Headphone
Description
The even length broken lines shown in the drawings are included for the purpose of illustrating portions of the headphone that form no part of the claimed design. The dashed-dot lines form the boundary of the enlarged portion views in
Claims
The ornamental design for a headphone as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
D637176 | May 3, 2011 | Brunner |
D691583 | October 15, 2013 | Kitayama |
D692853 | November 5, 2013 | Nokuo |
D707200 | June 17, 2014 | Yang |
D708164 | July 1, 2014 | Ishikura |
D725630 | March 31, 2015 | Nakagawa |
D732001 | June 16, 2015 | Licht |
D794601 | August 15, 2017 | Riggs |
D842267 | March 5, 2019 | Pedersen |
D857654 | August 27, 2019 | Levine |
D870066 | December 17, 2019 | Lundbäck |
D890123 | July 14, 2020 | Yoshimura |
10721550 | July 21, 2020 | Bunney |
D900782 | November 3, 2020 | Vaclavik |
D902496 | November 17, 2020 | Bui |
D905005 | December 15, 2020 | Liu |
D913990 | March 23, 2021 | Saule |
D918171 | May 4, 2021 | Nakayama |
D920283 | May 25, 2021 | Levine |
D928114 | August 17, 2021 | Terazaki |
11109135 | August 31, 2021 | Corona Aparicio |
D944759 | March 1, 2022 | Vaclavik |
D954019 | June 7, 2022 | Shyu |
D961545 | August 23, 2022 | Ahovi |
D968356 | November 1, 2022 | Zheng |
D974327 | January 3, 2023 | Shyu |
D976228 | January 24, 2023 | Zheng |
11665462 | May 30, 2023 | LeBlanc |
D1001094 | October 10, 2023 | Tang |
D1016780 | March 5, 2024 | Li |
D1027903 | May 21, 2024 | Lee |
D1027904 | May 21, 2024 | Rong |
D1027905 | May 21, 2024 | Lee |
20010017925 | August 30, 2001 | Ceravolo |
20060027245 | February 9, 2006 | Spector |
20140023222 | January 23, 2014 | Ito |
20150222980 | August 6, 2015 | Pizzaro |
20160277828 | September 22, 2016 | Oh |
20170019728 | January 19, 2017 | Cochran |
20170264992 | September 14, 2017 | Wallace |
20180302708 | October 18, 2018 | Monaghan |
20190037300 | January 31, 2019 | Wang |
20200029145 | January 23, 2020 | Kamimura |
20200280801 | September 3, 2020 | Andersen |
308747135 | July 2024 | CN |
008057400-0001 | July 2020 | EM |
015001796-0003 | October 2022 | EM |
015048979-0002 | January 2024 | EM |
9003743228-0001 | February 2017 | GB |
9008057400-0001 | July 2020 | GB |
Patent History
Patent number: D1055889
Type: Grant
Filed: Mar 15, 2023
Date of Patent: Dec 31, 2024
Assignee: Anker Innovations Technology Co., Ltd. (Changsha)
Inventors: Qiang Ma (Shenzhen), Zheng Wei (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/886,965
Type: Grant
Filed: Mar 15, 2023
Date of Patent: Dec 31, 2024
Assignee: Anker Innovations Technology Co., Ltd. (Changsha)
Inventors: Qiang Ma (Shenzhen), Zheng Wei (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/886,965
Classifications
Current U.S. Class:
Headphone Or Headset (D14/205)