Abstract: A solar cell, a preparation method thereof, a photovoltaic module, and a photovoltaic system, wherein the solar cell includes a substrate and a first tunnel oxide layer and a passivation medium layer sequentially stacked on a first surface of the substrate. The first tunnel oxide layer is at least partially in contact with the first surface. The passivation medium layer includes at least a transparent conductive oxide layer.

Abstract: A method that reorders partitioning candidates or motion vectors based on template matching costs for geometric prediction mode (GPM) is provided. A video coder receives data to be encoded or decoded as a current block of a current picture of a video. The current block is partitioned into first and second partitions by a bisecting line defined by an angle-distance pair. The video coder identifies a list of candidate prediction modes for coding the first and second partitions. The video coder computes a template matching (TM) cost for each candidate prediction mode in the list. The video coder receives or signals a selection of a candidate prediction mode based on an index that is assigned to the selected candidate prediction mode based on the computed TM costs. The video coder reconstructs the current block by using the selected candidate prediction mode to predict the first and second partitions.

Abstract: Provided are an information transmission method and device, and a storage medium. The method includes: receiving, by User Equipment (UE) or an Integrated Access Backhaul (LAB) node, mobility control information; and after detecting that a radio link failure occurs on the UE or the IAB node, activating, by the UE or the LAB node, a handover procedure.

Abstract: A module structure, a touch module, a display module and a display apparatus are provided. The module structure includes: a substrate including a base substrate, wherein the base substrate includes a functional area and a bonding area on one side of the functional area; a plurality of bonding terminals are provided in the bonding area and arranged along a first direction and each bonding terminal extends along a second direction, and at least one floating terminal is provided in the bonding area and on at least one side of the plurality of bonding terminals in the first direction; the module structure further includes a flexible circuit board, including: a plurality of first connection terminals provided corresponding to the plurality of bonding terminals, and at least one second connection terminal provided corresponding to the at least one floating terminal.

Abstract: An array substrate is provided. The array substrate includes a base substrate and a plurality of gate lines, a plurality of data lines, a common electrode layer and a plurality of pixel units arranged in an array disposed on the base substrate. Each of the pixel units includes a plurality of sub-pixel units defined by gate lines and data lines disposed to intersect each other laterally and vertically. The common electrode layer includes a plurality of common electrode blocks that double as self-capacitance electrodes, each of the common electrode blocks is connected with at least one wire, and the wires are in the middle of sub-pixel units of a same column.

Abstract: A video coding system that reorders prediction candidates is provided. A video coder receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The video coder identifies possible candidate prediction positions. The video coder computes a cost for each of the identified possible candidate prediction positions. The video coder assigns, based on the computed costs, a reordered index to each of N lowest cost candidate prediction positions from the identified possible candidate prediction positions. The video coder selects a candidate prediction position using the assigned reordered indices, wherein the selection is signaled in or parsed from the bitstream. The video coder encodes or decodes the current block by using the selected candidate prediction position.

Abstract: A wireless local area network (WLAN) system includes a first Wi-Fi device and at least one second Wi-Fi device. When the first Wi-Fi device and the at least one second Wi-Fi device receive an interference signal that occupies a current operation channel of the first Wi-Fi device and a current operation channel of the at least one second Wi-Fi device, the first Wi-Fi device performs channel switching upon the current operation channel of the first Wi-Fi device, and the at least one second Wi-Fi device performs channel switching upon the current operation channel of the at least one second Wi-Fi device.

Abstract: Methods, systems, and devices for top die back-side marking for memory systems are described. One or more alignment marks may be added to the back-side of a top memory die in a multi-layer memory device and used to align a position of the top memory die relative to a position of a memory die below the top memory die. The alignment marks may be formed on the top memory die during the manufacturing process of the multi-layer memory device. Operations for forming the alignment marks are described using various semiconductor fabrication techniques. Operations are also disclosed for using the alignment marks to modify placement of the top memory die to reduce the alignment offset in the manufacturing process of subsequent memory dies.

Abstract: A photonic assembly includes: an electronic integrated circuits (EIC) die including a semiconductor substrate, semiconductor devices located on a horizontal surface of the semiconductor substrate, first dielectric material layers embedding first metal interconnect structures, a dielectric pillar structure vertically extending through each layer selected from the first dielectric material layers, a first bonding-level dielectric layer embedding first metal bonding pads, wherein a first subset of the first metal bonding pads has an areal overlap with the dielectric pillar structure in a plan view; and a photonic integrated circuits (PIC) die including waveguides, photonic devices, second dielectric material layers embedding second metal interconnect structures, a second bonding-level dielectric layer embedding second metal bonding pads, wherein the second metal bonding pads are bonded to the first metal bonding pads.

Abstract: In an embodiment, a method includes forming a device region along a first substrate; forming an interconnect structure over the device region and the first substrate; forming a metal pillar over the interconnect structure, forming the metal pillar comprising: forming a base layer over the interconnect structure; forming an intermediate layer over the base layer; and forming a capping layer over the intermediate layer; forming a solder region over the capping layer; and performing an etch process to recess sidewalls of the base layer and the capping layer from sidewalls of the intermediate layer and the solder region.

Abstract: Some implementations described herein provide a laser device. The laser device includes a first portion of the laser device, at a proximal end of the laser device, that includes one or more optical devices, where the first portion is configured to emit first electromagnetic waves having a first wavelength. The laser device includes a second portion of the laser device, at a distal end of the laser device, that includes an optical crystal configured to receive the first electromagnetic waves and to emit second electromagnetic waves having a second wavelength based on reception of the first electromagnetic waves, where the optical crystal includes a thin film coating disposed on an end of the optical crystal, the thin film coating configured to: support emission of the second electromagnetic waves from the optical crystal, and support internal reflection of the first electromagnetic waves within the optical crystal.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: A topical formulation comprising (a) a therapeutically effective amount of tofacitinib; (b) at least one solvent; and (c) optionally one or more other pharmaceutically acceptable excipients is provided. Also provided is a method for treating and/or preventing autoimmune diseases in a subject administering said topical formulation.

Abstract: An interconnection structure includes a semiconductor substrate that is formed with a first metal trench and a second metal trench, a first metal via, a second metal via, a third metal trench and a fourth metal trench. The first metal via is disposed over and connected to the first metal trench. The second metal via is disposed over and connected to the second metal trench. The third metal trench is disposed over and connected to the first metal via. The fourth metal trench that is disposed over and connected to the second metal via. A thickness of the third metal trench is different from a thickness of the fourth metal trench.

Abstract: A height-adjustable folding chair comprises a first support, a second support, and a seat plate. A middle section of the first support is connected to a middle section of the second support through a hinge shaft, a lower section of the first support and a lower section of the second support each have a bending angle, and two ends of the seat plate are pivotally secured with a first support upper cross rod and a second support upper cross rod respectively. The seat plate has a side A and a side B. When the first support and the second support are unfolded in an X shape, a bent section of the first support and a bent section of the second support are bent facing each other or are bent facing away from each other.

Abstract: An osmotic pump controlled-release tablet of an insoluble drug includes a tablet core, a semi-permeable membrane coating and a drug-release hole, wherein the tablet core includes a solid dispersion of the insoluble drug and a penetration enhancer, the solid dispersion of the insoluble drug includes the insoluble drug and a carrier, the insoluble drug is selected from nicardipine, nifedipine and felodipine and pharmaceutically acceptable salts thereof, and the carrier is selected from organic acids. Compared with other tablets, the drug solubility of the osmotic pump controlled-release tablet of the insoluble drug is improved, a large amount of penetration enhancers or other excipients do not need to be used in the tablet core, the drug-loading capacity is improved, and the tablet core is not too large; the degree of release in vivo is improved.

Abstract: The present disclosure provides a process cartridge and a detection method. A process cartridge, detachably installed on an image-forming apparatus, includes a main body configured to store a developer; and a working element disposed on the main body and configured to detect or obtain a first parameter related to the process cartridge, where when the first parameter or a second parameter obtained based on the first parameter does not meet expectation, the image-forming apparatus controls the process cartridge to stop conveying the developer.

Abstract: The present application provides a lifting/lowering device (1) and a harvester (1000). The lifting/lowering device (1) comprises a driving member (20), a transmission mechanism (30), a mounting mechanism (40), and a measuring mechanism (50). The transmission mechanism (30) comprises a first transmission member (31) and a second transmission member (32). The first transmission member (31) is connected to the second transmission member (32) and the driving member (20) respectively. The first transmission member (31) is driven by the driving member (20) to drive the second transmission member (32) to rotate. The mounting mechanism (40) is threadedly connected to the second transmission member (32), and the mounting mechanism (40) is configured to mount a cutter head mechanism (2). When the second transmission member (32) rotates, the mounting mechanism (40) moves towards or away from the first transmission member (31).

Abstract: A method includes following steps. A semiconductor fin is formed on a substrate. A shallow trench isolation (STI) region is formed around a lower portion of the semiconductor fin. An STI protection layer is over the STI region. After forming the STI protection layer, source/drain recesses are etched in the semiconductor fin. Source/drain epitaxial regions are formed in the source/drain recesses.

Abstract: Provided are a high-pressure jet impact chamber structure, with an industrial-grade “single orifice+single pulverizing chamber” design, and a multi-parallel type convenient pulverizing component adopted with the high-pressure jet impact chamber structure. The high-pressure jet impact chamber structure includes a body, a jet orifice, and a pulverizing chamber. The multi-parallel type convenient pulverizing component adopted with the high-pressure jet impact chamber structure includes a multi-parallel type chassis, a multi-parallel type connector disk, multiple high-pressure jet impact chamber structures that are parallel to each other, a sealing end cover, a discharge disk, and a discharge pipe.