, wherein the lower end of the side surface of the heat dissipation duct is in contact with an upper surface of the main body.

4. The refrigerator of claim 1, further comprising a fastening member configured to fasten the plate coupling portion to the upper portion of the main body.

5. The refrigerator of claim 1, wherein

an upper wall of the main body comprises an installation opening to connect the storage compartment and an outside of the main body, and

the plate coupling portion is coupled around the installation opening on an upper surface of the main body.

6. The refrigerator of claim 1, wherein

the module plate comprises a plate base having a module plate opening in which the thermoelectric element is disposed, and

the heat sink is coupled to one side of the plate base, and the cooling sink is coupled to an opposite side of the plate base.

7. The refrigerator of claim 6, wherein

the module plate comprises a connection portion extending upwardly from an edge of the plate base, and

the plate coupling portion extends in a horizontal direction from an upper end of the connection portion.

8. The refrigerator of claim 5, wherein

the installation opening is formed on a left side relative to a front-to-back center line (X) of the upper surface of the main body, and

a lower end of a right side surface of the heat dissipation duct along a left-to-right center line (Y) of the upper surface of the main body is positioned below the imaginary plane extending from the bottom surface of the plate coupling portion.

9. The refrigerator of claim 5, wherein

the installation opening is formed on a right side relative to a front-to-back center line (X) of the upper surface of the main body, and

a lower end of a left side surface of the heat dissipation duct along a left-to-right center line (Y) of the upper surface of the main body is positioned below the imaginary plane extending from the bottom surface of the plate coupling portion.

10. The refrigerator of claim 5, wherein

the installation opening is formed at a center along a left-to-right direction of the upper surface of the main body, and

a lower end of a right side surface of the heat dissipation duct along a left-to-right center line (Y) of the upper surface of the main body and a lower end of a left side surface of the heat dissipation duct along the left-to-right center line (Y) of the upper surface of the main body are positioned below the imaginary plane extending from the bottom surface of the plate coupling portion.

11. The refrigerator of claim 5, wherein

a lower end of a left side surface of the heat dissipation duct along a left-to-right center line (Y) of the upper surface of the main body is positioned below the imaginary plane extending from the bottom surface of the plate coupling portion by a first length, and

a lower end of a right side surface of the heat dissipation duct along the left-to-right center line (Y) of the upper surface of the main body is positioned below the imaginary plane extending from the bottom surface of the plate coupling portion by a second length.

12. The refrigerator of claim 11, wherein

the installation opening is formed on a left side relative to a front-to-back center line (X) of the upper surface of the main body, and

the second length is greater than the first length.

13. The refrigerator of claim 11, wherein

the installation opening is formed on a right side relative to a front-to-back center line (X) of the upper surface of the main body, and

the first length is greater than the second length.

14. The refrigerator of claim 11, wherein

the installation opening is formed at a center along a left-to-right direction of the upper surface of the main body, and

the first length and the second length are same.

15. The refrigerator of claim 5, wherein

the installation opening is formed on a rear side relative to a left-to-right center line (Y) of the upper surface of the main body, and

a lower end of a front side surface of the heat dissipation duct along a front-to-back center line (X) of the upper surface of the main body is positioned below the imaginary plane extending from the bottom surface of the plate coupling portion.