Patents Assigned to Intel Corporation
  • Publication number: 20250149459
    Abstract: An integrated circuit structure includes a plurality of interconnect lines and a plurality of dummy lines that are co-planar with the plurality of interconnect lines, where a ratio of line length to end-to-end spacing of the dummy lines varies inversely with a density of the interconnect lines within each of a plurality of regions. The regions are of approximately equal area within a rectangular grid array.
    Type: Application
    Filed: January 7, 2025
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Burak Baylav, Dhananjay Bhawe
  • Publication number: 20250149145
    Abstract: Physical therapy assistant-as-a-service (PTaaS) enables the automatic evaluation of a patient's performance of physical therapy exercises and the automatic provision of feedback to the patient on their exercise performance in real-time. A patient device can provide real-time patient exercise video to a PTaaS backend that performs checks prior to the patient performing the exercise (pre-checks) and checks during patient performance of the exercise (live checks). If any of the checks fail, the PTaaS can provide feedback to the patient, such as if the patient is in an incorrect starting pose or has a body part at an incorrect angle before beginning the exercise or if the patient's form or posture during performance of the exercise needs to be adjusted. The PTaaS can automatically generate exercise metrics, reports, and physical therapy insights that a physical therapy clinician can access from a clinician portal.
    Type: Application
    Filed: December 26, 2024
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Sharon Talmor Marcovici, Rajasekaran Andiappan, Dan Horovitz, Amit Gur, Lakshman Krishnamurthy
  • Publication number: 20250150569
    Abstract: Embodiments are generally directed to selective packing of patches for immersive video. An embodiment of a processing system includes one or more processor cores; and a memory to store data for immersive video, the data including a plurality of patches for multiple projection directions. The system is to select the patches for packing, the selection of the patches based at least in part on which of the multiple projection directions is associated with each of the patches. The system is to encode the patches into one or more coded pictures according to the selection of the patches.
    Type: Application
    Filed: December 27, 2024
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Eyal Ruhm, Jill Boyce, Asaf J. Shenberg
  • Publication number: 20250151355
    Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack structure of a quantum dot device, wherein the quantum well stack structure includes an insulating material to define multiple rows of quantum dot formation regions; and a gate that extends over multiple ones of the rows.
    Type: Application
    Filed: January 10, 2025
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Hubert C. George, Ravi Pillarisetty, Jeanette M. Roberts, Nicole K. Thomas, James S. Clarke
  • Publication number: 20250150361
    Abstract: Network apparatus, communicatively coupled to a provider of services, that includes gateway circuitry to receive application programming interface (API) request data from a computing device that indicates a requested service. The gateway circuitry is to (1) select, based upon the API request data, at least one of the services corresponding to the requested service, and (2) generate, based upon mapping of the API request data to the at least one of the services, corresponding request data specifically for use in invoking the at least one of the services. The gateway circuitry is to (1) generate the corresponding request data by performing at least one programmable transformation, (2) be used in association with at least one proxy-related operation, (3) register the services for use in association with service discovery, and (4) verify the API request data and an identity associated with the computing device.
    Type: Application
    Filed: January 13, 2025
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Francesc Guim Bernat, Ned Smith, Kshitij Doshi, Alexander Bachmutsky, Suraj Prabhakaran
  • Publication number: 20250147233
    Abstract: A wavelength multiplexing optical fiber transmitter, receiver, or transceiver where multiple emitters and/or photodetectors of different center wavelengths are coupled to a single optical fiber core terminus through multiple waveguides, which may be directly printed in free space. The optical assemblies described are suitable for optical data link applications, for example, to reduce a number of optical fibers needed for a given bandwidth or increase the bandwidth of a give number of optical fibers. Bidirectional fiber termination may also be implemented with an emitter and a photodetector pair coupled to a single optical fiber core terminus through multiple waveguides.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Junyi Qiu, Mozhgan Mansuri, Beom-Taek Lee
  • Publication number: 20250147822
    Abstract: A computing apparatus, including: a hardware computing platform; and logic to operate on the hardware computing platform, configured to: receive a microservice instance registration for a microservice accelerator, wherein the registration includes a microservice that the microservice accelerator is configured to provide, and a microservice connection capability indicating an ability of the microservice instance to communicate directly with other instances of the same or a different microservice; and log the registration in a microservice registration database.
    Type: Application
    Filed: January 6, 2025
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Vadim Sukhomlinov, Kshitij A. Doshi
  • Publication number: 20250151318
    Abstract: Self-aligned gate endcap (SAGE) architectures with vertical sidewalls, and methods of fabricating self-aligned gate endcap (SAGE) architectures with vertical sidewalls, are described. In an example, an integrated circuit structure includes a semiconductor fin having sidewalls along a length of the semiconductor fin, each sidewall tapering outwardly from a top of the semiconductor fin toward a bottom of the semiconductor fin. A gate endcap isolation structure is spaced apart from the semiconductor fin and has a length parallel with the length of the semiconductor fin. The gate endcap isolation structure has a substantially vertical sidewall laterally facing one of the outwardly tapering sidewalls of the semiconductor fin.
    Type: Application
    Filed: January 13, 2025
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Ritesh K. DAS, Kiran CHIKKADI, Ryan PEARCE
  • Publication number: 20250149421
    Abstract: Disclosed herein are microelectronic assemblies and related devices and methods. In some embodiments, a microelectronic assembly may include a glass layer having a surface; a material on the surface of the glass layer, the material including a positive-type photo-imageable dielectric (PID) material; a via including a conductive material, wherein the via extends through the glass layer and through the material on the surface of the glass layer, and wherein the via has a first diameter through the material on the surface, a second diameter at the surface of the glass layer, and the first diameter is equal to the second diameter plus 1 micron or minus 1 micron; and a dielectric layer on the material at the surface of the glass layer, the dielectric layer including a conductive pathway electrically coupled to the via.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventor: Jeremy Ecton
  • Publication number: 20250150968
    Abstract: This disclosure describes systems, methods, and devices related to control frames status. A device may receive a control frame from a station (STA) at a beginning of a transmission opportunity (TxOP) that includes availability and unavailability information. The device may acknowledge the availability and unavailability information of the STA based on fields within the control frame, including unavailability target start time field and unavailability duration field. The device may adjust a transmission schedule to avoid transmitting to the STA during its indicated unavailability period. The device may initiate a TxOP with an initial control frame that includes updated availability and unavailability information based on the control frame from the STA.
    Type: Application
    Filed: January 7, 2025
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Laurent CARIOU, Thomas J. KENNEY
  • Publication number: 20250147762
    Abstract: Described herein is a graphics processor having processing resources with configurable thread and register configurations. Program code can configure a number of registers and accumulators that will be used by hardware threads during execution of the program code by the graphics processor. Processing resources within the graphics processor can be configured to assign different numbers of registers and accumulators to hardware threads based on the configuration requested by program code to be executed by the processing resource.
    Type: Application
    Filed: November 8, 2023
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Vasanth Ranganathan, Gang Chen, Supratim Pal, Jorge Eduardo Parra Osorio, Arthur Hunter, Boris Kuznetsov, Deepak N K, Siva Kumar Seemakurthi, James Valerio, Shubham Dinesh Chavan, Abhishek Kumar Singh, Samir Pandya, Sandeep Tippannanavar Niranjan, Alan Curtis, Jain Philip, Maltesh Kulkarni, Fangwen Fu, John Wiegert, Brent Schwartz
  • Publication number: 20250149455
    Abstract: Disclosed herein are microelectronic assemblies and related devices and methods. In some embodiments, a microelectronic assembly may include a glass layer having a surface; a material on the surface of the glass layer, the material including a polyimide or a dielectric material; a via including a conductive material, wherein the via extends through the glass layer and through the material on the surface of the glass layer, and wherein the via has a first diameter through the material on the surface, a second diameter at the surface of the glass layer, and the first diameter is equal to the second diameter plus 1 micron or minus 1 micron; and a dielectric layer on the material at the surface of the glass layer, the dielectric layer including a conductive pathway electrically coupled to the via.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Nicholas Haehn, Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram, Gang Duan
  • Publication number: 20250148089
    Abstract: Techniques for instruction prefix encoding for cryptographic computing capability data types are described. In an embodiment, an apparatus includes an instruction decoder to decode a first instruction including a first prefix; and cryptography circuitry to perform a cryptographic operation on data, the cryptographic operation to be based at least in part on the first prefix and a relative enumeration in a pointer to the data.
    Type: Application
    Filed: July 1, 2023
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: David M. Durham, Michael LeMay, Hans Goran Liljestrand
  • Patent number: 12293231
    Abstract: Examples described herein include a device interface; a first set of one or more processing units; and a second set of one or more processing units. In some examples, the first set of one or more processing units are to perform heavy flow detection for packets of a flow and the second set of one or more processing units are to perform processing of packets of a heavy flow. In some examples, the first set of one or more processing units and second set of one or more processing units are different. In some examples, the first set of one or more processing units is to allocate pointers to packets associated with the heavy flow to a first set of one or more queues of a load balancer and the load balancer is to allocate the packets associated with the heavy flow to one or more processing units of the second set of one or more processing units based, at least in part on a packet receive rate of the packets associated with the heavy flow.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: May 6, 2025
    Assignee: Intel Corporation
    Inventors: Chenmin Sun, Yipeng Wang, Rahul R. Shah, Ren Wang, Sameh Gobriel, Hongjun Ni, Mrittika Ganguli, Edwin Verplanke
  • Patent number: 12294027
    Abstract: Embodiments of the present invention describe a epitaxial region on a semiconductor device. In one embodiment, the epitaxial region is deposited onto a substrate via cyclical deposition-etch process. Cavities created underneath the spacer during the cyclical deposition-etch process are backfilled by an epitaxial cap layer. The epitaxial region and epitaxial cap layer improves electron mobility at the channel region, reduces short channel effects and decreases parasitic resistance.
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: May 6, 2025
    Assignee: Intel Corporation
    Inventors: Anand S. Murthy, Daniel Boune Aubertine, Tahir Ghani, Abhijit Jayant Pethe
  • Patent number: 12294368
    Abstract: The present disclosure is directed to 3-D stacked architecture for Programmable Fabrics and Central Processing Units (CPUs). The 3-D stacked orientation enables reconfigurability of the fabric, and allows the fabric to function using coarse-grained and fine-grained acceleration for offloading CPU processing. Additionally, the programmable fabric may be able to function to interface with multiple other compute chiplet components in the 3-D stacked orientation. This enables multiple compute components to communicate without the need for offloading the data communications between the compute chiplets.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: May 6, 2025
    Assignee: Intel Corporation
    Inventors: Rahul Pal, Dheeraj Subbareddy, Mahesh Kumashikar, Dheemanth Nagaraj, Rajesh Vivekanandham, Anshuman Thakur, Ankireddy Nalamalpu, Md Altaf Hossain, Atul Maheshwari
  • Patent number: 12293431
    Abstract: Embodiments described herein include, software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. Embodiment described herein provided techniques to detect zero value elements within a vector or a set of packed data elements output by a processing resource and generate metadata to indicate a location of the zero value elements within the plurality of data elements.
    Type: Grant
    Filed: May 2, 2023
    Date of Patent: May 6, 2025
    Assignee: Intel Corporation
    Inventors: Joydeep Ray, Scott Janus, Varghese George, Subramaniam Maiyuran, Altug Koker, Abhishek Appu, Prasoonkumar Surti, Vasanth Ranganathan, Valentin Andrei, Ashutosh Garg, Yoav Harel, Arthur Hunter, Jr., SungYe Kim, Mike Macpherson, Elmoustapha Ould-Ahmed-Vall, William Sadler, Lakshminarayanan Striramassarma, Vikranth Vemulapalli
  • Patent number: 12293237
    Abstract: Apparatuses, methods and storage medium for computing including determination of work placement on processor cores are disclosed herein. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to identify a favored core of the processor cores. The one or more processors, devices, and/or circuitry may be configured to determine whether to migrate a thread to or from the favored core. In some embodiments, the determination may be by a process executed by a driver and/or by an algorithm executed by a power control unit of the processor.
    Type: Grant
    Filed: December 19, 2023
    Date of Patent: May 6, 2025
    Assignee: Intel Corporation
    Inventors: Guy M. Therien, Michael D. Powell, Venkatesh Ramani, Arijit Biswas, Guy G. Sotomayor
  • Patent number: 12293661
    Abstract: Apparatus, systems, and/or methods may involve reporting a road hazard. Road hazard data may be collected for an object on a road, which may include automatically generated data from a device associated with the object causing a hazard. The road hazard data may be provided to a service, an application, a device, a client, and so on. For example, the road hazard data may be merged with a map and provided to a map services client, a navigation client, and so on. An alert may be generated based on the road hazard data to warn of the hazard caused by the object. The alert may include a visual and/or audio representation of the hazard data. The alert may be used to automatically and/or manually avoid the hazard.
    Type: Grant
    Filed: October 9, 2023
    Date of Patent: May 6, 2025
    Assignee: Intel Corporation
    Inventors: Tomer Rider, Aviv Ron, Yair Giwnewer
  • Patent number: 12294731
    Abstract: Techniques are provided for generation of secure video and tamper detection of the secure video. A methodology implementing the techniques according to an embodiment includes selecting a subset of macroblocks from a video frame to be transmitted and calculating a low frequency metric on each of the selected macroblocks. The method also includes performing a hash calculation on the low frequency metrics to generate a frame signature, encrypting the frame signature (using a private key) to generate an encrypted watermark, and modifying pixels of each of the selected macroblocks to generate the secured video frame, the modifications based on bits of the encrypted watermark that are associated with the selected macroblock. The method further includes authenticating a received video frame by comparing a calculated frame signature to an authenticated frame signature, the authenticated frame signature decrypted (using a public key) from an extracted watermark of the received video frame.
    Type: Grant
    Filed: January 15, 2024
    Date of Patent: May 6, 2025
    Assignee: Intel Corporation
    Inventors: Noam Levy, Guy Ben-Artzi