Abstract: An arrangement apparatus includes a stage, an arrangement part, and a control part. The stage supports a substrate. The arrangement part holds a die and arranges multiple dies on the substrate supported by the stage. The control part has a map data indicating arrangement positions of the dies and generated based on a positional relationship among patterns formed by an exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.

Abstract: Provided is an imprint apparatus that forms a pattern on a shot region of a substrate by curing an imprint material on the shot region by light irradiation in a state in which the imprint material is in contact with a mold. The apparatus comprises a shutter plate, and an adjuster configured to adjust a state of the shutter plate to control the light irradiation to the imprint material on the shot region, wherein the shutter plate includes a first passing portion used to irradiate a portion of an entire portion of the imprint material on the shot region with light, and the adjuster adjusts a tilt of the shutter plate.

Abstract: A device and a method for determining a microvibration effect on a millisecond-level space optical sensor are provided. The device includes: a light source, a star simulator, an air flotation vibration isolation platform, a suspension system/air flotation system, a zero stiffness system, a supporting system, a six-degree-of-freedom microvibration simulator, a signal driving apparatus, and a data acquisition and processing system. In the device for determining a microvibration effect on a space pointing measurement apparatus, a free boundary condition and a zero gravity environment are simulated by using a suspension system and a zero stiffness system. A light source and a star simulator simulate a star at infinity. A six-degree-of-freedom microvibration simulator simulates an on-orbit microvibration mechanical environment which is used as an input of a test. Extremely high-precision sensors collect system response data.

Abstract: An anti-shake camera includes a camera body, and a circuit board and a coil fixing plate which are fixed to a back surface of the camera body; a back surface of the coil fixing plate is divided into four areas according to diagonal lines, fan-shaped coils are respectively fixed to two symmetric areas among the four areas, and a rotating shaft is arranged in a center of the diagonal lines; and a substrate is arranged behind the back surface of the coil fixing plate, a surface, opposite to the back surface of the coil fixing plate, of the substrate is provided with a matching mechanism of the rotating shaft, and one or more fan-shaped permanent magnets forming gaps with included angles with the fan-shaped coils are fixed to areas, corresponding to areas of the coil fixing plate where no fan-shaped coils are fixed, on the substrate.

Abstract: A fluid handling system for wetting a substrate irradiated by radiation. The fluid handling system include a first device to confine a first liquid to a first space between the first device and the substrate. The first device includes a first liquid supply member to provide the first liquid to the first space and an extraction member to remove liquid. The fluid handling system further includes a second device including a second liquid supply member to provide a second liquid to a second space between the second device and the substrate, wherein there is a gap on the surface of the substrate between the first and second liquids. The fluid handling system is configured to provide the second liquid to the second space without removing any liquid from the second space to form a liquid layer, and is configured to provide the first and second liquids on the substrate simultaneously.

Abstract: A method for controlling a lithographic apparatus, and associated apparatuses. The method is configured to provide product structures to a substrate in a lithographic process and includes determining optimization data. The optimization data includes measured and/or simulated data of at least one performance parameter associated with the product structures and/or their arrangement which are to be applied to the substrate in the lithographic process. Substrate specific metrology data as measured and/or modelled before the providing of product structures to the substrate is determined, the substrate specific metrology data including metrology data relating to a characteristic of the substrate to which the structures are being applied and/or the state of the lithographic apparatus at the time that the structures are applied to the substrate.

Abstract: A method for obtaining a compensation pattern for a workpiece patterning device comprises printing (S11) a calibration pattern with a plurality of simultaneously operating exposure beams being sweepable in a second direction according to calibration pattern print data having a multitude of edges. Positions of the edges are measured (S12). Deviations of the measured positions relative calibration pattern are calculated (S13). Each deviation is associated (S14) with a used exposure beam, with a sweep position and a grid fraction position. Edge compensating data is computed (S15) for adapting edge representations of pattern print data prior to printing to compensate for the calculated deviations. The edge compensating data is dependent on the used exposure beam, the sweep position, and the grid fraction position.

Abstract: According to one embodiment, an apparatus is disclosed for implementing a radio frequency quadrupole stark decelerator (RFQ-SD). The RFQ-SD includes two dielectric plates having substantially planar shapes. The first dielectric plate includes a first set of wires being attached onto a surface of the first dielectric plate and a second set of wires being attached onto the surface of the first dielectric plate. The second dielectric plate includes a third set of wires being attached onto a surface of the second dielectric plate and a fourth set of wires being attached onto the surface of the second dielectric plate. The first dielectric plate and the second dielectric plate are spaced apart such that every four wires, two wires from the first dielectric plate and two wires from the second dielectric plate, form a quadrupole electric field channel for guiding neutral polar molecules.

Abstract: A fluid handling system that includes a liquid confinement structure configured to confine immersion liquid to a space between at least a part of the liquid confinement structure and a surface of a substrate. The fluid handling system also includes a mechanism configured to vibrate a vibration component in contact with the immersion liquid.

Abstract: A laser processing apparatus includes a laser beam applying unit for applying a laser beam to a workpiece, and a control unit. The laser beam applying unit includes a laser oscillator for emitting a laser, a condensing lens, a concave mirror having a focal point at a focused spot of the condensing lens and having a spherical reflecting surface, a beam splitter for transmitting therethrough the laser beam emitted from the laser oscillator toward the condensing lens and branching off a reflected beam, and a wavefront measuring unit for receiving the reflected beam and acquiring wavefront data. The control unit changes a phase pattern to be displayed on a display portion of a spatial light modulator on the basis of the wavefront data.

Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.

Abstract: Embodiments of the present disclosure include a lithography apparatus, patterning system, and method of patterning a layered structure. The patterning system includes an image formation device and a reactive layer. The patterning system allows for creating lithography patterns in a single operation. The lithography apparatus includes the patterning system and an optical system. The lithography apparatus uses a plurality of wavelengths of light, along with the image formation device, to create a plurality of color patterns on the reactive layer. The method of patterning includes exposing the reactive layer to a plurality of wavelengths of light. The light reacts differently with different regions of the reactive layer, depending on the wavelength of light emitted onto the different regions. The method and apparatuses disclosed herein require only one image formation device and one lithography operation.

Abstract: A method is described. The method includes obtaining a relationship between a thickness of a contamination layer formed on a mask and an amount of compensation energy to remove the contamination layer, obtaining a first thickness of a first contamination layer formed on the mask from a thickness measuring device, and applying first compensation energy calculated from the relationship to a light directed to the mask.

Abstract: Laser processing apparatus includes movable mirror for changing paths of laser light for processing and measurement light, and stage for changing an incident angle of measuring light. Furthermore, laser processing apparatus includes lens for condensing laser light for processing and measurement light on processing point, controller for controlling laser oscillator, movable mirror, and stage based on corrected data for processing, and measurement processor for measuring a depth of keyhole generated at processing point. The corrected data for processing is data corrected so as to a deviation of an arrival position of at least one of laser light for processing and measurement light caused by chromatic aberration of lens on the surface of workpiece. With this configuration, an accurate depth of keyhole can be measured.

Abstract: A measurement apparatus and method for determining a substrate grid describing a deformation of a substrate prior to exposure of the substrate in a lithographic apparatus configured to fabricate one or more features on the substrate. Position data for a plurality of first features and/or a plurality of second features on the substrate is obtained. Asymmetry data for at least a feature of the plurality of first features and/or the plurality of second features is obtained. The substrate grid based on the position data and the asymmetry data is determined. The substrate grid and asymmetry data are passed to the lithographic apparatus for controlling at least part of an exposure process to fabricate one or more features on the substrate.

Abstract: Systems and methods of dispersion compensation in an optical device are disclosed. A holographic optical element may include a set of different holograms in a grating medium. Each hologram in the set may have a corresponding grating vector with a grating frequency and direction. The directions of the grating vectors may vary as a function of the grating frequency. Different holograms in the set may diffract light in a particular direction so that the light emerges from a boundary of the grating medium in a single given direction regardless of wavelength. A prism may be used to couple light into the grating medium. The prism may be formed using materials having dispersion properties that are similar to the dispersion properties of the grating material. The prism may have an input face that receives perpendicular input light. The prism may include multiple portions having different refractive indices.

Abstract: A method includes receiving a wafer, measuring a surface topography of the wafer; calculating a topographical variation based on the surface topography measurement performing a single-zone alignment compensation when the topographical variation is less than a predetermined value or performing a multi-zone alignment compensation when the topographical variation is greater than the predetermined value; and performing a wafer alignment according to the single-zone alignment compensation or the multi-zone alignment compensation.

Abstract: An image of a portion of a semiconductor die is obtained that shows one or more structures in a first process layer and one or more structures in a second process layer. Using machine learning, a first region is defined on the image that at least partially includes the one or more structures in the first process layer. Also using machine learning, a second region is defined on the image that at least partially includes the one or more structures in the second process layer. An overlay offset between the one or more structures in the first process layer and the one or more structures in the second process layer is calculated using the first region and the second region.

Abstract: An object of the present disclosure is to propose a height measuring device which performs height measurement with high accuracy at each height with a relatively simple configuration even when the sample surface height changes greatly. A height measuring device which includes a projection optical system configured to project a light ray onto an object to be measured and a detection optical system including a detection element configured to detect a reflected light ray from the object to be measured, where the projection optical system includes a light splitting element (103) which splits a trajectory of the light ray with which the object to be measured is irradiated into a plurality of parts, and thus it is possible to project a light ray to a predetermined position even when the object to be measured is located at a plurality of heights, is proposed.

Abstract: A lithographic system for projecting an image onto a workpiece using radiation is provided. The lithographic system includes: a support structure for supporting a workpiece; a radiation source for providing radiation to project an image on the workpiece; a reticle positioned between the radiation source and the workpiece; and a mask positioned adjacent the reticle, the mask being configured to block radiation from the radiation source, the mask including a heat removal apparatus.

Abstract: A lithographic system for projecting an image onto a workpiece using radiation is provided. The lithographic system includes: a support structure for supporting a workpiece; a radiation source for providing radiation to project an image on the workpiece; a reticle positioned between the radiation source and the workpiece; and a mask positioned adjacent the reticle, the mask being configured to block radiation from the radiation source, the mask including a heat removal apparatus.

Abstract: A lithography method to pattern a first semiconductor wafer is disclosed. An optical mask is positioned over the first semiconductor wafer. A first region of the first semiconductor wafer is patterned by directing light from a light source through transparent regions of the optical mask. A second region of the first semiconductor wafer is patterned by directing energy from an energy source to the second region, wherein the patterning of the second region comprises direct-beam writing.

Abstract: The present application provides a temperature control method, an apparatus, an electronic device and a storage medium for an etching workbench. A real-time temperature of an etching workbench and a real-time temperature of a temperature control fluid are acquired firstly; then, a temperature control instruction is determined according to the real-time temperature of the etching workbench, the real-time temperature of the temperature control fluid and a limit temperature; and finally, in response to the temperature control instruction, a target operating temperature of the etching workbench is stabilized within a preset range by a circulating temperature control fluid loop.

Abstract: There is provided an electronic device including a light source module, an image sensor and a processor. The light source module projects a first pattern and a second pattern toward a moving direction. The image sensor captures an image of the first pattern and an image of the second pattern. The processor calculates one-dimensional depth information according to the image of the first pattern and calculates two-dimensional depth information according to the image of the second pattern.

Abstract: An optical element and a lithographic apparatus including the optical element. The optical element includes a first member having a curved optical surface and a heat transfer surface, and a second member that comprises at least one recess, the at least one recess sealed against the heat transfer surface to form at least one closed channel between the first member and the second member to allow fluid to flow therethrough for thermal conditioning of the curved optical surface. In an embodiment, one or more regions of the heat transfer surface exposed to the at least one closed channel are positioned along a curved profile similar to that of the curved optical surface.

Abstract: Embodiments provide image display systems and methods for one or more camera calibration using a two-sided diffractive optical element (DOE). More specifically, embodiments are directed to determining intrinsic parameters of one or more cameras using a single image obtained using a two-sided DOE. The two-sided DOE has a first pattern on a first surface and a second pattern on a second surface. Each of the first and second patterns may be formed by repeating sub-patterns that are lined when tiled on each surface. The patterns on the two-sided DOE are formed such that the brightness of the central intensity peak on the image of the image pattern formed by the DOE is reduced to a predetermined amount.

Abstract: In order to improve the throughput performance and/or economy of a measurement apparatus, the present disclosure provides a metrology apparatus including: a first measuring apparatus; a second measuring apparatus; a first substrate stage configured to hold a first substrate and/or a second substrate; a second substrate stage configured to hold the first substrate and/or the second substrate; a first substrate handler configured to handle the first substrate and/or the second substrate; and a second substrate handler configured to handle the first substrate and/or the second substrate, wherein the first substrate is loaded from a first, second or third FOUP, wherein the second substrate is loaded from the first, second or third FOUP, wherein the first measuring apparatus is an alignment measuring apparatus, and wherein the second measuring apparatus is a level sensor, a film thickness measuring apparatus or a spectral reflectance measuring apparatus.

Abstract: An immersion liquid supply and recovery device (2) with new-type pumping and drainage cavities includes pumping and drainage openings, pumping and drainage cavities, and sealed pumping and drainage channels, wherein the pumping and drainage cavities are in communication with an immersion flow field by means of the multiple pumping and drainage openings, and the pumping and drainage openings in communication with the different pumping and drainage cavities are circumferentially distributed in a crossed manner; at least two pumping and drainage cavities are provided, and each of the pumping and drainage cavities is in communication with an immersion liquid recovery system by one sealed pumping and drainage channel respectively; and the communication points of the pumping and drainage cavities and the sealed pumping and drainage channels are evenly arranged in the circumferential direction of the pumping and drainage cavities.

Abstract: A system for positioning, a stage system, a lithographic apparatus, a method for positioning and a method for manufacturing a device in which use is made of a stage system. The stage system has a plurality of air bearing devices. Each air bearing device has: a gas bearing body which has a free surface, a primary channel which extends through the bearing body and has an inlet opening in the free surface, and a secondary channel system which extends through the bearing body and which has a plurality of discharge openings in the free surface. The flow resistance in the secondary channel system can be higher than the flow resistance in the primary channel.

Abstract: In some embodiments, the present disclosure relates to a process tool that includes a lithography apparatus arranged over a wafer chuck and an immersion hood apparatus laterally around the lithography apparatus. The lithography apparatus includes a photomask arranged between a light source and a lens. The immersion hood apparatus comprises input piping, output piping, and extractor piping. The input piping is arranged on a lower surface of the immersion hood apparatus and configured to distribute a liquid between the lens and the wafer chuck. The output piping is arranged on the lower surface of the immersion hood apparatus and configured to contain the liquid arranged between the lens and the wafer chuck. The extractor piping is arranged on an outer sidewall of the immersion hood apparatus and configured to remove any liquid above the wafer chuck that is outside of the immersion hood apparatus.

Abstract: An exposure machine and an exposure method are provided in some embodiments of the present disclosure. The exposure machine includes: a detection module, configured to detect whether there are attachments on the surface of a reticle; a cleaning device, configured to clean the attachments on the surface of the reticle; and an exposure module, configured to expose the reticle having no attachments detected.

Abstract: An exposure apparatus including an obtainment unit configured to obtain, for each of a plurality of exposure regions on a substrate, surface positions in a height direction in the exposure region, and a control unit configured to control, based on the obtained surface positions, driving of a substrate stage in the height direction, wherein the control unit obtains an approximate surface approximately representing a cross-sectional shape of a surface of the exposure region from the obtained surface positions obtained, and for a first exposure region for which information related to the approximate surface does not exceed a predetermined range, controls the driving based on a correction value related to the driving obtained from an approximate surface approximately representing a cross-sectional shape of a surface of the exposure region that has been exposed prior to the first exposure region.

Abstract: Embodiments described herein provide a method of large area lithography to decrease widths of portions written into photoresists. One embodiment of the method includes projecting an initial light beam of a plurality of light beams at a minimum wavelength to a mask in a propagation direction of the plurality of light beams. The mask has a plurality of dispersive elements. A wavelength of each light beam of the plurality of light beams is increased until a final light beam of the plurality of light beams is projected at a maximum wavelength. The plurality of dispersive elements of the mask diffract the plurality of light beams into order mode beams to produce an intensity pattern in a medium between the mask and a substrate having a photoresist layer disposed thereon. The intensity pattern having a plurality of intensity peaks writes a plurality of portions in the photoresist layer.

Abstract: The present disclosure relates to a processing tool that includes a first wafer-mounting frame and a second wafer-mounting frame. The first wafer-mounting frame is configured to retain a target wafer. The second wafer-mounting frame is configured to retain a masking wafer. The masking wafer includes a mask pattern made up of a number of openings passing through the masking wafer to correspond to a predetermined deposition pattern to be formed on the target wafer. A deposition chamber is configured to receive the first and second wafer-mounting frames, when the first and second wafer-mounting frames are clamped together to retain the target wafer and the masking wafer. The deposition chamber includes a material deposition source configured to deposit material from the material deposition source through the number of openings in the mask pattern to form the material in the predetermined deposition pattern on the target wafer.

Abstract: Embodiments of a continuous dust accumulation monitoring system comprise an enclosure adapted for use in electrical hazardous locations, a sample area for collecting ambient dust, a dust accumulation sensor assembly installed in the enclosure configured to generate a signal based on the amount of ambient dust collected on the sample area and a circuit board within the enclosure configured to receive the signal from the dust accumulation sensor assembly. The continuous dust accumulation monitoring system may be connected to system control hardware.

Abstract: A system, computer program product, and method are presented for automatically executing chaos experiments on computing resources, applications, and services through automatically establishing and meeting core requirements for each chaos experiment. The method includes receiving a trigger signal configured to establish one or more condition s to execute one or more chaos experiments on at least a portion of one or more landing zones. The one or more chaos experiments are configured to operationally stress one or more of one or more infrastructure resources, one or more services, and one or more computing applications. The method also includes determining, automatically, the technical support coverage for the execution of the one or more chaos experiments. The method further includes executing, automatically, subject to the technical support coverage determination, the one or more chaos experiments.

Abstract: A projection device includes: a plurality of light sources arranged in a first direction; a spatial modulation element that modulates incident light into image information and emits the image information; a lens that changes an optical path of light emitted from each of the plurality of light sources such that the light emitted from each light source reaches substantially the same region of an incident surface of the spatial modulation element; and a first reflective optical member that deflects the light emitted from the lens toward the spatial modulation element, the first reflective optical member having a shape that reflects light emitted from the lens so as to be incident on an arbitrary point on the incident surface of the spatial modulation element at a predetermined reference incident angle.

Abstract: The present invention provides an exposure apparatus for performing scanning exposure on each of a plurality of shot regions in a substrate, comprising: a stage configured to hold the substrate; a driver configured to drive the stage; and a controller configured to control the scanning exposure on each of the plurality of shot regions while controlling the driver in accordance with a driving profile, wherein the driving profile includes a first section in which the stage is driven at a constant acceleration in a first direction, a second section in which the stage is driven at a constant acceleration in a second direction opposite to the first direction, and a connection section connecting the first section and the second section, and a period in which the scanning exposure is performed includes at least a part of the connection section.

Abstract: A substrate holder for use in a lithographic apparatus, the substrate holder including: a main body; a plurality of first burls provided on a first side of the main body and having end surfaces to support a substrate, wherein the first burls each include CrN; and a plurality of second burls provided on a second side of the main body.

Abstract: A lithographic apparatus includes an illumination system to produce a beam of radiation, a support to support a patterning device to impart a pattern on the beam, a projection system to project the patterned beam onto a substrate, and a metrology system that includes a radiation source to generate radiation, an optical element to direct the radiation toward a target, a detector to receive a first and second radiation scattered by the target and produce a first and second measurement respectively based on the received first and second radiation, and a controller. The controller determines a correction for the first measurement, an error between the correction for the first measurement and the first measurement, and a correction for the second measurement based on the correction for the first measurement, the second measurement, and the error. The lithographic apparatus uses the correction to adjust a position of a substrate.

Abstract: A wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.

Abstract: A LIDAR system is disclosed. The system has a laser light projection system to simultaneously project at least two laser light beams. The system also has a deflector to project the at least two laser light beams toward a field of view of the LIDAR system. Each of the at least two laser light beams has an energy density below an eye safe level. A total combined energy density of the at least two laser light beams is above an eye safe level. Further, the at least two laser light beams projected from the deflector are separated from one another by an angular spacing ranging from 2.5 mrad to 6 mrad.

Abstract: A method of determining a parameter of a patterning process, the method including: obtaining a detected representation of radiation redirected by a structure having geometric symmetry at a nominal physical configuration, wherein the detected representation of the radiation was obtained by illuminating a substrate with a radiation beam such that a beam spot on the substrate was filled with the structure; and determining, by a hardware computer system, a value of the patterning process parameter based on optical characteristic values from an asymmetric optical characteristic distribution portion of the detected radiation representation with higher weight than another portion of the detected radiation representation, the asymmetric optical characteristic distribution arising from a different physical configuration of the structure than the nominal physical configuration.

Abstract: Imprint apparatus brings pattern region of mold into contact with imprint material on shot region of substrate, aligns the shot region and the pattern region with each other, and cures the imprint material. The apparatus includes light irradiator which irradiates the imprint material with light. In state that the imprint material on the shot region and the pattern region are in contact and the pattern region is flat, the light irradiator performs preliminary exposure of irradiating the imprint material with the light to increase viscosity of the imprint material. In the preliminary exposure, the light irradiator irradiates the imprint material with the light under illuminance distribution determined such that illuminance in contact beginning region where the imprint material and the pattern region begin to contact is lower than illuminance in certain region different from the contact beginning region.

Abstract: An apparatus comprising: a position monitoring system configured to determine the position of the substrate with respect to a projection system configured to project a radiation beam through an opening in the projection system and onto a substrate, wherein a component of the position monitoring system is located beneath the projection system in use; and a baffle disposed between the opening and the component.

Abstract: A number of unit cells of a digital-to-analog converter (DAC) may be simultaneously activated to generate an analog signal. However, while each unit cell may be generally the same, there may be variations such as non-linearity or noise in the analog output depending on which unit cells are activated for a given digital signal value. For example, as additional unit cells are activated for increased values of the analog signal, the fill order in which the unit cells are activated may affect the linearity/noise of the DAC. The decision units may be programmable to select which branches of the fractal DAC to activate, changing the fill order based on a fill-selection signal. The fill order may be set by a fill controller via the fill-selection signal to account for manufacturing variations, gradients in the supply voltage, output line routing, and/or environmental factors such as temperature.

Abstract: A system and method for dynamically controlling a temperature of a thermostatic reticle. A thermostatic reticle assembly that includes a reticle, temperature sensors located in proximity to the reticle, and one or more heating elements. A thermostat component that is in communication with the temperature sensors and the heating element monitors the current temperature of the reticle relative to a steady-state temperature. In response to the current temperature of the reticle being lower than the steady-state temperature, the heating elements are activated to preheat the reticle to the steady-state temperature.

Abstract: A method of cleaning a surface of a reticle includes retrieving a reticle from a reticle library and transferring the reticle to a first exposure device. The surface of the reticle is cleaned in the first exposure device by irradiating the surface of the reticle with an extreme ultraviolet (EUV) radiation for a predetermined irradiation time. After the cleaning, the reticle is transferred to a second exposure device for lithography operation.

Abstract: The present invention discloses a double-sided synchronous scanning device. A scanning channel is formed between two scanning components; two backlight plates are respectively used to provide backlight for an opposite-side scanning component and fixed with the same-side scanning component; one side of each backlight plate facing the scanning channel is provided with a light guide groove corresponding to a light inlet of the corresponding scanning component; a backlight source is arranged in the light guide groove. When the two scanning components work synchronously, because the backlight plates always need to provide backlight for the opposite-side scanning component, and the reflected light generated by the backlight plates on a scanned sample enters the light inlet of the same-side scanning component, which will affect the image scanning effect.

Abstract: Reflectometer, spectrophotometer, ellipsometer, and polarimeter systems having a supercontinuum laser source of coherent electromagnetic radiation over a range of between 400 nm to between 4400 nm and 18000 nm, and another source of wavelengths to provide between 400 nm and as high as at least 50000 nm; a stage for supporting a sample and a detector of electromagnetic radiation, wherein the source provides a beam of electromagnetic radiation which interacts with a sample and enters a detector system optionally incorporating a wavelength modifier, where the detector system can be functionally incorporated with combinations of gratings and/or combination dichroic beam splitter-prisms, which can be optimized as regards wavelength dispersion characteristics to direct wavelengths in various ranges to various detectors that are well suited to detect them.