Headphone
Description
The broken lines in the figures illustrate portions of the headphone that form no part of the claimed design.
Claims
The ornamental design for a headphone, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1038068
Type: Grant
Filed: Apr 25, 2024
Date of Patent: Aug 6, 2024
Inventor: Wei Chen (Shenzhen)
Primary Examiner: Jack Reickel
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/939,215
Type: Grant
Filed: Apr 25, 2024
Date of Patent: Aug 6, 2024
Inventor: Wei Chen (Shenzhen)
Primary Examiner: Jack Reickel
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/939,215
Classifications
Current U.S. Class:
With Microphone (D14/206)