Heat sink for memory module
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The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.
The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.
Claims
The ornamental design for a heat sink for memory module, as shown and described.
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Type: Grant
Filed: Sep 28, 2023
Date of Patent: Feb 11, 2025
Assignee: Kingston Digital, Inc. (Fountain Valley, CA)
Inventor: Hui-Hsin Lu (Hsinchu)
Primary Examiner: Rebekah A Caruso
Assistant Examiner: Cole Sanders Holman
Application Number: 29/903,875