Heat sink for memory module
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Description
The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.
Claims
The ornamental design for a heat sink for memory module as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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Patent History
Patent number: D1080566
Type: Grant
Filed: Feb 23, 2022
Date of Patent: Jun 24, 2025
Assignee: Kingston Digital, Inc. (Fountain Valley, CA)
Inventor: Hui-Hsin Lu (Hsinchu)
Primary Examiner: April Rivas
Application Number: 29/827,966
Type: Grant
Filed: Feb 23, 2022
Date of Patent: Jun 24, 2025
Assignee: Kingston Digital, Inc. (Fountain Valley, CA)
Inventor: Hui-Hsin Lu (Hsinchu)
Primary Examiner: April Rivas
Application Number: 29/827,966
Classifications