Headphone
Description
The broken lines in the figures illustrate portions of the headphone that form no part of the claimed design.
Claims
The ornamental design for a headphone, as shown and described.
Referenced Cited
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Foreign Patent Documents
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Patent History
Patent number: D1037206
Type: Grant
Filed: Apr 22, 2024
Date of Patent: Jul 30, 2024
Inventor: Wei Chen (Shenzhen)
Primary Examiner: Jack Reickel
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/938,512
Type: Grant
Filed: Apr 22, 2024
Date of Patent: Jul 30, 2024
Inventor: Wei Chen (Shenzhen)
Primary Examiner: Jack Reickel
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/938,512
Classifications
Current U.S. Class:
With Microphone (D14/206)