Heat sink for memory module

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;

FIG. 2 is another perspective view of FIG. 1;

FIG. 3 is a front elevation view of FIG. 1;

FIG. 4 is a rear elevation view of FIG. 1;

FIG. 5 is a left side elevation view of FIG. 1;

FIG. 6 is a right side elevation view of FIG. 1;

FIG. 7 is a top plan view of FIG. 1;

FIG. 8 is a bottom plan view of FIG. 1; and,

FIG. 9 is an enlarged partial view illustrating the details of the dot-dash area “9” shown in FIG. 2.

The dash-dash broken lines in the drawings depict portions of the article and environmental subject matter that form no part of the claimed design.

The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.

Claims

The ornamental design for a heat sink for memory module, as shown and described.

Referenced Cited
U.S. Patent Documents
D626521 November 2, 2010 Chen
D657756 April 17, 2012 Mueller
D659110 May 8, 2012 Chen
D660810 May 29, 2012 Mueller
D689829 September 17, 2013 Chen
D698792 February 4, 2014 Lin
D702689 April 15, 2014 Lin
D702690 April 15, 2014 Lin
D717251 November 11, 2014 Mueller
D717744 November 18, 2014 Mueller
D733145 June 30, 2015 Chen
D735201 July 28, 2015 Lin
D793400 August 1, 2017 Lin
D842304 March 5, 2019 Depay
D862402 October 8, 2019 Lin
D956706 July 5, 2022 Chung
D964947 September 27, 2022 Lin
20030011993 January 16, 2003 Summers
20030026076 February 6, 2003 Wei
20060268523 November 30, 2006 Lin
20150212555 July 30, 2015 Cox
Patent History
Patent number: D1035597
Type: Grant
Filed: Dec 15, 2022
Date of Patent: Jul 16, 2024
Assignee: KINGSTON DIGITAL, INC. (Fountain Valley, CA)
Inventor: Hui-Hsin Lu (Hsinchu)
Primary Examiner: April Rivas
Application Number: 29/863,083
Classifications
Current U.S. Class: Heat Sink (D13/179)