Socket that engages a pin grid array
An example socket includes a plurality of contacts and a base. The base includes exterior walls and interior walls which extend between the exterior walls to form openings within the base such that each opening in the base includes one of the contacts. At least some interior walls include indentations that are adapted to receive projections on the contacts such that when the projections on the contacts are positioned within indentations in the interior walls, the contacts are secured to the base. Another example socket includes a first group of the interior walls that is oriented in a first direction and a second group of the interior walls oriented in a second direction that is orthogonal to the first direction. The first and second groups of interior walls form openings within the base with the first group of interior walls being higher than the second group of interior walls.
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This application is a continuation of U.S. patent application Ser. No. 11/610,635, filed on Dec. 14, 2006, now issued as U.S. Pat. No. 7,361,044, which is incorporated herein by reference.
TECHNICAL FIELDSome example embodiments of the present invention relate to a socket that engages an electronic package, and more particularly to a socket that engages a pin grid array on an electronic package.
BACKGROUNDThe processors in integrated circuits and other electronic assemblies are continually being required to handle an ever-increasing number of signals. A typical processor often requires additional signals in order to operate at higher frequencies and to simultaneously perform more logic and memory operations.
Electrical sockets are often used to secure electronic packages that include processors onto a system board (e.g., a mother board or a printed circuit board (PCB)). Most sockets are typically constructed for easy installation and replacement of the electronic packages.
Many sockets include contacts that are assembled within the socket to provide an electrical connection between the system board and the electronic package that includes the processor. Solder balls are usually attached to each contact so that a reflow process bonds the socket to the PCB.
There is a need for a socket that has a higher contact density in order to increase the number of signals that may be simultaneously sent to a processor which is within an electronic package. In addition, increasing the contact density within a socket may allow the overall size of an electronic package to be reduced depending on the configuration of the electronic system that includes the processor.
The following detailed description references the accompanying drawings. Like numerals describe substantially similar components throughout each of the drawings. Other embodiments may be used, and structural, logical, and electrical changes made. The sockets and electronic systems described herein can be manufactured, used, or shipped in a number of positions and orientations.
In some embodiments, the socket and the electronic system provide a current path for supplying signals to a processor. Signals are supplied to a processor, or die, using contacts that are included in the socket. The configuration of the socket allows the socket size to be minimized and/or additional signals to be delivered to the processor.
As shown most clearly in
In some embodiments, each contact 12 may include four projections 24 that extend into four indentations 22 in the interior walls 18 of the base 12.
As shown in
In addition, each contact 12 may be positioned within an opening 20 such that the flat section 30 of each contact 12 is positioned against one of the interior walls 18 that form the opening 20 (see
The first and second groups 50, 52 of interior walls 48 form a plurality of openings 54 within the base 44 such that each opening 54 in the base 44 includes one of the plurality of contacts 42. Although each opening 54 in
In the illustrated example embodiment, the first group 50 of interior walls 48 is higher than the second group 52 of interior walls 48. The degree to which the first group 50 of interior walls 48 is higher than the second group 52 of interior walls 48 will depend in part on the design of any pin grid arrays that get connected to the contacts 42 which are part of the socket 40.
As shown in
As shown in
The electronic system 70 further includes a socket 80. The socket 80 includes a base 81 and a plurality of contacts 82 which engage the pins 77 in the pin grid array. It should be noted that the number, location and size of the pins 77 in the pin grid array will depend in part on the type of die 74 that is included in the electronic system 70 as well as the type of applications where the electronic system 70 will be used.
In some embodiments, the electronic system 70 may further include a printed circuit board 78 such that the socket 80 is mounted to the printed circuit board 78. As an example, the socket 80 may be mounted to the printed circuit board 78 using a ball grid array.
As shown in
The first and second groups 85, 86 of interior walls 84 form a plurality of openings 87 within the base 81 such that each opening 87 in the base 81 includes one of the contacts 82. Although each opening 87 in
In the illustrated example embodiment, the first group 85 of interior walls 84 is higher than the second group 86 of interior walls 84. The degree to which the first group 85 of interior walls 84 is higher than the second group 86 of interior walls 84 will depend in part on the design of the pin grid array that gets connected to the contacts 82.
As shown in
In some embodiments, the interior walls 84 in the first group 85 of interior walls 84 include the indentations 90. Although each indentation 90 and projection 91 in
As shown in
It should be noted that each arm 94 in the pair of arms on each contact 82 may extend toward a stepped section 95 on the interior walls 84 of the base 81 when a pin 77 in the pin grid array is inserted between the arms 94 on each contact 82 (see
It should be noted that each arm 94 in the pair of arms on each contact 82 may extend toward a tapered section 96 on the interior walls 84 of the base 81 when a pin 77 in the pin grid array is inserted between the arms 94 on each contact 82 (se
Electronic system 70 may be a computer system that includes a system bus which electrically couples the various components of electronic system 70 together. The components in the electronic system 70 will be determined based on the space available and the application where the electronic system 70 is to be used (among other factors). In some embodiments, the electronic system 70 may further include a voltage source 79 that is electrically coupled to the printed circuit board 78.
In one embodiment, die 74 is a processor which can be of any type. As used herein, processor means any type of circuit such as, but not limited to, a microprocessor, a microcontroller, a graphics processor or a digital signal processor.
It should be noted that many types of circuits may form part of die 74. Some example circuits include a custom circuit or an application-specific integrated circuit, such as a communications circuit for use in wireless devices (e.g., cellular telephones, pagers, portable computers, two-way radios, and similar electronic systems).
Electronic system 70 may also include an external memory that in turn may include one or more memory elements suitable to a particular application, such as a main memory in the form of random access memory (RAM) (see. e.g., RAM 99 in
The sockets and electronic systems described herein may be implemented in a number of different embodiments. The elements, materials, geometries, and dimensions can all be varied to suit particular packaging requirements.
The sockets and electronic systems described above may provide a solution for supplying additional signals to processors. The design of the socket may increase the overall contact density of the sockets that are used in the electronic systems which include processors. Many other embodiments will be apparent to those of skill in the art from the above description.
The Abstract is provided to comply with 37 C.F.R. Section 1.72(b) requiring an abstract that will allow the reader to ascertain the nature and gist of the technical disclosure. It is submitted with the understanding that it will not be used to limit or interpret the scope or meaning of the claims. The following claims are hereby incorporated into the detailed description, with each claim standing on its own as a separate embodiment.
Claims
1. A socket that engages a pin grid array, the socket comprising:
- a plurality of contacts; and
- a base that includes exterior walls and a plurality of interior walls which extend between the exterior walls to form a plurality of openings within the base such that each opening in the base includes one of the plurality of contacts, at least some of the interior walls including indentations that receive projections on the contacts such that when the projections on the contacts are positioned within the indentations in the interior walls the contacts are secured to the base, wherein each of the indentations in the interior walls includes a base wall and four sidewalls, wherein each contact includes four projections that extend into four indentations in the interior walls of the base.
2. The socket of claim 1, wherein two of the four projections on each contact extend into indentations in an interior wall on one side of an opening and the other two projections on each contact extend into indentations in an interior wall on an opposing side of the opening.
3. A socket that engages a pin grid array, the socket comprising:
- a plurality of contacts; and
- a base that includes exterior walls and a plurality of interior walls which extend between the exterior walls to form a plurality of openings within the base such that each opening in the base includes one of the plurality of contacts, at least some of the interior walls including indentations that receive projections on the contacts such that when the projections on the contacts are positioned within the indentations in the interior walls the contacts are secured to the base, wherein each of the indentations in the interior walls includes a base wall and four sidewalls, wherein each contact includes a flat section and a pair of arms that extend from the flat section, the flat section of each contact including the projections that extend into the indentations in the interior walls of the base.
4. The socket of claim 3, wherein each contact is positioned within an opening such that the flat section of each contact is positioned against one of the interior walls that form the opening.
5. The socket of claim 3, wherein each of the openings is the same size.
6. The socket of claim 3, wherein each of the projections on each contact has a rectangular shape.
7. The socket of claim 6, wherein each of the indentations has a rectangular shape.
8. The socket of claim 3, wherein each of the contacts is the same size and shape.
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- “U.S. Appl. No. 11/610,635 Response filed 09/28/2007 in response to Non-Final Office Action mailed Aug. 10, 2007”, 7 pgs.
- “U.S. Appl. No. 11/610,635, Notice of Allowance mailed Nov. 28, 2007”, 2 pgs.
- “U.S. Appl. No. 11/610,635 Non-Final Office Action Mailed Aug. 10, 2007”, 3 pgs.
Type: Grant
Filed: Jan 10, 2008
Date of Patent: Mar 2, 2010
Patent Publication Number: 20080146065
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Vinayak Pandey (Chandler, AZ), Mingji Wang (Chandler, AZ), Donald T. Tran (Phoenix, AZ)
Primary Examiner: Phuong K Dinh
Attorney: Schwegman, Lundberg & Woessner, P.A.
Application Number: 11/972,047
International Classification: H01R 4/50 (20060101);