Circuit board
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Description
The broken line showing of the circuit board is for the purpose of illustrating portions of the article and forms no part of the claimed design.
Claims
The ornamental design for a circuit board as shown and described.
Referenced Cited
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Patent History
Patent number: D1055879
Type: Grant
Filed: Aug 18, 2022
Date of Patent: Dec 31, 2024
Assignee: Japan Aviation Electronics Industry, Limited (Tokyo)
Inventor: Kenichi Nakazato (Tokyo)
Primary Examiner: Rosemary K Tarcza
Assistant Examiner: Seth David Kumpf
Application Number: 29/850,290
Type: Grant
Filed: Aug 18, 2022
Date of Patent: Dec 31, 2024
Assignee: Japan Aviation Electronics Industry, Limited (Tokyo)
Inventor: Kenichi Nakazato (Tokyo)
Primary Examiner: Rosemary K Tarcza
Assistant Examiner: Seth David Kumpf
Application Number: 29/850,290
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)