Headphone

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Description

FIG. 1 is a front, right, top perspective view of a headphone, showing my new design;

FIG. 2 is a rear, left, bottom perspective view thereof;

FIG. 3 is a front elevational view of the reduced scale thereof;

FIG. 4 is a rear elevational view of the reduced scale thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is an enlarged view of detail 9 in FIG. 1;

FIG. 10 is an enlarged view of detail 10 in FIG. 1;

FIG. 11 is an enlarged view of detail 11 in FIG. 1;

FIG. 12 is an enlarged view of detail 12 in FIG. 1;

FIG. 13 is an enlarged view of detail 13 in FIG. 1;

FIG. 14 is an enlarged view of detail 14 in FIG. 2;

FIG. 15 is an enlarged view of detail 15 in FIG. 2;

FIG. 16 is an enlarged view of detail 16 in FIG. 2;

FIG. 17 is an enlarged view of detail 17 in FIG. 2;

FIG. 18 is an enlarged view of detail 18 in FIG. 3;

FIG. 19 is an enlarged view of detail 19 in FIG. 3;

FIG. 20 is an enlarged view of detail 20 in FIG. 3;

FIG. 21 is an enlarged view of detail 21 in FIG. 3;

FIG. 22 is an enlarged view of detail 22 in FIG. 4;

FIG. 23 is an enlarged view of detail 23 in FIG. 4;

FIG. 24 is an enlarged view of detail 24 in FIG. 5;

FIG. 25 is an enlarged view of detail 25 in FIG. 5;

FIG. 26 is an enlarged view of detail 26 in FIG. 6;

FIG. 27 is an enlarged view of detail 27 in FIG. 7;

FIG. 28 is an enlarged view of detail 28 in FIG. 7;

FIG. 29 is an enlarged view of detail 29 in FIG. 7;

FIG. 30 is an enlarged view of detail 30 in FIG. 8;

FIG. 31 is an enlarged view of detail 31 in FIG. 8;

FIG. 32 is a front, right, top perspective view of the headphone in a detached state;

FIG. 33 is an enlarged view of detail 33 in FIG. 32; and,

FIG. 34 is an enlarged view of detail 34 in FIG. 32.

The dashed broken lines in the figures are for the purposes of illustrating portions of the headphone and form no part of the claimed design.

The dash-dot-dash broken lines are for notating enlarged views and form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D1074641
Type: Grant
Filed: Nov 15, 2024
Date of Patent: May 13, 2025
Assignee: Shenzhen Apwil Electronic Co., Ltd. (Shenzhen)
Inventor: Dehua Guo (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/973,280
Classifications