Heat sink for memory module
Description
The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.
Claims
The ornamental design for a heat sink for memory module as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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Patent History
Patent number: D1080566
Type: Grant
Filed: Feb 23, 2022
Date of Patent: Jun 24, 2025
Assignee: Kingston Digital, Inc. (Fountain Valley, CA)
Inventor: Hui-Hsin Lu (Hsinchu)
Primary Examiner: April Rivas
Application Number: 29/827,966
Type: Grant
Filed: Feb 23, 2022
Date of Patent: Jun 24, 2025
Assignee: Kingston Digital, Inc. (Fountain Valley, CA)
Inventor: Hui-Hsin Lu (Hsinchu)
Primary Examiner: April Rivas
Application Number: 29/827,966
Classifications