Grinding pad
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Description
Claims
The ornamental design for a grinding pad, as shown and described.
Referenced Cited
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Patent History
Patent number: D1004393
Type: Grant
Filed: Apr 22, 2022
Date of Patent: Nov 14, 2023
Assignee: EHWA DIAMOND INDUSTRIAL CO., LTD. (Osan-si)
Inventors: Jang Hyuk Ahn (Hwaseong-si), Hwa Jin Jeong (Suwon-si)
Primary Examiner: Sheryl Lane
Assistant Examiner: Benjamin D. Wannemacher
Application Number: 29/836,031
Type: Grant
Filed: Apr 22, 2022
Date of Patent: Nov 14, 2023
Assignee: EHWA DIAMOND INDUSTRIAL CO., LTD. (Osan-si)
Inventors: Jang Hyuk Ahn (Hwaseong-si), Hwa Jin Jeong (Suwon-si)
Primary Examiner: Sheryl Lane
Assistant Examiner: Benjamin D. Wannemacher
Application Number: 29/836,031
Classifications
Current U.S. Class:
D8/70;
D8/90