Cool pad for electronic device
Description
Claims
The ornamental design for a cool pad for electronic device, as shown and described.
Referenced Cited
U.S. Patent Documents
| D266772 | November 2, 1982 | Sayers |
| D310576 | September 11, 1990 | Narbut et al. |
| D315366 | March 12, 1991 | Greenspahn |
| 5209452 | May 11, 1993 | Goldberg |
| 6082696 | July 4, 2000 | Patterson |
| 6258444 | July 10, 2001 | Muramoto |
| D455460 | April 9, 2002 | Cheris et al. |
| 7151620 | December 19, 2006 | Cheung et al. |
| D540330 | April 10, 2007 | Eyman et al. |
| D554647 | November 6, 2007 | Chan |
| D555162 | November 13, 2007 | Park et al. |
| D557267 | December 11, 2007 | Beilstein et al. |
| 20060192070 | August 31, 2006 | Chan |
Patent History
Patent number: D574005
Type: Grant
Filed: Jul 3, 2007
Date of Patent: Jul 29, 2008
Assignee: Cooler Master Co. Ltd. (Taipei)
Inventor: Yueh-Ting Chung (Chung-Ho)
Primary Examiner: Jennifer Rivard
Assistant Examiner: Angela J Lee
Application Number: 29/281,828
Type: Grant
Filed: Jul 3, 2007
Date of Patent: Jul 29, 2008
Assignee: Cooler Master Co. Ltd. (Taipei)
Inventor: Yueh-Ting Chung (Chung-Ho)
Primary Examiner: Jennifer Rivard
Assistant Examiner: Angela J Lee
Application Number: 29/281,828
Classifications
Current U.S. Class:
Support Or Base (D14/447)