Headphone

- SONY GROUP CORPORATION
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Description

FIG. 1 is a perspective view of a headphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is an enlarged perspective view thereof along the lines 8-8 and 8′-8′ of FIG. 1.

The broken lines illustrating portions of the headphone form no part of the claimed design.

Claims

The ornamental design for a headphone as shown and described.

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Patent History
Patent number: D1068721
Type: Grant
Filed: Apr 27, 2023
Date of Patent: Apr 1, 2025
Assignee: SONY GROUP CORPORATION (Tokyo)
Inventors: Soichi Tanaka (Kanagawa), Tamie Onishi (Tokyo)
Primary Examiner: Paula Allen Greene
Application Number: 29/875,008