Contact for a connector
Latest Molex, LLC Patents:
Description
The grey-fill shading is used as an aid to represent surface contour. The broken lines immediately adjacent to the shaded area represent the bounds of the claimed design and form no part thereof. The broken lines within the solid line circles form no part of the claimed design.
Claims
The ornamental design for a contact for a connector, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
D55253 | May 1920 | Eaton |
D181356 | November 1957 | Hertz |
2912668 | November 1959 | Eddy |
2941025 | June 1960 | Wayman et al. |
4072392 | February 7, 1978 | McConnell et al. |
4447108 | May 8, 1984 | Ghigliotti et al. |
D280935 | October 8, 1985 | Alcorn |
D287456 | December 30, 1986 | Kobos |
D332557 | January 19, 1993 | Blake et al. |
D359685 | June 27, 1995 | Luch |
5516303 | May 14, 1996 | Yohn et al. |
D391757 | March 10, 1998 | Johnson |
5769552 | June 23, 1998 | Kelley et al. |
5769652 | June 23, 1998 | Wider |
D432088 | October 17, 2000 | Malak |
6488136 | December 3, 2002 | Chang |
D487252 | March 2, 2004 | Schweitzer |
6715382 | April 6, 2004 | Hsien |
D491428 | June 15, 2004 | Barnett et al. |
D498775 | November 23, 2004 | Hu |
D498776 | November 23, 2004 | Hu |
D498777 | November 23, 2004 | Hu |
D498778 | November 23, 2004 | Hu |
D516039 | February 28, 2006 | Lei et al. |
D516521 | March 7, 2006 | Yao et al. |
D518778 | April 11, 2006 | Wardenburg |
D521455 | May 23, 2006 | Radza |
D534802 | January 9, 2007 | German |
D538749 | March 20, 2007 | Sengupta et al. |
D550049 | September 4, 2007 | Peng |
D550050 | September 4, 2007 | Peng |
D551924 | October 2, 2007 | Tuan Mu |
D558006 | December 25, 2007 | Tuan Mu |
7436278 | October 14, 2008 | Fischer et al. |
D582275 | December 9, 2008 | Reed et al. |
D606022 | December 15, 2009 | Sakamoto |
7806737 | October 5, 2010 | Mark et al. |
D633762 | March 8, 2011 | Zhou et al. |
D636265 | April 19, 2011 | Gartner |
D650518 | December 13, 2011 | Fletcher et al. |
D685505 | July 2, 2013 | Yamamoto et al. |
D685507 | July 2, 2013 | Sun |
D723370 | March 3, 2015 | Medlin |
D723919 | March 10, 2015 | Taber et al. |
D727152 | April 21, 2015 | Yaseen |
D739695 | September 29, 2015 | Chang |
D743223 | November 17, 2015 | Chang |
D749384 | February 16, 2016 | Chang |
D769193 | October 18, 2016 | Willette |
9484650 | November 1, 2016 | Shinder-Lerner et al. |
9680268 | June 13, 2017 | Finona |
D848377 | May 14, 2019 | Maroney et al. |
10454196 | October 22, 2019 | Feng |
D867298 | November 19, 2019 | Joniak et al. |
D867299 | November 19, 2019 | Joniak et al. |
D868000 | November 26, 2019 | Joniak et al. |
D868001 | November 26, 2019 | Joniak et al. |
D868002 | November 26, 2019 | Joniak et al. |
D869000 | December 3, 2019 | Sonneman |
D871348 | December 31, 2019 | Kufner |
D875718 | February 18, 2020 | Lee et al. |
D876363 | February 25, 2020 | Joniak |
D877702 | March 10, 2020 | Joniak |
D878304 | March 17, 2020 | Joniak |
D884653 | May 19, 2020 | Kufner |
D885904 | June 2, 2020 | Kim |
D913945 | March 23, 2021 | Jung |
D914606 | March 30, 2021 | Jung |
D915286 | April 6, 2021 | Jung |
D922199 | June 15, 2021 | Kim |
D936014 | November 16, 2021 | Lu |
D936015 | November 16, 2021 | Lu |
D936016 | November 16, 2021 | Lu |
D936017 | November 16, 2021 | Lu |
D942954 | February 8, 2022 | Joniak |
20010054531 | December 27, 2001 | Chang |
20090197482 | August 6, 2009 | Mark et al. |
20100099290 | April 22, 2010 | Gastineau |
20100124835 | May 20, 2010 | Johnson |
20100186228 | July 29, 2010 | Montena |
20100216354 | August 26, 2010 | Copper et al. |
20100216355 | August 26, 2010 | Copper et al. |
20100261361 | October 14, 2010 | Kasparian et al. |
20130095689 | April 18, 2013 | Hayman et al. |
20130109228 | May 2, 2013 | Sykes et al. |
20130161069 | June 27, 2013 | Erdle et al. |
20130283669 | October 31, 2013 | da Rosa et al. |
20130286669 | October 31, 2013 | Moser et al. |
20140017960 | January 16, 2014 | Friedhof et al. |
20140029900 | January 30, 2014 | Logan, Jr. et al. |
20140227900 | August 14, 2014 | Zitsch et al. |
20160141784 | May 19, 2016 | Hashiguchi |
20160230979 | August 11, 2016 | Kwon et al. |
20160332783 | November 17, 2016 | Kim |
20170338606 | November 23, 2017 | Copper et al. |
20180138623 | May 17, 2018 | Feng |
20180208333 | July 26, 2018 | Cesari et al. |
20190199031 | June 27, 2019 | Surana |
20190237921 | August 1, 2019 | Yamanaka |
20190267735 | August 29, 2019 | Lu et al. |
20190288466 | September 19, 2019 | Copper et al. |
20200358234 | November 12, 2020 | Liu et al. |
101752728 | June 2010 | CN |
202977789 | June 2010 | CN |
203574201 | April 2014 | CN |
104022376 | September 2014 | CN |
104332736 | February 2015 | CN |
204216296 | March 2015 | CN |
210729-0001 | June 2009 | IN |
S51-103267 | September 1976 | JP |
H03-118572 | December 1991 | JP |
H08-31488 | February 1996 | JP |
2000-182696 | June 2000 | JP |
D1247912 | August 2005 | JP |
2011-204607 | October 2011 | JP |
D1474827 | July 2013 | JP |
2016-096022 | May 2016 | JP |
D1591876 | November 2017 | JP |
2014-0112506 | September 2014 | KR |
D141995 | August 2011 | TW |
D149635 | October 2012 | TW |
D154833 | July 2013 | TW |
D154834 | July 2013 | TW |
D158550 | January 2014 | TW |
D166892 | April 2015 | TW |
D167921 | May 2015 | TW |
D173044 | January 2016 | TW |
D174323 | March 2016 | TW |
D185047 | August 2017 | TW |
D191419 | July 2018 | TW |
2015/080946 | June 2015 | WO |
2018063928 | April 2018 | WO |
2018093981 | May 2018 | WO |
- International Search Report and Written Opinion received for PCT application No. PCT/US2017/061910, dated Mar. 15, 2018, 9 pages.
- International Preliminary Report on Patentability received for PCT Application No. PCT/US2017/061910, dated May 31, 2019, 8 pages.
- Notification of Reasons for refusal received for JP application No. 2019-515860. dated Mar. 24, 2020, 15 pages. (8 pages of English translation and 7 pages of official copy).
- Molex 6.0mm Coeur CST High Current Connector System and Application Tools, dated Oct. 15, 2018, [online], [site visited Jul. 6, 2021]. Available from Internet, URL: https://www.molex.com/pdm_docs/as/2043130006-AS-000.pdf (Year: 2018).
- High-current interconnect system eases PCB connections, dated Oct. 6, 2018, [online], [site visited Jul. 6, 2021]. Available from Internet, URL: https://www.electronicproducts.com/high-current-interconnect-system-eases-pcb-connections/# (Year: 2018).
Patent History
Patent number: D1015281
Type: Grant
Filed: Dec 10, 2019
Date of Patent: Feb 20, 2024
Assignee: Molex, LLC (Lisle, IL)
Inventors: Jeffrey Alan Joniak (Homer Glen, IL), Chiuming Lu (Lisle, IL)
Primary Examiner: Bridget L Eland
Application Number: 29/716,556
Type: Grant
Filed: Dec 10, 2019
Date of Patent: Feb 20, 2024
Assignee: Molex, LLC (Lisle, IL)
Inventors: Jeffrey Alan Joniak (Homer Glen, IL), Chiuming Lu (Lisle, IL)
Primary Examiner: Bridget L Eland
Application Number: 29/716,556
Classifications
Current U.S. Class:
Element Or Attachment (D13/154)