Headphone

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Description

FIG. 1 is a top perspective view of a headphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines in the figures illustrate portions of the headphone that form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D1036415
Type: Grant
Filed: Aug 31, 2022
Date of Patent: Jul 23, 2024
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Pohsun Lee (Shenzhen), Rafal Mateusz Czaniecki (Shenzhen), Laurent Lindenberger (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/866,185
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)