Heat-dissipating bracket
Latest Acer Incorporated Patents:
Description
The broken lines illustrate portions of the heat-dissipating bracket that form no part of the claimed design.
Claims
The ornamental design for a heat-dissipating bracket, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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- Amazon.com_ Ice Coorel Aluminum Laptop Cooling Pad, first available Jan. 22, 2021 [online], retrieved Jul. 26, 2023, available at URL: https://a.co/d/fgzGKai (Year: 2021).
- Amazon.com_ Teesso Aluminum Alloy Laptop Cooling Stand, first available Apr. 30, 2023 [online], retrieved Jul. 26, 2023, available at URL: https://a.co/d/fdnQGEF (Year: 2023).
- Amazon.com_ Tecknet Laptop Cooling Pad, first available May 5, 2022 [online], retrieved Jul. 26, 2023, available at URL: https://a.co/d/apPdffL (Year: 2022).
Patent History
Patent number: D1016822
Type: Grant
Filed: Dec 1, 2021
Date of Patent: Mar 5, 2024
Assignee: Acer Incorporated (New Taipei)
Inventors: Wei-Chang Chen (New Taipei), Jung-Wei Tsao (New Taipei)
Primary Examiner: Wendy L Arminio
Assistant Examiner: Carrie S Gelula
Application Number: 29/817,498
Type: Grant
Filed: Dec 1, 2021
Date of Patent: Mar 5, 2024
Assignee: Acer Incorporated (New Taipei)
Inventors: Wei-Chang Chen (New Taipei), Jung-Wei Tsao (New Taipei)
Primary Examiner: Wendy L Arminio
Assistant Examiner: Carrie S Gelula
Application Number: 29/817,498
Classifications
Current U.S. Class:
Support Or Base (D14/447)