Heat sink for memory module
The dash-dash broken lines in the drawings depict portions of the article and environmental subject matter that form no part of the claimed design.
The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.
Claims
The ornamental design for a heat sink for memory module, as shown and described.
| D626521 | November 2, 2010 | Chen |
| D657756 | April 17, 2012 | Mueller |
| D659110 | May 8, 2012 | Chen |
| D660810 | May 29, 2012 | Mueller |
| D689829 | September 17, 2013 | Chen |
| D698792 | February 4, 2014 | Lin |
| D702689 | April 15, 2014 | Lin |
| D702690 | April 15, 2014 | Lin |
| D717251 | November 11, 2014 | Mueller |
| D717744 | November 18, 2014 | Mueller |
| D733145 | June 30, 2015 | Chen |
| D735201 | July 28, 2015 | Lin |
| D793400 | August 1, 2017 | Lin |
| D842304 | March 5, 2019 | Depay |
| D862402 | October 8, 2019 | Lin |
| D956706 | July 5, 2022 | Chung |
| D964947 | September 27, 2022 | Lin |
| 20030011993 | January 16, 2003 | Summers |
| 20030026076 | February 6, 2003 | Wei |
| 20060268523 | November 30, 2006 | Lin |
| 20150212555 | July 30, 2015 | Cox |
Type: Grant
Filed: Dec 15, 2022
Date of Patent: Jul 16, 2024
Assignee: KINGSTON DIGITAL, INC. (Fountain Valley, CA)
Inventor: Hui-Hsin Lu (Hsinchu)
Primary Examiner: April Rivas
Application Number: 29/863,083