Patents Assigned to Intel Corporation
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Publication number: 20260323739Abstract: This disclosure describes systems, methods, and devices related to an unlicensed national information infrastructure 4 (UNII4) discovery. A device may identify a UNII4 discovery request received from a station device (STA) by a first AP of the AP MLD. The device may send the UNII4 discovery request from the first AP to a second AP of the AP MLD, wherein the second AP is capable of operating on a UNII4 frequency band. The device may send a discovery response to the discovery request from the second AP to the STA. The device may establish a first link in a multi-link operation between the second AP and the STA.Type: ApplicationFiled: September 30, 2022Publication date: October 15, 2026Applicant: INTEL CORPORATIONInventors: Laurent CARIOU, Thomas J. KENNEY
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Publication number: 20260322872Abstract: For example, a first wireless communication device may be configured to determine a negotiated bootstrapping mechanism based on a first message-exchange including Peer-to-Peer (P2P) messages exchanged with a second wireless communication device; to pair the first wireless communication device with the second wireless communication device according to the negotiated bootstrapping mechanism; to derive a Pairwise Master Key Security Association (PMKSA) based on a second message-exchange with the second wireless communication device, e.g., after pairing with the second wireless communication device; and to determine an encryption key according to a third message exchange with the second wireless communication device based on the PMKSA. For example, the encryption key may be configured to encrypt a P2P communication with the second wireless communication device.Type: ApplicationFiled: June 25, 2026Publication date: October 15, 2026Applicant: Intel CorporationInventors: Emily H. Qi, Ilan Peer, Ido Ouzieli, Carlos Cordeiro, Preston Hunt
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Publication number: 20260323711Abstract: An apparatus of a New Radio (NR) User Equipment (UE), includes the processing circuitry to: detect a synchronization signal block (SSB) from a NR Node B (gNB); determine a number of multiple physical random access channel (PRACH) transmissions, wherein respective PRACH transmissions of the multiple PRACH transmissions correspond to repetitions of each other and to a preamble; determine a set of valid PRACH occasions associated with the SSB, wherein respective ones of the valid PRACH occasions of the set: are in sequential respective time instances; and use same frequency resources as any immediately prior PRACH occasion of the set; and send the multiple PRACH transmissions in the set for transmission to the gNB.Type: ApplicationFiled: June 12, 2024Publication date: October 15, 2026Applicant: Intel CorporationInventors: Gang Xiong, Debdeep Chatterjee, Dae Won Lee
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Publication number: 20260322873Abstract: For example, a first wireless communication device may be configured to determine a negotiated bootstrapping mechanism based on a first message-exchange including Peer-to-Peer (P2P) messages exchanged with a second wireless communication device; to pair the first wireless communication device with the second wireless communication device according to the negotiated bootstrapping mechanism; to derive a Pairwise Master Key Security Association (PMKSA) based on a second message-exchange with the second wireless communication device, e.g., after pairing with the second wireless communication device; and to determine an encryption key according to a third message exchange with the second wireless communication device based on the PMKSA. For example, the encryption key may be configured to encrypt a P2P communication with the second wireless communication device.Type: ApplicationFiled: June 25, 2026Publication date: October 15, 2026Applicant: Intel CorporationInventors: Emily H. Qi, Ilan Peer, Ido Ouzieli, Carlos Cordeiro, Preston Hunt
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Publication number: 20260324088Abstract: An integrated circuit having a transistor architecture includes a first semiconductor body and a second semiconductor body. The first and second semiconductor bodies are arranged vertically (e.g., stacked configuration) or horizontally (e.g., forksheet configuration) with respect to each other, and separated from one another by insulator material, and each can be configured for planar or non-planar transistor topology. A first gate structure is on the first semiconductor body, and includes a first gate electrode and a first high-k gate dielectric. A second gate structure is on the second semiconductor body, and includes a second gate electrode and a second high-k gate dielectric. In an example, the first gate electrode includes a layer comprising a compound of silicon and one or more metals; the second gate structure may include a silicide workfunction layer, or not. In one example, the first gate electrode is n-type, and the second gate electrode is p-type.Type: ApplicationFiled: January 29, 2026Publication date: October 15, 2026Applicant: Intel CorporationInventors: Aaron D. Lilak, Orb Acton, Cheng-Ying Huang, Gilbert Dewey, Ehren Mannebach, Anh Phan, Willy Rachmady, Jack T. Kavalieros
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Publication number: 20260323044Abstract: Methods, systems, mediums, and devices use video processing with low latency bitstream distribution.Type: ApplicationFiled: March 13, 2026Publication date: October 15, 2026Applicant: Intel CorporationInventors: Gang SHEN, Guangxin XU, Jianhua WU, Ce WANG
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Publication number: 20260319794Abstract: Embodiments detailed herein relate to matrix (tile) operations. For example, decode circuitry to decode an instruction having fields for an opcode and a memory address; and execution circuitry to execute the decoded instruction to set a tile configuration for the processor to utilize tiles in matrix operations based on a description retrieved from the memory address, wherein a tile a set of 2-dimensional registers are discussed.Type: ApplicationFiled: June 23, 2026Publication date: October 15, 2026Applicant: Intel CorporationInventors: Robert VALENTINE, Mark J. CHARNEY, Elmoustapha OULD-AHMED-VALL, Dan BAUM, Zeev SPERBER, Jesus CORBAL, Bret L. TOLL, Raanan SADE, Igor YANOVER, Yuri GEBIL, Rinat RAPPOPORT, Stanislav SHWARTSMAN, Menachem ADELMAN, Simon RUBANOVICH
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Publication number: 20260320490Abstract: Embodiments herein relate to a machine learning (ML) management system of a cellular network. The ML management system may be configure to emulate, or facilitate emulation of, a trained ML model in an emulation environment. ML emulation may refer to performing inference using the ML model in an emulation environment that is different than an inference environment of the cellular network. Other embodiments may be described and/or claimed.Type: ApplicationFiled: May 8, 2024Publication date: October 15, 2026Applicant: INTEL CORPORATIONInventor: Yizhi Yao
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Publication number: 20260324403Abstract: Bonding interfaces between a die and a carrier wafer are described herein. Using a bonding layer between wafers that includes metal, a doped dielectric material, and/or a semiconductor material may reduce damage from processes such as dicing. In one example, dopants are introduced into a dielectric material before bonding. In another example, the bonding layer includes a semiconductor material. In one example, a conductive material including a metal is used as a bonding interface between wafers. In some examples, the metallic bonding material may be patterned. In some examples, a conductive material including metal may replace a dielectric material as a bonding material. In other examples, the bonding interface may include a layer of conductive material and a layer of a dielectric material or a semiconductor material.Type: ApplicationFiled: April 11, 2025Publication date: October 15, 2026Applicant: Intel CorporationInventors: Gwang Soo Kim, Julia Chiu, Shawna M. Liff, Amy Roskowski, Karson Knutson, Jordan Crist, Patrick Kain, Bhaskar Jyoti Krishnatreya
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Publication number: 20260324459Abstract: An electronic system includes a substrate and a top surface active component die. The substrate includes a glass core layer having a glass core layer active component die disposed in a cavity and a discrete passive component disposed in another cavity; a mold layer including a mold layer active component die disposed in the mold layer; and a buildup layer contacting a top surface of the glass core layer and a bottom surface of the mold layer. The buildup layer includes electrically conductive interconnect connecting the glass core layer active component die, the discrete passive component, and the mold layer active component die. The top surface of the component die is electrically connected to the mold layer active component die.Type: ApplicationFiled: June 25, 2026Publication date: October 15, 2026Applicant: Intel CorporationInventors: Bohan Shan, Haobo Chen, Yiqun Bai, Dingying Xu, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Ziyin Lin, Bai Nie, Kyle Jordan Arrington, Jeremy D. Ecton, Brandon C. Marin
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Patent number: 12763782Abstract: A digital-to-analog converter (DAC) and a method for correcting amplitude and/or skew error in a DAC. The DAC includes a main DAC, cell error determination circuit, a correction DAC, and a combiner. The main DAC includes a plurality of DAC cells. The cell error determination circuit is configured to determine an amplitude error and/or a skew error of each of the plurality of DAC cells and generate error data of the DAC based on the input data to the DAC cells. The correction DAC is configured to generate an error signal based on the error data. The combiner is configured to combine the error signal with an output of the main DAC.Type: GrantFiled: December 22, 2022Date of Patent: October 13, 2026Assignee: Intel CorporationInventors: Daniel Gruber, Michael Kalcher, Martin Clara
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Patent number: 12762468Abstract: An apparatus to facilitate protecting assets of mutually distrustful entities during federated learning training on a remote device is disclosed. The apparatus includes a processor to a processor to: receive, at a trusted execution environment (TEE) hosted by a client platform, an encrypted machine learning (ML) model and a cryptographic message authentication code (MAC) from a model owner platform, wherein the encrypted ML model is encrypted by the model owner platform using homomorphic encryption (HE); verify integrity of the encrypted ML model using the cryptographic MAC and a TEE key established by the processor during remote attestation of the TEE with the model owner platform; perform, in the TEE, training of the encrypted ML model using HE computation on sensor data; and send, to the model owner platform, output of the training comprising updated model parameters of the encrypted ML model, where the output is homomorphically encrypted.Type: GrantFiled: August 22, 2022Date of Patent: October 13, 2026Assignee: INTEL CORPORATIONInventors: Reshma Lal, Sarbartha Banerjee
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Patent number: 12762639Abstract: Embodiments described herein provide a system of concurrent compute queues that enable the scheduling of a large number of compute contexts simultaneously on graphics processor hardware. One embodiment provides an apparatus comprising a system interface and a general-purpose graphics processor coupled with the system interface. The general-purpose graphics processor comprises a plurality of graphics processor hardware resources configured to be partitioned into a plurality of isolated partitions, each of the plurality of isolated partitions including a first command streamer, a second command streamer, and circuitry configured to schedule general-purpose graphics compute workloads submitted to a first plurality of command queues associated with the first command streamer and a second plurality of command queues associated with the second command streamer.Type: GrantFiled: August 10, 2022Date of Patent: October 13, 2026Assignee: INTEL CORPORATIONInventors: Joydeep Ray, Vasanth Ranganathan, James Valerio, Jeffery S. Boles, Hema Chand Nalluri, Aditya Navale, Ben J. Ashbaugh, Michal Mrozek, Murali Ramadoss, Hong Jiang, Ankur Shah
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Enhanced techniques for real-time multi-person three-dimensional pose tracking using a single camera
Patent number: 12762735Abstract: This disclosure describes systems, methods, and devices related to real-time multi-person three-dimensional pose tracking using a single camera.Type: GrantFiled: December 10, 2021Date of Patent: October 13, 2026Assignee: Intel CorporationInventors: Shandong Wang, Yurong Chen, Ming Lu, Li Xu, Anbang Yao -
Patent number: 12765319Abstract: This disclosure describes electrostatic wafer chuck designs for holding and heating semiconductor wafers. An electrostatic wafer chuck may include a metal base; a temperature sensor; and a multi-layer ceramic plate including: a bonding layer; a heater; a first dielectric positioned between the heater and the bonding layer; an electrode to electrostatically hold a semiconductor wafer; a second dielectric positioned between the heater and the electrode; a heat spreader to uniformly distribute heat from the heater to the semiconductor wafer; and a third dielectric positioned between the electrode and the semiconductor wafer; and a temperature sensor may extend through the metal base and at least partially through the multi-layer ceramic plate.Type: GrantFiled: December 28, 2022Date of Patent: October 13, 2026Assignee: Intel CorporationInventor: Robert Chroneos, Jr.
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Patent number: 12762057Abstract: Examples include techniques associated with data movement to a cache in a disaggregated die system. Examples include circuitry at a first die receiving and granting requests to move data to a first cache resident on the first die or to a second cache resident on a second die that also includes a core of a processor. The granting of the request based, at least in part, on a traffic source type associated with a source of the request.Type: GrantFiled: November 15, 2022Date of Patent: October 13, 2026Assignee: Intel CorporationInventors: Kapil Sood, Lokpraveen Mosur, Aneesh Aggarwal, Niall D. Mcdonnell, Chitra Natarajan, Ritu Gupta, Edwin Verplanke, George Leonard Tkachuk
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Patent number: 12761965Abstract: An offload analyzer analyzes a program for porting to a heterogeneous computing system by identifying code objects for offloading to an accelerator. Runtime metrics generated by executing the program on a host processor unit are provided to an accelerator model that models the performance of the accelerator and generates estimated accelerator metrics for the program. A code object offload selector selects code objects for offloading based on whether estimated accelerated times of the code objects, which comprise estimated accelerator times and offload overhead times, are better than their host processor unit execution times. The code object offload selector selects additional code objects for offloading using a dynamic-programming-like performance estimation approach that performs a bottom-up traversal of a call tree. A heterogeneous version of the program can be generated for execution on the heterogeneous computing system.Type: GrantFiled: April 23, 2021Date of Patent: October 13, 2026Assignee: Intel CorporationInventors: Kermin E. ChoFleming, Jr., Egor A. Kazachkov, Daya Shanker Khudia, Zakhar A. Matveev, Sergey U. Kokljuev, Fabrizio Petrini, Dmitry S. Petrov, Swapna Raj
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Patent number: 12763810Abstract: Disclosed herein is a radio frequency (RF) circuit for a transmit/receive switch that includes an antenna coupled to a receive path through a first coupled transmission line. The antenna is also coupled to a transmit path through a second coupled transmission line. The RF circuit includes a receiver switch configured to selectively present to the receive path a high impedance or a low impedance to ground and a transmitter switch configured to selectively present to the transmit path a high impedance or a low impedance to ground. The receiver switch and/or transmitter switch may be independently supplied with a bias voltage that depends on whether the circuit is operating in a transmit mode or receive mode. The RF circuit may have improved insertion loss, bandwidth, and linearity, while also providing robustness to electrostatic discharge (ESD).Type: GrantFiled: December 29, 2022Date of Patent: October 13, 2026Assignee: INTEL CORPORATIONInventors: Ritesh A. Bhat, Steven Callender
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Patent number: 12763868Abstract: A physical layer (PHY) device of a switch system of a computing network, a switch system including the PHY device, a tangible non-transitory machine-readable medium to perform operations at the PHY device, and a method to be performed at the PHY device. The PHY device includes a first physical input/output (I/O), and a second physical (I/O), and PHY circuitry coupled between the first I/O and the second I/O. The PHY circuitry includes one of a retimer circuitry or a switch circuitry, and is to: implement a plurality of ports at the first I/O, and a data link at the second I/O; access a plurality of data flows from the plurality of ports at the first I/O; determine a multiplexed data stream from the plurality of data flows by implementing a multiplexing algorithm; and send the multiplexed data stream for transmission from the data link at the second I/O.Type: GrantFiled: September 30, 2022Date of Patent: October 13, 2026Assignee: Intel CorporationInventor: Soren R. F. Laursen
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Patent number: RE51079Abstract: The present description relates to the field of fabricating microelectronic devices having non-planar transistors. Embodiments of the present description relate to the formation of source/drain contacts within non-planar transistors, wherein a titanium-containing contact interface may be used in the formation of the source/drain contact with a discreet titanium silicide formed between the titanium-containing interface and a silicon-containing source/drain structure.Type: GrantFiled: April 14, 2023Date of Patent: October 13, 2026Assignee: Intel CorporationInventors: Sameer S. Pradhan, Subhash M. Joshi, Jin-Sung Chun