Circuit board

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Description

FIG. 1 is a front elevational view of a circuit board showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view showing a front, top and right side thereof; and,

FIG. 8 is a perspective view showing a front, bottom and right side thereof.

The broken line showing of the circuit board is for the purpose of illustrating portions of the article and forms no part of the claimed design.

Claims

The ornamental design for a circuit board as shown and described.

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Patent History
Patent number: D1055879
Type: Grant
Filed: Aug 18, 2022
Date of Patent: Dec 31, 2024
Assignee: Japan Aviation Electronics Industry, Limited (Tokyo)
Inventor: Kenichi Nakazato (Tokyo)
Primary Examiner: Rosemary K Tarcza
Assistant Examiner: Seth David Kumpf
Application Number: 29/850,290