Heat sink for memory module

- Kingston Digital, Inc.
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Description

FIG. 1 is a perspective view of a heat sink for memory module showing the claimed design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.

Claims

The ornamental design for a heat sink for memory module as shown and described.

Referenced Cited
U.S. Patent Documents
D296323 June 21, 1988 McCarthy
D453744 February 19, 2002 Lee
D717744 November 18, 2014 Mueller
D727912 April 28, 2015 Kang
D761744 July 19, 2016 Mueller
D842304 March 5, 2019 Depay
D863311 October 15, 2019 Depay
D868069 November 26, 2019 Hung
D964947 September 27, 2022 Lin
D1005295 November 21, 2023 Huang
D1061464 February 11, 2025 Lu
D1066274 March 11, 2025 Lu
D1070863 April 15, 2025 Lu
20230048165 February 16, 2023 Yang
Other references
  • Gamer Braves, “Get yourself the 35th anniversary Kingston Fury Beast DDR4 RGB Special Edition”, “3 Years Ago” from Apr. 25, 2025. Est. 2022. (https://www.gamerbraves.com/get-yourself-the-35th-anniversary-kingston-fury-beast-ddr4-rgb-special-edition/) (Year: 2022).
  • ITHardware.pl, “Test Hiksemi U100 Wave . . . ”, Published Mar. 11, 2024. (https://ithardware.pl/testyirecenzje/hiksemi_u100_wave_ddr4_test_recenzja_opinia-32003.html) (Year: 2024).
Patent History
Patent number: D1080566
Type: Grant
Filed: Feb 23, 2022
Date of Patent: Jun 24, 2025
Assignee: Kingston Digital, Inc. (Fountain Valley, CA)
Inventor: Hui-Hsin Lu (Hsinchu)
Primary Examiner: April Rivas
Application Number: 29/827,966
Classifications