Heat sink for memory module

- Kingston Digital, Inc.
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Description

FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;

FIG. 2 is another perspective view thereof;

FIG. 3 is another perspective view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a top plan view thereof;

FIG. 9 is a bottom plan view thereof;

FIG. 10 is an enlarged view illustrating the details of the dot-dash area “10” shown in FIG. 1;

FIG. 11 is an enlarged view illustrating the details of the dot-dash area “11” shown in FIG. 2; and,

FIG. 12 is an enlarged view illustrating the details of the dot-dash area “12” shown in FIG. 3.

The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.

The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.

Claims

The ornamental design for a heat sink for memory module, as shown and described.

Referenced Cited
U.S. Patent Documents
D702689 April 15, 2014 Lin
D702690 April 15, 2014 Lin
D717744 November 18, 2014 Mueller
D733145 June 30, 2015 Chen
D842304 March 5, 2019 Depay
D862402 October 8, 2019 Lin
D964947 September 27, 2022 Lin
D1035597 July 16, 2024 Lu
Other references
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Patent History
Patent number: D1061464
Type: Grant
Filed: Sep 28, 2023
Date of Patent: Feb 11, 2025
Assignee: Kingston Digital, Inc. (Fountain Valley, CA)
Inventor: Hui-Hsin Lu (Hsinchu)
Primary Examiner: Rebekah A Caruso
Assistant Examiner: Cole Sanders Holman
Application Number: 29/903,875
Classifications