Circuit board sensor pad

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Description

FIG. 1 is a front, top and right side perspective view of a circuit board sensor pad, shown with a first broken line environment, of my new design.

FIG. 2 is an enlarged view of area 2 shown in FIG. 1.

FIG. 3 is a top plan view of the circuit board sensor pad shown in FIG. 1.

FIG. 4 is a bottom, rear and left side perspective view thereof.

FIG. 5 is a bottom plan view thereof.

FIG. 6 is a front, top and right side perspective view of a circuit board sensor pad of my new design, shown with a second broken line environment, of my new design.

FIG. 7 is an enlarged view of area 7 shown in FIG. 6.

FIG. 8 is a top plan view of the circuit board sensor pad shown in FIG. 6.

FIG. 9 is a bottom, rear and left side perspective view thereof; and,

FIG. 10 is a bottom plan view thereof.

The dash-dash broken lines depict portions of the circuit board sensor pad that form no part of the claimed design. The dash-dot-dash broken rectangle defines the enlarged area in FIGS. 1, 2, 6 and 7 the remaining dash-dot-dash lines define the boundaries of the claim. The dash-dot-dash lines and surface shading shown in lighter weight line form no part of the claimed design.

Claims

I claim the ornamental design for a circuit board sensor pad, as shown and described.

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Patent History
Patent number: D1012871
Type: Grant
Filed: Jun 30, 2020
Date of Patent: Jan 30, 2024
Assignee: Roche Molecular Systems, Inc. (Pleasanton, CA)
Inventor: Uichong Brandon Yi (San Diego, CA)
Primary Examiner: Christy Nemeth
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/740,057