Headphone

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Description

FIG. 1 is a front top perspective view of a headphone showing our new design;

FIG. 2 is a bottom rear perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top view thereof;

FIG. 8 is a bottom view thereof; and,

FIG. 9 is an enlarged view of the encircled portion 9 indicated in FIG. 1.

The even length broken lines shown in the drawings are included for the purpose of illustrating portions of the headphone that form no part of the claimed design. The dashed-dot lines form the boundary of the enlarged portion views in FIGS. 1 and 9 and form no part of the claimed design.

Claims

The ornamental design for a headphone as shown and described.

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Patent History
Patent number: D1055889
Type: Grant
Filed: Mar 15, 2023
Date of Patent: Dec 31, 2024
Assignee: Anker Innovations Technology Co., Ltd. (Changsha)
Inventors: Qiang Ma (Shenzhen), Zheng Wei (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/886,965
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)