Patents by Inventor Wei Chen

Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11032636
    Abstract: A speaker module includes a housing and a speaker unit accommodated in the housing. The housing includes a bottom wall, a top wall, and a side wall. The speaker module further includes at least one first isolating member connected to the bottom wall and the top wall respectively. The first isolating member isolates an accommodating space into an accommodating cavity and a first filling cavity. The first isolating member includes a first metal frame and an air-permeable isolating mesh attached to the first metal frame. The first metal frame includes a first top border and a first bottom border. The first top border and/or the first bottom border is provided with a protrusion portion, and the protrusion portion abuts against the top wall or the bottom wall and is connected to the top wall or the bottom wall by spot welding.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: June 8, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Zhichen Chen, Wei Wei
  • Patent number: 11031381
    Abstract: An optical transceiver including a photonic integrated circuit component, an electric integrated circuit component and an insulating encapsulant is provided. The photonic integrated circuit component includes at least one optical input/output portion and at least one groove located in proximity of the at least one optical input/output portion. The electric integrated circuit component is disposed on and electrically connected to the photonic integrated circuit component. The insulating encapsulant is disposed on the photonic integrated circuit component and laterally encapsulating the electric integrated circuit component. The at least one groove of the photonic integrated circuit component is revealed by the insulating encapsulant and is adapted for insertion of a photonic device.
    Type: Grant
    Filed: November 22, 2018
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 11031286
    Abstract: Generally, examples are provided relating to conductive features that include a barrier layer, and to methods thereof. In an embodiment, a metal layer is deposited in an opening through a dielectric layer(s) to a source/drain region. The metal layer is along the source/drain region and along a sidewall of the dielectric layer(s) that at least partially defines the opening. The metal layer is nitrided, which includes performing a multiple plasma process that includes at least one directional-dependent plasma process. A portion of the metal layer remains un-nitrided by the multiple plasma process. A silicide region is formed, which includes reacting the un-nitrided portion of the metal layer with a portion of the source/drain region. A conductive material is disposed in the opening on the nitrided portions of the metal layer.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Yip Loh, Chih-Wei Chang, Hong-Mao Lee, Chun-Hsien Huang, Yu-Ming Huang, Yan-Ming Tsai, Yu-Shiuan Wang, Hung-Hsu Chen, Yu-Kai Chen, Yu-Wen Cheng
  • Patent number: 11031282
    Abstract: A method for forming a three-dimensional memory device includes forming, on a first side of a first substrate, a peripheral circuitry including first and second peripheral devices, a first interconnect layer, and a shallow trench isolation (STI) structure between the first and second peripheral devices, and forming, on a second substrate, a memory array including a plurality of memory cells and a second interconnect layer. The method includes bonding the first and second interconnect layers and forming an isolation trench through the first substrate and exposing a portion of the STI structure. The isolation trench is formed through a second side of the first substrate that is opposite to the first side. The method includes disposing an isolation material to form an isolation structure in the isolation trench and performing a planarization process to remove portions of the isolation material disposed on the second side of the first substrate.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: June 8, 2021
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Liang Chen, Wei Liu, Cheng Gan
  • Patent number: 11032932
    Abstract: A mount assembly configured to be cooperative with expansion card and socket of circuit board. Mount assembly includes first slide rail, second slide rail, first latch and first slidable stopper. First latch includes first cantilever and first protrusion. First cantilever includes first fixed end part and first free end part that are located opposite to each other. First fixed end part is fixed to sidewall part of first slide rail. First protrusion protrudes from first free end part and is located in groove of first slide rail. First protrusion is configured to be engaged with engagement hole of expansion card. First slidable stopper includes stopper body and handle portion. Stopper body is slidably disposed on sidewall part of first slide rail and movable between blocking position and releasing position. Handle portion protrudes from side of stopper body.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: June 8, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventor: Shih-Wei Chen
  • Patent number: 11031363
    Abstract: Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, an interconnect structure includes dielectric layers, a conductive layer disposed in the dielectric layers, and a via layer disposed in the dielectric layers proximate the conductive layer. An underball metallization (UBM) layer is disposed in the dielectric layers proximate the via layer. A first connector coupling region is disposed in the via layer and the UBM layer. A via layer portion of the first connector coupling region is coupled to a first contact pad in the conductive layer. A second connector coupling region is disposed in the UBM layer. The second connector coupling region is coupled to a conductive segment in the UBM layer and the via layer. The second connector coupling region is coupled to a second contact pad in the conductive layer by the conductive segment.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Hsien-Wei Chen
  • Patent number: 11030373
    Abstract: A system (including a processor and memory with computer program code) configured to execute a method which includes generating a layout diagram including: generating first and second active area patterns on opposite sides of (and having long axes parallel to) a first symmetry axis; generating non-overlapping first, second and third conductive patterns (having long axes perpendicular to the first symmetry axis) which overlap the first and second active area patterns; centering the first conductive pattern between the second and third conductive patterns; generating a first cut-pattern for, and which overlaps, central regions of the second and third conductive patterns; centering the first cut-pattern relative to the first symmetry axis; generating a fourth conductive pattern over an area bounded by the first cut-pattern; and expanding the fourth conductive pattern to substantially overlap a portion of the first conductive pattern and a portion of the second or third conductive patterns.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: June 8, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Li-Chun Tien, Ting-Wei Chiang, Shun Li Chen, Ting Yu Chen, XinYong Wang
  • Patent number: 11030963
    Abstract: A motion blur effect adjustment method includes partitioning a display panel into at least two regions, tracking positions of eyes for generating position information of eyes tracking by using an image capturing device, acquiring a first region corresponding to a visual range of the positions of eyes from the at least two regions according to the position information of eyes tracking, reducing a first motion blur effect of the first region, and adjusting a second motion blur effect of a second region outside the first region.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: June 8, 2021
    Assignee: Qisda Corporation
    Inventors: Tse-Wei Fan, Wei-Yu Chen, Jen-Hao Liao
  • Patent number: 11031923
    Abstract: An interface device and an interface method for interfacing between a master device and a slave device is provided. The master device generates command and the slave device generates data according to the command. The interface device includes a master interface and a slave interface. The master interface is coupled to the master device and configured to send the command to the slave device and/or receive the data from the slave device. The slave interface is coupled to the slave device and configured to receive the command from the master device and/or send the data to the master device. The master interface and the slave interface are driven by a clock generated by a clock generator. The master interface and the slave interface are electrically connected by one or plurality of bonds and/or TSVs.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: June 8, 2021
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Igor Elkanovich, Amnon Parnass, Pei Yu, Li-Ken Yeh, Yung-Sheng Fang, Sheng-Wei Lin, Tze-Chiang Huang, King Ho Tam, Ching-Fang Chen
  • Patent number: 11031354
    Abstract: A method includes forming an interposer, which includes a semiconductor substrate, and an interconnect structure over the semiconductor substrate. The method further includes bonding a device die to the interposer, so that a first metal pad in the interposer is bonded to a second metal pad in the device die, and a first surface dielectric layer in the interposer is bonded to a second surface dielectric layer in the device die. The method further includes encapsulating the device die in an encapsulating material, forming conductive features over and electrically coupling to the device die, and removing the semiconductor substrate. A part of the interposer, the device die, and portions of the conductive features in combination form a package.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Hsien-Wei Chen, Chih-Chia Hu, Chen-Hua Yu
  • Patent number: 11027125
    Abstract: A fixation mechanism of an implantable medical device is formed by a plurality of tines fixedly mounted around a perimeter of a distal end of the device. Each tine may be said to include a first segment fixedly attached to the device, a second segment extending from the first segment, and a third segment, to which the second segment extends. When the device is loaded in a lumen of a delivery tool and a rounded free distal end of each tine engages a sidewall that defines the lumen, to hold the tines in a spring-loaded condition, the first segment of each tine, which has a spring-biased pre-formed curvature, becomes relatively straightened, and the third segment of each tine, which is terminated by the free distal end, extends away from the axis of the device at an acute angle in a range from about 45 degrees to about 75 degrees.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: June 8, 2021
    Assignee: MEDTRONIC, INC.
    Inventors: Xin Chen, Michael D. Eggen, Vladimir Grubac, Brian P. Colin, Wei Gan, Thomas A. Anderson, Kathryn Hilpisch
  • Patent number: 11028878
    Abstract: The present application discloses a bearing structural member, a support, a joint assembly and a tube section assembly, wherein the maximum counter force provided by the bearing structural member under an external load is an own designed threshold value, namely when the external load is greater than the designed threshold value of the bearing structural member, the bearing structural member deforms, and provides a counter force equal to the designed threshold value; the support includes at least one bearing structural member; and the joint assembly and the tube section assembly are both equipped with the support. When the external load is not high and is less than the designed threshold value, the bearing structural member may effectively suppress the deformation just like a rigid structural member; when the external load exceeds the designed threshold value, the bearing structural member may deform, and provide a stable counter supporting force less than the external load.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: June 8, 2021
    Assignees: China Communications Construction Co. Ltd., CCCC Highway Consultants Co. Ltd., CCCC Wuhan Harbour Engineering Design & Research Co., Ltd., Shanghai Zhenhua Heavy Industries Co., Ltd.
    Inventors: Ming Lin, Wei Lin, Xiaodong Liu, Kexin Liu, Haiqing Yin, Liuqing Tu, Jibing Gao, Yaping Liu, Weibin Chen, Yiyuan Wu, Huawen Wang, Yu Liu
  • Patent number: 11029462
    Abstract: A backlight module including a light guide plate, a light source, an optical film, a first prism sheet and a second prism sheet is provided. The light guide plate has a light incident surface and a light emitting surface connected to each other. The light source is disposed on a side of the light incident surface. The optical film is overlapped with the light emitting surface and has a plurality of optical microstructures facing the light emitting surface. An angle between the extending direction of the optical microstructures and the light incident surface is 90 degrees or between 45 degrees and 90 degrees. The first prism sheet and the second prism sheet are overlapped with the optical film and are positioned on a side of the optical film being far away from the light guide plate. A display apparatus adopting the backlight module is also provided.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: June 8, 2021
    Assignee: Coretronic Corporation
    Inventors: Ping-Yen Chen, Chung-Yang Fang, Jen-Wei Yu, Yang-Ching Lin, Yu-Fan Chen
  • Patent number: 11029237
    Abstract: A sediment pressure-holding transfer device developed based on abyssal sediment fidelity sampler is disclosed, which uses a vacuum pump to discharge a gas in the device, uses a high-pressure pump as a power source to perform a pressurization process, uses gravity of a sample to perform a first transfer, and uses a high-pressure impurity pump and a safety valve to perform a second transfer of a sample mixture, in its structure, a high-pressure-resistant and corrosion-resistant material is used as a main material of the device, the device mainly comprises a mechanical system and a hydraulic system, the mechanical system is used as a main frame of the device and is a basis for ensuring operation of the device; the hydraulic system is used as a core of the device and is a key to ensure success of sediment transfer.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: June 8, 2021
    Assignee: Zhejiang University
    Inventors: Jiawang Chen, Jing Xiao, Jiasong Fang, Weitao He, Hao Wang, Yue Huang, Wei Wang, Yuxia Sun
  • Publication number: 20210162806
    Abstract: Disclosed herein are tread rubber compositions containing a specified polyurethane, tires containing a tread made from the rubber compositions, and related methods of improving the wet and dry traction of a tire tread by using the polyurethane-containing rubber compositions. The polyurethane includes a saturated hydroxy-functionalized polydiene segment as diol.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 3, 2021
    Applicant: Bridgestone Corporation
    Inventors: Yaohong Chen, Mindaugas Rackaitis, Wei Zhao
  • Publication number: 20210163859
    Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
    Type: Application
    Filed: February 10, 2021
    Publication date: June 3, 2021
    Inventors: Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
  • Publication number: 20210161292
    Abstract: The present disclosure relates to an automatically adjustable smart shelf, a cargo storing method, and an unmanned logistics system. The automatically adjustable smart shelf includes a shelf outer frame and a control unit. A first movable shelf layer and a second movable shelf layer provided on the shelf outer frame and respectively movable along a first direction and a second direction intersecting with each other. A control unit can control the first movable shelf layer and the second movable shelf layer to move along the first direction and the second direction respectively, so as to form various sizes of storage space for storing various cargos accordingly.
    Type: Application
    Filed: September 27, 2018
    Publication date: June 3, 2021
    Applicants: BEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO., LTD., BEIJING JINGDONG CENTURY TRADING CO., LTD.
    Inventors: Wei CHEN, Jun XIAO, Jinhua CAI, Yanguang LIU, Chen FAN
  • Publication number: 20210163326
    Abstract: The present invention discloses intelligent oil sludge treatment apparatuses and treatment processes.
    Type: Application
    Filed: May 27, 2019
    Publication date: June 3, 2021
    Applicant: PANJIN NEWTIDE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Jie Ren, Xiuwen Wang, Ying Liang, Zhengguo Shi, Hongmei Zhang, Wang Huo, Wei Wang, Ge Li, Geng Wang, Changkun Zhou, Yuting Shao, Bo Li, Rui Wang, Peng Chen
  • Publication number: 20210164334
    Abstract: Methods, computing systems, and computer-readable media for interpreting drilling dynamics data are described herein. The method can include receiving drilling dynamics data simulated by a processor or collected by a sensor positioned in a drilling tool. The method can further include extracting a feature map from the drilling dynamics data, and determining that a feature zone from the feature map corresponds to a predetermined dynamic state. The feature zone can be determined using a neural network trained to associate feature zones with dynamic states. Additionally, the method can include selecting a drilling parameter for a drill string based on the feature zone.
    Type: Application
    Filed: May 14, 2019
    Publication date: June 3, 2021
    Applicant: Schlumberger Technology Corporation
    Inventors: Wei CHEN, Yingwei YU, Yuelin SHEN, Zhengxin ZHANG, Velizar VESSELINOV
  • Patent number: D921622
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: June 8, 2021
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Haitao Li, Xinyan Zheng, Wei Chen